CN208159088U - A kind of cooling encapsulation device - Google Patents
A kind of cooling encapsulation device Download PDFInfo
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- CN208159088U CN208159088U CN201820481983.9U CN201820481983U CN208159088U CN 208159088 U CN208159088 U CN 208159088U CN 201820481983 U CN201820481983 U CN 201820481983U CN 208159088 U CN208159088 U CN 208159088U
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- radiator
- electronic component
- encapsulation device
- liquid metal
- groove
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Abstract
The utility model discloses a kind of cooling encapsulation devices, including electronic component, liquid metal sheet, sealing ring and radiator；Wherein, groove is equipped on the substrate of the radiator, the liquid metal sheet is placed in the groove, the sealing ring is placed on the sheet metal, electronic component is fixedly mounted in the groove of radiator；The electronic component, sealing ring and radiator form confined space, and the liquid metal sheet is sealed in the confined space.A kind of cooling encapsulation device provided by the utility model, using liquid metal as boundary material, utilize the feature that its high heat conductance, good mobility and service life are long, it can be good at reducing the thermal contact resistance between heater element and radiator, greatly improve the radiating efficiency of radiator, it is in the temperature of electronic component within safety standard, ensure that the normal operation of equipment.
Description
Technical field
The utility model relates to electronic radiation technical field more particularly to a kind of cooling encapsulation devices.
Background technique
With the development of electronic technology, the electronic component function in electronic product is more and more stronger, but its calorific value is also got over
Come it is bigger, calorific value will lead to greatly be electronic component temperature increase, when the temperature of electronic component be more than its heatproof upper limit when can make
At component wear.Therefore, it is necessary to radiate to element.Electronic component is often mounted in radiator surface and radiates.
The heat of element will be taken away by radiator by air or coolant liquid.But electronic component is contacted with radiator or water-cooled plate
There can be gap between face, be full of air in gap.Since the thermal conductivity of air is very low, about 0.03wm-1·K-1, lead to device
Thermal resistance between part and radiator contact surface is very big.Thermal resistance between contact surface is referred to as thermal contact resistance, and thermal contact resistance is very big to be led
Causing the heat of element cannot efficiently be transmitted in radiator or water-cooled plate, to hinder element radiating.Reduce thermal contact resistance
Conventional means mainly solid-state heat-conducting cream of the addition with mobility between contact surface, such as silicone grease, or there is height flexible
Electronic component is being pressed on by spreader surface by pressing device after heat conductive elastomeric gasket such as silica gel pad, is utilizing lotion
The air gap of filling contact surface is gone in the elastic deformation of mobility or gasket, reduces thermal contact resistance.But either silicone grease is still
Gasket all has the following disadvantages：
1) since own material properties cause them that cannot adequately fill up contact surface, cause between element and radiator still
So there are the air gap, thermal contact resistance is big；
2) thermal conductivity of solid-state heat-conducting cream or elastomeric pad is lower；
3) using solid-state heat-conducting cream as when boundary material, packaged type is complicated, and heat conducting paste thickness control is difficult, and with
Time passage, heat-conducting cream are easy dehydration and lose flowability, cannot fill gap, increase thermal contact resistance instead；
4) using silica gel pad as when boundary material, silica gel pad is due to cooling by heating repeatedly, it is easier to aging.
It is still larger that these disadvantages will lead to the thermal contact resistance between electronic component and radiator, is unfavorable for element radiating.
That there are thermal resistances is big as boundary material for i.e. conventional heat-conducting cream, mobility is bad causes thermal contact resistance to increase and long
The defects of causing interface resistance to increase easy to aging after the heating of time is cooling, it is unfavorable for the heat dissipation of electronic component using heat-conducting cream.
Utility model content
The utility model provides a kind of cooling encapsulation device, utilizes the high heat conductance of liquid metal, good mobility
And service life long safe and harmless feature, effectively improve the heat dissipation of electronic component.
The utility model provides a kind of cooling encapsulation device, including electronic component, liquid metal sheet, sealing ring and heat dissipation dress
It sets；Wherein, groove is equipped on the substrate of the radiator, the liquid metal sheet is placed in the groove, described
The sealing ring is placed on sheet metal, and electronic component is fixedly mounted in the groove of radiator；The electronic component, sealing
Circle and radiator form confined space, and the liquid metal sheet is sealed in the confined space.
