CN208317104U - The two-sided PCB circuit board radiator structure of multi-layered high-density - Google Patents
The two-sided PCB circuit board radiator structure of multi-layered high-density Download PDFInfo
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- CN208317104U CN208317104U CN201820985238.8U CN201820985238U CN208317104U CN 208317104 U CN208317104 U CN 208317104U CN 201820985238 U CN201820985238 U CN 201820985238U CN 208317104 U CN208317104 U CN 208317104U
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- heat
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- conducting plate
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- 239000000758 substrate Substances 0.000 claims abstract description 41
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 37
- 239000010949 copper Substances 0.000 claims abstract description 31
- 229910052802 copper Inorganic materials 0.000 claims abstract description 31
- 238000001816 cooling Methods 0.000 claims abstract description 23
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 34
- 230000017525 heat dissipation Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000011161 development Methods 0.000 description 4
- 230000018109 developmental process Effects 0.000 description 4
- 239000003984 copper intrauterine device Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses the two-sided PCB circuit board radiator structures of multi-layered high-density, it includes substrate, the first insulating layer is bonded at the upper surface of base plate center, and first insulating layer upper surface be bonded with the first layers of copper for circuit to be arranged, the two sides that the upper surface of base plate is located at the first layers of copper are symmetrically arranged with the first heat-conducting plate, and the first heat-conducting plate upper surface is equidistantly welded with multiple first cooling fins.In the utility model, the first heat-conducting plate is bonded in the two sides that the upper surface of substrate is located at the first layers of copper, first heat-conducting plate upper surface is equidistantly welded with the first cooling fin, the two sides that the lower surface of substrate is located at the second layers of copper are bonded with the second heat-conducting plate, the lower surface of second heat-conducting plate is equidistantly welded with the second heat sink strip, allow the temperature of substrate to be transferred to the first cooling fin and the second cooling fin by the first heat-conducting plate and the second heat-conducting plate, be dispersed into air, effectively improves its radiating efficiency.
Description
Technical field
The utility model relates to pcb board manufacturing technology field more particularly to the two-sided PCB circuit board heat dissipation knots of multi-layered high-density
Structure.
Background technique
PCB (Printed Circuit Board), Chinese is printed circuit board, also known as printed wiring board, is important
Electronic component, be the supporter of electronic component, be electronic component electrical connection carrier.Since it is using electronic seal
The production of brush art, therefore circuit board referred to as " is printed ", printed board develops to two-sided, multilayer and flexibility from single layer, and still protects
Hold respective development trend.Due to constantly developing to high-precision, high density and high reliability direction, constantly diminution volume,
It reduces cost, improve performance, so that printed board still maintains powerful life in the development engineering of future electronic equipment
Power.
Currently, it is substantially coincident to the discussion of the following PCB Production manufacturing technology developments both at home and abroad, i.e., to height
Density, high-precision, fine pore, thin wire, thin space is highly reliable, multiple stratification, high-speed transfer, light weight, and slim direction is developed,
Cost is reduced to productivity is improved simultaneously in production, reduces pollution, adapts to multi items, the development of small lot production mode reform.Printing electricity
The state-of-art on road, generally with the line width in printed board, aperture, plate thickness/aperture ratio is representative.
However the existing two-sided PCB circuit board radiator structure of multi-layered high-density in use there is some shortcomings it
Place, its structure is complicated, electronic component welding density is big, and calorific value is larger when work；Existing two-sided PCB circuit board structure is set
In meter, lack radiator structure, lead to it during use, is also easy to produce high temperature, causes the variation of electronic component operating condition even
Damage, high failure rate in use, influence electronic product using the safe and service life.
Utility model content
Purpose of the utility model is to solve disadvantages existing in the prior art, and propose a kind of improvement heat dissipation performance
The two-sided PCB circuit board radiator structure of multi-layered high-density.
To achieve the goals above, the utility model adopts the technical scheme that
The two-sided PCB circuit board radiator structure of multi-layered high-density comprising substrate is bonded at the upper surface of base plate center
First insulating layer, and the first insulating layer upper surface is bonded with the first layers of copper for circuit to be arranged, the upper surface of base plate is located at
The two sides of first layers of copper are symmetrically arranged with the first heat-conducting plate, and the first heat-conducting plate upper surface is equidistantly welded with multiple first heat dissipations
Piece is bonded with second insulating layer at the base lower surface center, and second insulating layer lower surface bonds have for circuit to be arranged
The second layers of copper, offer conductive hole on the substrate, the two sides that the base lower surface is located at the second layers of copper are symmetrically arranged with
Second heat-conducting plate, and the second heat-conducting plate lower surface is equidistantly welded with multiple second cooling fins, opens at the inside center of the substrate
Equipped with circular through hole, and heat conducting pipe is embedded with inside circular through hole, fixed mini-fan on the table wall of first cooling fin side,
And mini-fan is connect by gas-guide tube with heat conducting pipe conductor, first layers of copper upper surface is coated with tin coating.
