CN201402307Y - Improved structure for IC test fixture - Google Patents
Improved structure for IC test fixture Download PDFInfo
- Publication number
- CN201402307Y CN201402307Y CN2009200550078U CN200920055007U CN201402307Y CN 201402307 Y CN201402307 Y CN 201402307Y CN 2009200550078 U CN2009200550078 U CN 2009200550078U CN 200920055007 U CN200920055007 U CN 200920055007U CN 201402307 Y CN201402307 Y CN 201402307Y
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- circuit
- adaptor
- contact
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- making apparatus
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- Measuring Leads Or Probes (AREA)
Abstract
The utility model relates to the technical field of IC test equipment, in particular to an improved structure for an IC test fixture, comprising a seat body arranged on a circuit board. The seat bodyis provided with a containing space used for placing an integrated circuit, at least two sets of conductive probes are arranged in the containing space, a first contact end which is electrically connected with a pin of the integrated circuit is arranged at one end of each conductive probe, a second contact end is arranged at the other end of each conductive probe to be vertical to the bottom of the seat body, an adaptor is arranged at the bottom of the seat body, a corresponding first through circuit is arranged on the contact surface of the adaptor and the second contact end, a second throughcircuit is arranged on the contact surface of the adaptor and the circuit board, and the first through circuit and the second through circuit are connected and in electrical conduction. In addition,the contact distribution positions of the second through circuit are different from the contact distribution positions of the first through circuit. The utility model has the advantages that the fixture service life is prolonged, and the purchase cost is lowered, therefore, the freedom degree and the convenience of whole circuit design are better.
Description
Technical field:
The utility model relates to IC testing apparatus technical field, refers in particular to a kind of IC testing making apparatus structure-improved.
Background technology:
Integrated circuit (Integrated Circuits) correlation technique is quite ripe now, can produce various different IC and satisfy public demand, and after a large amount of productions of each IC, before shipment is peddled, most important link is whether normal operation of every IC of test, just as all products, must be before shipment through last QC test, and must consider in the process of IC test that every kind of IC has the outer package of different size according to the different pins amount, must have corresponding testing making apparatus to test to repeat ccontaining IC.
The encapsulation specification of IC is numerous, common as SOP (Small Out-Line package), QFP (Quad Flat Package), BGA (Ball grid array), LCC (LeadlessChip Carrier), SOIC (Small-outline integrated circuit) etc., and corresponding IC testing making apparatus, for example shown in Figure 9, it is the cut-open view of SOP (Small Out-Line package) IC testing making apparatus, its pin is drawn L-shaped sea-gull wing from the encapsulation both sides, mainly comprise a pedestal 10, this pedestal 10 is provided with one in order to place the accommodation space 11 of to-be-measured integrated circuit 100, and in this accommodation space 11 metal leg 101 positions of corresponding this integrated circuit 100, be provided with complex conduction shell fragment 200, make first contact jaw, 201 correspondences of this electroconductive elastic sheet 200 touch this plural number metal leg 101, electroconductive elastic sheet 200 exposes second contact, 202 ends with the connecting circuit plate in these pedestal 10 bottoms, wherein this complex conduction shell fragment 200 can be because must repeatedly replace the integrated circuit 100 of desire test, and contact with these metal leg 101 frictions repeatedly, get off for a long time to make the contact surface abrasion of this first contact jaw 201 and this metal leg 101, the part of these first contact jaw, 201 surface gold-plating is disappeared, gradually cause this first contact jaw 201 and these metal leg 101 poor electrical contact, influence the accuracy of IC test process, moreover, because this kind electroconductive elastic sheet 200 contacts with this metal leg 101 in order to guarantee, usually this first contact jaw 201 is understood unsettled exposing, utilize these electroconductive elastic sheet 200 material elasticity own the Flexible Reset when touching to be provided and can to suppress the space, the position that makes this first contact jaw 201 expose is more, and make this first contact jaw 201 bend skew because of accident is stressed easily, for example the integrated circuit 100 that do not conform to of pin position is put into these accommodation space 11 backs and desire when taking out, this metal leg 101 is colluded because of dislocation mutually with this first contact jaw 201 pulls, cause this first contact jaw, 201 bendings, if under the state of not discovering these first contact jaw, 201 bendings, test and proceed this integrated circuit 100, slight then influence the accuracy of IC test, serious then cause tested these integrated circuit 100 damage reimbursements, bring great inconvenience.