In cooling encapsulation device provided by the utility model, the shape of the groove and the outer contour shape of electronic component
Identical, the size of the electronic component is less than the size of groove, forms gap between the two.
In cooling encapsulation device provided by the utility model, the sealing ring is high-temperature resistant elastic rubber circle.
In cooling encapsulation device provided by the utility model, the thickness of the sealing ring is greater than the size in the gap,
The sealing ring forms interference filling between the electronic component and groove, forms confined space.
In cooling encapsulation device provided by the utility model, the radiator is air-cooled radiator.
In cooling encapsulation device provided by the utility model, the radiator is water-cooled plate.
In cooling encapsulation device provided by the utility model, the liquid metal sheet is 60 DEG C and the above are liquid, 60
DEG C the following are solid high thermal conductivity liquid metal materials.
In cooling encapsulation device provided by the utility model, the radiator is by aluminium alloy or high thermal conductivity plastics system
At.
In cooling encapsulation device provided by the utility model, the electronic component is in IGBT, resistance and rectifier bridge
It is one or more.
In cooling encapsulation device provided by the utility model, the electronic component is fixed by screws in the heat dissipation dress
It sets.
A kind of cooling encapsulation device provided by the utility model utilizes its high fever using liquid metal as boundary material
The feature of conductance, good mobility and service life length can be good at reducing the thermal contact resistance between heater element and radiator, pole
The earth improves the radiating efficiency of radiator, is in the temperature of electronic component within safety standard, ensure that equipment just
Often operation.Well contacting between heat-generating electronic elements and radiator keeps the integral heat sink of radiator more efficient, existing
Temperature rise standard under heat sink size can be done small, save heat dissipation cost.The packaged type of the utility model is simple, operation
Fast, without additional encapsulation tool, so that equipment is easier to safeguard.
Detailed description of the invention
In order to illustrate more clearly of the utility model embodiment technical solution, will make below to required in embodiment description
Attached drawing is briefly described, it should be apparent that, the accompanying drawings in the following description is some embodiments of the utility model, for
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing.
Fig. 1 is a kind of structural schematic diagram of cooling encapsulation device provided by the embodiment of the utility model；
Fig. 2 is the encapsulation schematic diagram of cooling encapsulation device shown in Fig. 1；
Fig. 3 is the sectional view of cooling encapsulation device shown in Fig. 1；
Fig. 4 is a kind of structural schematic diagram of cooling encapsulation device provided by the embodiment of the utility model；
Fig. 5 is a kind of structural schematic diagram of cooling encapsulation device provided by the embodiment of the utility model.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
It clearly and completely describes, it is clear that the embodiments are a part of the embodiments of the present invention, rather than whole implementation
Example.Based on the embodiments of the present invention, those of ordinary skill in the art are obtained without making creative work
The every other embodiment obtained, fall within the protection scope of the utility model.
The direction term that the utility model is previously mentioned, for example, "upper", "lower", "front", "rear", "left", "right", "inner", "
Outside ", " side " etc. is only the direction with reference to annexed drawings.Therefore, the direction term used is to illustrate and understand that this is practical
It is novel, rather than to limit the utility model.
In Fig. 1 into Fig. 5, structurally similar or identical structure is to be given the same reference numerals.
It please refers to Fig.1 to Fig.3, Fig. 1 is the structural schematic diagram of cooling encapsulation device in the present embodiment, and Fig. 2 is to dissipate shown in Fig. 1
The encapsulation schematic diagram of assembling device is sealed, Fig. 3 is the sectional view of cooling encapsulation device shown in Fig. 1.The cooling encapsulation device includes electricity
Subcomponent 1, liquid metal sheet 2, sealing ring 3, radiator 5.Wherein, groove 4 is equipped on the substrate of radiator 5, to
Place electronic component.Liquid metal sheet 2 is placed in groove 4, is placed sealing ring 3 thereon, electronic component 1 is fixedly mounted on scattered
In the groove 4 of thermal 5.Electronic component 1, sealing ring 3 and radiator 5 form confined space, and liquid metal sheet 2 is sealed in institute
It states in confined space.
In one embodiment, the shape of groove 4 is identical as the outer contour shape of electronic component 1, can be rectangle, can also be with
It is round or oval, is not particularly limited herein.
The size of groove 4 is more slightly larger than the outer profile size of electronic component 1, and in some embodiments, the size of groove 4 is than electricity
Big 1mm of the outer profile size of subcomponent 1 or so, there are a certain size gaps between electronic component 1 and groove 4, convenient for putting
Sealing ring is set, confined space is formed.
Electronic component 1 can be screwed on the substrate for being mounted on radiator 5, can also be filled by compressions such as buckles
It sets or other modes is fixed on radiator 5, be not particularly limited herein.
In one embodiment, sealing ring 5 is high temperature resistant and flexible rubber ring, and the thickness of rubber ring is than above-mentioned electronics
Gap between element 1 and groove 4 is big, by the elastic reaction of rubber ring, forms interference between electronic component 1 and groove and fills out
It fills, forms confined space, liquid metal sheet 2 is sealed in the groove 4 of electronic component 1 and radiator 5.
In one embodiment, liquid metal sheet is 60 DEG C and the above are liquid, and 60 DEG C the following are solid high thermal conductivity liquid
Metal material, when the temperature of electronic component 1 reaches 60 DEG C above, liquid metal sheet is undergone phase transition, and becomes liquid from solid-state, due to hair
A large amount of latent heats of phase change are absorbed when raw phase transformation and temperature change does not occur substantially (may exist in slight temperature in actual use
Rise), therefore temperature rise that can be violent to avoid electronic component 1.It is particularly suitable for the electronic component 1 or week to golf calorific value in short-term
The electronic component 1 of phase property height fever radiates, and heat dissipation cost can be greatly reduced.
The liquid metal sheet that the utility model uses can be by solid state transformed for liquid when its temperature is at 60 DEG C or more.Room
The lower liquid metal of temperature is solid-state, facilitates and fits together electronic component 1, liquid metal sheet 2, radiator 5；When reaching liquid
When the phase transformation temperature points of sheet metal 2 can by it is solid state transformed be liquid, be sufficient filling with full electronics member using the excellent mobility of liquid
Contact gap between part and radiator；As boundary material, the thermal conductivity of liquid metal is much higher than silicone grease and silica gel pad, energy
Heat sink size can be done small, saving by the radiating efficiency for effectively improving radiator entirety under existing temperature rise standard
Heat dissipation cost；Good cycle, long service life.
The present embodiment, as heat-transfer matcrial, utilizes the high heat conductance of liquid metal, good flowing using liquid metal sheet
Property and service life long safe and harmless feature, reduce the interface resistance between electronic component 1 and radiator 5, increase electronics member
Part 1 avoids leading to electricity because the temperature of electronic component 1 cannot be transmitted in time radiator 5 to the heat-transfer capability of radiator 5
Subcomponent 1 rapidly heats up, and damages electronic component 1.
The cooling encapsulation device that the utility model embodiment proposes, by the way that groove 4, benefit is arranged on the surface of radiator 5
Liquid metal sheet 2 is encapsulated in electronic component 1, the groove 4 on radiator 5 and sealing with the interference of elastic seal ring 3 effect
In 3 confined space that surrounds of circle, liquid metal sheet 2 becomes liquid and leaks out when preventing because of high temperature, avoids letting out because of liquid metal
Dew cause electronic component 1 short circuit, burn into overtemperature generation, it is ensured that electronic equipment it is safe and reliable.Meanwhile the utility model
The packaged type of embodiment is easy to operate, maintains easily.
In one embodiment, radiator 5 is air-cooled radiator, back to the one side of radiating fin on the substrate of radiator
Groove 4 is set, it is of course also possible to which groove 4 is arranged in the one side in the side of radiator back to radiating fin, referring to fig. 4, for recessed
The installation site of slot 4 and electronic component 1 is not specifically limited herein.
Referring to Fig. 5, Fig. 5 is a kind of structural schematic diagram of cooling encapsulation device provided by the embodiment of the utility model,
In other embodiments, radiator 5 is liquid cooling heat radiator, i.e. water-cooled plate.Groove 4 is set on the main radiating surface of water-cooled plate, is used
To install electronic component 1.
In one embodiment, electronic component 1 is that (Insulated Gate Bipolar Transistor, that is, insulate IGBT
Grid bipolar junction transistor), resistance, one of elements such as rectifier bridge or a variety of, since liquid metal is applicable in as boundary material
In a variety of electronic components, it is not particularly limited herein.
