CN113496966A - Electronic package - Google Patents
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- CN113496966A CN113496966A CN202010333902.2A CN202010333902A CN113496966A CN 113496966 A CN113496966 A CN 113496966A CN 202010333902 A CN202010333902 A CN 202010333902A CN 113496966 A CN113496966 A CN 113496966A
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- Prior art keywords
- electronic
- electronic package
- functional element
- layer
- bearing structure
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- 239000011247 coating layer Substances 0.000 claims abstract description 8
- 239000010410 layer Substances 0.000 claims description 66
- 238000005253 cladding Methods 0.000 claims description 30
- 239000000463 material Substances 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 238000005538 encapsulation Methods 0.000 claims description 4
- 239000000945 filler Substances 0.000 claims description 4
- 230000005855 radiation Effects 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 description 15
- 230000017525 heat dissipation Effects 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 8
- 238000000465 moulding Methods 0.000 description 7
- 239000004593 Epoxy Substances 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- SZUVGFMDDVSKSI-WIFOCOSTSA-N (1s,2s,3s,5r)-1-(carboxymethyl)-3,5-bis[(4-phenoxyphenyl)methyl-propylcarbamoyl]cyclopentane-1,2-dicarboxylic acid Chemical compound O=C([C@@H]1[C@@H]([C@](CC(O)=O)([C@H](C(=O)N(CCC)CC=2C=CC(OC=3C=CC=CC=3)=CC=2)C1)C(O)=O)C(O)=O)N(CCC)CC(C=C1)=CC=C1OC1=CC=CC=C1 SZUVGFMDDVSKSI-WIFOCOSTSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229940126543 compound 14 Drugs 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000012792 core layer Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
An electronic package comprising: the electronic device comprises a bearing structure, a plurality of electronic elements arranged on the bearing structure and electrically connected with the bearing structure, a coating layer formed on the bearing structure and a sheet-shaped functional piece embedded in the coating layer, wherein the coating layer is provided with at least one through hole for exposing the functional piece, so that the functional piece can radiate heat only by being close to the periphery of the electronic element without being combined with the electronic element, and a heat radiation area on the bearing structure is increased.
Description
Technical Field
The present invention relates to a package structure, and more particularly, to an electronic package with heat dissipation function.
Background
With the rapid development of portable electronic products in recent years, various related products are gradually developed toward high density, high performance, and light, thin, short and small trends, wherein semiconductor package structures applied to various types of the portable electronic products are also developed in a matching manner so as to meet the requirements of light, thin, short and high density.
Fig. 1 is a schematic cross-sectional view of a conventional semiconductor package 1. The semiconductor package 1 is provided with a semiconductor element 11 and a passive element 11 'on the upper and lower sides of a circuit structure 10, and a molding compound (molding compound)14 is used to encapsulate the semiconductor element 11 and the passive element 11', and a plurality of solder balls 13 are formed on the contacts 100, so that the semiconductor package 1 is connected to an electronic device (not shown) such as a circuit board through the solder balls 13 in a subsequent manufacturing method, wherein the contacts 100 (I/O)100 of the circuit structure 10 are exposed from the molding compound 14.
However, in the conventional semiconductor package 1, the semiconductor device 11 and the passive device 11 ' generate a large amount of heat energy during operation, and the encapsulant 14 covering the semiconductor device 11 and the passive device 11 ' is a poor heat-conducting material with a thermal conductivity of only 0.8Wm-1k-1 (i.e., the dissipation efficiency of heat energy is not good), so that the generated heat energy cannot be effectively dissipated, which may cause damage to the semiconductor device 11 and the passive device 11 ' or cause product reliability problems.
Therefore, how to overcome the above problems in the prior art has become a problem to be overcome in the industry.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, the present invention provides an electronic package to improve the heat dissipation effect.
The electronic package of the present invention includes: a load bearing structure; the electronic element is arranged on the bearing structure and is electrically connected with the bearing structure; a cladding layer formed on the load-bearing structure; and a sheet-like functional member embedded in the clad, wherein the clad has at least one through hole corresponding to the functional member.
In the electronic package, the supporting structure has a first side and a second side opposite to each other, and the electronic element is disposed on the first side and/or the second side.