In order to improve the shortcoming of above-mentioned conventional IC testing making apparatus, also have a kind of IC testing making apparatus to utilize the mode of probe to replace the mode of utilizing this electroconductive elastic sheet 200, the surface of contact of this metal leg 101 of order contact converts the single-point way of contact to by planar fashion, make fixture increase serviceable life, and it is not fragile, but utilize the probe mode to improve the shortcoming while of this electroconductive elastic sheet 200, can produce another kind of shortcoming again, because conventional probe is vertical pin column body, this pin column body can't bend, make the arrangement of probe to mate with the arrangement of IC pin position, and IC pin position is tight arrangement, circuit junction on the circuit board also will be followed compact configuration, cause the fixture location difficulty and cause contact overstocked easily, contact is short circuit mutually easily in the scolding tin process, has increased many unnecessary risks, hence one can see that, is badly in need of wanting a kind of advantage that can include above-mentioned dual mode simultaneously at present, and can avoid the testing making apparatus of shortcoming simultaneously.
The utility model content:
The purpose of this utility model is exactly to provide a kind of IC testing making apparatus structure-improved at the deficiency of prior art existence, overcomes existing fixture short deficiency in serviceable life.
To achieve these goals, the technical solution adopted in the utility model is: a kind of IC testing making apparatus structure-improved, it comprises the pedestal of being located on the circuit board, this pedestal is provided with the accommodation space of a placement integrated circuit, be provided with at least two group conducting probes in this accommodation space, described conducting probe stretches on perpendicular to the straight line on pedestal surface, one end of described conducting probe is provided with first contact jaw that electrically connects with the pin of integrated circuit, the other end is provided with second contact jaw, described second contact jaw is perpendicular to described pedestal bottom, and expose described pedestal bottom, described pedestal bottom also is provided with an adaptor, the surface that this adaptor contacts with second contact jaw is provided with corresponding first built-up circuit, the one side that this adaptor contacts with circuit board is provided with second built-up circuit, described first built-up circuit, second built-up circuit joins and electrically conducts, and the contact distributing position of this second built-up circuit and the contact distributing position of first built-up circuit are inequality.
First built-up circuit and two built-up circuits are arranged on the circuit copper cash on the circuit board.
Described contact is the naked copper contact that is arranged on the circuit board.
Described adaptor is the hard circuit board.
Described adaptor is soft circuit board.
Be provided with at least one slow bent part between described pedestal and the adaptor.
Described slow bent part and pedestal connect as one structure.
Described slow bent part and adaptor connect as one structure.
Described slow bent part is parts independently.
The bottom of described pedestal is provided with in order to connect the keeper of adaptor, and described keeper is the right cylinder that protrudes in the pedestal bottom, and adaptor is provided with the column mouth with the keeper coupling.
The beneficial effects of the utility model are:
(1) the utility model utilizes the pin of conducting probe and integrated circuit to contact, and utilizes vertical point pressure mode to contact the pin of integrated circuit, significantly reduces the friction and the loss of IC testing making apparatus and metal leg contact point, prolongs the fixture life-span and reduces acquisition cost.
(2) the utility model utilizes the pin of conducting probe and integrated circuit to contact, and the exposed part of first contact jaw of conducting probe is significantly reduced, avoid because of accidents such as external force false touch cause the conducting probe bending, and damage of feasible whole group fixture or reimbursement.
(3) the utility model utilizes second built-up circuit that adaptor makes that the IC testing making apparatus contacts with circuit board, the contact of second built-up circuit can freely change specification and position location, make the wires design of circuit board no longer be subjected to the restriction of IC pin position standard specification, significantly increase the degree of freedom and the convenience of integrated circuit design.
Description of drawings:
Fig. 1 is a structural representation of the present utility model;
Fig. 2 is a cut-open view of the present utility model;
Fig. 3 is the B place enlarged diagram of Fig. 2;
Fig. 4 is the cut-open view of probe extended configuration of the present utility model;
Fig. 5 is the cut-open view of probe compressive state of the present utility model;
Fig. 6 is a decomposing schematic representation of the present utility model;
Fig. 7 is another decomposing schematic representation of the utility model;
Fig. 8 is the structural representation of the utility model embodiment 5;
Fig. 9 is the cut-open view of at present common IC measurement jig.
