CN111866682A - MEMS microphone and temperature measurement combined sensor and production process thereof - Google Patents
MEMS microphone and temperature measurement combined sensor and production process thereof Download PDFInfo
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- CN111866682A CN111866682A CN202010832392.3A CN202010832392A CN111866682A CN 111866682 A CN111866682 A CN 111866682A CN 202010832392 A CN202010832392 A CN 202010832392A CN 111866682 A CN111866682 A CN 111866682A
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/12—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/20—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/12—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
- G01J2005/126—Thermoelectric black plate and thermocouple
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2231/00—Details of apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor covered by H04R31/00, not provided for in its subgroups
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2410/00—Microphones
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Radiation Pyrometers (AREA)
Abstract
The invention relates to an infrared temperature measurement sensor which has the effect of wide application range. The invention discloses an MEMS microphone and temperature measurement combined sensor which comprises a PCB substrate, wherein a resistance-capacitance element, an NTC, an MEMS thermopile, an ADC, a microphone MEMSsensor and an ASIC are arranged on the PCB substrate, a tube shell is sleeved outside the PCB substrate, an optical window and a sound inlet hole are formed in the tube shell, an optical filter for sealing the optical window is arranged on the tube shell, an annular bonding pad surrounding electronic components is arranged on the PCB substrate, and the electronic components on the PCB substrate are electrically connected with the annular bonding pad through gold threads. By means of the matching of the microphone based on the MEMS and the infrared temperature measuring sensor, the integrated setting of temperature measurement and recording is realized, and the application range of the infrared temperature measuring sensor is expanded.
Description
Technical Field
The invention relates to an infrared temperature measurement sensor, in particular to an MEMS microphone and temperature measurement combined sensor and a production process thereof.
Background
Non-contact infrared temperature measurement, also called radiation temperature measurement, generally uses a pyroelectric or photoelectric detector as a detection element. The temperature measuring system is simple, can realize large-area temperature measurement, and can also be used for measuring the temperature of a certain point on a measured object.
At present, the infrared sensor adopts a TO46 packaging mode, the size is large, the automation degree of client assembly is low, and the infrared sensor is packaged by a plug-in, so that the application range is limited. The output signal of the TO46 packaged infrared temperature measurement sensor is an analog signal, and the anti-interference capability is weak. The TO46 packaged infrared temperature measurement sensor has a single temperature measurement function, the TO46 packaged infrared temperature measurement sensor is large in size and weight, the MEMS microphone and the TO46 packaged infrared temperature measurement sensor are two different types of independent sensing devices, and the two cannot be combined in the prior art, so that the application field of the infrared temperature measurement sensor is limited.
Disclosure of Invention
In view of the defects in the prior art, an object of the present invention is to provide a MEMS microphone and temperature measurement combined sensor, which has a wide application range.
In order to achieve the technical purpose, the invention provides the following technical scheme: the utility model provides a combined sensor of MEMS microphone and temperature measurement, includes the PCB substrate, be provided with resistance-capacitance, NTC, MEMS thermopile, ADC, microphone MEMSSensor and ASIC on the PCB substrate, PCB substrate overcoat is equipped with the tube, optical window and sound inlet have been seted up on the tube, be provided with the light filter of closed optical window on the tube, the PCB substrate is provided with the annular pad around electronic components, electronic components on the PCB substrate passes through the gold thread and is connected with annular pad electricity.
Through adopting above-mentioned technical scheme, resistance-capacitance, NTC, MEMS thermopile and ADC cooperate jointly, convert the voltage signal that the MEMS thermopile received into digital signal and pass through annular pad and transmit away through the ADC. Microphone MEMSsensor will advance the sound conversion that the sound hole transmitted into and send out for the signal of telecommunication to transmit through annular pad, be in the same place microphone and temperature measurement function integration, simultaneously small, light in weight has saved customer end space and the design degree of difficulty. The temperature measuring device can be used in the scenes of mobile phones, earphones, intelligent watches, wristbands, forehead temperature guns, air conditioner temperature control, industrial temperature measurement, temperature monitoring, fire prevention and the like, and the application range of the sensor is widened.
Preferably, the microphone MEMS sensor includes a MEMS micro-capacitive sensor, a micro-integrated switching circuit, an acoustic cavity, and an RF anti-interference circuit, where the MEMS micro-capacitive sensor includes a silicon diaphragm and a silicon back electrode, and the silicon diaphragm is used to receive an audio signal.
By adopting the technical scheme, the silicon diaphragm can directly receive audio signals and transmits the audio signals to the micro-integrated conversion circuit through the MEMS micro-capacitance sensor, the micro-integrated conversion circuit converts and amplifies high-resistance audio electrical signals into low-resistance electrical signals, and meanwhile, the low-resistance electrical signals are filtered by the RF anti-interference circuit and output to be matched with the front-end circuit, so that the acousto-electric conversion is completed. And the electric signals are read, so that the voice is identified.
