CN112055460A - Resistance material, copper-clad plate containing resistance layer and manufacturing method of printed circuit board - Google Patents
Resistance material, copper-clad plate containing resistance layer and manufacturing method of printed circuit board Download PDFInfo
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- CN112055460A CN112055460A CN202010905587.6A CN202010905587A CN112055460A CN 112055460 A CN112055460 A CN 112055460A CN 202010905587 A CN202010905587 A CN 202010905587A CN 112055460 A CN112055460 A CN 112055460A
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- resistance
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- phosphorus
- nickel
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0776—Resistance and impedance
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
The invention provides a resistance material, a copper-clad plate containing a resistance layer and a manufacturing method of a printed circuit board. The resistance material is nickel-phosphorus-copper alloy, and after the resistance material is used for manufacturing the resistor, the electromagnetic property of the resistor can be improved, and the transmission stability of high-speed and high-frequency signals is ensured. The copper-clad plate containing the resistance layer is made of nickel-phosphorus-copper alloy, so that the electromagnetic property of the resistance layer can be improved, and the transmission stability of high-speed and high-frequency signals is ensured. The manufacturing method of the printed circuit board of the invention reserves the resistance layer at the place where the resistance is needed to obtain various resistance values needed in the circuit pattern design; and the nickel-phosphorus-copper alloy is directly deposited on the copper foil, and the resistance layer is obtained after etching, so that the connection between the circuit wiring of the finally formed printed circuit board and the resistance layer is firmer and more stable; in addition, copper element is introduced into the resistance layer, so that the electromagnetic property of the resistor can be improved, and the transmission stability of high-speed and high-frequency signals is ensured.
Description
Technical Field
The invention relates to the technical field of circuit board processing, in particular to a resistance material, a copper-clad plate containing a resistance layer and a manufacturing method of a printed circuit board.
Background
Printed Circuit Board (PCB) manufacturers at home and abroad are in intense competition with packaging technologies such as Wafer Level Chip Size Package (WL-CSP), Quad Flat Non-leaded Package (QFN), and Fine pitch Ball Grid Array (FBGA) packages, and also in competition with three-dimensional Chip stacking technology as the next generation of large-capacity and multi-functional technology. One of the high-density packaging methods is a substrate technique with built-in components.
As a technique of a substrate with a built-in component, that is, a method of incorporating a component into a substrate, various proposals have been made and commercialized. However, a resistance, a capacitance, an inductance, and the like, which are passive components, are restricted to an active element in terms of processing conditions, and when the passive components are embedded in a substrate, a resistance element is often used in view of the degree of freedom in design and the ease of processing.
In recent years, there has been an increasing demand for the use of a metal foil with a resistive layer in the design of a substrate having an active element and a passive component built therein. Among them, nickel-phosphorus alloy is widely used in the electronic industry as a resistance layer. However, with the development of communication technology, the signal frequency is gradually increased, and the existing resistor using nickel-phosphorus alloy as a resistance layer is difficult to maintain the integrity of the signal. Therefore, how to ensure the transmission stability of high-speed high-frequency signals is a problem to be solved for such resistance of the metal foil with the resistance layer.
Disclosure of Invention
The invention aims to provide a resistance material, which is a nickel-phosphorus-copper alloy, and through the introduction of copper element, the electromagnetic property of a resistor made of the resistance material can be improved, and the transmission stability of high-speed and high-frequency signals is ensured.
The invention also aims to provide a copper-clad plate containing a resistance layer, wherein the resistance layer is made of nickel-phosphorus-copper alloy, so that the electromagnetic property of the resistance layer can be improved, and the transmission stability of high-speed and high-frequency signals is ensured.
The invention also aims to provide a manufacturing method of the printed circuit board, which introduces copper element into the resistance layer, can improve the electromagnetic property of the resistance and ensure the transmission stability of high-speed and high-frequency signals.
In order to achieve the purpose, the invention provides a resistance material which is a nickel-phosphorus-copper alloy.
