CN205430758U - Electromagnetic shield membrane suitable for high frequency signal - Google Patents
Electromagnetic shield membrane suitable for high frequency signal Download PDFInfo
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- CN205430758U CN205430758U CN201521064859.5U CN201521064859U CN205430758U CN 205430758 U CN205430758 U CN 205430758U CN 201521064859 U CN201521064859 U CN 201521064859U CN 205430758 U CN205430758 U CN 205430758U
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Abstract
The utility model discloses an electromagnetic shield membrane suitable for high frequency signal, this electromagnetic shield membrane includes: the metal level, coating the resistant high temperature insulating layer of metal level one side and coating the unilateral conduction gluing agent layer of metal level another side, resistant high temperature insulating layer goes up the laminating has the carrier thin film layer. Useful part lies in: the utility model discloses an electromagnetic shield membrane suitable for high frequency signal has the metal level, and shielding property is good, and unilateral conduction gluing agent layer has excellent conduction ability, and resistant high temperature insulating layer has good insulating nature and resistant buckling nature, can be able to bear or endure 340 DEG C of 30sec temperature, can satisfy the compliance requirement of flexible line way board trade simultaneously.
Description
Technical field
This utility model relates to a kind of electromagnetic shielding film being applicable to high-frequency signal, has the feature of high electromagnetic wave shielding.
Background technology
Printed substrate is material indispensable in electronic product, it is widely used at present in computer and ancillary equipment, communication product and consumption electronic products, along with consumption electronic products demand sustainable growth, the requirement for printed circuit board (PCB) also grows with each passing day.In flexible print circuit board industry, along with the update of the electronic equipment such as smart mobile phone, Ipad, the requirement to electromagnetic shielding is more and more higher.In the course of processing of flexible circuit board, circuit will use electromagnetic shielding membrane material in large quantities.
Development along with flexible circuitry plate substrate, HF link progressively occurs, and increasingly come into one's own and develop, the appearance of HF link also been proposed higher requirement to electromagnetic shielding, such as USB3.0 etc., transmission speed is more than 10 times of USB2.0, quickly, containing much information, signal is steady and audible is following theme.Therefore, it is adaptable to the electromagnetic shielding film of high-frequency signal becomes following guiding, and the technological gap in this field remains to be filled.
Utility model content
For solving the deficiencies in the prior art, the purpose of this utility model is to provide a kind of electromagnetic shielding film being applicable to high-frequency signal.
In order to realize above-mentioned target, this utility model adopts the following technical scheme that:
It is applicable to the electromagnetic shielding film of high-frequency signal, it is characterized in that, the temperature-resistant insulation layer including: metal level, coating metal level one side and the unilateal conduction adhesive layer coating metal level another side, being fitted with carrier film layer on described temperature-resistant insulation layer, this electromagnetic shielding film is " four-layer structure ".
Further, aforementioned unilateal conduction adhesive layer is additionally provided with a leafing type protective layer, thus defines the electromagnetic shielding film of " five-layer structure ".
Preferably, aforementioned metal layer is metal forming, and described metal forming is made up of the mixture of one or more in silver, copper, aluminum, nickel, and thickness is 2-12 μm.
It is highly preferred that aforementioned temperature-resistant insulation layer is polyimides, thickness is 3-50 μm.
More preferably, aforementioned unilateal conduction adhesive layer is made up of adhesive main body and the conducting powder being distributed in adhesive main body, the material of conducting powder is the mixture of one or more in argentum powder, silver-coated copper powder, copper powder and nikel powder, adhesive main body is the mixture of one or more in modified epoxy, polyacrylic resin, polyimide resin, modified rubber, phenolic resin, polyester resin, polyurethane resin, the thickness of unilateal conduction adhesive layer is 3-15 μm, and the particle diameter of conducting powder is 1-15 μm.
It is further preferred that aforementioned bearer thin layer is high molecular polymer thin layer, the modified film of one or more in PET, PEN, PI, PBT, PPS thin film, thickness is 25-200 μm.And, carrier film layer surface is with the micro-viscose glue bonding with temperature-resistant insulation layer, it is possible to and the good adhesion of temperature-resistant insulation layer, it is not easy to delamination.
More preferably; aforementioned release protective layer is the one in PET mould release membrance, PP mould release membrance, PBT mould release membrance and release paper; release protective layer is coated with silicone oil or non-silicone oil mould release; the thickness of release protecting film layer is 12-200 μm, gives this characteristic that unilateal conduction adhesive layer can easily be peeled off.
Of the present utility model have the beneficial effect that the electromagnetic shielding film of high-frequency signal that is applicable to of the present utility model is with metal level, advantages of good shielding performance, unilateal conduction adhesive layer has the conduction property of excellence, temperature-resistant insulation layer has good insulating properties and bending resistance folding endurance, it is capable of withstanding 340 DEG C of * 30sec temperature, the softness requirements of flexible circuitry board industry can be met simultaneously.
