CN204259357U - A kind of electromagnetic shielding film with the coat of metal - Google Patents
A kind of electromagnetic shielding film with the coat of metal Download PDFInfo
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- CN204259357U CN204259357U CN201420792894.8U CN201420792894U CN204259357U CN 204259357 U CN204259357 U CN 204259357U CN 201420792894 U CN201420792894 U CN 201420792894U CN 204259357 U CN204259357 U CN 204259357U
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Abstract
The utility model discloses a kind of electromagnetic shielding film with the coat of metal, comprising: carrier film layer, the ink layer coated on carrier film layer, the vacuum sputtering metal film layer on ink layer and the conduction adhesive layer coated on metal film layer; Usefulness is: electromagnetic shielding film of the present utility model is with the coat of metal, and advantages of good shielding performance, overall construction design can make the electromagnetic shielding film thickness ultrathin obtained, and meets the softness requirements of flexible circuitry board industry simultaneously, facilitates commercial introduction to apply.
Description
Technical field
The utility model relates to a kind of electromagnetic shielding film with the coat of metal, has the advantages that thickness is thin.
Background technology
Printed substrate is material indispensable in electronic product, be widely used in computer and ancillary equipment, communication product and consumption electronic products at present, along with the sustainable growth of consumption electronic products demand, the requirement for printed circuit board (PCB) also grows with each passing day.
In flexible print circuit board industry, along with the update of the electronic equipment such as smart mobile phone, Ipad, also more and more higher to the requirement of electromagnetic shielding.In the course of processing of flexible circuit board, circuit will use electromagnetic shielding membrane material in large quantities.
The thickness of flexible circuit board main flow electromagnetic shielding film is 22 microns (μm) in the market, relative to the requirement of " light, thin, short, little " that flexible circuitry plate material is advocated, also has certain gap, gap is shown with the requirement of the Wearable electronic product of current hot topic, therefore, in the urgent need to developing the ultra-thin demand that a kind of new electromagnetic shielding film uses to meet product.
Utility model content
For solving the deficiencies in the prior art, the purpose of this utility model is to provide a kind of ultra-thin type electromagnetic screened film with the coat of metal.
In order to realize above-mentioned target, the utility model adopts following technical scheme:
A kind of electromagnetic shielding film with the coat of metal, comprise: carrier film layer, the ink layer coated on carrier film layer, the vacuum sputtering metal film layer on ink layer and the conduction adhesive layer coated on metal film layer, this electromagnetic shielding film is four layers of superthin structure.
Further, aforesaid conductive gluing layer is also provided with the release protective film of one deck, thus defines the electromagnetic shielding film of five layers of superthin structure.
Aforementioned bearer thin layer plays carrying effect to ink layer, is generally high molecular polymer thin layer, is specifically as follows the modified film of one or more of PET, PEN, PI, PBT, PPS film, and thickness is 25-200 μm.
Aforementioned ink layer has the function of rapid curing and insulation, and be the mixture of one or more in epoxy resin, polyacrylic resin, modified rubber, phenolic resins, mylar, polyurethane resin, thickness is 5-50 μm.
Preferably, aforementioned metal thin layer is the mixture of one or more in silver, copper, aluminium, nickel, and thickness is 20-3000nm.
Aforesaid conductive adhesive layer is made up of adhesive main body and the conducting powder be distributed in adhesive main body, the material of conducting powder is the mixture of one or more in silver powder, silver-coated copper powder, copper powder and nickel powder, adhesive main body is the mixture of one or more in modified epoxy, polyacrylic resin, polyimide resin, modified rubber, phenolic resins, mylar, polyurethane resin, the thickness of Conductive adhesive layer is 3-15 μm, the preferred 1-15 μm of particle diameter of conducting powder.
Particularly; aforementioned release protective film is the one in PET release film, PP release film, PBT release film, release liners; release protective film is coated with silicone oil or non-silicone oil mould release, and the thickness of release protective film is 12-200 μm, gives the characteristic that this conductive adhesive film can easily be peeled off.
Usefulness of the present utility model is: electromagnetic shielding film of the present utility model is with the coat of metal, advantages of good shielding performance, conductive adhesive layer has excellent conduction property, ink layer has good insulating properties, overall construction design can make the electromagnetic shielding film thickness ultrathin obtained, and the gross thickness of ink layer, the coat of metal and conductive adhesive layer is only 8-16um; Ink layer and the conductive adhesive layer of screened film have fabulous pliability, can meet the softness requirements of flexible circuitry board industry, facilitate commercial introduction to apply.
Accompanying drawing explanation
Fig. 1 is the structural representation of the electromagnetic shielding film of four layers of superthin structure of the present utility model;
Fig. 2 is the structural representation of the electromagnetic shielding film of five layers of superthin structure of the present utility model.