Preferably, the sound inlet hole is closed by a waterproof sound-transmitting membrane.
By adopting the technical scheme, the problem of inaccurate temperature measurement caused by the fact that water vapor enters the cavity to influence the ambient temperature is solved, and the non-contact infrared temperature measurement precision and the temperature measurement stability are further improved.
Preferably, the ADC includes a reference voltage output, a multiplexer, a 4-64X programmable operational amplifier, a 24-bit digital-to-analog converter, a digital filter and a DSP, and supports 12C and SPI interfaces.
By adopting the technical scheme, the electric signals transmitted by the MEMS thermopile are sequentially amplified, converted and filtered by means of the matching of the converter, the amplifier and the filter, so that the influence of the environment on temperature measurement is avoided, the consistency of output signals of the sensor is ensured, and the temperature measurement precision is improved.
Preferably, the NTC resistor and the MEMS thermopile are fixed on the PCB substrate through silver paste, the microphones MEMSSensor and ADC are fixed on the PCB substrate through silica gel, the ASIC and the ADC are stacked on the PCB substrate through a stack die mode, and the long-pass infrared lens is fixed on the resin shell through glue.
Through adopting above-mentioned technical scheme, fix electronic components on the PCB substrate with the help of glue, guaranteed the structural stability, improved the life of sensor. Meanwhile, the size of the product is reduced to the maximum extent, and space is saved for client application.
In view of the defects in the prior art, another object of the present invention is to provide a production process of a MEMS microphone and thermometric combination sensor, which has the effect of high production efficiency.
In order to achieve the technical purpose, the invention provides the following technical scheme: a production process of a combined sensor of an MEMS microphone and temperature measurement comprises the following steps:
s1, mounting a chip, namely mounting a resistance-capacitance component on a PCB substrate by using a chip mounter;
s2, die bonding, namely sucking chips (a microphone MEMSSensor, an ASIC, an ADC, an MEMS thermopile and an NTC) by using automatic equipment, wherein the microphone MEMSSensor and the ADC are fixed on a PCB substrate by using silica gel, the ASIC and the ADC are used for stacking and die bonding two chips by using a stack die process, and the MEMS thermopile and the NTC are fixed on the PCB substrate by using silver gel;
s3, baking, namely putting the PCB substrate attached with the chip into a baking oven at 150 ℃;
s4, bonding, namely welding a gold wire to a bonding pad between the chip and the PCB by using ultrasonic waves by using automatic equipment to complete the electrical connection of the chip;
s5, pasting, namely placing the tube shell on a special TRAY disc by means of a disc placing machine, enabling the inner side of the tube shell to face upwards, applying UV glue on the inner side of the tube shell by using an automatic glue dispenser, pasting an optical filter on the inner side of the tube shell, and sending the tube shell into an ultraviolet curing machine for curing;
s6, attaching a waterproof sound-transmitting film, and attaching the waterproof sound-transmitting film to the pipe shell by using automatic equipment to cover the sound inlet hole by using the mesh, so that the influence of water vapor entering the cavity on the temperature measurement sensor is reduced;
s7, pasting a shell, drawing the solder paste on a frame of the PCB substrate by using automatic dispensing equipment, pasting a tube shell on the PCB substrate by using the automatic pasting equipment, and melting the solder paste by using a reflow furnace;
s8, dividing the whole substrate into single temperature sensing elements by using an automatic cutting machine through a thin diamond blade rotating at 30000 revolutions per minute;
and S9, detecting, namely automatically sucking the element to detect the photoelectric property and the electric property, automatically finishing BIN by the element, and removing defective products.
By adopting the technical scheme, the combined sensor is processed by means of automatic equipment, manual control is not needed, processing can be carried out for 24 hours, and the production efficiency is improved.
In summary, the present invention achieves the following effects:
1. by means of the matching of the microphone based on the MEMS and the infrared temperature measuring sensor, the integrated setting of temperature measurement and recording is realized, and the application range of the infrared temperature measuring sensor is expanded;
2. by means of a calibration circuit in the ADC, the sensor signals are unified and have high precision;
3. by means of an automatic production process, the production efficiency is improved.
Drawings
FIG. 1 is a schematic view for showing the overall structure in the present embodiment;
FIG. 2 is a schematic diagram of a microphone circuit according to the present embodiment;
FIG. 3 is a schematic diagram illustrating an overall control process of the infrared temperature measurement sensor in this embodiment;
FIG. 4 is a diagram showing a calibration circuit in the ADC according to the present embodiment;
fig. 5 is a schematic diagram of the expression parameter calculation formula in this embodiment.