Accompanying drawing explanation
Fig. 1 is the structural representation of " four-layer structure " of the present utility model electromagnetic shielding film；
Fig. 2 is the structural representation of " dismissing for five layers " of the present utility model electromagnetic shielding film.
The implication of reference in figure: 1, carrier film layer, 2, temperature-resistant insulation layer, 3, metal level, 4, unilateal conduction adhesive layer, 5, release protective layer.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, this utility model made concrete introduction.
See Fig. 1, the electromagnetic shielding film being applicable to high-frequency signal of four-layer structure of the present utility model includes: metal level 3, coats the temperature-resistant insulation layer 2 of metal level 3 one side and coats the unilateal conduction adhesive layer 4 of metal level 3 another side, and temperature-resistant insulation layer 2 is fitted with carrier film layer 1.Seeing Fig. 2, the electromagnetic shielding film of " five-layer structure ", is i.e. to be additionally provided with a leafing type protective layer 5 on unilateal conduction adhesive layer 4.
Metal level 3 is metal forming, is made up of the mixture of one or more in silver, copper, aluminum, nickel, and thickness is 2-12 μm.Temperature-resistant insulation layer 2 has the soft and characteristic of insulation, and concrete material is polyimides (such as TPI, TPI), and thickness is 3-50 μm.Unilateal conduction adhesive layer 4 is made up of adhesive main body and the conducting powder being distributed in adhesive main body, the material of conducting powder is the mixture of one or more in argentum powder, silver-coated copper powder, copper powder and nikel powder, adhesive main body is the mixture of one or more in modified epoxy, polyacrylic resin, polyimide resin, modified rubber, phenolic resin, polyester resin, polyurethane resin, the thickness of unilateal conduction adhesive layer 4 is 3-15 μm, and the particle diameter of conducting powder is 1-15 μm.Temperature-resistant insulation layer 2 is played carrying effect, generally high molecular polymer thin layer, the modified film of one or more being specifically selected from PET, PEN, PI, PBT, PPS thin film by carrier film layer 1, and thickness is 25-200 μm；And, carrier film layer 1 surface is with the micro-viscose glue bonding with temperature-resistant insulation layer 2, it is possible to and the good adhesion of temperature-resistant insulation layer 2, it is not easy to delamination.
Release protective layer 5 in Fig. 2 is the one in PET mould release membrance, PP mould release membrance, PBT mould release membrance and release paper; release protective layer 5 is coated with silicone oil or non-silicone oil mould release; the thickness of release protecting film layer is 12-200 μm, gives this characteristic that unilateal conduction adhesive layer 4 can easily be peeled off.
The electromagnetic shielding film of four-layer structure of the present utility model and five-layer structure is respectively provided with good pliability, thickness ultrathin, heat resistance meets tin soldering liquid immersion and reaches 340 DEG C * 30 seconds, not stratified foaming, and having good conduction property, conducting resistance is below 100 milliohms, and effectiveness is good, more than 70db can be reached, meet the demand of electronic product industry well.
In order to preferably apply this utility model, being introduced the manufacturing process of the electromagnetic shielding film of " four-layer structure " of the present utility model below, step is as follows:
A1, at the coated on one side temperature-resistant insulation layer 2 of metal level 3, make insulating barrier solvent removal rolling, metal level 3 thickness be 2-12 μm through oven drying, the coating thickness of temperature-resistant insulation layer 2 is 3-50 μm；
A2, utilizing baking oven to be heating and curing the metal level 3 of web-like band temperature-resistant insulation layer 2, in baking oven, logical nitrogen protection or evacuation, make temperature-resistant insulation layer 2 be firmly adhered to metal level 3 surface；
A3, on the another side of metal level 3 be coated with unilateal conduction adhesive layer 4, thickness is 3-15 μm, is incorporated to oven drying, and oven temperature is 60-120 DEG C, and linear velocity is 5-30m/min；
A4, carrier film layer 1 of fitting on temperature-resistant insulation layer 2, make the micro-mucilage glue surface on carrier film layer 1 fit tightly with temperature-resistant insulation layer 2；
A5, rolling.
The manufacturing process of the electromagnetic shielding film of " five-layer structure " is similar with upper, and step is as follows:
B1, at the coated on one side temperature-resistant insulation layer 2 of metal level 3, make insulating barrier solvent removal rolling, metal level 3 thickness be 2-12 μm through oven drying, the coating thickness of temperature-resistant insulation layer 2 is 3-50 μm；
B2, utilizing baking oven to be heating and curing the metal level 3 of web-like band temperature-resistant insulation layer 2, in baking oven, logical nitrogen protection or evacuation, make temperature-resistant insulation layer 2 be firmly adhered to metal level 3 surface；
B3, on the another side of metal level 3 be coated with unilateal conduction adhesive layer 4, thickness is 3-15 μm, is incorporated to oven drying, and oven temperature is 60-120 DEG C, and linear velocity is 5-30m/min；
B4, on unilateal conduction adhesive layer 4 heat posted unification leafing type protective layer 5；
B5, carrier film layer 1 of fitting on temperature-resistant insulation layer 2, make the micro-mucilage glue surface on carrier film layer 1 fit tightly with temperature-resistant insulation layer 2 face；
B6, rolling.
Therefore, manufacturing process of the present utility model easily realizes, the operations such as used coating, baking and curing, curing oven are all the mature common technologies of industry in prior art, do not repeat, use the mature technology of these routines, manufacturing process of the present utility model is the most easily realized and can effectively control cost, it is simple to industrially popularization and application.
Of the present utility model ultimate principle, principal character and advantage have more than been shown and described.Skilled person will appreciate that of the industry, above-described embodiment limits this utility model, the technical scheme that the mode of all employing equivalents or equivalent transformation is obtained the most in any form, all falls within protection domain of the present utility model.
Claims (8)
1. it is applicable to the electromagnetic shielding film of high-frequency signal, it is characterised in that including: metal level, coat the temperature-resistant insulation layer of metal level one side and coat the unilateal conduction adhesive layer of metal level another side, described temperature-resistant insulation layer is fitted with carrier film layer.
The electromagnetic shielding film being applicable to high-frequency signal the most according to claim 1, it is characterised in that be additionally provided with a leafing type protective layer on described unilateal conduction adhesive layer.
The electromagnetic shielding film being applicable to high-frequency signal the most according to claim 1, it is characterised in that described metal level is metal forming, described metal forming is made up of silver, copper, aluminum or nickel, and thickness is 2-12 μm.
The electromagnetic shielding film being applicable to high-frequency signal the most according to claim 1, it is characterised in that described temperature-resistant insulation layer is polyimides, thickness is 3-50 μm.
The electromagnetic shielding film being applicable to high-frequency signal the most according to claim 1, it is characterised in that the thickness of described unilateal conduction adhesive layer is 3-15 μm.
The electromagnetic shielding film being applicable to high-frequency signal the most according to claim 1, it is characterised in that described carrier film layer is high molecular polymer thin layer, the one in PET, PEN, PI, PBT, PPS thin film.
The electromagnetic shielding film being applicable to high-frequency signal the most according to claim 6, it is characterised in that described carrier film layer surface is with the micro-viscose glue bonding with temperature-resistant insulation layer.
The electromagnetic shielding film being applicable to high-frequency signal the most according to claim 2; it is characterized in that; described release protective layer is the one in PET mould release membrance, PP mould release membrance, PBT mould release membrance and release paper; being coated with silicone oil or non-silicone oil mould release on release protective layer, the thickness of release protecting film layer is 12-200 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201521064859.5U CN205430758U (en) | 2015-12-18 | 2015-12-18 | Electromagnetic shield membrane suitable for high frequency signal |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201521064859.5U CN205430758U (en) | 2015-12-18 | 2015-12-18 | Electromagnetic shield membrane suitable for high frequency signal |
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| CN205430758U true CN205430758U (en) | 2016-08-03 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105491786A (en) * | 2015-12-18 | 2016-04-13 | 苏州城邦达力材料科技有限公司 | Electromagnetic shielding film applicable to high-frequency signal and manufacturing process thereof |
| WO2019010973A1 (en) * | 2017-07-11 | 2019-01-17 | 苏州城邦达力材料科技有限公司 | Novel nonmetal-system electromagnetic shielding film and preparation method therefor, and flexible printed circuit board |
| CN110137682A (en) * | 2018-02-02 | 2019-08-16 | 康普技术有限责任公司 | For adjusting the component and electrical tilt antenna system of electrical tilt antenna |
| CN110268812A (en) * | 2017-07-10 | 2019-09-20 | 拓自达电线株式会社 | Electromagnetic shielding film and the shielding printed wiring board for having the electromagnetic shielding film |
-
2015
- 2015-12-18 CN CN201521064859.5U patent/CN205430758U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105491786A (en) * | 2015-12-18 | 2016-04-13 | 苏州城邦达力材料科技有限公司 | Electromagnetic shielding film applicable to high-frequency signal and manufacturing process thereof |
| CN110268812A (en) * | 2017-07-10 | 2019-09-20 | 拓自达电线株式会社 | Electromagnetic shielding film and the shielding printed wiring board for having the electromagnetic shielding film |
| WO2019010973A1 (en) * | 2017-07-11 | 2019-01-17 | 苏州城邦达力材料科技有限公司 | Novel nonmetal-system electromagnetic shielding film and preparation method therefor, and flexible printed circuit board |
| CN110137682A (en) * | 2018-02-02 | 2019-08-16 | 康普技术有限责任公司 | For adjusting the component and electrical tilt antenna system of electrical tilt antenna |
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Address after: 215300 South of Yingbin West Road, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province (399 Dongping Road) Patentee after: Suzhou Chengbang Dayi Material Technology Co., Ltd. Address before: 215300 South of Yingbin West Road, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province (399 Dongping Road) Patentee before: Suzhou City-State Dali Material Technology Co., Ltd. |