In one embodiment, radiator 5 can be processed by modes such as profile, die casting, inserted sheet, CNC.In order to which electronics is first
The heat that part 1 generates distributes, which is made of heat-conducting.Specifically, in one embodiment, the radiator
It can be heat dissipation metal material, be the cooling materials such as aluminium alloy, copper for example, or other Heat Conduction Materials, as high thermal conductivity is moulded
Material.
In certain application scenarios, the cooling encapsulation device that the utility model embodiment proposes generates heat suitable for electronic component
It measures in biggish air cooler, such as radiates to the IGBT module of frequency converter.IGBT switching frequency in usual frequency converter compared with
Height, calorific value is larger, needs to blow radiator by fan to reduce the temperature for the IGBT element being installed on a heat sink.Therefore it is available
The utility model reduces the thermal contact resistance between IGBT and radiator, improving radiating effect.And it can also using this packaged type
Realize Quick overhaul equipment or element replacement.
In other application scenarios, the cooling encapsulation device that the utility model embodiment proposes is suitable for new-energy automobile
The heat dissipation of IGBT element in auxiliary control system.IGBT is with the operation switching frequency such as start and stop of automobile in new-energy automobile auxiliary control system
Quickly, calorific value is very big.This class component often uses water-cooling.Likewise, outputing groove, in water-cooled plate with liquid gold
Belong to and be used as boundary material, is sealed with sealing ring.That is the packaged type of the utility model is equally applicable to water-cooled plate.IGBT member
Part is mounted in the groove in water-cooled plate, is fixed by screws in water-cooled plate.It is used between the bottom and water-cooled plate of IGBT element
Liquid metal is as boundary material.And the gap between IGBT element side and water-cooled plate groove side is embedded by sealing ring and is worked as
In.Sealing ring is compressed using interference fit to achieve the purpose that sealing.
A kind of cooling encapsulation device provided by the utility model utilizes its high fever using liquid metal as boundary material
The feature of conductance, good mobility and service life length can be good at reducing the thermal contact resistance between heater element and radiator, pole
The earth improves the radiating efficiency of radiator, is in the temperature of electronic component within safety standard, ensure that equipment just
Often operation.Well contacting between heat-generating electronic elements and radiator keeps the integral heat sink of radiator more efficient, existing
Temperature rise standard under heat sink size can be done small, save heat dissipation cost.The packaged type of the utility model is simple, operation
Fast, without additional encapsulation tool, so that equipment is easier to safeguard.
The interference fit by elastic seal ring of the utility model seals liquid metal sheet in the enclosed space, prevents
When higher because of electronic element radiating temperature, liquid metal, which is undergone phase transition, to be become liquid and leaks out, avoid electrical short, corrosion and
The generation of overtemperature improves the reliability of safety and electronic equipment that liquid metal uses.
In the above-described embodiments, it all emphasizes particularly on different fields to the description of each embodiment, is not described in some embodiment
Part, reference can be made to the related descriptions of other embodiments.
Obviously, it is practical without departing from this can to carry out various modification and variations to the utility model by those skilled in the art
Novel spirit and scope.In this way, even these modifications and variations of the present invention belong to the utility model claims and
Within the scope of its equivalent technologies, then the utility model is also intended to include these modifications and variations.
Above description is only a specific implementation of the present invention, but the protection scope of the utility model is not limited to
In this, anyone skilled in the art within the technical scope disclosed by the utility model, can be readily occurred in various
Equivalent modifications or substitutions, these modifications or substitutions should be covered within the scope of the utility model.Therefore, this is practical
Novel protection scope should be subject to the protection scope in claims.
Claims (10)
1. a kind of cooling encapsulation device, which is characterized in that including electronic component, liquid metal sheet, sealing ring and radiator；Its
In, groove is equipped on the substrate of the radiator, the liquid metal sheet is placed in the groove, in the sheet metal
It is upper to place the sealing ring, electronic component is fixedly mounted in the groove of radiator；The electronic component, sealing ring and dissipate
Thermal forms confined space, and the liquid metal sheet is sealed in the confined space.
2. cooling encapsulation device according to claim 1, which is characterized in that the shape of the groove and electronic component it is outer
Chamfered shape is identical, and the size of the electronic component is less than the size of groove, forms gap between the two.
3. cooling encapsulation device according to claim 2, which is characterized in that the sealing ring is high-temperature resistant elastic rubber
Circle.
4. cooling encapsulation device according to claim 3, which is characterized in that the thickness of the sealing ring is greater than the gap
Size, the sealing ring formed between the electronic component and groove interference filling, formed confined space.