In the nickel-phosphorus-copper alloy, 70 to 95 parts by weight of nickel, 4 to 20 parts by weight of phosphorus and 0.01 to 8 parts by weight of copper are used.
In the nickel-phosphorus-copper alloy, the weight parts of nickel are 80-90, the weight parts of phosphorus are 8-16, and the weight parts of copper are 0.1-6.
The invention also provides a copper-clad plate containing the resistance layer, which comprises a bearing substrate, the resistance layer arranged on the bearing substrate and a conducting layer arranged on the resistance layer;
one surface of the bearing substrate close to the resistance layer is an electric insulation surface;
the conducting layer is made of copper, and the resistance layer is made of nickel-phosphorus-copper alloy.
In the nickel-phosphorus-copper alloy, 70 to 95 parts by weight of nickel, 4 to 20 parts by weight of phosphorus and 0.01 to 8 parts by weight of copper are used.
The invention also provides a manufacturing method of the printed circuit board, which comprises the following steps:
and 4, carrying out local patterning treatment on the composite pattern of the resistance layer and the conducting layer to obtain the local resistance required by design.
The step 3 specifically includes: according to a preset circuit pattern, protecting the circuit pattern by using a masking protection technology to expose the part except the circuit pattern; etching the conductive foil with an acidic etchant to exposeA resistance material layer outside the circuit pattern to obtain a conductive layer above the resistance material layer; then CuSO is adopted4And etching the resistance material layer by using sulfuric acid etching solution to expose the part of the bearing substrate except the circuit pattern, thereby obtaining a composite pattern of the resistance layer and the conducting layer positioned above the bearing substrate.
The step 4 specifically includes: protecting a part of the conducting layer to be required by using a masking protection technology according to a preset resistance pattern, and exposing a part of the conducting layer; and removing the exposed conducting layer by using alkaline etching solution to expose part of the resistance layer, wherein the exposed part of the resistance layer forms a local resistance required by design.
The conductive foil is made of copper, and the square resistance of the resistance layer is 1-500 omega-□。
In the nickel-phosphorus-copper alloy, 70 to 95 parts by weight of nickel, 4 to 20 parts by weight of phosphorus and 0.01 to 8 parts by weight of copper are used.
The invention has the beneficial effects that: the invention provides a resistance material, which is a nickel-phosphorus-copper alloy, and after the resistance material is used for manufacturing a resistor, the electromagnetic property of the resistor can be improved, and the transmission stability of high-speed and high-frequency signals is ensured. The invention also provides a copper-clad plate containing the resistance layer, which comprises a bearing substrate, the resistance layer arranged on the bearing substrate and a conducting layer arranged on the resistance layer, wherein the resistance layer is made of nickel-phosphorus-copper alloy, so that the electromagnetic property of the resistance layer can be improved, and the transmission stability of high-speed and high-frequency signals is ensured. The invention also provides a manufacturing method of the printed circuit board, which adopts alkaline etching solution to remove part of the conductive layer according to the requirement and expose the resistance layer, thereby reserving the resistance layer at the position where the resistance is needed and obtaining various resistance values needed in the circuit pattern design. And the nickel-phosphorus-copper alloy is directly deposited on the copper foil, and the resistance layer is obtained after etching, so that the connection between the circuit wiring of the finally formed printed circuit board and the resistance layer is firmer and more stable. In addition, copper element is introduced into the resistance layer, so that the electromagnetic property of the resistor can be improved, and the transmission stability of high-speed and high-frequency signals is ensured.
Drawings
For a better understanding of the nature and technical aspects of the present invention, reference should be made to the following detailed description of the invention, taken in conjunction with the accompanying drawings, which are provided for purposes of illustration and description and are not intended to limit the invention.
