CN113858463A - Diamond wire cutting machine for solar-grade silicon wafer - Google Patents
Diamond wire cutting machine for solar-grade silicon wafer Download PDFInfo
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- CN113858463A CN113858463A CN202111291284.0A CN202111291284A CN113858463A CN 113858463 A CN113858463 A CN 113858463A CN 202111291284 A CN202111291284 A CN 202111291284A CN 113858463 A CN113858463 A CN 113858463A
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- cutting
- fixedly connected
- recovery
- power
- filtering
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- 238000005520 cutting process Methods 0.000 title claims abstract description 75
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 28
- 239000010432 diamond Substances 0.000 title claims abstract description 28
- 229910021422 solar-grade silicon Inorganic materials 0.000 title claims abstract description 14
- 238000001914 filtration Methods 0.000 claims abstract description 36
- 238000001125 extrusion Methods 0.000 claims abstract description 20
- 238000013016 damping Methods 0.000 claims description 35
- 238000011084 recovery Methods 0.000 claims description 33
- 239000000872 buffer Substances 0.000 claims description 19
- 239000007788 liquid Substances 0.000 claims description 18
- 239000012530 fluid Substances 0.000 claims description 17
- 235000012431 wafers Nutrition 0.000 claims description 17
- 238000007789 sealing Methods 0.000 claims description 11
- 238000001816 cooling Methods 0.000 claims description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 6
- 230000005540 biological transmission Effects 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 239000010703 silicon Substances 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 239000012528 membrane Substances 0.000 claims description 4
- 239000011148 porous material Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 3
- 230000037452 priming Effects 0.000 claims description 2
- 238000009763 wire-cut EDM Methods 0.000 claims 1
- 239000000110 cooling liquid Substances 0.000 abstract description 14
- 239000002210 silicon-based material Substances 0.000 abstract description 4
- 238000004140 cleaning Methods 0.000 description 11
- 239000007921 spray Substances 0.000 description 6
- 238000003754 machining Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000002452 interceptive effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0633—Grinders for cutting-off using a cutting wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0683—Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention discloses a diamond wire cutting machine for a solar-grade silicon wafer, which comprises a cutting box, wherein a cutting cavity is arranged in the cutting box, two sliding grooves are formed in the rear wall of the cutting cavity, a guide rod is fixedly connected in each sliding groove, and an electric sliding rail is connected on each guide rod in a sliding manner; according to the invention, through the matching between the filtering hydraulic rod and the extrusion block, scraps left during silicon material cutting are washed by cooling liquid, and meanwhile, the scraps are filtered and recovered, so that the phenomenon that the scraps are doped in the recovered cooling liquid to cause the reduction of the service life of equipment is avoided.
Description
Technical Field
The invention relates to the relevant field of wire cutting machines, in particular to a diamond wire cutting machine for a solar-grade silicon wafer.
Background
The diamond wire cutting machine adopts the mode of unidirectional circulation or reciprocating circulation motion of the diamond wire to enable the diamond wire and an object to be cut to form relative grinding motion, thereby achieving the purpose of cutting.
The existing diamond wire cutting machine can generate vibration during cutting, the machining precision and the machining effect are influenced to a certain extent, and chips generated during cutting of silicon materials are not processed properly, so that blockage and equipment damage are caused easily.
Disclosure of Invention
The invention aims to solve the problems in the prior art, provides a diamond wire cutting machine for a solar-grade silicon wafer, and adopts the following technical scheme in order to achieve the aim:
according to the invention, the diamond wire cutting machine for the solar energy level silicon wafer comprises a cutting box, a cutting cavity is arranged in the cutting box, two sliding grooves are arranged on the rear wall of the cutting cavity, a guide rod is fixedly connected in the sliding grooves, an electric sliding rail is connected on the guide rod in a sliding manner, a wire cutting mechanism for cutting the silicon wafer is arranged on the front side of the electric sliding rail, a recovery platform is fixedly arranged on the bottom wall of the cutting cavity, a recovery groove with an upward opening is arranged in the recovery platform, a filter block is fixedly arranged on the bottom wall of the recovery groove, a filter groove with an upward opening is arranged in the filter block, a filter mechanism for filtering cutting scraps is arranged in the filter groove, two fixing frames are symmetrically arranged on the left inner wall and the right inner wall of the cutting cavity, a buffer groove is arranged on the fixing frames, two buffer springs are symmetrically and fixedly connected between the upper inner wall and the lower inner wall of the buffer groove, and a damping mechanism capable of damping is arranged between the buffer springs, the air pump is fixedly arranged on the top wall of the cutting cavity, a liquid feeding pipe is fixedly connected to the left end face of the air pump, a cooling sprayer is fixedly connected to the other end of the liquid feeding pipe, the cooling sprayer is fixedly arranged on the rear wall of the cutting cavity, and a recovery pipe extending to the recovery tank is fixedly connected to the lower end face of the air pump.
Preferably, the wire cutting mechanism is including fixed establishing the headstock of terminal surface before the electronic slide rail, be equipped with the power cavity that the opening is preceding in the headstock, it has the closing plate to seal on the headstock front side cross-section, the fixed motor power that is equipped with on the power cavity back wall, the terminal surface control system has the power shaft that runs through the closing plate before the motor power, fixedly connected with initiative wire wheel on the power shaft, it is connected with the driven shaft that runs through to rotate on the power cavity back wall, fixedly connected with driven wire wheel on the driven shaft, the power shaft with the driven shaft passes through band pulley drive assembly and transmits each other, the winding has diamond wire on initiative wire wheel and the driven wire wheel, utilizes wire cutting mechanism to steadily cut silicon material, improves cutting efficiency.
Preferably, the filtering mechanism comprises a filtering hydraulic rod fixedly arranged on the bottom wall of the filtering tank, the upper end face of the filtering hydraulic rod is fixedly connected with an extrusion block, the upper end face of the extrusion block is fixedly connected with a clamping block, the extrusion block is provided with two positioning holes which are symmetrical in left and right positions, the bottom wall of the filtering tank is fixedly provided with a positioning shaft corresponding to the positioning holes, and the filtering mechanism is used for screening out processing scraps to prevent the processing scraps from interfering cutting.
Preferably, two discharge pipes communicated with the filter tank are symmetrically arranged at the left and right positions in the filter block, a water filtering membrane is fixedly arranged in each discharge pipe, a recovery pipe is communicated with the lower side of each discharge pipe, and a manual valve is fixedly arranged on each recovery pipe, so that the structure is stable.
Preferably, the damping mechanism includes fixed connection and is in damping fluid tank between buffer spring, the damping fluid tank is equipped with the damping fluid chamber, sliding connection has the piston piece in the damping fluid chamber, be equipped with on the piston piece about the filtration pore that runs through, damping fluid tank left side be equipped with on the surface with the through-hole of damping fluid chamber intercommunication, filtration pore left end face fixedly connected with passes the piston rod of through-hole, piston rod left end face fixedly connected with fixed plate, fixedly connected with between the fixed plate the closing plate utilizes damping mechanism real-time damping, improves the machining precision.
Preferably, fixedly connected with fixed bolster on the cutting chamber left wall, pass the scavenge pipe in the fixed bolster, fixedly connected with self priming pump on the scavenge pipe lower cross-section, scavenge pipe right side fixedly connected with washs the shower nozzle, the fixed glass board that is equipped with of terminal surface before the cutting case improves the purity of retrieving the coolant liquid.
The invention has the beneficial effects that:
according to the invention, through the matching between the filtering hydraulic rod and the extrusion block, the scraps left during silicon material cutting are washed by the cooling liquid, and meanwhile, the scraps are filtered and recovered, so that the phenomenon that the service life of equipment is shortened due to the fact that the scraps are doped in the recovered cooling liquid is avoided;
the invention utilizes the matching of the sealing plate and the damping liquid box to assist the vibration reduction and the force unloading of the online cutting equipment when the online cutting equipment works, thereby improving the cutting precision;
the invention also utilizes the matching of the self-priming pump and the cleaning spray head to wash the cutting clamp in real time, thereby preventing the machining debris from interfering the cutting and improving the cutting efficiency.
Drawings
FIG. 1 is a schematic external view of the present invention;
FIG. 2 is a schematic view of the overall structure of a diamond wire cutting machine for solar-grade silicon wafers according to the present invention;
FIG. 3 is a block diagram of the power chamber of FIG. 2 in accordance with the present invention;
FIG. 4 is a block diagram of the filter tank of FIG. 2 according to the present invention;
FIG. 5 is a block diagram of the damping fluid chamber of FIG. 2 according to the present invention.
Detailed Description
In the description of the present invention, it should be noted that the terms "inside", "below", and the like refer to orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the present invention conventionally place when used, and are used only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first", "second", and the like are used for descriptive purposes only and are not to be construed as indicating or implying any relative importance, and the specific features of the diamond wire saw for solar-grade silicon wafer are described in detail below:
referring to fig. 1 to 5, a diamond wire cutting machine for solar grade silicon wafers according to an embodiment of the present invention includes a cutting box 11, a cutting chamber 12 is disposed in the cutting box 11, two sliding grooves 13 are disposed on a rear wall of the cutting chamber 12, a guide rod 14 is fixedly connected in the sliding groove 13, an electric slide rail 15 is slidably connected on the guide rod 14, a wire cutting mechanism 58 for cutting silicon wafers is disposed on a front side of the electric slide rail 15, a recovery platform 25 is fixedly disposed on a bottom wall of the cutting chamber 12, a recovery tank 26 with an upward opening is disposed in the recovery platform 25, a filter block 27 is fixedly disposed on a bottom wall of the recovery tank 26, a filter tank 28 with an upward opening is disposed in the filter block 27, a filter mechanism 59 for filtering cutting debris is disposed in the filter tank 28, two fixing frames 38 are symmetrically disposed on left and right inner walls of the cutting chamber 12, a buffer tank 39 is disposed on the fixing frame 38, two buffer springs 40 are fixedly connected with the upper inner wall and the lower inner wall of the buffer groove 39 in a symmetrical mode, a damping mechanism 60 capable of damping is arranged between the buffer springs 40, an air pump 48 is fixedly arranged on the top wall of the cutting cavity 12, a liquid feeding pipe 49 is fixedly connected to the left end face of the air pump 48, a cooling spray head 50 is fixedly connected to the other end of the liquid feeding pipe 49, the cooling spray head 50 is fixedly arranged on the rear wall of the cutting cavity 12, and a recovery pipe 52 extending into the recovery groove 26 is fixedly connected to the lower end face of the air pump 48.
Beneficially, the wire cutting mechanism 58 includes a power box 16 fixedly arranged on the front end face of the electric slide rail 15, a power cavity 17 with a forward opening is arranged in the power box 16, a sealing plate 18 is sealed on the front side cross section of the power box 16, a power motor 19 is fixedly arranged on the rear wall of the power cavity 17, a power shaft 20 penetrating through the sealing plate 18 is controlled on the front end face of the power motor 19, a driving wire wheel 21 is fixedly connected on the power shaft 20, a driven shaft 22 penetrating through the sealing plate 18 is rotatably connected on the rear wall of the power cavity 17, a driven wire wheel 23 is fixedly connected on the driven shaft 22, the power shaft 20 and the driven shaft 22 are mutually driven through a belt wheel transmission assembly 24, a diamond wire 61 is wound on the driving wire wheel 21 and the driven wire wheel 23, the power shaft 20 is driven to rotate by the power motor 19, and the power shaft 20 drives the driving wire wheel 21 to rotate, because the driven shaft 22 is in friction transmission with the power shaft 20 through the belt wheel transmission assembly 24, the power shaft 20 drives the driven shaft 22 to rotate, the driven shaft 22 drives the driven wire wheel 23 to rotate, and the driving wire wheel 21 and the driven wire wheel 23 drive the diamond wire 61 to rotate together.
Advantageously, the filtering mechanism 59 includes a filtering hydraulic rod 29 fixedly arranged on the bottom wall of the filtering tank 28, the upper end surface of the filtering hydraulic rod 29 is fixedly connected with an extrusion block 30, the upper end surface of the extrusion block 30 is fixedly connected with a clamping block 31, the extrusion block 30 is provided with two positioning holes 33 which are symmetrical in left and right positions, the bottom wall of the filtering tank 28 is fixedly provided with a positioning shaft 32 corresponding to the positioning holes 33, the filtering hydraulic rod 29 drives the extrusion block 30 to move downwards, and the extrusion block 30 drives the clamping block 31 to move downwards.
Advantageously, two discharge pipes 34 communicated with the filter tank 28 are symmetrically arranged at left and right positions in the filter block 27, a water filtering membrane 36 is fixedly arranged in the discharge pipes 34, a recovery pipe 35 is communicated with the lower side of the discharge pipes 34, a manual valve 37 is fixedly arranged on the recovery pipe 35, and under the extrusion action of the extrusion block 30, the cooling liquid mixed with the processing debris is filtered and discharged to the recovery tank 26 through the water filtering membrane 36 and the processing debris is screened out of the recovery pipe 35.
Advantageously, the damping mechanism 60 comprises a damping fluid tank 41 fixedly connected between the damping springs 40, a damping liquid cavity 42 is arranged in the damping liquid box 41, a piston block 43 is connected in the damping liquid cavity 42 in a sliding way, the piston block 43 is provided with a filter hole 44 which penetrates through the piston block from left to right, the left surface of the damping liquid box 41 is provided with a through hole 47 which is communicated with the damping liquid cavity 42, the left end face of the filtering hole 44 is fixedly connected with a piston rod 45 penetrating through the through hole 47, the left end face of the piston rod 45 is fixedly connected with a fixing plate 46, the sealing plate 18 is fixedly connected between the fixing plates 46, the piston rod 45 is driven by the fixing plate 46 to vibrate back and forth left and right, the piston rod 45 drives the piston block 43 to vibrate left and right, since the damping fluid chamber 42 is filled with damping fluid, the damping fluid is expelled through the filtering holes 44 to buffer the vibration, to reasonably perform the force unloading, and the vertical vibration of the sealing plate 18 is buffered by the buffer spring 40.
Advantageously, a fixed bracket 53 is fixedly connected to the left wall of the cutting chamber 12, a cleaning pipe 54 passes through the fixed bracket 53, a self-priming pump 55 is fixedly connected to the lower section of the cleaning pipe 54, a cleaning nozzle 56 is fixedly connected to the right side of the cleaning pipe 54, a glass plate 57 is fixedly arranged on the front end face of the cutting box 11, the cooling liquid in the recovery tank 26 is conveyed into the cleaning nozzle 56 through the cleaning pipe 54 by the self-priming pump 55, and the debris on the upper surface of the positioning hole 33 is washed by the cleaning nozzle 56.
The invention relates to a diamond wire cutting machine for a solar-grade silicon wafer, which comprises the following working procedures:
a worker adds enough cooling liquid into the liquid adding funnel 51 in advance, places and clamps the solar grade silicon wafer to be cut on the clamping block 31, starts the power motor 19, the power motor 19 drives the power shaft 20 to rotate, the power shaft 20 drives the driving wire wheel 21 to rotate, the driven shaft 22 and the power shaft 20 are in friction transmission through the belt wheel transmission assembly 24, the power shaft 20 drives the driven shaft 22 to rotate, the driven shaft 22 drives the driven wire wheel 23 to rotate, the driving wire wheel 21 and the driven wire wheel 23 drive the diamond wire 61 to rotate together, and meanwhile, the electric slide rail 15 is started, and the electric slide rail 15 slowly moves downwards on the guide rod 14 until the diamond wire 61 is attached to the surface of the cut solar grade silicon wafer, and cutting operation is carried out;
meanwhile, the air pump 48 is started, the air pump 48 delivers cooling liquid to the cooling spray nozzle 50 through the liquid delivery pipe 49, when the diamond wire 61 cuts the cut solar-grade silicon wafer, the cooling liquid acts as a medium and washes away the cut chips, after the cut chips are cut to a certain depth, a large amount of processing chips remain on the upper surfaces of the clamping block 31 and the extrusion block 30, and the cooling liquid accumulates in the filter tank 28 to a certain depth, the filtering hydraulic rod 29 is started, the filtering hydraulic rod 29 drives the extrusion block 30 to move downwards, the extrusion block 30 drives the clamping block 31 to move downwards until the cooling liquid in the filter tank 28 submerges the surface of the clamping block 31, meanwhile, under the extrusion action of the extrusion block 30, the cooling liquid mixed with the processing chips is filtered and discharged to the recovery tank 26 through the water filtering film 36, and the processing chips are screened out in the recovery pipe 35, at this time, the air pump 48 can draw the filtered cooling liquid in the recovery tank 26 through the recovery pipe 52 for reuse, meanwhile, the self-sucking pump 55 is started, the self-sucking pump 55 conveys the cooling liquid in the recovery tank 26 into the cleaning spray head 56 through the cleaning pipe 54, and the cleaning spray head 56 washes the chips on the upper surface of the positioning hole 33, so that the chips in the recovery tank 26 are prevented from being doped;
when the diamond wire 61 cuts the solar-grade silicon wafer to generate vibration, the sealing plate 18 conducts the vibration to the fixing plate 46, the fixing plate 46 drives the piston rod 45 to vibrate left and right in a reciprocating manner, the piston rod 45 drives the piston block 43 to vibrate left and right, the damping liquid is squeezed out through the filtering holes 44 to buffer the vibration due to the fact that the damping liquid is filled in the damping liquid cavity 42, force unloading is reasonably performed, meanwhile, the vibration in the vertical direction generated by the sealing plate 18 buffers the force unloading through the buffer spring 40, and the cutting precision is guaranteed.
It will be apparent to those skilled in the art that various modifications may be made to the above embodiments without departing from the general spirit and concept of the invention. All falling within the scope of protection of the present invention. The protection scheme of the invention is subject to the appended claims.
Claims (6)
1. The utility model provides a diamond wire cut electrical discharge machining for solar energy level silicon chip, includes cutting box (11), its characterized in that: the silicon wafer cutting machine is characterized in that a cutting cavity (12) is arranged in the cutting box (11), two sliding grooves (13) are formed in the rear wall of the cutting cavity (12), a guide rod (14) is fixedly connected in the sliding grooves (13), an electric sliding rail (15) is connected on the guide rod (14) in a sliding mode, a linear cutting mechanism (58) for cutting a silicon wafer is arranged on the front side of the electric sliding rail (15), a recovery table (25) is fixedly arranged on the bottom wall of the cutting cavity (12), a recovery groove (26) with an upward opening is arranged in the recovery table (25), a filter block (27) is fixedly arranged on the bottom wall of the recovery groove (26), a filter groove (28) with an upward opening is arranged in the filter block (27), a filter mechanism (59) for filtering cutting scraps is arranged in the filter groove (28), two fixing frames (38) are symmetrically arranged on the left inner wall and the right inner wall of the cutting cavity (12), and a buffer groove (39) is arranged on the fixing frame (38), two buffer spring (40) of position symmetry fixedly connected with between inner wall about buffer slot (39), be equipped with between buffer spring (40) can absorbing damper (60), fixed air pump (48) that are equipped with on cutting chamber (12) roof, air pump (48) left end face fixedly connected with liquid delivery pipe (49), liquid delivery pipe (49) other end fixedly connected with cooling shower nozzle (50), cooling shower nozzle (50) are fixed to be established on cutting chamber (12) back wall, end face fixedly connected with extends to under air pump (48) recovery tube (52) in recovery tank (26).
2. The diamond wire saw according to claim 1, wherein: the wire cutting mechanism (58) comprises a power box (16) fixedly arranged on the front end surface of the electric slide rail (15), a power cavity (17) with a forward opening is arranged in the power box (16), a sealing plate (18) is sealed on the front side section of the power box (16), a power motor (19) is fixedly arranged on the rear wall of the power cavity (17), a power shaft (20) penetrating through the sealing plate (18) is controlled on the front end surface of the power motor (19), a driving wire wheel (21) is fixedly connected on the power shaft (20), a driven shaft (22) penetrating through the sealing plate (18) is rotatably connected on the rear wall of the power cavity (17), the driven shaft (22) is fixedly connected with a driven wire wheel (23), the power shaft (20) and the driven shaft (22) are mutually transmitted through a belt wheel transmission component (24), and diamond wires (61) are wound on the driving wire wheel (21) and the driven wire wheel (23).
3. The diamond wire saw according to claim 1, wherein: the filtering mechanism (59) comprises a filtering hydraulic rod (29) fixedly arranged on the bottom wall of the filtering tank (28), an extrusion block (30) is fixedly connected to the upper end face of the filtering hydraulic rod (29), a clamping block (31) is fixedly connected to the upper end face of the extrusion block (30), two positioning holes (33) which are symmetrical in left and right positions are formed in the extrusion block (30), and positioning shafts (32) corresponding to the positioning holes (33) are fixedly arranged on the bottom wall of the filtering tank (28).
4. A diamond wire saw for solar grade silicon wafers according to claim 3, wherein: two discharge pipes (34) communicated with the filter tank (28) are symmetrically arranged at the left and right positions in the filter block (27), a water filtering membrane (36) is fixedly arranged in the discharge pipes (34), a recovery pipe (35) is communicated with the lower side of the discharge pipes (34), and a manual valve (37) is fixedly arranged on the recovery pipe (35).
5. The diamond wire saw according to claim 2, wherein: damper (60) are including fixed connection damping fluid tank (41) between buffer spring (40), be equipped with damping fluid chamber (42) in damping fluid tank (41), sliding connection has piston piece (43) in damping fluid chamber (42), be equipped with on piston piece (43) about the filtration pore (44) that run through, damping fluid tank (41) left side be equipped with on the surface with through-hole (47) of damping fluid chamber (42) intercommunication, filtration pore (44) left end face fixedly connected with passes piston rod (45) of through-hole (47), piston rod (45) left end face fixedly connected with fixed plate (46), fixedly connected with between fixed plate (46) sealed plate (18).
6. The diamond wire saw according to claim 1, wherein: fixedly connected with fixed bolster (53) on cutting chamber (12) left wall, pass scavenge pipe (54) in fixed bolster (53), fixedly connected with self priming pump (55) on the cross-section under scavenge pipe (54), scavenge pipe (54) right side fixedly connected with washs shower nozzle (56), fixed glass board (57) that is equipped with of terminal surface before cutting case (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111291284.0A CN113858463A (en) | 2021-11-03 | 2021-11-03 | Diamond wire cutting machine for solar-grade silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111291284.0A CN113858463A (en) | 2021-11-03 | 2021-11-03 | Diamond wire cutting machine for solar-grade silicon wafer |
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| Publication Number | Publication Date |
|---|---|
| CN113858463A true CN113858463A (en) | 2021-12-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111291284.0A Pending CN113858463A (en) | 2021-11-03 | 2021-11-03 | Diamond wire cutting machine for solar-grade silicon wafer |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117207027A (en) * | 2023-10-27 | 2023-12-12 | 浙江振兴阿祥集团有限公司 | Grooving machine for processing solar silicon wafer storage rack body |
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Application publication date: 20211231 |