The implication of Reference numeral in figure: 1, carrier film layer, 2, ink layer, 3, metal film layer, 4, Conductive adhesive layer, 5, release protective film.
Embodiment
Below in conjunction with the drawings and specific embodiments, concrete introduction is done to the utility model.
See Fig. 1, a kind of electromagnetic shielding film with the coat of metal of the present utility model, comprise: carrier film layer 1, the ink layer 2 coated on carrier film layer 1, the vacuum sputtering metal film layer 3 on ink layer 2 and the conduction adhesive layer coated on metal film layer 3, so, the electromagnetic shielding film of four layers of superthin structure is constituted.
Preferably, carrier film layer 1 pair of ink layer 2 plays carrying effect, is generally high molecular polymer thin layer, is specifically as follows the modified film of one or more of PET, PEN, PI, PBT, PPS film, and thickness is 25-200 μm; Ink layer 2 has the function of rapid curing and insulation, is generally the mixture of one or more in epoxy resin, polyacrylic resin, modified rubber, phenolic resins, mylar, polyurethane resin, and thickness is 5-50 μm; Metal film layer 3 is the mixture of one or more in silver, copper, aluminium, nickel, and thickness is 20-3000nm; Conductive adhesive layer is made up of adhesive main body and the conducting powder be distributed in adhesive main body, the material of conducting powder is the mixture of one or more in silver powder, silver-coated copper powder, copper powder and nickel powder, adhesive main body is the mixture of one or more in modified epoxy, polyacrylic resin, polyimide resin, modified rubber, phenolic resins, mylar, polyurethane resin, the thickness of Conductive adhesive layer 4 is 3-15 μm, the preferred 1-15 μm of particle diameter of conducting powder.
Further, as shown in Figure 2, conduction adhesive layer is also provided with the release protective film 5 of one deck, thus defines the electromagnetic shielding film of five layers of superthin structure.Particularly, release protective film 5 is the one in PET release film, PP release film, PBT release film, release liners, and release diaphragm is coated with silicone oil or non-silicone oil mould release, and the thickness of release diaphragm is 12-200 μm.
The electromagnetic shielding film of four layers of superthin structure of the present utility model and the electromagnetic shielding film of five layers of superthin structure all have good pliability, thickness ultrathin, heat resistance meet tin soldering liquid soak reach 340 DEG C * 30 seconds, not stratified foaming, and have good conduction property, in 300 milliohms once, effectiveness is good for conducting resistance, can more than 50db be reached, meet the demand of electronic product industry well.
In order to apply the utility model better, briefly introduce the manufacturing process of the electromagnetic shielding film of four layers of superthin structure of the present utility model below, step is as follows:
A1, remove greasy dirt on carrier thin film volume inner face and foreign matter, and dope layer of ink 2 thereon, through oven drying, ink layer 2 is solidified;
A2, on ink layer 2 vacuum sputtering layer of metal thin layer 3, thickness is 20-3000nm;
A3, on metal film layer 3, be coated with one deck conductive adhesive layer, thickness is 3-15 μm, is incorporated to oven drying, and oven temperature is 60-120 DEG C, and linear velocity is 5-30m/min;
A4, rolling.
The manufacturing process of the electromagnetic shielding film of five layers of superthin structure and upper similar, concrete steps are as follows:
B1, remove greasy dirt on carrier thin film volume inner face and foreign matter, and dope layer of ink 2 thereon, through oven drying, ink layer 2 is solidified;
B2, on ink layer 2 vacuum sputtering layer of metal thin layer 3, thickness is 20-3000nm;
B3, on metal film layer 3, be coated with one deck conductive adhesive layer, thickness is 3-15 μm, is incorporated to oven drying, and oven temperature is 60-120 DEG C, and linear velocity is 5-30m/min;
B4, on conductive adhesive layer the release protective film 5 of thermal-adhering one deck;
B5, rolling.
As can be seen here, the operation such as removing foreign matter, coating, baking and curing, vacuum sputtering used in above-mentioned manufacturing process is all mature common technologies of industry in prior art, do not repeat, adopt the mature technology of these routines, make manufacturing process of the present utility model be simple and easy to realize and can effectively control cost, be convenient to industrially apply.
More than show and describe general principle of the present utility model, principal character and advantage.The technical staff of the industry should understand, and above-described embodiment does not limit the utility model in any form, the technical scheme that the mode that all employings are equal to replacement or equivalent transformation obtains, and all drops in protection range of the present utility model.