In the drawings, there is shown in the drawings,
FIG. 1 is a schematic structural diagram of a copper-clad plate containing a resistance layer according to the present invention;
FIG. 2 is a schematic perspective view of a printed circuit board manufactured by the method of manufacturing a printed circuit board according to the present invention;
FIG. 3 is a flow chart of a method of fabricating a printed circuit board of the present invention;
FIG. 4 is a schematic diagram of step 1 of the method of fabricating a printed circuit board of the present invention;
FIG. 5 is a schematic diagram of step 2 of the method of fabricating a printed circuit board of the present invention;
FIG. 6 is a schematic diagram of step 3 of the method of fabricating a printed circuit board of the present invention;
fig. 7 is a schematic diagram of step 4 of the method for manufacturing the printed circuit board of the present invention.
Detailed Description
To further illustrate the technical means and effects of the present invention, the following detailed description is given with reference to the preferred embodiments of the present invention and the accompanying drawings.
The invention provides a resistance material which is a nickel-phosphorus-copper alloy. After the resistor is made of the resistor material, the electromagnetic property of the resistor can be improved, and the transmission stability of high-speed and high-frequency signals is ensured.
Specifically, in the nickel-phosphorus-copper alloy, the weight parts of nickel are 70 to 95, the weight parts of phosphorus are 4 to 20, and the weight parts of copper are 0.01 to 8.
Preferably, in the nickel-phosphorus-copper alloy, the nickel is 80 to 90 parts by weight, the phosphorus is 8 to 16 parts by weight, and the copper is 0.1 to 6 parts by weight.
Referring to fig. 1, based on the above resistive material, the present invention provides a copper-clad plate containing a resistive layer, which includes a carrier substrate 10, a resistive layer 20 disposed on the carrier substrate 10, and a conductive layer 30 disposed on the resistive layer 20.
Specifically, one surface of the carrier substrate 10 close to the resistive layer 20 is an electrically insulating surface;
preferably, one surface of the carrier substrate 10 close to the resistive layer 20 is an organic surface;
specifically, the material of the conductive layer 30 is copper.
Specifically, the material of the resistance layer 20 is nickel-phosphorus-copper alloy.
Further, in the nickel-phosphorus-copper alloy, the weight parts of nickel are 70 to 95, the weight parts of phosphorus are 4 to 20, and the weight parts of copper are 0.01 to 8.
Preferably, in the nickel-phosphorus-copper alloy, the nickel is 80 to 90 parts by weight, the phosphorus is 8 to 16 parts by weight, and the copper is 0.1 to 6 parts by weight.
Specifically, the square resistance of the resistance layer 20 is 1-500 Ω -□。
Specifically, the thickness of the carrier substrate 10 is 100 μm to 500 μm.
The thickness of the resistance layer 20 is 0.08 μm to 0.2 μm.
The thickness of the conductive layer 30 is 18 to 36 μm.
Based on the copper-clad plate containing the resistance layer, the invention also provides a manufacturing method of the printed circuit board, the resistance layer and the copper foil of the copper-clad plate containing the resistance layer are etched to form a circuit, and the required printed circuit board is obtained, and the structural schematic diagram of the printed circuit board is shown in figure 2. Referring to fig. 3, the method for manufacturing the printed circuit board includes the following steps:
Specifically, the conductive foil 30' is a copper foil.
Specifically, the surface of the carrier substrate 10, which is attached to the resistive material layer 20', is an electrically insulating surface.
Preferably, one surface of the carrier substrate 10, which is attached to the resistance material layer 20', is an organic surface.
Specifically, the resistance material layer 20' may be attached to the carrier substrate 10 by pressing, bonding, or the like.
Specifically, the step 3 specifically includes:
and according to a preset circuit pattern, protecting the circuit pattern by using a masking protection technology to expose the part except the circuit pattern. The conductive foil 30 ' is etched with an acidic etchant to expose the portion of the resistive material layer 20 ' outside the circuit pattern, resulting in a conductive layer 30 over the resistive material layer 20 '. Then CuSO is adopted4And etching the resistance material layer 20' by using a sulfuric acid etching solution to expose the part of the carrier substrate 10 outside the circuit pattern, thereby obtaining a composite pattern of the resistance layer 20 and the conductive layer 30 positioned above the carrier substrate 10.
Specifically, in step 3, the acidic etching solution may be acidic CuCl2And (3) solution.
