CN113031402B - Preparation method of smooth micro-lens structure surface - Google Patents
Preparation method of smooth micro-lens structure surface Download PDFInfo
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- CN113031402B CN113031402B CN202110265370.8A CN202110265370A CN113031402B CN 113031402 B CN113031402 B CN 113031402B CN 202110265370 A CN202110265370 A CN 202110265370A CN 113031402 B CN113031402 B CN 113031402B
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2057—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using an addressed light valve, e.g. a liquid crystal device
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
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- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention provides a preparation method of a smooth micro-lens structure surface, which is applied to a preparation system of the smooth micro-lens structure surface, and the preparation system comprises the following steps: the exposure light source is sequentially provided with a dodging collimation element, a DMD chip, a projection objective lens and a three-dimensional precision platform along the exposure light irradiation direction, and further comprises a mechanical vibration auxiliary mechanism which is used for driving the projection objective lens to generate sine vibration or cosine vibration; wherein the preparation method comprises the following steps: starting an exposure light source to generate exposure light, wherein a dodging collimation element is used for processing the exposure light into uniform light beams, and a projection objective focuses the uniform light beams to a precise exposure position of a three-dimensional precise platform so as to generate an exposure pattern on the surface of a workpiece; starting a mechanical vibration auxiliary mechanism, driving the projection objective to generate sine vibration or cosine vibration so as to blur DMD pixel gaps and eliminate pixel quantization errors of exposure patterns; and developing the micro-lens structure pattern by using a developing solution.
Description
Technical Field
The invention relates to the field of digital photoetching processing, in particular to a preparation method of a smooth micro-lens structure surface.
Background
With the increasing demand for miniaturization of optoelectronic devices, microlens structures have become important micro-optical devices, have the characteristics of high surface smoothness, excellent optical performance and the like, and are widely applied to the fields of compact imaging, sensing, optical communication, Charge Coupled Devices (CCD), three-dimensional display and the like. In recent years, various microlens structure manufacturing methods have been rapidly developed, including methods of thermal reflow of photoresist, droplet ejection, laser direct writing, thermal imprinting, and the like. Despite the great advances made by these methods, there are still some limitations, such as long time consumption, high process complexity, poor manufacturing flexibility, and difficulty in consistency control.
Compared with the method, the digital photoetching technology based on the Digital Micromirror Device (DMD) has the advantages of high processing efficiency, low cost, good flexibility and the like, is widely concerned by various scholars in recent years, and is considered to be a novel digital photoetching technology following the single-point laser direct writing technology. However, as can be seen from the DMD discretization pixel characteristics, when the DMD displays a digital mask pattern, it is a process of sampling and quantizing the mask by the DMD according to the pixel size, which introduces a non-integer pixel error, i.e., a DMD pixel quantization error. To solve this problem, some scholars at home and abroad have carried out related research work, such as YM Ha of korea calshan university, which uses a high power objective lens to enhance the lithography resolution, so as to reduce the influence of the pixel quantization error, but the imaging field of view is severely reduced, and the influence on the forming efficiency is large. The university of Nanchang, Gaoyiqing, et al, reduces DMD pixel errors by designing mask feature sizes to be integer multiples of DMD pixels, but this approach is limited by the design and handling of the microstructured sliced layer and is not very flexible in processing. The technology is that each frame of original image data generates a plurality of sub-frame data, then a projection image of each sub-frame is respectively shifted by half pixel size in XY direction relative to an image of a previous frame, and then superposition exposure is completed. The technology is applied to a DMD scanning photoetching system in Liuhua and the like of northeast university in China, and the edge height smoothness enhancement of a large-area two-dimensional microstructure is realized. It can be seen that scholars at home and abroad mainly optimize the pixel quantization error by enhancing the digital photoetching resolution of the DMD, but the research methods cannot be fundamentally eliminated.
Disclosure of Invention
In view of the above, the present invention is directed to a method for preparing a smooth surface of a microlens structure, so as to solve the technical problems in the prior art.
In view of the above, the present invention provides a method for preparing a smooth surface of a microlens structure, which is applied to a system for preparing a smooth surface of a microlens structure, the system comprising: the device comprises an exposure light source, a uniform light collimation element, a DMD chip, a projection objective and a three-dimensional precision platform, wherein the exposure light source is used for providing exposure light; the DMD chip is used for reflecting the uniform light beam to a projection objective; the projection objective is used for focusing the uniform light beam to a precise exposure position of the three-dimensional precise platform so as to generate an exposure pattern on the surface of the workpiece; the mechanical vibration auxiliary mechanism is connected to the projection objective and drives the projection objective to generate sine vibration or cosine vibration;
wherein the preparation method comprises the following steps:
starting an exposure light source to generate exposure light, wherein a dodging collimation element is used for processing the exposure light into uniform light beams, and a projection objective focuses the uniform light beams to a precise exposure position of a three-dimensional precise platform so as to generate an exposure pattern on the surface of a workpiece;
starting a mechanical vibration auxiliary mechanism, driving the projection objective to generate sine vibration or cosine vibration so as to blur DMD pixel gaps and eliminate pixel quantization errors of exposure patterns;
and developing the micro-lens structure pattern by using a developing solution.