In the foregoing electronic package, the carrier structure is configured with a plurality of electronic components, and the functional element has at least one supporting portion standing on the carrier structure and blocking between two of the plurality of electronic components.
In the electronic package, the functional element is a metal element. For example, the functional element is a heat sink and/or a shield.
In the electronic package, the functional element has a main body portion and at least one supporting portion disposed on the main body portion, and the main body portion is stacked on the supporting structure through the supporting portion. For example, the support portion is columnar or wall-shaped.
In the electronic package, the functional element is further exposed at a side surface of the package layer.
The electronic package further includes a shielding layer formed on the encapsulation layer. For example, the shielding layer also extends into the through-hole. Alternatively, a filler is formed in the through hole. Further, the shielding layer contacts the functional member.
The electronic package further includes a conductive element formed on the carrier structure.
The electronic package further includes a support frame stacked on the carrier structure.
Therefore, in the electronic package of the present invention, the functional element is embedded in the cladding layer and exposed out of the through holes, so that the functional element can dissipate heat only by being close to a heat source (such as around the electronic element) without being combined with the electronic element, so as to increase the heat dissipation area of the supporting structure.
Drawings
Fig. 1 is a schematic cross-sectional view illustrating a conventional method for fabricating a semiconductor package.
Fig. 2A to 2D are schematic cross-sectional views illustrating a method for fabricating an electronic package according to the present invention.
Fig. 2A' is a partial top view of fig. 2A.
Fig. 2C' is a partial top view of fig. 2C.
Fig. 2D' is a schematic cross-sectional view of another process of fig. 2D.
FIG. 2D' is a schematic cross-sectional view of another embodiment of FIG. 2D.
Fig. 3 to 5 are schematic cross-sectional views of other embodiments of fig. 2D.
Description of the reference numerals
1 semiconductor package 10 line structure
100 contact 11 semiconductor element
11' passive component 13 solder ball
14 encapsulation of the gel 2, 2', 3,4,5 electronic package
2a,2 a', 3a,4a,5a electronic component 20 carrying structure
20a first side 20b second side
200 wiring layer 21 first electronic component
210,220 conductive bumps 22, 22', 22 ″
23 conductive element 24 second cladding layer
24a first surface 24b second surface
25 support 250 electrical contact pad
250a,251a,26a surface 251 bond pad
26 first coating 27 function
27a conductive material 270 body part
271,271 ', 371 support 28, 28' join layer
29 shield layer 290 filler
h height L distance
And S, cutting a path.
Detailed Description
The following description of the embodiments of the present invention is provided by way of specific examples, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein.
It should be understood that the structures, ratios, sizes, and the like shown in the drawings attached to the present specification are only used for matching with the disclosure of the present specification for understanding and reading of the present invention, and are not used for limiting the conditions of the present invention, so they have no technical significance, and any structural modifications, ratio relationship changes or size adjustments should fall within the scope of the present invention without affecting the function and the achievable purpose of the present invention. In addition, the terms "upper", "lower", "first", "second" and "first" used in the present specification are for clarity of description, and are not intended to limit the scope of the present invention, and changes or modifications in the relative relationship may be made without substantial technical changes.
Fig. 2A to 2D are schematic cross-sectional views illustrating a method for manufacturing the electronic package 2 according to the present invention.
As shown in fig. 2A, an electronic component 2A is provided, and a sheet-like functional element 27 is disposed on the electronic component 2A.
In the present embodiment, the electronic component 2a includes a carrying structure 20, and a conductive element 23, a first electronic element 21 and a second electronic element 22, 22', 22 ″ disposed on the carrying structure 20.
The load bearing structure 20 has a first side 20a (e.g., a lower side) and a second side 20b (e.g., an upper side) opposite each other. In the embodiment, the carrier structure 20 is a circuit structure such as a package substrate (substrate) having a core layer and a circuit structure or a coreless layer (core), and has a plurality of circuit layers 200, such as a fan-out (fan out) redistribution layer (RDL). It should be understood that the supporting structure 20 may also be other supporting units for supporting electronic devices such as chips, for example, lead frame (lead frame), but is not limited thereto.
The first electronic component 21 is disposed on the first side 20a of the carrying structure 20. In the present embodiment, the first electronic component 21 is an active component, such as a semiconductor chip, a passive component, such as a resistor, a capacitor, and an inductor, or a combination thereof. For example, the first electronic component 21 is disposed on the circuit layer 200 of the first side 20a in a flip-chip manner through a plurality of conductive bumps 210 such as solder material, and electrically connected to the circuit layer 200, and the conductive bumps 210 are encapsulated by an underfill (not shown) or a first encapsulating layer 26 (described later); alternatively, the first electronic component 21 can be electrically connected to the circuit layer 200 on the first side 20a by wire bonding through a plurality of bonding wires (not shown). However, the manner of electrically connecting the first electronic component 21 to the carrying structure 20 is not limited to the above.
The second electronic component 22, 22', 22 "is disposed on the second side 20b of the carrier structure 20. In the present embodiment, the second electronic component 22,22 ', 22 ″ is an active component, a passive component, or a combination thereof, wherein the active component (as shown in the figure, the second electronic component 22) is, for example, a semiconductor chip, and the passive component (as shown in the figure, the second electronic component 22', 22 ") is, for example, a resistor, a capacitor, and an inductor. For example, the second electronic component 22 is disposed on the circuit layer 200 on the second side 20b in a flip-chip manner through a plurality of conductive bumps 220 such as solder material, and electrically connected to the circuit layer 200, and the conductive bumps 220 are covered by an underfill (not shown) or a second cladding layer 24 (described later); alternatively, the second electronic component 22 can be electrically connected to the circuit layer 200 on the second side 20b by wire bonding via a plurality of bonding wires (not shown); alternatively, the second electronic component 22', 22 ″ may directly contact the circuit layer 200 on the second side 20 b. However, the manner of electrically connecting the second electronic components 22, 22', 22 ″ to the carrying structure 20 is not limited to the above.
The conductive element 23 is disposed on the circuit layer 200 at the first side 20a of the carrier structure 20. In the present embodiment, the conductive element 23 is a solder ball (ball) or a metal pillar, and is not particularly limited.
In addition, the electronic component 2a further includes a supporting frame 25, such as a lead frame (lead frame), having a plurality of spaced apart electrical contact pads 250 and at least one bonding pad 251, such that each of the electrical contact pads 250 is bonded to each of the conductive elements 23, and the first electronic element 21 is bonded to the bonding pad 251 through a bonding layer 28. For example, the bonding layer 28 is, for example, a film (film), an epoxy (epoxy) or a Thermal Interface Material (TIM).
In addition, the electronic component 2a further includes a first coating layer 26 formed between the first side 20a of the supporting structure 20 and the supporting frame 25, such that the first coating layer 26 coats the first electronic element 21, the conductive bump 210 and the conductive element 23, and the first coating layer 26 is exposed out of the partial surfaces of the electrical contact pads 250 and the bonding pads 251, so as to connect an electronic device (not shown) such as a circuit board through the electrical contact pads 250. For example, the surfaces 250a of the electrical contact pads 250 and the surface 251a of the bonding pad 251 are flush with the surface 26a of the first cladding layer 26. Specifically, the material forming the first cladding layer 26 is Polyimide (PI), dry film (dry film), epoxy resin (epoxy), or molding compound (molding compound), but is not limited thereto).
The functional component 27 is disposed on the second side 20b of the carrying structure 20, and has a main body 270 and a plurality of supporting portions 271, 271' disposed on the lower side of the main body 270.
In the present embodiment, the functional element 27 is a metal plate structure, such as a heat sink, the lower side of the plate-shaped body 270 is bonded to the second electronic component 22 through another bonding layer 28 ', and the supporting portions 271,271 ' (shown in fig. 2A ' as a column or wall) are bonded to the second side 20b of the supporting structure 20 through a conductive material 27a, such as solder or conductive adhesive. For example, the bonding layer 28' is a film (film), epoxy (epoxy) or Thermal Interface Material (TIM). Specifically, the supporting portions 271,271 ' are erected on the second side 20b of the supporting structure 20 and electrically connected to the circuit layer 200 of the second side 20b and the supporting structure 20, and the supporting portions 271,271 ' can be located around the second electronic components 22,22 ', 22 ″ as required.
In addition, the main body 270 and the supporting portions 271, 271' are formed as a copper sheet structure; alternatively, as shown in fig. 3, a solder material may be used for the columnar support 371, and the body 270 and the support 371 are formed non-integrally.
As shown in fig. 2B, a second cladding layer 24 is formed on the second side 20B of the carrying structure 20 to clad the second electronic element 22, 22', 22 ", the conductive bump 220 and the functional element 27.
In the present embodiment, the material forming the second cladding layer 24 is Polyimide (PI), dry film (dry film), epoxy resin (epoxy), or molding compound (molding compound), but is not limited thereto. For example, the material of the first cladding layer 26 and the material of the second cladding layer 24 may be the same or different. Specifically, the second cladding layer 24 has a first surface 24a and a second surface 24b opposite to each other, and the second cladding layer 24 is combined with the second surface 24b thereof to the second side 20b of the bearing structure 20.
In addition, after the singulation method is performed along the cutting path S shown in fig. 2A, the body portion 270 is exposed to the side surface 24c of the second cladding layer 24, wherein the side surface 24c of the second cladding layer 24 is adjacent to the first surface 24a and the second surface 4b of the second cladding layer 24.
As shown in fig. 2C, a plurality of through holes 240 are formed on the first surface 24a of the second cladding layer 24, such that a portion of the surface of the functional element 27 is exposed to the through holes 240.
In the present embodiment, the through holes 240 are elongated or rectangular openings, as shown in fig. 2C', so that part of the surface of the body 270 of the functional element 27 is exposed out of the through holes 240.
As shown in fig. 2D, a shielding layer 29 is formed on the first surface 24a and the side surface 24c of the second cladding layer 24 to contact the body portion 270, and the shielding layer 29 further extends into the through hole 240 to contact the body portion 270.
In the present embodiment, the shielding layer 29 is a metal material formed by sputtering and is not filled in the through hole 240. However, in other embodiments, the shielding layer 29 may be sputtered copper to fill the through hole 240; alternatively, as shown in fig. 2D ', the electronic package 2' fills the through hole 240 with a filling material 290 such as a metal material (e.g., metal paste or other manufacturing method metal material) or an insulating material, so as to fill the through hole 240.
Therefore, in the electronic package 2,2 'of the present invention, the functional element 27 is embedded in the second cladding layer 24 in a bent sheet structure, and the supporting portions 271, 271', 371 are connected to the supporting structure 20, and the main portion 270 is exposed out of the through holes 240, so that the functional element 27 can dissipate heat only by being close to a heat source (such as the periphery of the second electronic element 22 ', 22 ″) without being combined with the second electronic element 22', 22 ″, thereby increasing a heat dissipation area on the second side 20b of the supporting structure 20. For example, the height h of the second electronic component 22 "is high, and as shown in fig. 2D, the upper side of the second electronic component is not covered by the main body 270, but the wall-shaped supporting portion 271 '(as shown in fig. 2A') and the main body 270 can be close to the periphery of the second electronic component 22" to achieve the purpose of heat dissipation.
In addition, by the design of the through hole 240, the main body 270 does not need to be flush with the first surface 24a of the second cladding layer 24 for heat dissipation, so the height of the supporting portions 271, 271', 371 (or the distance L between the main body 270 and the second side 20b of the carrying structure 20 as shown in fig. 2D) can be greatly reduced, and thus the heat conduction path of the functional component 27 can be shortened for heat dissipation acceleration.
In addition, the supporting portions 271, 271', 371 are disposed between the second electronic components 22 to generate a sandwiched state, so that the effect of shielding Electromagnetic Interference (EMI) between the second electronic components 22 can be enhanced.
The electronic component 2a is not limited to the above-described embodiment, but may be of various types. For example, fig. 2D "shows an electronic component 2 a', which has a first side 20a of a carrying structure 20 as a ball-implanting side, and is configured with only a conductive element 23 for receiving an electronic device (not shown) such as a circuit board; alternatively, as shown in fig. 3, the electronic package 3 has an electronic component 3a without a support frame 25; or, as shown in fig. 4, in the electronic package 4, the second side 20b of the carrying structure 20 of the electronic component 4a is not provided with an active device (the second electronic component 22); furthermore, as shown in fig. 5, in the electronic package 5, the electronic component 5a is not provided with the supporting frame 25, and the second side 20b of the carrying structure 20 is also not provided with the active component (the second electronic component 22).
The invention also provides an electronic package 2, 2', 2 ", 3,4,5 comprising: a carrier structure 20, a first electronic component 21 and/or a second electronic component 22, 22', 22 ", a second cladding layer 24 and a sheet-like functional element 27.
The first electronic component 21 and/or the second electronic component 22, 22', 22 ″ are disposed on the supporting structure 20 and electrically connected to the supporting structure 20.
The second cladding layer 24 is formed on the load bearing structure 20.
The sheet-like functional element 27 is embedded in the second cladding layer 24, wherein the second cladding layer 24 has at least one through hole 240 exposing the functional element 27.
In one embodiment, the supporting structure 20 has a first side 20a and a second side 20b opposite to each other, the second electronic element 22 is disposed on the second side 20b, and a first covering layer 26 covering the first electronic element 21 can be disposed on the first side 20a as required; alternatively, the second cladding layer 24 may also encapsulate the second electronic component 22, 22', 22 ".
In one embodiment, the carrying structure 20 is configured with a plurality of the second electronic components 22,22 ', 22 ", and the functional component 27 has at least one supporting portion 271,271 ', 371 standing on the carrying structure 20 and being separated between two of the plurality of the second electronic components 22,22 ', 22".
In one embodiment, the functional element 27 is a metal element. The functional element 27 is, for example, a heat sink and/or a shield.
In one embodiment, the functional element 27 has a main body 270 and at least one supporting portion 271,271 ', 371 disposed on the lower side of the main body 270, and the main body 270 is stacked on the supporting structure 20 through the supporting portions 271, 271', 371.
In one embodiment, the electronic package 2, 2', 2 ", 3,4,5 further comprises a shielding layer 29 formed on the second cladding layer 24. For example, the shielding layer 29 also extends into the through hole 240. Alternatively, as shown in fig. 2D', a filler 290 is formed in the through hole 240. Alternatively, the shielding layer 29 contacts the functional element 27.
In one embodiment, the electronic package 2 ", 3,5 further includes at least one conductive element 23 formed on the carrier structure 20 to serve as an I/O contact for connecting an electronic device such as a circuit board. Further, the conductive element 23 can be embedded in the first cladding layer 26 and partially exposed out of the surface 26a of the first cladding layer 26 to serve as an I/O contact for combining with an electronic device such as a circuit board.
In one embodiment, the electronic package 2, 2', 4 further includes a supporting frame 25 stacked on the carrying structure 20 and embedded in the first cladding 26, and a portion of the supporting frame is exposed out of the surface 26a of the first cladding 26 to serve as an I/O contact (e.g., an electrical contact pad 250) for being combined with an electronic device such as a circuit board.
In summary, the electronic package 2,2 ', 2 ", 3,4,5 of the present invention provides a heat dissipation function by the design of the functional element 27, so that compared to the prior art, when the first electronic component 21 and the second electronic component 22,22 ', 22" generate a large amount of heat energy during operation, the functional element 27 can effectively dissipate the heat generated by the carrying structure 20 and the electronic components thereon, thereby avoiding the damage to the first electronic component 21 and the second electronic component 22,22 ', 22 "or the product reliability problem.
In addition, the design of the functional component 27 provides a shielding function, so that the shielding effect of Electromagnetic Interference (EMI) between the second electronic components 22 can be enhanced.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify the above-described embodiments without departing from the spirit and scope of the present invention. The scope of the invention is therefore indicated by the appended claims.
Claims (14)
1. An electronic package, comprising:
a load bearing structure;
the electronic element is arranged on the bearing structure and is electrically connected with the bearing structure;
a cladding layer formed on the load-bearing structure; and
the sheet-shaped functional element is embedded in the coating layer, and the coating layer is provided with at least one through hole corresponding to the functional element.