And 4, as shown in fig. 7, performing local patterning on the composite pattern of the resistance layer 20 and the conductive layer 30 to obtain a local resistance 21 required by design.
Specifically, the step 4 specifically includes:
according to the preset resistance pattern, the part of the conductive layer 30 required is protected by using a masking protection technology, and part of the conductive layer 30 is exposed. The exposed conductive layer 30 is removed by using an alkaline etchant to expose a portion of the resistive layer 20, and the exposed portion of the resistive layer 20 forms a partial resistor 21 required by the design.
Specifically, in step 4, the alkaline etching solution may be an alkaline aqueous solution of cuprammonium.
Specifically, the material of the conductive layer 30 is copper.
Specifically, the material of the resistance layer 20 is nickel-phosphorus-copper alloy. By introducing copper element into the resistor layer 20, the electromagnetic characteristics of the resistor are improved, and the transmission stability of high-speed and high-frequency signals is ensured.
Further, in the nickel-phosphorus-copper alloy, the weight parts of nickel are 70 to 95, the weight parts of phosphorus are 4 to 20, and the weight parts of copper are 0.01 to 8.
Preferably, in the nickel-phosphorus-copper alloy, the nickel is 80 to 90 parts by weight, the phosphorus is 8 to 16 parts by weight, and the copper is 0.1 to 6 parts by weight.
Specifically, the square resistance of the resistance layer 20 is 1-500 Ω -□。
Specifically, the thickness of the carrier substrate 10 is 100 μm to 500 μm.
The thickness of the resistance layer 20 is 0.08 μm to 0.2 μm.
The thickness of the conductive layer 30 is 18 to 36 μm.
According to the manufacturing method of the printed circuit board, the alkaline etching solution is adopted to remove part of the conducting layer according to the requirement, and the resistance layer is exposed, so that the resistance layer is reserved at the position where the resistance is needed, and various resistance values needed in the circuit pattern design are obtained. And the nickel-phosphorus-copper alloy is directly deposited on the copper foil, and the resistance layer is obtained after etching, so that the connection between the circuit wiring of the finally formed printed circuit board and the resistance layer is firmer and more stable. In addition, the copper element is introduced into the resistance layer, so that the electromagnetic property of the resistor can be improved, and the transmission stability of high-speed and high-frequency signals can be ensured.
In summary, the resistance material provided by the invention is a nickel-phosphorus-copper alloy, and after the resistance material is used for manufacturing the resistor, the electromagnetic property of the resistor can be improved, and the transmission stability of high-speed and high-frequency signals is ensured. The copper-clad plate containing the resistance layer comprises a bearing substrate, the resistance layer arranged on the bearing substrate and a conducting layer arranged on the resistance layer, wherein the resistance layer is made of nickel-phosphorus-copper alloy, so that the electromagnetic property of the resistance layer can be improved, and the transmission stability of high-speed and high-frequency signals is ensured. The manufacturing method of the printed circuit board provided by the invention reserves the resistance layer at the place where the resistance is needed to obtain various resistance values needed in the circuit pattern design; and the nickel-phosphorus-copper alloy is directly deposited on the copper foil, and the resistance layer is obtained after etching, so that the connection between the circuit wiring of the finally formed printed circuit board and the resistance layer is firmer and more stable; in addition, the copper element is introduced into the resistance layer, so that the electromagnetic property of the resistor can be improved, and the transmission stability of high-speed and high-frequency signals can be ensured.
As described above, it will be apparent to those skilled in the art that various other changes and modifications can be made based on the technical solution and the technical idea of the present invention, and all such changes and modifications should fall within the protective scope of the appended claims.
Claims (10)
1. The resistance material is characterized by being a nickel-phosphorus-copper alloy.
2. The resistive material of claim 1, wherein the nickel-phosphorus-copper alloy comprises 70 to 95 parts by weight of nickel, 4 to 20 parts by weight of phosphorus, and 0.01 to 8 parts by weight of copper.