Embodiment:
Embodiment 1
See Fig. 1 to 7, a kind of IC testing making apparatus structure-improved, it comprises the pedestal of being located on the circuit board 2, this pedestal 2 is provided with the accommodation space 2a of a placement integrated circuit 3, be provided with at least two group conducting probes 4 in this accommodation space 2a, described conducting probe 4 stretches on perpendicular to the straight line on pedestal 2 surfaces, one end of described conducting probe 4 is provided with the first contact jaw 4a that electrically connects with the pin 3a of integrated circuit 3, the other end is provided with the second contact jaw 4b, the described second contact jaw 4b is perpendicular to described pedestal 2 bottoms, and expose described pedestal 2 bottoms, described pedestal 2 bottoms also are provided with an adaptor 5, the surface that this adaptor 5 contacts with the second contact jaw 4b is provided with corresponding first built-up circuit 6, the one side that this adaptor 5 contacts with circuit board is provided with second built-up circuit 7, described first built-up circuit 6, second built-up circuit 7 joins and electrically conducts, and, the contact 6a distributing position of the contact 7a distributing position of this second built-up circuit 7 and first built-up circuit 6 is inequality, and said structure is the utility model basic structure.
First built-up circuit 6 and two built-up circuits 7 are arranged on the circuit copper cash on the circuit board.
The utility model considers that simultaneously circuit board is curved because of being subjected to the overweight plate that causes of external force or bearing assembly sometimes, and then the whole stability of influence, so, between pedestal 2 and adaptor 5, be provided with at least one slow bent part 8, when circuit board has the curved phenomenon of plate to produce quadric stress, utilize and to make adaptor 5 when plate is curved by slow bent part 8, crooked cushion space can be arranged, make adaptor 5 can not cause deformation set or excessive crooked skew because of bending, avoid further having influence on contact 6a, the stability that electrically connects between 7a and the second contact jaw 4b and the circuit board, in the present embodiment, described slow bent part 8 connects as one structure with pedestal 2.
About conducting probe 4 with longitudinal elasticity, see also Fig. 4 and Fig. 5, this is the mode one that conducting probe 4 can specifically be implemented, this conducting probe 4 includes a conduction body 24, sheathed one probe and with first contact jaw 4a has the probe of the second contact jaw 4b in this conduction body 24, and between the probe of the probe of the first contact jaw 4a and the second contact jaw 4b, be provided with an elastic component 23, and above-mentioned all members all are electric conductors, so, when the first contact jaw 4a of conducting probe 4 or the second contact jaw 4b are touched, elastic component 23 is compressed, utilizes this characteristic, when integrated circuit 3 is put into the IC testing making apparatus, and, during conducting probe 4 contact pin 3a, can avoid, guarantee that conducting probe 4 and pin 3a can stably electrically connect because of having difference of height to cause problems such as loose contact between pin 3a.
The bottom of pedestal 2 is provided with in order to connect the keeper 33 of adaptor 5, in the present embodiment, described keeper 33 is for protruding in the right cylinder of pedestal 2 bottoms, adaptor 5 is provided with the column mouth with keeper 33 couplings, first built-up circuit 6 is provided with contact 6a at adaptor 5 and the contacted one side of the second contact jaw 4b, second built-up circuit 7 is provided with contact 7a on adaptor 5 and one side that circuit board contacts, described contact 6a, 7a are the naked copper contact that is arranged on the circuit board.
Wherein, described adaptor 5 is the hard circuit board.
See Fig. 1 to 7, in the present embodiment, described adaptor 5 is soft circuit board, and other structure is identical with the structure of embodiment 1, no longer repeats here.
Embodiment 3
See Fig. 1 to 7, in the present embodiment, described slow bent part 8 connects as one structure with adaptor 5, and other structure is identical with the structure of embodiment 1, no longer repeats here.
See Fig. 1 to 7, in the present embodiment, described slow bent part 8 is parts independently, can be convenient for changing, and other structure is identical with the structure of embodiment 1, no longer repeats here.
See Fig. 1 to 5,8, in the present embodiment, wherein the contact 7a of this second built-up circuit 7 can freely misplace on demand, and should be a continuous lines strip by slow bent part 8, as long as the deformation cushion space of this adaptor 5 when plate is curved can be provided, other structure is identical with the structure of embodiment 1, no longer repeats here.
Certainly, the embodiment of the above, it is better embodiment of the present utility model, be not to be used for limiting practical range of the present utility model, so all equivalences of doing according to the described structure of the utility model claim, feature and principle change or modify, and all should be included in the utility model claim.
Claims (10)
1, a kind of IC testing making apparatus structure-improved, it comprises the pedestal of being located on the circuit board, this pedestal is provided with the accommodation space of a placement integrated circuit, be provided with at least two group conducting probes in this accommodation space, described conducting probe stretches on perpendicular to the straight line on pedestal surface, one end of described conducting probe is provided with first contact jaw that electrically connects with the pin of integrated circuit, the other end is provided with second contact jaw, described second contact jaw is perpendicular to described pedestal bottom, and expose described pedestal bottom, it is characterized in that: described pedestal bottom also is provided with an adaptor, the surface that this adaptor contacts with second contact jaw is provided with corresponding first built-up circuit, the one side that this adaptor contacts with circuit board is provided with second built-up circuit, described first built-up circuit, second built-up circuit joins and electrically conducts, and the contact distributing position of this second built-up circuit and the contact distributing position of first built-up circuit are inequality.
2, a kind of IC testing making apparatus structure-improved according to claim 1, it is characterized in that: first built-up circuit and two built-up circuits are arranged on the circuit copper cash on the circuit board.
3, a kind of IC testing making apparatus structure-improved according to claim 1, it is characterized in that: described contact is the naked copper contact that is arranged on the circuit board.
4, a kind of IC testing making apparatus structure-improved according to claim 1, it is characterized in that: described adaptor is the hard circuit board.
5, a kind of IC testing making apparatus structure-improved according to claim 1, it is characterized in that: described adaptor is soft circuit board.
6, a kind of IC testing making apparatus structure-improved according to claim 1 is characterized in that: be provided with at least one slow bent part between described pedestal and the adaptor.
7, a kind of IC testing making apparatus structure-improved according to claim 6, it is characterized in that: described slow bent part and pedestal connect as one structure.
8, a kind of IC testing making apparatus structure-improved according to claim 6, it is characterized in that: described slow bent part and adaptor connect as one structure.
9, a kind of IC testing making apparatus structure-improved according to claim 6 is characterized in that: described slow bent part is parts independently.
10, a kind of IC testing making apparatus structure-improved according to claim 1, it is characterized in that: the bottom of described pedestal is provided with in order to connect the keeper of adaptor, described keeper is the right cylinder that protrudes in the pedestal bottom, and adaptor is provided with the column mouth with the keeper coupling.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009200550078U CN201402307Y (en) | 2009-04-21 | 2009-04-21 | Improved structure for IC test fixture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009200550078U CN201402307Y (en) | 2009-04-21 | 2009-04-21 | Improved structure for IC test fixture |
Publications (1)
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CN201402307Y true CN201402307Y (en) | 2010-02-10 |
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CN2009200550078U Expired - Fee Related CN201402307Y (en) | 2009-04-21 | 2009-04-21 | Improved structure for IC test fixture |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102368078A (en) * | 2011-10-19 | 2012-03-07 | 昆山迈致治具科技有限公司 | Circuit board detection tool positioning mechanism |
CN103954854A (en) * | 2014-01-26 | 2014-07-30 | 深圳市兴森快捷电路科技股份有限公司 | Testing method and device for pogo pin electrical performance |
CN111103526A (en) * | 2019-12-31 | 2020-05-05 | 沪士电子股份有限公司 | Tool and method for detecting residual metal in back drilling hole of PCB |
CN112083308A (en) * | 2019-06-12 | 2020-12-15 | 杰冯科技有限公司 | Integrated circuit test equipment |
WO2021253735A1 (en) * | 2020-06-16 | 2021-12-23 | 法特迪精密科技(苏州)有限公司 | Auxiliary test fixture for accuracy debugging of testing machine |
-
2009
- 2009-04-21 CN CN2009200550078U patent/CN201402307Y/en not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102368078A (en) * | 2011-10-19 | 2012-03-07 | 昆山迈致治具科技有限公司 | Circuit board detection tool positioning mechanism |
CN103954854A (en) * | 2014-01-26 | 2014-07-30 | 深圳市兴森快捷电路科技股份有限公司 | Testing method and device for pogo pin electrical performance |
CN112083308A (en) * | 2019-06-12 | 2020-12-15 | 杰冯科技有限公司 | Integrated circuit test equipment |
CN112083308B (en) * | 2019-06-12 | 2024-02-27 | 杰冯科技有限公司 | Integrated circuit test equipment |
CN111103526A (en) * | 2019-12-31 | 2020-05-05 | 沪士电子股份有限公司 | Tool and method for detecting residual metal in back drilling hole of PCB |
WO2021253735A1 (en) * | 2020-06-16 | 2021-12-23 | 法特迪精密科技(苏州)有限公司 | Auxiliary test fixture for accuracy debugging of testing machine |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100210 Termination date: 20170421 |
|
CF01 | Termination of patent right due to non-payment of annual fee |