Nothing Special   »   [go: up one dir, main page]

CN201167098Y - Low light-decline small power white light LED - Google Patents

Low light-decline small power white light LED Download PDF

Info

Publication number
CN201167098Y
CN201167098Y CNU2007201710145U CN200720171014U CN201167098Y CN 201167098 Y CN201167098 Y CN 201167098Y CN U2007201710145 U CNU2007201710145 U CN U2007201710145U CN 200720171014 U CN200720171014 U CN 200720171014U CN 201167098 Y CN201167098 Y CN 201167098Y
Authority
CN
China
Prior art keywords
white light
led
light
power white
bracket
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNU2007201710145U
Other languages
Chinese (zh)
Inventor
李国平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangzhou Hongli Tronic Co Ltd
Original Assignee
Guangzhou Hongli Tronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangzhou Hongli Tronic Co Ltd filed Critical Guangzhou Hongli Tronic Co Ltd
Priority to CNU2007201710145U priority Critical patent/CN201167098Y/en
Application granted granted Critical
Publication of CN201167098Y publication Critical patent/CN201167098Y/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Landscapes

  • Led Device Packages (AREA)

Abstract

The utility model discloses a white light LED with low photodegradation and lower power. The LED includes a bracket and a light-emitting chip which is arranged on the bracket. The LED is characterized in that a silicone cohesive glue layer is stuck between the light-emitting chip and the bracket. The outside of the light-emitting chip is covered with a silicone mixed phosphor powder layer which is prepared by taking the silica gel as a carrier and mixing with phosphor powder. The surface of the silicone mixed phosphor powder layer is covered with an epoxy resin mixed silicon diffusion powder layer. The white light LED has the advantages of ensuring the lower photodegradation of the white light LED and improving the photochromic consistency thereof.

Description

A kind of low light decay small-power white light LEDs
Technical field
The utility model relates to a kind of diode that emits white light (abbreviation white light LEDs), is a kind of low light decay small-power white light LEDs specifically.
Background technology
At present, advantage such as just little with its volume, the good anti-vibration of LED, rich color is captured the market of photoelectricity industry rapidly.Especially the paces that LED enters illuminating industry have been accelerated in the successful development of white light LEDs and produce.The white light LEDs common process is to be excited by yellow fluorescent powder by blue light to produce white light, and the brightness decay of white light mainly contains three factors, the 1. decay of chip brightness; 2. aging (understanding extinction after solid glue is aging) of crystal-bonding adhesive water; 3. fluorescence carrier glue is aging.Traditional small-power white LED lamp adopts epoxy resin to join yellow fluorescent powder and covers, in lighting process, because epoxy resin xanthochromia and charing phenomenon occur under the effect of high temperature (luminescent wafer discharges certain heat in luminous) and low band ultraviolet light, and have a strong impact on light extraction efficiency, in continuous luminescence process, charing is constantly deepened, make that light extraction efficiency is more and more lower, brightness descends, thereby make brightness decay (abbreviation light decay) more and more serious, the allotment of silica gel and fluorescent material makes light decay improve.But silica gel is seriously restricting the application and the development of white light LEDs.
Summary of the invention
The purpose of this utility model provides a kind ofly not only can be guaranteed the low light decay of white light LEDs but also can improve its photochromic conforming low light decay small-power white light LEDs.
The purpose of this utility model is achieved through the following technical solutions.
A kind of low light decay small-power white light LEDs comprises support and luminescence chip, and luminescence chip is positioned on the support, it is characterized in that: a bonding silicones glue line between described luminescence chip and the support.
The utility model compared with prior art has the following advantages.
Because silicones is compared epoxy resin, its thermal conductivity is good, has the characteristic of not yellow of high temperature, not charing, and the aging ability of anti-low ripple ultraviolet light is strong; Be exactly to be coated with lid layer epoxy resin mixing silicon spread powder again on the fluorescent glue surface once more, with solving interface problem between epoxy resin and the silica gel (when silicones combines with epoxy resin, owing to have certain interface between two kinds of materials, when lighting because Temperature Influence, and the interface is changed, thereby influence photochromic) the silicon spread powder is mixed with epoxy, and then coat on fluorescent material, because silica flour combines with epoxy, thereby has solved interface problem; At last, outer package glue available epoxy or silicones.
Description of drawings
Fig. 1 is the structural representation of the low light decay small-power white light LEDs of the utility model.
Embodiment:
Below in conjunction with accompanying drawing the utility model is described in further detail.
As shown in Figure 1, the low light decay small-power white light LEDs of the utility model mainly is made up of support 1, silicones glue line 2, luminescence chip 3, gold thread 4, silicones mixed fluorescent powder layer 5, epoxy resin mixing silicon diffusion bisque 6, epoxy resin layer 7, luminescence chip is positioned on the support, the silicones glue line is between luminescence chip and support, silicones mixed fluorescent powder layer covers outside the luminescence chip, epoxy resin mixing silicon diffusion bisque is coated at the outer surface of silicones mixed fluorescent powder layer, and the epoxy resin layer outer package is outside epoxy resin mixing silicon diffusion bisque.