3. The resistive material of claim 2, wherein the nickel-phosphorus-copper alloy comprises 80 to 90 parts by weight of nickel, 8 to 16 parts by weight of phosphorus, and 0.1 to 6 parts by weight of copper.
4. The copper-clad plate containing the resistance layer is characterized by comprising a bearing substrate (10), the resistance layer (20) arranged on the bearing substrate (10) and a conducting layer (30) arranged on the resistance layer (20);
one surface of the bearing substrate (10) close to the resistance layer (20) is an electric insulation surface;
the conducting layer (30) is made of copper, and the resistance layer (20) is made of nickel-phosphorus-copper alloy.
5. The copper-clad plate containing the resistance layer according to claim 4, wherein the nickel-phosphorus-copper alloy comprises 70 to 95 parts by weight of nickel, 4 to 20 parts by weight of phosphorus, and 0.01 to 8 parts by weight of copper.
6. A method for manufacturing a printed circuit board is characterized by comprising the following steps:
step 1, providing a conductive foil (30 '), and depositing a nano-scale nickel-phosphorus-copper alloy on the surface of the conductive foil (30 ') to form a resistance material layer (20 ');
step 2, providing a bearing substrate (10), and attaching the surface of the resistance material layer (20') to the bearing substrate (10);
step 3, patterning the conductive foil (30') to obtain a conductive layer (30); patterning the resistance material layer (20') to obtain a composite pattern of the resistance layer (20) and the conducting layer (30);
and 4, carrying out local patterning treatment on the composite pattern of the resistance layer (20) and the conductive layer (30) to obtain a local resistance (21) required by design.
7. The method for manufacturing a printed circuit board according to claim 6, wherein the step 3 specifically comprises: according to a preset circuit pattern, protecting the circuit pattern by using a masking protection technology to expose the part except the circuit pattern; etching the conductive foil (30 ') by using an acidic etching solution to expose the part of the resistance material layer (20 ') outside the circuit pattern to obtain a conductive layer (30) positioned above the resistance material layer (20 '); then CuSO is adopted4And etching the resistance material layer (20') by using a sulfuric acid etching solution, and exposing the part of the bearing substrate (10) except the circuit pattern to obtain a composite pattern of the resistance layer (20) and the conductive layer (30) positioned above the bearing substrate (10).
8. The method for manufacturing a printed circuit board according to claim 6, wherein the step 4 specifically comprises: protecting the part of the conductive layer (30) required by using a masking protection technology according to a preset resistance pattern, and exposing part of the conductive layer (30); and removing the exposed conductive layer (30) by using an alkaline etching solution to expose part of the resistance layer (20), wherein the exposed part of the resistance layer (20) forms a local resistance (21) required by design.
9. The method of claim 6The method for manufacturing the printed circuit board is characterized in that the conductive foil (30') is made of copper, and the square resistance of the resistance layer (20) is 1-500 Ω -□。
10. The method of claim 6, wherein the nickel-phosphorus-copper alloy comprises 70 to 95 parts by weight of nickel, 4 to 20 parts by weight of phosphorus, and 0.01 to 8 parts by weight of copper.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010905587.6A CN112055460B (en) | 2020-09-01 | 2020-09-01 | Resistance material, copper-clad plate containing resistance layer and manufacturing method of printed circuit board |
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| CN202010905587.6A CN112055460B (en) | 2020-09-01 | 2020-09-01 | Resistance material, copper-clad plate containing resistance layer and manufacturing method of printed circuit board |
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| CN112055460A true CN112055460A (en) | 2020-12-08 |
| CN112055460B CN112055460B (en) | 2022-12-06 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113556875A (en) * | 2021-06-30 | 2021-10-26 | 惠州市金百泽电路科技有限公司 | Method for improving size precision of buried resistor PCB (printed circuit board) sheet resistor |
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| CN113556875A (en) * | 2021-06-30 | 2021-10-26 | 惠州市金百泽电路科技有限公司 | Method for improving size precision of buried resistor PCB (printed circuit board) sheet resistor |
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| Publication number | Publication date |
|---|---|
| CN112055460B (en) | 2022-12-06 |
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