CN203787466U

CN203787466U - LED (light emitting diode) packaging structure

Info

Publication number: CN203787466U
Application number: CN201420259785.XU
Authority: CN
Inventors: 齐向阳
Original assignee: Shenzhen Polytechnic
Current assignee: Shenzhen Polytechnic
Priority date: 2014-05-20
Filing date: 2014-05-20
Publication date: 2014-08-20
Anticipated expiration: 2024-05-20

Abstract

The utility model relates to an LED (light emitting diode) packaging structure. The LED packaging structure comprises a base plate, at least one LED chip which is arranged on the base plate, and a packaging shell which covers the LED chip; the surface, facing the LED chip, of the packaging shell is provided with a discontinuous fluorescent powder layer, and the discontinuity refers that micro-pores which do not contain fluorescent powder are densely formed in the fluorescent powder layer. The fluorescent powder layer adopts a structure that the fluorescent power in different granularities is coated in a mixing manner, a coating with a coarse surface is formed, so that not only can a luminescence area be effectively increased, but also diffuse reflected light which is emitted by the LED chip can be absorbed by the coarse surface, the diffusion reflection light can be effectively reduced, the luminescence efficiency and the color saturation degree can be improved, and the light is relatively soft. In addition, the fluorescent powder layer is in a discontinuous netted structure, so that the consumption of the fluorescent powder is effectively saved, and the production cost is reduced.

Description

LED encapsulating structure

Technical field

The utility model relates to LED encapsulation technology field, is specifically related to a kind of fluorescent powder coated encapsulating structure.

Background technology

LED (light Emitting Diode, light-emitting diode) is a kind of solid-state semiconductor device, can be luminous energy by electric energy conversion, is widely used in illumination and demonstration field.White light LEDs be described as replace fluorescent lamps and incandescent lamp the 4th generation lighting source.The traditional approach that forms white light LEDs is that blue light or ultraviolet light chip excite the fluorescent material being coated in above chip, and the light stimulus fluorescent material that chip sends under electric energy drives produces the visible ray of other wave band, and each several part colour mixture forms white light.

In the technique of existing LED chip+fluorescent material, after generally fluorescent material being mixed with binding agent, by gluing process, it is once coated onto on chip.In operating process, thereby being greater than binding agent, the proportion of fluorescent material easily produces precipitation, there is skewness after causing fluorescent powder curing, affect the feature such as color temperature uniformity, color rendering index, the color uniformity of LED.The more important thing is, fluorescent material is close to LED chip, causes the light of LED chip transmitting and light that chip excitated fluorescent powder sends turn back to chip and lose through scattering.Meanwhile, the shorter LED chip of emission wavelength can produce a large amount of heats while lighting, thereby very easily occurs that phosphor powder layer is subject to the phenomenon of the LED light source colour temperature drift that temperatures involved causes, and shortens the LED light source result in useful life.

For this reason, research staff develops a kind of remote fluorescence technology,, by fluorescent material away from LED chip setting, thereby reduced the impact of junction temperature of chip on fluorescent material, not only increased the luminous efficiency of fluorescent material, also increase LED light-emitting area, solved the strong problem of illumination granular sensation, reduced dazzle.Meanwhile, with respect to current fluorescent material gluing process, remote fluorescence technology has also been saved LED light fixture secondary optical design process, has reduced Design and manufacture cost.

But it is upper that fluorescent material is coated in LED lampshade (or lamp plate) by existing remote fluorescence technology, the fluorescent material consumption that causes remote fluorescence to apply increases greatly, and cost of material is higher.

Utility model content

For this reason, problem to be solved in the utility model is the large problem of fluorescent material consumption in existing remote fluorescence technology, thus provide that a kind of fluorescent material consumption is few, light-emitting area is large, without the LED encapsulating structure of granular sensation.

For solving the problems of the technologies described above, the technical solution adopted in the utility model is as follows:

A kind of LED encapsulating structure described in the utility model, comprises substrate, is arranged at least one LED chip on substrate, and covers the encapsulating housing of LED chip, and described encapsulating housing is provided with discontinuous phosphor powder layer on the surface near described LED chip.

The thickness of described phosphor powder layer is 50 μ m～200 μ m; Fluorescent material particle diameter in described phosphor powder layer is entirely not identical, forms rough surface.

In described phosphor powder layer, be provided with discontinuous hole, the size of described hole is 15 μ m～30, μ m × 15 μ m × 30 μ m.

Described fluorescent material comprises the first grade fluorescent material and the second grade fluorescent material, and the particle diameter of described the first grade fluorescent material is 12～15 μ m, and the particle diameter of described the second grade fluorescent material is 8～12 μ m.

Described in described phosphor powder layer, the volume ratio of the first grade fluorescent material and the second grade fluorescent material is 3:1～6:1.

Described fluorescent material also comprises the 3rd grade fluorescent material, and the particle diameter of described the 3rd grade fluorescent material is 5～8 μ m.

Described in described phosphor powder layer, the volume ratio of the first grade fluorescent material and described the 3rd grade fluorescent material is 3:1～9:1.

Technique scheme of the present utility model has the following advantages compared to existing technology:

1, LED encapsulating structure described in the utility model, comprises substrate, is arranged at least one LED chip on substrate, and covers the encapsulating housing of LED chip; Described encapsulating housing is provided with discontinuous phosphor powder layer on the surface near described LED chip; Described phosphor powder layer is discontinuous network structure, has greatly saved the consumption of fluorescent material, thereby has reduced production cost.For White-light LED package structure, after the gold-tinted blend that the blue light being sent by blue-light LED chip, the blue light that transmits described encapsulating housing and excitated fluorescent powder send, form white light, light-emitting area is large, light is soft.

2, LED encapsulating structure described in the utility model, adopts the fluorescent material of size fractionated to mix the structure of coating in described phosphor powder layer, form shaggy coating, has not only effectively increased the light-emitting area of gold-tinted; And LED chip sends a large amount of diffuse reflection of rear formation described in coarse Surface absorption, effectively antireflective light, thus improve luminous efficiency and color saturation, make light softer.

Brief description of the drawings

For content of the present utility model is more likely to be clearly understood, according to specific embodiment of the utility model also by reference to the accompanying drawings, the utility model is described in further detail, wherein below

Fig. 1 is the structural representation of LED encapsulating structure described in the utility model;

In figure, Reference numeral is expressed as: 1-substrate, 2-LED chip, 3-encapsulating housing, 4-phosphor powder layer.

Embodiment

In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with accompanying drawing, execution mode of the present utility model is described in further detail.

The utility model can be implemented in many different forms, and should not be understood to be limited to embodiment set forth herein.On the contrary, provide these embodiment, making the disclosure will be thorough and complete, and design of the present utility model fully will be conveyed to those skilled in the art, and the utility model will only be limited by claim.In the accompanying drawings, for clarity, can exaggerate size and the relative size in parts and region.

The present embodiment provides a kind of LED encapsulating structure, as shown in Figure 1, comprises substrate 1, is arranged on four LED chips 2 on substrate 1, and cover the encapsulating housing 3 of LED chip 2; Described encapsulating housing 3 is provided with discontinuous phosphor powder layer 4 on the surface of described LED chip 2.In the present embodiment, described LED chip 2 is blue chip, and described fluorescent material is gold-tinted fluorescent material.Described phosphor powder layer 4 is discontinuous network structure, be that the part light that described LED chip 2 sends can directly appear by described encapsulating housing 3, also can appear by described phosphor powder layer 4 and described encapsulating housing 3 successively, the gold-tinted sending after the blue light that described LED chip 2 sends, blue-light excited fluorescent material and the blue light that appears described encapsulating housing 3 obtain white light.Described phosphor powder layer 4 is discontinuous network structure, has greatly saved the consumption of fluorescent material, thereby has reduced production cost.In addition, in described phosphor powder layer 4, adopt the fluorescent material of size fractionated to mix the structure of coating, form shaggy coating, not only effectively increased the light-emitting area of gold-tinted; And, after the blue light that LED chip 2 sends described in coarse Surface absorption, form a large amount of diffuse reflections, effectively reduce the reflection ray of blue light, thereby improved luminous efficiency and color saturation, make light softer.