As an optional implementation manner, the mechanical vibration assisting mechanism includes a driving rod, a unidirectional vibration generator, and a sine/cosine function generator, the sine/cosine function generator is connected to the unidirectional vibration generator, one end of the driving rod is connected to an output end of the unidirectional vibration generator, and the other end is connected to the projection objective.
As an alternative embodiment, the vibration direction of the mechanical vibration assist mechanism is made on the diagonal of the exposure pattern coordinate system to simultaneously blur X, Y the DMD pixel gaps in both directions.
As an alternative embodiment, the corresponding vibration amplitude is characterized by measuring the central offset of the microlens structure through an optical microscope, and then the quantitative relation between the vibration frequency and the vibration amplitude is obtained.
As an alternative embodiment, the frequency amplitude parameter of the sine/cosine function generator is adjusted based on the DMD pixel discrete gap size.
As an alternative embodiment, the individual micromirror size of the DMD chip is 10.8 microns or 7.6 microns.
From the above, it can be seen that the system for preparing a smooth surface of a micro-lens structure provided by the invention can blur DMD pixel gaps by applying sine/cosine vibration to a projection objective and adjusting frequency/amplitude, thereby eliminating pixel quantization errors of an exposure pattern and realizing the advantage of ultra-smooth surface roughness.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic diagram of a microlens structure fabrication system of the present invention;
FIG. 2 is a comparison graph of the effect of the microlens structure before and after the DMD pixel quantization error is eliminated.
In the figure: 1. a 405 nanometer ultraviolet light source; 2. a dodging collimation element; 3. a DMD chip; 4. a projection objective; 5. a three-dimensional precision platform; 6. a drive rod; 7. a unidirectional vibration generator; 8. a sine/cosine function generator; 9. a DMD controller; 10. a computing terminal; 11. a platform controller; 12. effect diagrams before micro-lens smoothing treatment; 13-effect graph after microlens smoothing treatment.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to specific embodiments and the accompanying drawings.
In order to achieve the above object, as shown in fig. 1, an embodiment of the present invention provides a system for preparing a smooth surface of a microlens structure, including:
an exposure light source for providing exposure light, a dodging collimation element 2, a DMD chip 3, a projection objective 4 and a three-dimensional precise platform 5 are sequentially arranged along the irradiation direction of the exposure light, wherein,
the dodging collimation element 2 is used for processing exposure light into uniform light beams;
the DMD chip 3 is used for reflecting the uniform light beam to a projection objective 4;
the projection objective 4 is used for focusing the uniform light beam to a precise exposure position of a three-dimensional precise platform so as to generate an exposure pattern on the surface of a workpiece;
the DMD pixel array further comprises a mechanical vibration auxiliary mechanism connected to the projection objective 4, wherein the mechanical vibration auxiliary mechanism drives the projection objective 4 to generate sine vibration or cosine vibration so as to blur DMD pixel gaps and eliminate pixel quantization errors of exposure patterns.
As an alternative embodiment, the mechanical vibration assisting mechanism includes a driving rod 6, a unidirectional vibration generator 7, and a sine/cosine function generator 8, the sine/cosine function generator 8 is connected to the unidirectional vibration generator 7, one end of the driving rod 6 is connected to the output end of the unidirectional vibration generator 7, and the other end is connected to the projection objective 4.
Alternatively, the connection mode of the driving rod 6 may be any one of fastener connection, bonding or welding.
In the embodiment of the invention, the preparation method of the preparation system comprises the following steps:
the exposure light source is started to generate exposure light, the dodging collimation element 2 is used for processing the exposure light into uniform light beams, and the projection objective 4 focuses the uniform light beams to the accurate exposure position of the three-dimensional precision platform so as to generate an exposure pattern on the surface of a workpiece;
starting a mechanical vibration auxiliary mechanism, driving the projection objective 4 to generate sine vibration or cosine vibration so as to blur DMD pixel gaps and eliminate pixel quantization errors of exposure patterns;
and developing the micro-lens structure pattern by using a developing solution to obtain a micro-lens structure with the surface roughness within 10 nanometers.
Since the DMD has a pixel quantization error, discrete pixels may cause the exposed surface to be unsmooth, as shown at 12 in fig. 1, in the present invention, by applying a sine/cosine vibration to the projection objective 4 and by adjusting the frequency/amplitude, the DMD pixel gap may be blurred, thereby eliminating the pixel quantization error of the exposed pattern, as shown at 13 in fig. 2, the advantage of ultra-smooth surface roughness is achieved.
Preferably, the vibration direction of the mechanical vibration assist mechanism is made on the diagonal of the exposure pattern coordinate system to simultaneously blur X, Y the DMD pixel gaps in both directions.