It is as above-mentioned technical proposal to further describe:
First heat-conducting plate and the second heat-conducting plate are symmetrical about substrate.
It is as above-mentioned technical proposal to further describe:
First heat-conducting plate and the second heat-conducting plate pass through heat conductive silica gel to be fixed with substrate bonding.
It is as above-mentioned technical proposal to further describe:
There are four the circular through hole opens up altogether, and four circular through holes are in same level, and adjacent two is round logical
Spacing between hole is equal.
It is as above-mentioned technical proposal to further describe:
First layers of copper and the second layers of copper are symmetrical about substrate.
The beneficial effects of the utility model are: heat dissipation performance is greatly improved, specifically: the upper surface of substrate first is located at
The two sides of first layers of copper are bonded with the first heat-conducting plate, and the first heat-conducting plate upper surface is equidistantly welded with the first cooling fin, under substrate
The two sides that surface is located at the second layers of copper are bonded with the second heat-conducting plate, and the lower surface of the second heat-conducting plate is equidistantly welded with the second heat dissipation
Item allows the temperature of substrate to be transferred to the first cooling fin and the second cooling fin by the first heat-conducting plate and the second heat-conducting plate,
It is dispersed into air, effectively improves its radiating efficiency, secondly such structure design, will can be used to be arranged the first of circuit
Layers of copper and the second layers of copper are arranged at the center of substrate, have the function of protection to it, when fixed, pass through the first cooling fin and the
Two cooling fins are supported fixation, and the circuit being arranged in its first layers of copper and the second layers of copper is made to be not easily susceptible to extrusion damage, secondly
Circular through hole is offered inside substrate, heat conducting pipe is embedded in circular through hole, the temperature of substrate is transferred in heat conducting pipe, miniature
It under the action of fan, can discharge the air into heat conducting pipe, absorb heat, radiate to substrate, further improve this
The heat dissipation performance of two-sided PCB circuit board facilitates it to further increase welding density, and extends the use longevity of electronic component
Life.
Detailed description of the invention
Fig. 1 is the whole the schematic diagram of the section structure of the two-sided PCB circuit board radiator structure of the utility model multi-layered high-density；
Fig. 2 is the schematic perspective view of the utility model substrate；
Fig. 3 is the structural schematic diagram of the first layers of copper of the utility model.
Marginal data:
1- substrate, the first insulating layer of 2-, the first layers of copper of 3-, the first heat-conducting plate of 4-, the first cooling fin of 5-, 6- second insulate
Layer, the second layers of copper of 7-, 8- conductive hole, the second heat-conducting plate of 9-, the second cooling fin of 10-, 11- circular through hole, 12- heat conducting pipe, 13- are led
Tracheae, 14- mini-fan, 15- tin coating.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.
Referring to Fig.1-3, the two-sided PCB circuit board radiator structure of multi-layered high-density provided in this embodiment comprising substrate 1,
The first insulating layer 2 is bonded at 1 upper surface center of substrate, and 2 upper surface of the first insulating layer is bonded with for circuit to be arranged
One layers of copper 3, the two sides that 1 upper surface of substrate is located at the first layers of copper 3 are symmetrically arranged with the first heat-conducting plate 4, and table on the first heat-conducting plate 4
Face is equidistantly welded with multiple first cooling fins 5, and substrate is bonded with second insulating layer 6, and second insulating layer 6 at 1 lower surface center
Lower surface bonds have the second layers of copper 7 for circuit to be arranged, and conductive hole 8 is offered on substrate 1, and 1 lower surface of substrate is located at second
The two sides of layers of copper 7 are symmetrically arranged with the second heat-conducting plate 9, and 9 lower surface of the second heat-conducting plate is equidistantly welded with multiple second cooling fins
10, circular through hole 11 is offered at the inside center of substrate 1, and heat conducting pipe 12, the first cooling fin 5 are embedded with inside circular through hole 11
Fixed mini-fan 14 on the table wall of side, and mini-fan 14 is connect by gas-guide tube 13 with 12 conductor of heat conducting pipe, the first bronze medal
3 upper surface of layer are coated with tin coating 15.
First heat-conducting plate 4 and the second heat-conducting plate 9 are symmetrical about substrate 1, and the first heat-conducting plate 4 and the second heat-conducting plate 9 are
It is adhesively fixed by heat conductive silica gel and substrate 1, there are four circular through hole 11 opens up altogether, and four circular through holes 11 are in same water
In plane, the spacing between adjacent two circular through hole 11 is equal, and the first layers of copper 3 and the second layers of copper 7 are symmetrical about substrate 1,
The height of first cooling fin 5 is greater than the thickness of the first layers of copper 3.
