CN113169153A - 一种芯片的封装结构 - Google Patents
一种芯片的封装结构 Download PDFInfo
- Publication number
- CN113169153A CN113169153A CN201880099876.2A CN201880099876A CN113169153A CN 113169153 A CN113169153 A CN 113169153A CN 201880099876 A CN201880099876 A CN 201880099876A CN 113169153 A CN113169153 A CN 113169153A
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- Prior art keywords
- wiring board
- metal
- chip
- wiring
- package structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
一种封装结构，包括布线板(22)，以及贴附于所述布线板(22)上下两面的两个芯片(10、20)。由于上下两个芯片(10、20)直接贴附于所述布线板(22)上，从而减小了芯片的厚度。
Description
PCT国内申请，说明书已公开。
Claims (13)
- PCT国内申请，权利要求书已公开。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2018/123686 WO2020132909A1 (zh) | 2018-12-26 | 2018-12-26 | 一种芯片的封装结构 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113169153A true CN113169153A (zh) | 2021-07-23 |
| CN113169153B CN113169153B (zh) | 2023-09-29 |
Family
ID=71126835
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880099876.2A Active CN113169153B (zh) | 2018-12-26 | 2018-12-26 | 一种芯片的封装结构 |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN113169153B (zh) |
| WO (1) | WO2020132909A1 (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11410902B2 (en) * | 2019-09-16 | 2022-08-09 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package and method of manufacturing the same |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140210099A1 (en) * | 2013-01-30 | 2014-07-31 | Taiwan Semiconductor Manufacturing Company, Ltd. | Packaged Semiconductor Devices and Packaging Methods |
| CN105047617A (zh) * | 2015-06-09 | 2015-11-11 | 华进半导体封装先导技术研发中心有限公司 | 一种整体堆叠封装结构及其制作方法 |
| CN105118823A (zh) * | 2015-09-24 | 2015-12-02 | 中芯长电半导体（江阴）有限公司 | 一种堆叠型芯片封装结构及封装方法 |
| US20160035666A1 (en) * | 2014-07-30 | 2016-02-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Packages with molding structures and methods of forming the same |
| CN106558574A (zh) * | 2016-11-18 | 2017-04-05 | 华为技术有限公司 | 芯片封装结构和方法 |
| CN106876363A (zh) * | 2017-03-13 | 2017-06-20 | 江苏长电科技股份有限公司 | 3d连接的扇出型封装结构及其工艺方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10157828B2 (en) * | 2016-09-09 | 2018-12-18 | Powertech Technology Inc. | Chip package structure with conductive pillar and a manufacturing method thereof |
-
2018
- 2018-12-26 CN CN201880099876.2A patent/CN113169153B/zh active Active
- 2018-12-26 WO PCT/CN2018/123686 patent/WO2020132909A1/zh active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140210099A1 (en) * | 2013-01-30 | 2014-07-31 | Taiwan Semiconductor Manufacturing Company, Ltd. | Packaged Semiconductor Devices and Packaging Methods |
| US20160035666A1 (en) * | 2014-07-30 | 2016-02-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Packages with molding structures and methods of forming the same |
| CN105047617A (zh) * | 2015-06-09 | 2015-11-11 | 华进半导体封装先导技术研发中心有限公司 | 一种整体堆叠封装结构及其制作方法 |
| CN105118823A (zh) * | 2015-09-24 | 2015-12-02 | 中芯长电半导体（江阴）有限公司 | 一种堆叠型芯片封装结构及封装方法 |
| CN106558574A (zh) * | 2016-11-18 | 2017-04-05 | 华为技术有限公司 | 芯片封装结构和方法 |
| CN106876363A (zh) * | 2017-03-13 | 2017-06-20 | 江苏长电科技股份有限公司 | 3d连接的扇出型封装结构及其工艺方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113169153B (zh) | 2023-09-29 |
| WO2020132909A1 (zh) | 2020-07-02 |
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