5. cooling encapsulation device according to claim 1, which is characterized in that the radiator is air-cooled radiator.
6. cooling encapsulation device according to claim 1, which is characterized in that the radiator is water-cooled plate.
7. cooling encapsulation device according to claim 1, which is characterized in that the liquid metal sheet be 60 DEG C and the above are
Liquid, 60 DEG C the following are solid high thermal conductivity liquid metal materials.
8. cooling encapsulation device according to claim 1, which is characterized in that the radiator is by aluminium alloy or high thermal conductivity
Plastics are made.
9. cooling encapsulation device according to claim 1, which is characterized in that the electronic component is IGBT, resistance and whole
Flow one of bridge or a variety of.
10. cooling encapsulation device according to claim 1, which is characterized in that the electronic component is fixed by screws in
On the radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820481983.9U CN208159088U (en) | 2018-03-30 | 2018-03-30 | A kind of cooling encapsulation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820481983.9U CN208159088U (en) | 2018-03-30 | 2018-03-30 | A kind of cooling encapsulation device |
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| Publication Number | Publication Date |
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| CN208159088U true CN208159088U (en) | 2018-11-27 |
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| CN201820481983.9U Active CN208159088U (en) | 2018-03-30 | 2018-03-30 | A kind of cooling encapsulation device |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109729699A (en) * | 2019-01-11 | 2019-05-07 | 厦门大学 | A kind of phase transformation graphene heat-conducting pad, preparation method and applications |
| CN110343927A (en) * | 2019-07-18 | 2019-10-18 | 深圳前海量子翼纳米碳科技有限公司 | A method of reducing liquid metal alloy thermally conductive sheet thermal resistance |
| CN113395870A (en) * | 2020-03-13 | 2021-09-14 | 兆勤科技股份有限公司 | Heat sink device |
| CN113784583A (en) * | 2021-08-17 | 2021-12-10 | 北京自动化控制设备研究所 | Heat radiation structure, power driver and electric servo device |
| CN113889444A (en) * | 2021-09-13 | 2022-01-04 | 云南中宣液态金属科技有限公司 | Packaging structure and packaging method of circuit board containing liquid metal and circuit board |
| EP4113247A1 (en) * | 2021-06-30 | 2023-01-04 | Micro-Star Int'l Co., Limited | Heat dissipation structure assembly |
| CN115666109A (en) * | 2022-11-28 | 2023-01-31 | 荣耀终端有限公司 | Heat-conducting film, preparation method, electronic component, circuit board assembly and electronic equipment |
-
2018
- 2018-03-30 CN CN201820481983.9U patent/CN208159088U/en active Active
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109729699A (en) * | 2019-01-11 | 2019-05-07 | 厦门大学 | A kind of phase transformation graphene heat-conducting pad, preparation method and applications |
| CN109729699B (en) * | 2019-01-11 | 2020-08-11 | 厦门大学 | Phase-change graphene heat-conducting gasket, preparation method and application thereof |
| CN110343927A (en) * | 2019-07-18 | 2019-10-18 | 深圳前海量子翼纳米碳科技有限公司 | A method of reducing liquid metal alloy thermally conductive sheet thermal resistance |
| CN110343927B (en) * | 2019-07-18 | 2021-01-08 | 深圳前海量子翼纳米碳科技有限公司 | Method for reducing thermal resistance of liquid metal alloy heat-conducting fin |
| CN113395870A (en) * | 2020-03-13 | 2021-09-14 | 兆勤科技股份有限公司 | Heat sink device |
| EP4113247A1 (en) * | 2021-06-30 | 2023-01-04 | Micro-Star Int'l Co., Limited | Heat dissipation structure assembly |
| CN113784583A (en) * | 2021-08-17 | 2021-12-10 | 北京自动化控制设备研究所 | Heat radiation structure, power driver and electric servo device |
| CN113784583B (en) * | 2021-08-17 | 2024-05-03 | 北京自动化控制设备研究所 | Heat radiation structure, power driver and electric servo device |
| CN113889444A (en) * | 2021-09-13 | 2022-01-04 | 云南中宣液态金属科技有限公司 | Packaging structure and packaging method of circuit board containing liquid metal and circuit board |
| CN115666109A (en) * | 2022-11-28 | 2023-01-31 | 荣耀终端有限公司 | Heat-conducting film, preparation method, electronic component, circuit board assembly and electronic equipment |
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