Preferably, the corresponding vibration amplitude is characterized by measuring the central offset of the micro-lens structure through an optical microscope, and then the quantitative relation between the vibration frequency and the vibration amplitude is obtained.
Preferably, the frequency amplitude parameter of the sine/cosine function generator 8 is adjusted based on the DMD pixel discrete gap size.
As an alternative embodiment, the exposure light source adopts a 405 nm ultraviolet light source 1.
As an optional implementation manner, the apparatus further includes a DMD controller 9, the DMD controller 9 is electrically connected to the DMD chip 3, and the DMD controller 9 controls the DMD chip 3 to control the generation of the exposure pattern.
Optionally, the device further comprises a computing terminal 10 for designing an exposure pattern, and the computing terminal 10 is electrically connected to the DMD controller 9.
As an optional embodiment, the system further comprises a stage controller 11 electrically connected to the three-dimensional precision stage, wherein the stage controller 11 is configured to control a precise exposure position of the three-dimensional precision stage.
As an alternative embodiment, the individual micromirror size of the DMD chip 3 is 10.8 microns or 7.6 microns.
It is to be noted that technical terms or scientific terms used in the embodiments of the present invention should have the ordinary meanings as understood by those having ordinary skill in the art to which the present disclosure belongs, unless otherwise defined. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect.
Those of ordinary skill in the art will understand that: the discussion of any embodiment above is meant to be exemplary only, and is not intended to intimate that the scope of the disclosure, including the claims, is limited to these examples; within the idea of the invention, also features in the above embodiments or in different embodiments may be combined, steps may be implemented in any order, and there are many other variations of the different aspects of the invention as described above, which are not provided in detail for the sake of brevity.
The embodiments of the invention are intended to embrace all such alternatives, modifications and variances that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, substitutions, improvements and the like that may be made without departing from the spirit and principles of the invention are intended to be included within the scope of the invention.
Claims (4)
1. A method for preparing a smooth surface of a micro-lens structure is applied to a system for preparing the smooth surface of the micro-lens structure,
the preparation system comprises: the device comprises an exposure light source, a uniform light collimation element, a DMD chip, a projection objective and a three-dimensional precision platform, wherein the exposure light source is used for providing exposure light; the DMD chip is used for reflecting the uniform light beam to a projection objective; the projection objective is used for focusing the uniform light beam to a precise exposure position of the three-dimensional precise platform so as to generate an exposure pattern on the surface of the workpiece; the mechanical vibration auxiliary mechanism is connected to the projection objective and drives the projection objective to generate sine vibration or cosine vibration;
wherein the preparation method comprises the following steps:
starting an exposure light source to generate exposure light, wherein a dodging collimation element is used for processing the exposure light into uniform light beams, and a projection objective focuses the uniform light beams to a precise exposure position of a three-dimensional precise platform so as to generate an exposure pattern on the surface of a workpiece;
starting a mechanical vibration auxiliary mechanism, driving the projection objective to generate sine vibration or cosine vibration so as to blur DMD pixel gaps and eliminate pixel quantization errors of exposure patterns;
developing the micro-lens structure pattern by using a developing solution;
the mechanical vibration auxiliary mechanism comprises a driving rod, a one-way vibration generator and a sine/cosine function generator, the sine/cosine function generator is connected to the one-way vibration generator, one end of the driving rod is connected to the output end of the one-way vibration generator, and the other end of the driving rod is connected to the projection objective;
wherein the vibration direction of the mechanical vibration assist mechanism is made on the diagonal line of the exposure pattern coordinate system to simultaneously blur X, Y the DMD pixel gaps in both directions.
2. The method of claim 1, wherein the vibration frequency and vibration amplitude are quantified by measuring the center shift of the microlens structure through an optical microscope to characterize the corresponding vibration amplitude.
3. The method of claim 1, wherein the frequency amplitude parameter of the sine/cosine function generator is adjusted based on the DMD pixel discrete gap size.
4. The method of claim 1, wherein the DMD chip has a single micromirror size of 10.8 microns or 7.6 microns.
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Citations (1)
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CN101271258A (en) * | 2007-03-22 | 2008-09-24 | 台达电子工业股份有限公司 | Optical projection system and image smoothing apparatus thereof |
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JP2006126243A (en) * | 2004-10-26 | 2006-05-18 | Fuji Photo Film Co Ltd | Exposure mask, microlens array and manufacturing method therefor |
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CN101271258A (en) * | 2007-03-22 | 2008-09-24 | 台达电子工业股份有限公司 | Optical projection system and image smoothing apparatus thereof |
Non-Patent Citations (1)
Title |
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基于DMD无掩膜光刻技术及其微透镜快速成型方法的研究;黄胜洲;《中国优秀博硕士学位论文全文数据库(博士) 工程科技Ⅱ辑 (月刊)》;20171115;第2.2.1节、第2.4-2.5节 * |
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