Claims (1)

1, a kind of low light decay small-power white light LEDs comprises support and luminescence chip, and luminescence chip is positioned on the support, it is characterized in that: a bonding silicones glue line between described luminescence chip and the support.
CNU2007201710145U 2007-11-22 2007-11-22 Low light-decline small power white light LED Expired - Lifetime CN201167098Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2007201710145U CN201167098Y (en) 2007-11-22 2007-11-22 Low light-decline small power white light LED

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2007201710145U CN201167098Y (en) 2007-11-22 2007-11-22 Low light-decline small power white light LED

Publications (1)

Publication Number Publication Date
CN201167098Y true CN201167098Y (en) 2008-12-17

Family

ID=40192489

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2007201710145U Expired - Lifetime CN201167098Y (en) 2007-11-22 2007-11-22 Low light-decline small power white light LED

Country Status (1)

Country Link
CN (1) CN201167098Y (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101442087B (en) * 2007-11-22 2013-01-02 广州市鸿利光电股份有限公司 Low power low light loss white light LED
CN107887481A (en) * 2017-11-09 2018-04-06 江苏稳润光电科技有限公司 The preparation method and white light LEDs product of a kind of consistent white light LEDs product of hot spot

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101442087B (en) * 2007-11-22 2013-01-02 广州市鸿利光电股份有限公司 Low power low light loss white light LED
CN107887481A (en) * 2017-11-09 2018-04-06 江苏稳润光电科技有限公司 The preparation method and white light LEDs product of a kind of consistent white light LEDs product of hot spot

Similar Documents

Publication Publication Date Title
CN102130227B (en) Encapsulation process for white light LED with optical lens
TWM407494U (en) LED package structure
CN101442087B (en) Low power low light loss white light LED
CN103050615B (en) A kind of White LED with high color rendering property device
CN203784667U (en) LED (light emitting diode) lamp
CN102644901B (en) Light-emitting diode (LED) fluorescent diaphragm and LED illuminating lamp based on LED florescent diaphragm
CN102646674A (en) Light-emitting device of white-light LED (light-emitting diode)
CN201555171U (en) LED lighting element
CN201167098Y (en) Low light-decline small power white light LED
CN207421802U (en) A kind of high-power multicolored COB light source
CN107785476B (en) A kind of white light LEDs fluorescent glass film and preparation method thereof
KR20140004505U (en) Structure of light mixing type light emitting diode
CN202585520U (en) Light-emitting diode light source module structure
CN201221690Y (en) LED plane illuminating device
CN103727438A (en) LED lamp and manufacturing method
CN202938048U (en) White-light LED bulb lamp structure with transparent ceramic package
CN204189795U (en) Arc MCOB LED encapsulation structure
CN203787466U (en) LED (light emitting diode) packaging structure
CN209183572U (en) A kind of LED light source
CN201448655U (en) Light-emitting diode structure
CN201966248U (en) LED wafer component
CN202048403U (en) Anti-aging LED (Light-Emitting Diode) illuminating lamp with long service life based on composite fluorescent membrane
CN203415624U (en) White LED with high color rendering index
CN202549924U (en) Novel light-emitting diode (LED) device
CN201666469U (en) LED module packaging structure

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee
CP01 Change in the name or title of a patent holder

Address after: Four 11D room, 510000 floor, building B, 10 Fengshen Road, Huadu District, Guangdong, Guangzhou

Patentee after: Guangzhou Hongli Tronic Co., Ltd.

Address before: Four 11D room, 510000 floor, building B, 10 Fengshen Road, Huadu District, Guangdong, Guangzhou

Patentee before: Guangzhou Hongli Photoelectron Co., Ltd.

CX01 Expiry of patent term

Granted publication date: 20081217