As convertible embodiment of the present utility model; described LED chip 2 can also be for having the chip of other glow color; described fluorescent material also can, for having the fluorescent material of other glow colors, all can be realized the purpose of this utility model, belongs to protection range of the present utility model.

The thickness of described phosphor powder layer 4 is 50 μ m～200 μ m, and the present embodiment is preferably 100 μ m left and right.

In described phosphor powder layer 4, discontinuous pore size is 15 μ m～30, μ m × 15 μ m × 30 μ m, and the present embodiment is preferably 20 μ m × 20 μ m left and right.

Described fluorescent material comprises the first grade fluorescent material and the second grade fluorescent material, and the particle diameter of described the first grade fluorescent material is 12 μ m～15 μ m, and the particle diameter of described the second grade fluorescent material is 8 μ m～12 μ m; In the present embodiment, the particle diameter of described the first grade fluorescent material is preferably 15 μ m, and the particle diameter of described the second grade fluorescent material is preferably 8 μ m.

Described in described phosphor powder layer 4, the volume ratio of the first grade fluorescent material and the second grade fluorescent material is 3:1～6:1; Described in the present embodiment, the volume ratio of the first grade fluorescent material and the second grade fluorescent material is 6:1.

As other embodiment of the present utility model, described fluorescent material also comprises the 3rd grade fluorescent material, and the particle diameter of described the 3rd grade fluorescent material is 5～8 μ m.The volume ratio of described the first grade fluorescent material and described the 3rd grade fluorescent material is 3:1～9:1, all can realize the purpose of this utility model, belongs to protection range of the present utility model.

Obviously, above-described embodiment is only for example is clearly described, and the not restriction to execution mode.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here without also giving exhaustive to all execution modes.And the apparent variation of being extended out thus or variation are still among protection range of the present utility model.

Claims

1. a LED encapsulating structure, comprise substrate (1), be arranged at least one LED chip (2) on substrate (1), and the encapsulating housing (3) of covering LED chip (2), it is characterized in that: described encapsulating housing (3) is provided with discontinuous phosphor powder layer (4) near on the surface of described LED chip (2).

2. LED encapsulating structure according to claim 1, is characterized in that: the thickness of described phosphor powder layer (4) is 50 μ m～200 μ m; Fluorescent material particle diameter in described phosphor powder layer (4) is entirely not identical, forms rough surface.

3. LED encapsulating structure according to claim 1, is characterized in that: described phosphor powder layer is provided with discontinuous hole in (4), and the size of described hole is 15 μ m～30, μ m × 15 μ m × 30 μ m.

4. according to the arbitrary described LED encapsulating structure of claim 1-3, it is characterized in that: described fluorescent material comprises the first grade fluorescent material and the second grade fluorescent material, the particle diameter of described the first grade fluorescent material is 12～15 μ m, and the particle diameter of described the second grade fluorescent material is 8～12 μ m.

5. LED encapsulating structure according to claim 4, is characterized in that: described in described phosphor powder layer (4), the volume ratio of the first grade fluorescent material and the second grade fluorescent material is 3:1～6:1.

6. LED encapsulating structure according to claim 4, is characterized in that: described fluorescent material also comprises the 3rd grade fluorescent material, and the particle diameter of described the 3rd grade fluorescent material is 5～8 μ m.

7. LED encapsulating structure according to claim 6, is characterized in that: described in described phosphor powder layer (4), the volume ratio of the first grade fluorescent material and described the 3rd grade fluorescent material is 3:1～9:1.