CN210617477U - Heat dissipation epoxy phenolic glass cloth double-sided copper-clad plate - Google Patents
Heat dissipation epoxy phenolic glass cloth double-sided copper-clad plate Download PDFInfo
- Publication number
- CN210617477U CN210617477U CN201921448802.3U CN201921448802U CN210617477U CN 210617477 U CN210617477 U CN 210617477U CN 201921448802 U CN201921448802 U CN 201921448802U CN 210617477 U CN210617477 U CN 210617477U
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- CN
- China
- Prior art keywords
- glass cloth
- epoxy phenolic
- plate
- heat
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004744 fabric Substances 0.000 title claims abstract description 45
- 239000011521 glass Substances 0.000 title claims abstract description 45
- 239000004593 Epoxy Substances 0.000 title claims abstract description 42
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 title claims abstract description 34
- 230000017525 heat dissipation Effects 0.000 title claims description 10
- 239000000758 substrate Substances 0.000 claims abstract description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000011889 copper foil Substances 0.000 claims abstract description 13
- 230000002093 peripheral effect Effects 0.000 claims abstract description 5
- -1 phenolic aldehyde Chemical class 0.000 claims description 7
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 239000002383 tung oil Substances 0.000 claims description 6
- 238000007731 hot pressing Methods 0.000 claims description 5
- 229920003986 novolac Polymers 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 229910021389 graphene Inorganic materials 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 6
- 150000008064 anhydrides Chemical class 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Images
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- Laminated Bodies (AREA)
Abstract
The utility model discloses a double-sided copper-clad plate of thermal diffusivity epoxy phenolic glass cloth relates to copper-clad plate technical field. The utility model comprises an epoxy phenolic glass cloth substrate and copper foils coated on the two sides of the epoxy phenolic glass cloth substrate, wherein grooves are respectively arranged on the front and back sides of the epoxy phenolic glass cloth substrate, a heat conducting plate is embedded and fixed in the grooves, and the thickness of the grooves is the same as that of the heat conducting plate; the heat conducting plate comprises an outer edge part arranged on the peripheral side of the epoxy phenolic glass cloth substrate, and a connecting part is arranged in the middle of the outer edge part; the peripheral side of the outer edge part of the heat conducting plate is provided with a slot, and a radiating fin is fixedly inserted in the slot. The utility model discloses a heat-conducting plate through evenly distributed between copper foil and base plate exports the heat, simple manufacture, plate body stable in structure to utilize the fin to scatter and disappear the heat fast, reach quick radiating effect of heat conduction, can improve the life and the performance of copper-clad plate.
Description
Technical Field
The utility model belongs to the technical field of the copper-clad plate, especially relate to a thermal diffusivity epoxy phenolic glass cloth two-sided copper-clad plate.
Background
The copper-clad laminate is a plate-like material obtained by impregnating a reinforcing material with a resin and then hot-pressing the resin with a copper foil on one or both surfaces thereof. It is a basic material for PCB, often called substrate. When it is used for the production of multilayer boards, it is also called a core board.
Epoxy phenolic glass cloth has higher mechanical strength, and the electrical property stability is good under high humidity, is applicable to products such as machinery, electricity and electron, can improve PCB waterproof performance and toughening effect by tung oil anhydride modified phenolic epoxy resin, however, because tung oil anhydride heat distortion temperature is low, and current copper-clad plate thermal diffusivity is not strong enough, leads to the copper-clad plate to have long operating time under high temperature state, causes the sheet layer to separate easily, reduces life.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a thermal diffusivity epoxy phenolic glass cloth two-sided copper-clad plate has solved current copper-clad plate thermal diffusivity not strong enough, causes the sheet layer separation easily, reduces life's problem.
In order to solve the technical problem, the utility model discloses a realize through following technical scheme:
the utility model relates to a heat dissipation epoxy phenolic glass cloth double-sided copper-clad plate, which comprises an epoxy phenolic glass cloth substrate and copper foils coated on the double sides of the epoxy phenolic glass cloth substrate, wherein grooves are respectively arranged on the front and back surfaces of the epoxy phenolic glass cloth substrate, a heat-conducting plate is embedded and fixed in the grooves, and the thickness of the grooves is the same as that of the heat-conducting plate; the heat conducting plate comprises an outer edge part arranged on the peripheral side of the epoxy phenolic glass cloth substrate, and a connecting part is arranged in the middle of the outer edge part; slots are arranged on the periphery of the outer edge of the heat conducting plate, and radiating fins are fixedly inserted into the slots.
Further, the connecting part is in the shape of a rectangular strip arranged at equal intervals.
Furthermore, the material of the heat radiating fin is graphene.
Furthermore, the epoxy phenolic aldehyde glass cloth substrate is a substrate which is formed by impregnating alkali-free glass cloth with phenolic aldehyde epoxy resin and performing hot pressing.
Furthermore, the heat conducting plate is made of heat conducting paste.
The utility model discloses following beneficial effect has:
the utility model discloses a heat-conducting plate of evenly distributed between copper foil and base plate exports the heat, simple manufacture, plate body stable in structure to utilize the fin to scatter and disappear the heat fast, reach quick radiating effect of heat conduction, can improve the life and the performance of copper-clad plate.
Of course, it is not necessary for any particular product to achieve all of the above-described advantages at the same time.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic structural view of the heat dissipation epoxy phenolic glass cloth double-sided copper-clad plate of the present invention;
FIG. 2 is a schematic view of the structure of the heat conducting plate embedded in the groove of the epoxy novolac glass cloth substrate;
fig. 3 is a cross-sectional view of the present invention.