2. The electronic package according to claim 1, wherein the carrier structure has a first side and a second side opposite to each other, and the electronic component is disposed on the first side and/or the second side.
3. The electronic package according to claim 1, wherein the carrier structure is configured with a plurality of electronic components, and the functional element has at least one supporting portion standing on the carrier structure, so that the supporting portion is isolated between two of the plurality of electronic components.
4. The electronic package of claim 1, wherein the functional element is a metal element.
5. The electronic package of claim 4, wherein the functional element is a heat spreader and/or a shield.
6. The electronic package according to claim 1, wherein the functional element has a body portion and at least one supporting portion disposed on the body portion, and the body portion is stacked on the supporting structure through the supporting portion.
7. The electronic package of claim 6, wherein the support portion is cylindrical or wall-shaped.
8. The electronic package of claim 1, wherein the functional element is further exposed at a side of the encapsulation layer.
9. The electronic package of claim 1, further comprising a shielding layer formed on the encapsulation layer.
10. The electronic package of claim 9, wherein the shielding layer further extends into the through-hole.
11. The electronic package of claim 9, wherein the via hole has a filler material formed therein.
12. The electronic package of claim 9, wherein the shielding layer contacts the functional element.
13. The electronic package of claim 1, further comprising a conductive element formed on the carrier structure.
14. The electronic package according to claim 1, further comprising a support frame stacked on the carrier structure.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW109111268A TWI732509B (en) | 2020-04-01 | 2020-04-01 | Electronic package |
| TW109111268 | 2020-04-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113496966A true CN113496966A (en) | 2021-10-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010333902.2A Pending CN113496966A (en) | 2020-04-01 | 2020-04-24 | Electronic package |
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| Country | Link |
|---|---|
| CN (1) | CN113496966A (en) |
| TW (1) | TWI732509B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI800416B (en) * | 2022-06-24 | 2023-04-21 | 矽品精密工業股份有限公司 | Electronic package and manufacturing method thereof |
| TWI826091B (en) * | 2022-11-01 | 2023-12-11 | 矽品精密工業股份有限公司 | Electronic package and manufacturing method thereof |
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| CN1585115A (en) * | 2003-08-22 | 2005-02-23 | 矽品精密工业股份有限公司 | Semiconductor sealer with radiating structure |
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| CN106298742A (en) * | 2012-12-28 | 2017-01-04 | 日月光半导体制造股份有限公司 | Semiconductor package assembly and a manufacturing method thereof |
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| TWI611533B (en) * | 2014-09-30 | 2018-01-11 | 矽品精密工業股份有限公司 | Semiconductor pa ckage and method of manufacture |
| US10517948B2 (en) * | 2015-03-11 | 2019-12-31 | The Board Of Regents Of The University Of Texas System | Anti-DC-HIL antibodies for cancer diagnosis, prognosis and therapy |
| TWI603456B (en) * | 2016-09-30 | 2017-10-21 | 矽品精密工業股份有限公司 | Electronic package structure and method for fabricating the same |
| TWI645518B (en) * | 2017-02-16 | 2018-12-21 | 矽品精密工業股份有限公司 | Package structure and the manufacture thereof |
| TWI663701B (en) * | 2017-04-28 | 2019-06-21 | 矽品精密工業股份有限公司 | Electronic package and method for fabricating the same |
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2020
- 2020-04-01 TW TW109111268A patent/TWI732509B/en active
- 2020-04-24 CN CN202010333902.2A patent/CN113496966A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1585115A (en) * | 2003-08-22 | 2005-02-23 | 矽品精密工业股份有限公司 | Semiconductor sealer with radiating structure |
| KR20050061646A (en) * | 2003-12-18 | 2005-06-23 | 삼성전자주식회사 | Integrated circuit package with emi shielding and heat sink |
| CN106298742A (en) * | 2012-12-28 | 2017-01-04 | 日月光半导体制造股份有限公司 | Semiconductor package assembly and a manufacturing method thereof |
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| TWI732509B (en) | 2021-07-01 |
| TW202139375A (en) | 2021-10-16 |
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