Claims (7)
1. with an electromagnetic shielding film for the coat of metal, it is characterized in that, comprising: carrier film layer, the ink layer coated on carrier film layer, the vacuum sputtering metal film layer on ink layer and the conduction adhesive layer coated on metal film layer.
2. a kind of electromagnetic shielding film with the coat of metal according to claim 1, is characterized in that, described conduction adhesive layer is also provided with the release protective film of one deck.
3. a kind of electromagnetic shielding film with the coat of metal according to claim 1, is characterized in that, described carrier film layer is high molecular polymer thin layer, and for the one of PET, PEN, PI, PBT, PPS film is made, thickness is 25-200 μm.
4. a kind of electromagnetic shielding film with the coat of metal according to claim 1, it is characterized in that, described ink layer is the one in epoxy resin, polyacrylic resin, modified rubber, phenolic resins, mylar, polyurethane resin, and thickness is 5-50 μm.
5. a kind of electromagnetic shielding film with the coat of metal according to claim 1, is characterized in that, described metal film layer is the one in silver, copper, aluminium, nickel, and thickness is 20-3000nm.
6. a kind of electromagnetic shielding film with the coat of metal according to claim 1, it is characterized in that, described conduction adhesive layer is made up of adhesive main body and the conducting powder be distributed in adhesive main body, the material of conducting powder is the one in silver powder, silver-coated copper powder, copper powder and nickel powder, adhesive main body is the one in modified epoxy, polyacrylic resin, polyimide resin, modified rubber, phenolic resins, mylar, polyurethane resin, the thickness of Conductive adhesive layer is 3-15 μm, and the particle diameter of conducting powder is 1-15 μm.
7. a kind of electromagnetic shielding film with the coat of metal according to claim 2; it is characterized in that; described release protective film is the one in PET release film, PP release film, PBT release film and release liners; release protective film is coated with silicone oil or non-silicone oil mould release, and the thickness of release protective film is 12-200 μm.
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CN201420792894.8U CN204259357U (en) | 2014-12-16 | 2014-12-16 | A kind of electromagnetic shielding film with the coat of metal |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN104507301A (en) * | 2014-12-16 | 2015-04-08 | 苏州城邦达力材料科技有限公司 | Electromagnetic shielding film with metal coating and manufacturing technique of electromagnetic shielding film |
CN104883866A (en) * | 2015-05-12 | 2015-09-02 | 苏州城邦达力材料科技有限公司 | Electromagnetic shielding film with excellent thermal conductivity and manufacturing process of electromagnetic shielding film |
CN107426957A (en) * | 2017-08-16 | 2017-12-01 | 苏州城邦达力材料科技有限公司 | Conducting resinl film layer, preparation method and electromagnetic shielding film |
CN108282990A (en) * | 2018-03-14 | 2018-07-13 | 苏州城邦达力材料科技有限公司 | A kind of electromagnetic shielding film of base material reinforcement and preparation method thereof, application |
CN108702863A (en) * | 2016-03-23 | 2018-10-23 | 拓自达电线株式会社 | Electromagnetic shielding film |
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2014
- 2014-12-16 CN CN201420792894.8U patent/CN204259357U/en active Active
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104507301A (en) * | 2014-12-16 | 2015-04-08 | 苏州城邦达力材料科技有限公司 | Electromagnetic shielding film with metal coating and manufacturing technique of electromagnetic shielding film |
CN104883866A (en) * | 2015-05-12 | 2015-09-02 | 苏州城邦达力材料科技有限公司 | Electromagnetic shielding film with excellent thermal conductivity and manufacturing process of electromagnetic shielding film |
CN108702863A (en) * | 2016-03-23 | 2018-10-23 | 拓自达电线株式会社 | Electromagnetic shielding film |
CN107426957A (en) * | 2017-08-16 | 2017-12-01 | 苏州城邦达力材料科技有限公司 | Conducting resinl film layer, preparation method and electromagnetic shielding film |
CN107426957B (en) * | 2017-08-16 | 2020-08-28 | 苏州城邦达益材料科技有限公司 | Conductive adhesive film layer, preparation method and electromagnetic shielding film |
CN108282990A (en) * | 2018-03-14 | 2018-07-13 | 苏州城邦达力材料科技有限公司 | A kind of electromagnetic shielding film of base material reinforcement and preparation method thereof, application |
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Address after: 215300, Jiangsu, Suzhou, Kunshan, Pakistan Town West Yingbin Road South Patentee after: Suzhou Chengbang Dayi Material Technology Co., Ltd. Address before: 215300, Jiangsu, Suzhou, Kunshan, Pakistan Town West Yingbin Road South Patentee before: Suzhou City-State Dali Material Technology Co., Ltd. |
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CP01 | Change in the name or title of a patent holder |