In the drawings, the components represented by the respective reference numerals are listed below:
the heat-conducting plate comprises 1-copper foil, 2-epoxy phenolic glass cloth substrate, 3-heat-conducting plate, 301-outer edge part, 302-connecting part and 4-radiating fin.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
Please refer to fig. 1-3, the utility model relates to a heat dissipation epoxy phenolic glass cloth double-sided copper-clad plate, which comprises an epoxy phenolic glass cloth substrate 2 and a copper foil 1 covering the two sides of the epoxy phenolic glass cloth substrate 2, the epoxy phenolic glass cloth substrate 2 is a substrate formed by impregnating alkali-free glass cloth with tung oil anhydride modified phenolic epoxy resin through hot pressing, tung oil anhydride is used as a curing agent of phenolic epoxy resin adhesive, grooves are arranged on the front and back sides of the epoxy phenolic glass cloth substrate 2, a heat conduction plate 3 is embedded and fixed in the grooves, the thickness of the grooves is the same as that of the heat conduction plate 3, the outer surface of the heat conduction plate 3 is flush with the front and back sides of the epoxy phenolic glass cloth substrate 2, and can be simultaneously flush with, the epoxy phenolic glass cloth substrate 2 is contacted with the copper foil 1, so that the heat conduction effect is achieved, and the bonding effect of the epoxy phenolic glass cloth substrate on the copper foil 1 can not be influenced.
The heat conducting plate 3 comprises an outer edge part 301 arranged on the peripheral side of the epoxy novolac glass cloth substrate 2, a connecting part 302 is arranged in the middle of the outer edge part 301, and the connecting part 302 is in a rectangular strip shape arranged at equal intervals, so that heat inside the copper foil 1 and the epoxy novolac glass cloth substrate 2 can be uniformly led out; the heat conducting plate 3 and the radiating fins 4 are connected with the epoxy phenolic glass cloth substrate 2 while the copper foil 1 and the epoxy phenolic glass cloth substrate 2 are fixed in a hot pressing mode.
Wherein, the material of fin 4 is graphite alkene, because the thermal conductivity of graphite alkene is far away than copper, heat dispersion is good, and heat-conducting plate 3 can give fin 4 with the heat transfer on 1 surface of copper foil 2 of epoxy phenolic glass cloth base plate, and fin 4 scatters the heat to the air fast again to form rapid cooling, prevent tung oil anhydride modified phenolic epoxy resin thermal deformation, guarantee the structural stability of copper-clad plate.
The heat conducting plate 3 is made of heat conducting paste, the heat conducting paste is novel organic grease specially prepared for heat transfer of electronic components, the heat conducting paste is produced by adopting a special formula, and the heat conducting paste is prepared by compounding metal oxide with good heat conductivity and insulating property and organic siloxane and has good heat conductivity and electric insulating property.
In the description herein, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications, to thereby enable others skilled in the art to best understand the invention for and utilize the invention. The present invention is limited only by the claims and their full scope and equivalents.
Claims (5)
1. The utility model provides a double-sided copper-clad plate of thermal diffusivity epoxy phenolic aldehyde glass cloth, includes epoxy phenolic aldehyde glass cloth base plate (2) and covers in two-sided copper foil (1) of epoxy phenolic aldehyde glass cloth base plate (2), its characterized in that: grooves are formed in the front surface and the back surface of the epoxy phenolic glass cloth substrate (2), a heat conducting plate (3) is fixedly embedded in each groove, and the thickness of each groove is the same as that of the heat conducting plate (3); the heat conducting plate (3) comprises an outer edge part (301) arranged on the periphery of the epoxy phenolic glass cloth substrate (2), and a connecting part (302) is arranged in the middle of the outer edge part (301); slots are arranged on the peripheral sides of the outer edge portions (301) of the heat conducting plates (3), and radiating fins (4) are fixedly inserted into the slots in an inserting mode.
2. The epoxy novolac glass cloth double-sided copper-clad plate with heat dissipation performance as claimed in claim 1, wherein the connection portions (302) are rectangular strips spaced at equal intervals.
3. The epoxy phenolic glass cloth double-sided copper-clad plate with heat dissipation performance according to claim 1, wherein the heat dissipation sheet (4) is made of graphene.
4. The double-sided copper-clad plate with the heat dissipation epoxy phenolic glass cloth as claimed in claim 1, wherein the epoxy phenolic glass cloth substrate (2) is prepared by hot-pressing alkali-free glass cloth impregnated with tung oil anhydride modified phenolic epoxy resin.
5. The epoxy novolac glass cloth double-sided copper-clad plate with heat dissipation performance according to claim 1, wherein the heat conducting plate (3) is made of heat conducting paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921448802.3U CN210617477U (en) | 2019-09-03 | 2019-09-03 | Heat dissipation epoxy phenolic glass cloth double-sided copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921448802.3U CN210617477U (en) | 2019-09-03 | 2019-09-03 | Heat dissipation epoxy phenolic glass cloth double-sided copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210617477U true CN210617477U (en) | 2020-05-26 |
Family
ID=70765139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921448802.3U Expired - Fee Related CN210617477U (en) | 2019-09-03 | 2019-09-03 | Heat dissipation epoxy phenolic glass cloth double-sided copper-clad plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210617477U (en) |
-
2019
- 2019-09-03 CN CN201921448802.3U patent/CN210617477U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200526 |