Working principle: the two-sided PCB circuit board of the multi-layered high-density is fixed on specified position, in welding electronic component it
Afterwards, be powered, can PCB circuit board enter working condition；In the use, electronic component adstante febre, the first heat of substrate 1 of being powered
Amount can be transferred on the first cooling fin 6 and the second cooling fin 10 by the first heat-conducting plate 4 and the second heat-conducting plate 9, be dissipated by first
Backing 6 and the second cooling fin 10 are contacted with air and are radiated, while can open mini-fan 14, are inhaled by mini-fan 14
Enter air to be drained into heat conducting pipe 12, the heat of 12 absorptive substrate 1 of heat conducting pipe is dispersed into air, is carried out it further
Heat dissipation, the two-sided PCB circuit board radiator structure of the multi-layered high-density, rationally, thermal diffusivity is good for design, convenient for promoting the use of.
The preferable specific embodiment of the above, only the utility model, but the protection scope of the utility model is not
It is confined to this, anyone skilled in the art is within the technical scope disclosed by the utility model, practical according to this
Novel technical solution and its utility model design are subject to equivalent substitution or change, should all cover the protection model in the utility model
Within enclosing.
Claims (5)
1. the two-sided PCB circuit board radiator structure of multi-layered high-density, including substrate (1), which is characterized in that table on the substrate (1)
It is bonded at the center of face the first insulating layer (2), and the first insulating layer (2) upper surface is bonded with the first layers of copper for circuit to be arranged
(3), the two sides that substrate (1) upper surface is located at the first layers of copper (3) are symmetrically arranged with the first heat-conducting plate (4), and first is thermally conductive
Plate (4) upper surface is equidistantly welded with multiple first cooling fins (5), is bonded with the second insulation at substrate (1) the lower surface center
Layer (6), and second insulating layer (6) lower surface bonds have the second layers of copper (7) for circuit to be arranged, and open up on the substrate (1)
Having conductive hole (8), the two sides that substrate (1) lower surface is located at the second layers of copper (7) are symmetrically arranged with the second heat-conducting plate (9), and
Second heat-conducting plate (9) lower surface is equidistantly welded with multiple second cooling fins (10), offers at the inside center of the substrate (1)
Circular through hole (11), and heat conducting pipe (12) are embedded with inside circular through hole (11), it is fixed on the table wall of the first cooling fin (5) side
Mini-fan (14), and mini-fan (14) is connect by gas-guide tube (13) with heat conducting pipe (12) conductor, first layers of copper
(3) upper surface is coated with tin coating (15).
2. the two-sided PCB circuit board radiator structure of multi-layered high-density according to claim 1, which is characterized in that described first
Heat-conducting plate (4) and the second heat-conducting plate (9) are symmetrical about substrate (1).
3. the two-sided PCB circuit board radiator structure of multi-layered high-density according to claim 1, which is characterized in that described first
Heat-conducting plate (4) and the second heat-conducting plate (9) are adhesively fixed by heat conductive silica gel with substrate (1).
4. the two-sided PCB circuit board radiator structure of multi-layered high-density according to claim 1, which is characterized in that the circle
There are four through-hole (11) opens up altogether, and four circular through holes (11) are in same level, adjacent two circular through hole (11) it
Between spacing it is equal.
5. the two-sided PCB circuit board radiator structure of multi-layered high-density according to claim 1, which is characterized in that described first
Layers of copper (3) and the second layers of copper (7) are symmetrical about substrate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820985238.8U CN208317104U (en) | 2018-06-26 | 2018-06-26 | The two-sided PCB circuit board radiator structure of multi-layered high-density |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820985238.8U CN208317104U (en) | 2018-06-26 | 2018-06-26 | The two-sided PCB circuit board radiator structure of multi-layered high-density |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208317104U true CN208317104U (en) | 2019-01-01 |
Family
ID=64708715
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820985238.8U Active CN208317104U (en) | 2018-06-26 | 2018-06-26 | The two-sided PCB circuit board radiator structure of multi-layered high-density |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208317104U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110012609A (en) * | 2019-05-10 | 2019-07-12 | 四川海英电子科技有限公司 | The combination process of high-thermal conductive metal circuit board |
| CN112601347A (en) * | 2020-12-22 | 2021-04-02 | 京东方科技集团股份有限公司 | PCB assembly and display module |
-
2018
- 2018-06-26 CN CN201820985238.8U patent/CN208317104U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110012609A (en) * | 2019-05-10 | 2019-07-12 | 四川海英电子科技有限公司 | The combination process of high-thermal conductive metal circuit board |
| CN112601347A (en) * | 2020-12-22 | 2021-04-02 | 京东方科技集团股份有限公司 | PCB assembly and display module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Heat dissipation structure of multi-layer high-density double-sided PCB circuit board Effective date of registration: 20231205 Granted publication date: 20190101 Pledgee: Industrial and Commercial Bank of China Limited Fengshun Branch Pledgor: FENGSHUN COUNTY JINSHUN TECHNOLOGY CO.,LTD. Registration number: Y2023980069316 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |