CN2063334U - Metal printed circuit board - Google Patents
Metal printed circuit board Download PDFInfo
- Publication number
- CN2063334U CN2063334U CN 89216575 CN89216575U CN2063334U CN 2063334 U CN2063334 U CN 2063334U CN 89216575 CN89216575 CN 89216575 CN 89216575 U CN89216575 U CN 89216575U CN 2063334 U CN2063334 U CN 2063334U
- Authority
- CN
- China
- Prior art keywords
- plate
- clad plate
- metal printing
- printing plate
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model discloses a metal printing plate and a copper clad plate, which use aluminum or aluminum alloy as a base plate. An oxide film layer is obtained through the existing anodized method. The oxide film layer is bonded with electrolytic copper foil with a certain shape to form the metal printing plate taking the metallic aluminum as the base plate. The metal printing plate and the copper clad plate have relatively good heat dissipation performance. The utility model has the advantages of high strength, low cost and good electromagnetic shielding performance. The metal printing plate and the copper clad plate can resist a breakdown voltage of 300 V and can be applied to extensive electronic industries and integrated circuits, especially to semiconductor refrigerators. The existing ceramic pieces are replaced, and because the utility model has relatively good heat dispersion performance, the performance of the refrigerators can be improved and technological operation is simplified.
Description
Metal printed circuit board and copper-clad plate belong to the used in electronic industry material.The copper-clad plate of existing used in electronic industry and printed board are paper or the glass cloth of crossing with resin impregnating, or pottery is with resin etc., again with the electrolytic copper foil hot pressing of definite shape together, the resin that forms to insulate is the copper-clad plate and the printed board of substrate.Because it is to be substrate with resin or pottery, its heat-conductive characteristic is lower, is unfavorable for heat radiation, so it can not be applied on the thermoelectric cooling module of refrigeration and constant temperature.
Printed board of this metal and copper-clad plate are in order to improve heat-conductive characteristic, to enlarge the range of application of printed board and copper-clad plate.
This plate is achieved in that it is is substrate with aluminum or aluminum alloy (existing mostly be almag), forms oxidation film layer by anodized method on substrate, with binding agent with the electrolytic copper foil hot pressing of definite shape on oxidation film layer.It has anti-300 volts puncture voltage, can use in the scope of-150C-120C, and its heat dispersion is the height of substrate than resin or pottery significantly.
Concrete structure is provided by accompanying drawing: on the surface of aluminum or aluminum alloy ［ 1 ］ is an aluminium oxide rete ［ 2 ］, and a layer binder ［ 3 ］ is arranged on the rete, is the Copper Foil of definite shape on binding agent.What accompanying drawing provided is single sided board, also can make printed board and the copper-clad plate that all there is Copper Foil on the two sides according to need.
The advantage of this plate is: heat-conductive characteristic is good, be convenient to heat radiation, with comparing of resin plate, its intensity has increased, but also good capability of electromagnetic shielding is arranged, enlarge the range of application of original printed board, for example be applied on the semiconductor cooler, can replace existing ceramic material, not only can improve the refrigerator performance, increase toughness, and simplified technology, reduced cost.
Example: printed board of this metal and copper-clad plate, getting the thick aluminum or aluminum alloy of 1-2MM is substrate, generates the layer oxide film layer on its surface by anodized method, adopts industrial current technology.Its flow process is as follows:
The alkaline etching sealing is handled
Aluminium is wiped out the sun baking
Base oil flowing water cleans utmost point flowing water and cleans
Material is cut dirtization and is done
Remove oxide
This plate process using sulfur acid anodizing method, can obtain water white transparency or translucent aluminium oxide rete, the about 25-30 μ of its thicknesses of layers M, anti-300 volts of puncture voltage, being coated with on alumina surface with phenolic resins be that the electrolytic copper foil of binding agent and definite shape is hot pressed into the metallic aluminium is the printed board and the copper-clad plate of substrate, adopts existing industrial phenolic resin curing condition; Temperature 170-175C, pressure 10-20Kg/CM, hot pressing time 50-60 branch, 1 hour cooling time.
Industrially existingly produce printed board and be: in copper-clad plate, through photoetch or stencil, the reserve part Copper Foil claims printed board selectively. At present new method is, without the copper-clad plate process, has left and taken selectively the Copper Foil shape, again take resin as binding agent hot pressing on the substrates such as resin. The method can be saved a large amount of copper, is reasonable method.
This printed board can be used on the integrated circuit, particularly is used on the existing semiconductor cooler, and the ceramic material of the poor-performing that can replace dispelling the heat not only can improve the refrigerator performance, preferably electromagnetic wave shielding is arranged, and simplified technical process, has reduced cost.
Claims (2)
1, a kind of is the copper-clad plate or the printed board of substrate with paper, glass cloth, pottery etc., it is characterized in that with the aluminum or aluminum alloy being substrate, growth one deck aluminium oxide rete on its substrate surface is again with the metal copper-clad plate of electrolytic copper foil hot pressing all-in-one-piece or the Metal printed circuit board of definite shape.
2, Metal printed circuit board and the metal copper-clad plate of saying according to claim 1 is characterized in that its plate can be a single face, also can be the two-sided electrolytic copper foil that all has.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 89216575 CN2063334U (en) | 1989-09-04 | 1989-09-04 | Metal printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 89216575 CN2063334U (en) | 1989-09-04 | 1989-09-04 | Metal printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2063334U true CN2063334U (en) | 1990-10-03 |
Family
ID=4872004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 89216575 Withdrawn CN2063334U (en) | 1989-09-04 | 1989-09-04 | Metal printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2063334U (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100342527C (en) * | 2002-12-27 | 2007-10-10 | 三菱麻铁里亚尔株式会社 | Heat conductive multilayer substrate and substrate for power module |
| CN100437665C (en) * | 2002-11-18 | 2008-11-26 | 深圳富泰宏精密工业有限公司 | Name plate and processing method thereof |
| CN102442025A (en) * | 2011-09-08 | 2012-05-09 | 深圳市必事达电子有限公司 | Manufacturing method of heat dissipation aluminum substrate |
| CN102605355A (en) * | 2012-02-21 | 2012-07-25 | 北京化工大学 | Copper film on surface of substrate as well preparation method and application thereof |
| CN101145428B (en) * | 2007-07-31 | 2012-10-10 | 上海美星电子有限公司 | Low spoilage module type transformer packaging structure |
| CN106029955A (en) * | 2013-11-15 | 2016-10-12 | 康桥纳诺塞姆有限公司 | Flexible electronic substrate |
| CN108461616A (en) * | 2018-05-21 | 2018-08-28 | 杭州电子科技大学 | A kind of great power LED detaches the packaging method of radiator structure with thermoelectricity |
| CN108630799A (en) * | 2018-05-21 | 2018-10-09 | 杭州电子科技大学 | A kind of great power LED thermoelectricity separation radiator structure |
-
1989
- 1989-09-04 CN CN 89216575 patent/CN2063334U/en not_active Withdrawn
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100437665C (en) * | 2002-11-18 | 2008-11-26 | 深圳富泰宏精密工业有限公司 | Name plate and processing method thereof |
| CN100342527C (en) * | 2002-12-27 | 2007-10-10 | 三菱麻铁里亚尔株式会社 | Heat conductive multilayer substrate and substrate for power module |
| CN101145428B (en) * | 2007-07-31 | 2012-10-10 | 上海美星电子有限公司 | Low spoilage module type transformer packaging structure |
| CN102442025A (en) * | 2011-09-08 | 2012-05-09 | 深圳市必事达电子有限公司 | Manufacturing method of heat dissipation aluminum substrate |
| CN102605355A (en) * | 2012-02-21 | 2012-07-25 | 北京化工大学 | Copper film on surface of substrate as well preparation method and application thereof |
| CN102605355B (en) * | 2012-02-21 | 2014-07-02 | 北京化工大学 | Copper film on surface of substrate as well preparation method and application thereof |
| CN106029955A (en) * | 2013-11-15 | 2016-10-12 | 康桥纳诺塞姆有限公司 | Flexible electronic substrate |
| CN106134302A (en) * | 2013-11-15 | 2016-11-16 | 康桥纳诺塞姆有限公司 | There is the metal basal board of insulation via |
| CN106029955B (en) * | 2013-11-15 | 2018-01-09 | 康桥纳诺塞姆有限公司 | Flexible electronic substrate |
| US10299374B2 (en) | 2013-11-15 | 2019-05-21 | Cambridge Nanotherm Limited | Flexible electronic substrate |
| CN108461616A (en) * | 2018-05-21 | 2018-08-28 | 杭州电子科技大学 | A kind of great power LED detaches the packaging method of radiator structure with thermoelectricity |
| CN108630799A (en) * | 2018-05-21 | 2018-10-09 | 杭州电子科技大学 | A kind of great power LED thermoelectricity separation radiator structure |
| CN108461616B (en) * | 2018-05-21 | 2020-08-07 | 杭州电子科技大学 | Packaging method of thermoelectric separation heat dissipation structure for high-power L ED |
| CN108630799B (en) * | 2018-05-21 | 2020-08-07 | 杭州电子科技大学 | Thermoelectric separation heat radiation structure for high-power L ED |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |