CN112223570A

CN112223570A - Semiconductor chip processing and slitting equipment

Info

Publication number: CN112223570A
Application number: CN202011120928.5A
Authority: CN
Inventors: 庄绍海
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-10-19
Filing date: 2020-10-19
Publication date: 2021-01-15

Abstract

The invention discloses a semiconductor chip processing and cutting device, which structurally comprises: the filter is fixed in the middle of the machine body through a bolt, the controller extends upwards from a through hole in the left side of the machine body, the controller is connected with a motor at the inner end of the cutting device through a lead, and the cutting device is horizontally fixed at the bottom of the radiator; has the advantages that: according to the invention, the baffle and the barrier strips are in bidirectional fit, when the sieve hopper rotates, silicon particles collide with the baffle and fall off, and under the condition that the silicon particles still do not fall off after colliding with the baffle, the barrier strips on the surface of the vibration cavity on the outer side are reversely extruded, fragments are gradually guided to be discharged to the bottom, so that the blockage of a screen is avoided, and the filtering effect is better.

Description

Semiconductor chip processing and slitting equipment

Technical Field

The invention discloses a semiconductor chip processing and cutting device, and belongs to the field of semiconductor cutting devices.

Background

Etching and wiring are performed on the semiconductor wafer to obtain a semiconductor device capable of realizing a certain function. Not only silicon chip, it is common still including gallium arsenide, semiconductor materials such as germanium, semiconductor chip need cut at the processing initial stage and polish, cut through senior steel wire equidistance distribution and fast-speed and semiconductor chip raw and other materials when cutting, but because cut the silicon chip through the friction between steel wire and the silicon chip, the in-process of cutting can produce a large amount of silica flour, and the steel wire collides the little fragment that causes in polishing, consequently at filterable in-process, the silicon piece can lead to the filter screen to block up, and still need grind very inconveniently to the fritter secondary when retrieving.

Disclosure of Invention

Aiming at the defects in the prior art, the invention aims to provide semiconductor chip processing and cutting equipment to solve the problems that a filter screen is blocked due to silicon blocks in the filtering process, and fine blocks are inconvenient to grind for the second time in the recovery process.

In order to achieve the purpose, the invention is realized by the following technical scheme: a semiconductor chip processing and cutting device structurally comprises: filter, organism, controller, cut device, radiator, the filter passes through the bolt fastening at the middle part of organism, organism left side through-hole upwards extends and is equipped with the controller, the controller is connected with the inner motor of cutting the device through the wire, cut the device level and fix the bottom at the radiator.

Preferably, the filter comprises hopper, baffle, collecting hopper, inhale powder chamber, the kerve that gathers materials, exhaust fan in dividing the material, it is angle along the inclination in the hopper in the material to divide, and be parallel to each other with the baffle, the baffle passes through the bolt fastening in the bottom of collecting hopper, in dividing the material hopper bottom and the kerve swing joint that gathers materials, the kerve both sides that gather materials are equipped with exhaust fan, inhale the powder chamber and install the top at the kerve that gathers materials.

Preferably, the material separating middle hopper is provided with a material returning baffle, a driving shaft, a screening hopper, a protective top fence and a grinding bottom shaft, the material returning baffle is arranged on the outer side of the screening hopper and is parallel to the material returning baffle, the driving shaft is welded and fixed at the bottom of the screening hopper, the middle of the driving shaft is of a hollow structure, the bottom end of the driving shaft is in interference fit with the upper end of the grinding bottom shaft, the protective top fence is embedded in a bottom groove of the material collecting hopper, and a gap exists between the protective top fence and the grinding bottom shaft.

Preferably, the feed back baffle is provided with a converter, a positioning shaft, a vibration cavity, more than two resonance ribs and barrier strips, the driving unit at the inner end of the converter is connected with the shaft rod of the positioning shaft, the positioning shaft is welded at the center of the arc edge at the right side of the vibration cavity, the internal grooves in the vibration cavity are uniformly fixed, and the concave surface at the left side of the vibration cavity is tightly attached to the barrier strips.

As preferred, grind the end axle and be equipped with material receiving ring, pressure disk, dustproof piece, activity chamber, jacking ware, material receiving ring nestification is fixed on the outer edge of pressure disk, the pressure disk edge keeps the parallel and level with the outer edge in dustproof piece, dustproof piece parcel is in the outside in activity chamber, jacking ware vertical fixation is in the center of pressure disk, material receiving ring upper end extends to the bottom of drive shaft, and through welded fastening.

Preferably, the powder suction cavities are fixed on two sides of the material distribution middle hopper in an angle.

Preferably, the vibration cavity is of an arc-shaped hollow structure.

Preferably, the upper edge of the pressure plate is arc-shaped, and two ends of the pressure plate extend to the bottom to form a vertical plane.

Preferably, the platen is made of metal.

Advantageous effects

The invention relates to a semiconductor chip processing and cutting device, which has the following effects:

1. according to the invention, the motor in the aggregate bottom groove drives the driving shaft to rotate, silicon particles passing through a gap between the pressure plate and the aggregate bottom groove are crushed and discharged, and the gap between the pressure plate and the aggregate bottom groove can be controlled by the jacking device according to requirements, so that the secondary processing of silicon powder is avoided, and the working efficiency is improved.

2. According to the invention, the baffle and the barrier strips are in bidirectional fit, when the sieve hopper rotates, silicon particles collide with the baffle and fall off, and under the condition that the silicon particles still do not fall off after colliding with the baffle, the barrier strips on the surface of the vibration cavity on the outer side are reversely extruded, fragments are gradually guided to be discharged to the bottom, so that the blockage of a screen is avoided, and the filtering effect is better.

Drawings

Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:

fig. 1 is a schematic structural diagram of a semiconductor chip processing and dicing apparatus according to the present invention.

Fig. 2 is a schematic front view of the filter of the present invention.

Fig. 3 is a schematic sectional view of the hopper in the material distribution of the present invention.

FIG. 4 is a schematic cross-sectional view of the feed back baffle of the present invention.

FIG. 5 is a schematic cross-sectional view of the grinding bottom shaft of the present invention.

FIG. 6 is a schematic diagram of the structure of the vibration chamber and the barrier strips according to the present invention.

Fig. 7 is a schematic perspective view of the distributing hopper of the present invention.

In the figure: the device comprises a filter-1, a machine body-2, a controller-3, a slitting device-4, a radiator-5, a material distribution middle hopper-11, a baffle-12, a material collection hopper-13, a powder suction cavity-14, a material collection bottom groove-15, a material return baffle-111, a driving shaft-112, a screening hopper-113, a protection top fence-114, a grinding bottom shaft-115, a converter-1111, a positioning shaft-1112, a vibration cavity-1113, a resonance rib-1114, a baffle-1115, a material receiving ring-1151, a pressure plate-1152, a dustproof sheet-1153, a movable cavity-1154 and a jacking device-1155.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.

Referring to fig. 1 to 7, the present invention provides a technical solution of a semiconductor chip processing and cutting apparatus: the structure includes: filter 1, organism 2, controller 3, cut device 4, radiator 5, filter 1 passes through the bolt fastening at the middle part of

organism

2, 2 left side through-holes of organism upwards extend and are equipped with controller 3, controller 3 is connected with the inner motor of cutting device 4 through the wire, cut the bottom at radiator 5 of device 4 level fixation.

Filter 1 by in the branch fill 11, baffle 12, aggregate bin 13, inhale powder chamber 14, the kerve 15 that gathers materials, exhaust fan 16 constitutes, in the branch fill 11 interior edge inclination be 45, and be parallel to each other with baffle 12, baffle 12 passes through the bolt fastening in the bottom of aggregate bin 13, in the branch fill 11 bottom and the kerve 15 swing joint that gathers materials, 15 both sides of kerve 15 are equipped with exhaust fan 16, inhale powder chamber 14 and install the top at the kerve 15 that gathers materials, in the foretell branch fill 11 interior edge inclination be 45, and be parallel to each other with baffle 12, the baffle can avoid too much dust to concentrate on the upper surface of feed back baffle 111, can scrape the debris that partly struck off more easily simultaneously.

Hopper 11 is equipped with feed back baffle 111, drive shaft 112, sieve hopper 113, protection top fence 114, grinds bottom shaft 115 in the branch material, feed back baffle 111 installs in the outside of sieve hopper 113, and the two is parallel to each other, drive shaft 112 welded fastening is in the bottom of sieve hopper 113, and the middle part is hollow out construction, drive shaft 112 bottom and the interference fit of grinding bottom shaft 115 upper end, protection top fence 114 caulking groove is at the kerve of collecting hopper 13, and the two has the clearance.

The feed back baffle 111 is equipped with converter 1111, location axle 1112, vibrations chamber 1113, resonance muscle 1114, blend stop 1115, converter 1111 inner drive unit is connected with location axle 1112 axostylus axostyle, location axle 1112 welds in vibrations chamber 1113 right side arc limit center, resonance muscle 1114 is equipped with more than two, evenly fixes the inside groove at vibrations chamber 1113, vibrations chamber 1113 left side indent surface closely laminates with blend stop 1115, and foretell blend stop 1115 is slope symmetric distribution (see fig. 6) can guide hole site inner impurities to discharge when the check keeps off.

The grinding bottom shaft 115 is provided with a material receiving ring 1151, a pressure plate 1152, a dustproof sheet 1153, a movable cavity 1154 and a jacking device 1155, the material receiving ring 1151 is fixed on the outer edge of the pressure plate 1152 in a nested mode, the edge of the pressure plate 1152 is flush with the outer edge of the dustproof sheet 1153, the dustproof sheet 1153 is wrapped outside the movable cavity 1154, the jacking device 1155 is vertically fixed at the center of the pressure plate 1152, and the upper end of the material receiving ring 1151 extends to the bottom end of the driving shaft 112 and is fixed through welding.

Inhale powder chamber 14 and be 45 and fix in dividing the both sides of fighting, the powder of inhaling that will filter absorbs fast, and owing to be the slope structure, can pile up earlier then retrieve when the dust is great, improves the efficiency of retrieving.

Vibrations chamber 1113 is arc hollow out construction, and when the barrier was touched to the blend stop, vibrations chamber 1113 inside produced resonance and made resonance muscle 1114 shake, shaken off the dust on vibrations chamber 1113 surface, carries out the high frequency striking to 113 unilateral sieve hoppers simultaneously for the granule in the hole is shaken out, avoids blocking.

The upper edge of the pressure plate 1152 is arc-shaped, and two ends of the pressure plate extend to the bottom to form a vertical plane.

The platen 1152 is made of metal.

When in use:

the controller 3 controls the slitting device 4 at the upper end of the machine body 2 to perform slitting work, and the radiator 5 ensures that the temperature of the steel wire is kept in a normal range in the slitting process, so that the condition that the cutting effect is not good due to high-temperature softening is avoided.

Inside the branch material of cutting silicon powder entering filter 1 inside collection hopper 13 lower edge fill 11, inhale the powder and discharge to both sides under the wind pressure of inhaling powder chamber 14, because the effect of gravity, large granule silicon piece is disregarded the wind pressure and directly falls to inside the material receiving ring 1151 of grinding bottom shaft 115, then when the inside motor of bottom groove 15 that gathers materials drives drive shaft 112 rotatory, through pressure disk 1152 and the granule in the bottom groove 15 gap of gathering materials crushed the discharge, and can be according to the demand, make the granule size obtain control through the clearance of jacking ware 1155 control pressure disk 1152 and bottom groove 15 that gathers materials.

When part silicon fragments are clamped in the side groove of the sieve hopper 113, the silicon fragments collide with the baffle 12 and fall off when the sieve hopper 113 rotates, and the silicon fragments still do not fall off when colliding with the baffle 12, the barrier strips 1115 on the surface of the vibration cavity 1113 on the outer side reversely extrude to gradually guide the fragments to be discharged towards the bottom, the guide direction of the barrier strips 1115 can be adjusted by driving the positioning shaft 1112 through the converter 1111, the direction of the barrier strips 1115 is changed when the silicon fragments are attached to different directions (see fig. 6), and the impurity cleaning and crushing are more thorough by matching with the positive and negative rotation of the driving shaft.

The foregoing merely illustrates the principles and preferred embodiments of the invention and many variations and modifications may be made by those skilled in the art in light of the foregoing disclosure, which are intended to be within the scope of the invention.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. A semiconductor chip processing and cutting device structurally comprises: filter (1), organism (2), controller (3), cut device (4), radiator (5), its characterized in that:

filter (1) passes through the bolt fastening at the middle part of organism (2), organism (2) left side through-hole upwards extends and is equipped with controller (3), controller (3) are connected with the inner motor of cutting device (4) through the wire, cut device (4) level and fix the bottom at radiator (5).

2. The semiconductor chip processing and dicing apparatus according to claim 1, wherein: filter (1) by in the branch fill (11), baffle (12), aggregate bin (13), inhale powder chamber (14), the kerve (15) that gathers materials, exhaust fan (16) are constituteed, be 45 along the inclination in fighting (11) in the branch, and be parallel to each other with baffle (12), baffle (12) pass through the bolt fastening in the bottom of aggregate bin (13), fight (11) bottom and the kerve (15) swing joint that gathers materials in the branch, the kerve (15) both sides of gathering materials are equipped with exhaust fan (16), inhale the top of powder chamber (14) and install at the kerve (15) that gathers materials.

3. The semiconductor chip processing and dicing apparatus according to claim 2, wherein: hopper (11) are equipped with feed back baffle (111), drive shaft (112), sieve hopper (113), protection overhead guard (114), grind bottom shaft (115) in dividing the material, feed back baffle (111) are installed in the outside of sieve hopper (113), and the two is parallel to each other, drive shaft (112) welded fastening is in the bottom of sieve hopper (113), and the middle part is hollow out construction, drive shaft (112) bottom and grinding bottom shaft (115) upper end interference fit, protection overhead guard (114) caulking groove is at the kerve of collecting hopper (13), and the two has the clearance.

4. The semiconductor chip processing and dicing apparatus according to claim 2, wherein: feed back baffle (111) are equipped with converter (1111), location axle (1112), vibrations chamber (1113), resonance muscle (1114), blend stop (1115), converter (1111) inner drive unit is connected with location axle (1112) axostylus axostyle, location axle (1112) welding is at vibrations chamber (1113) right side arc limit center, resonance muscle (1114) are equipped with more than two, evenly fix the inside groove in vibrations chamber (1113), vibrations chamber (1113) left side indent surface closely laminates with blend stop (1115).

5. The semiconductor chip processing and dicing apparatus according to claim 3, wherein: grind end axle (115) and be equipped with material receiving ring (1151), pressure disk (1152), dust guard (1153), activity chamber (1154), jacking ware (1155), material receiving ring (1151) nestification is fixed at the outer edge of pressure disk (1152), pressure disk (1152) edge and dust guard (1153) outer edge keep the parallel and level, the outside in activity chamber (1154) is wrapped up in dust guard (1153), jacking ware (1155) vertical fixation is in the center of pressure disk (1152), material receiving ring (1151) upper end extends to the bottom of drive shaft (112), and through welded fastening.

6. The semiconductor chip processing and dicing apparatus according to claim 2, wherein: the powder suction cavity (14) is fixed on two sides of the distributing hopper at an angle of 45 degrees.

7. The semiconductor chip processing and dicing apparatus according to claim 4, wherein: the vibration cavity (1113) is of an arc-shaped hollow structure.

8. The semiconductor chip processing and dicing apparatus according to claim 5, wherein: the upper edge of the pressure plate (1152) is arc-shaped, and two ends of the pressure plate extend to the bottom to form a vertical plane.