In the figure, 1, a PCB substrate; 2. a MEMS thermopile; 3. NTC; 4. resistance-capacitance; 5. an ADC; 6. a pipe shell; 7. an optical filter; 8. a microphone mems sensor; 9. an ASIC; 10. an annular pad; 11. the sound inlet hole.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications of the present embodiment without inventive contribution as needed after reading the present specification, but all of them are protected by patent law within the scope of the claims of the present invention.
Example (b): the utility model provides a combined sensor of MEMS microphone and temperature measurement, as shown in fig. 1 and 3, including the PCB substrate, be provided with resistance-capacitance on the PCB substrate, NTC, MEMS thermopile, ADC, microphone MEMSSensor and ASIC, PCB substrate overcoat is equipped with the tube, has seted up optical window and sound inlet hole on the tube, is provided with the light filter of closed optical window on the tube, and the PCB substrate is provided with the annular pad around electronic components, and electronic components on the PCB substrate passes through the gold thread and is connected with annular pad electricity.
The resistance-capacitance, the NTC, the MEMS thermopile and the ADC cooperate together to convert a voltage signal received by the MEMS thermopile into a digital signal through the ADC and transmit the digital signal through the annular bonding pad. Microphone MEMSsensor will advance the sound conversion that the sound hole transmitted into and send out for the signal of telecommunication to transmit through annular pad, be in the same place microphone and temperature measurement function integration, simultaneously small, light in weight has saved customer end space and the design degree of difficulty. The temperature measuring device can be used in the scenes of mobile phones, earphones, intelligent watches, wristbands, forehead temperature guns, air conditioner temperature control, industrial temperature measurement, temperature monitoring, fire prevention and the like, and the application range of the sensor is widened.
As shown in fig. 2, the MEMS sensor includes a MEMS micro-capacitive sensor, a micro-integrated switching circuit, an acoustic cavity, and an RF anti-interference circuit, the MEMS micro-capacitive sensor includes a silicon diaphragm and a silicon back electrode, and the silicon diaphragm is used for receiving an audio signal. The silicon diaphragm can directly receive audio signals and transmits the audio signals to the micro-integrated conversion circuit through the MEMS micro-capacitance sensor, the micro-integrated conversion circuit converts and amplifies high-resistance audio electrical signals into low-resistance electrical signals, and meanwhile, the low-resistance audio electrical signals are filtered by the RF anti-interference circuit and output electrical signals matched with the front-end circuit, so that the acousto-electric conversion is completed. And the electric signals are read, so that the voice is identified.
The sound inlet hole is sealed through the waterproof sound-transmitting membrane, the problem that temperature measurement is inaccurate due to the fact that water vapor enters the cavity to influence the ambient temperature is solved, and the non-contact infrared temperature measurement precision and the temperature measurement stability are further improved.
As shown in fig. 4 and 5, the ADC includes a reference voltage output, a multiplexer, a 4-64X programmable operational amplifier, a 24-bit digital-to-analog converter, a digital filter and a DSP, and supports 12C and SPI interfaces. By means of the cooperation of the converter, the amplifier and the filter, the electric signals transmitted by the MEMS thermopile are sequentially amplified, converted and filtered, the influence of the environment on temperature measurement is avoided, the consistency of output signals of the sensor is ensured, and the temperature measurement precision is improved.
NTC resistance and MEMS thermopile pass through the silver-colored glue to be fixed on the PCB substrate, and microphone MEMSSensor and ADC pass through silica gel to be fixed on the PCB substrate, and ASIC and ADC pass through the stack die mode and stack on the PCB substrate, and the long infrared lens that leads to passes through glue to be fixed on the resin casing. The electronic components on the PCB substrate are fixed by means of glue, so that the structural stability is ensured, and the service life of the sensor is prolonged. Meanwhile, the size of the product is reduced to the maximum extent, and space is saved for client application.
A production process of a combined sensor of an MEMS microphone and temperature measurement comprises the following steps:
s1, mounting a chip, namely mounting a resistance-capacitance component on a PCB substrate by using a chip mounter;
s2, die bonding, namely sucking chips (a microphone MEMSSensor, an ASIC, an ADC, an MEMS thermopile and an NTC) by using automatic equipment, wherein the microphone MEMSSensor and the ADC are fixed on a PCB substrate by using silica gel, the ASIC and the ADC are used for stacking and die bonding two chips by using a stack die process, and the MEMS thermopile and the NTC are fixed on the PCB substrate by using silver gel;
s3, baking, namely putting the PCB substrate attached with the chip into a baking oven at 150 ℃;
s4, bonding, namely welding a gold wire to a bonding pad between the chip and the PCB by using ultrasonic waves by using automatic equipment to complete the electrical connection of the chip;
s5, pasting, namely placing the tube shell on a special TRAY disc by means of a disc placing machine, enabling the inner side of the tube shell to face upwards, applying UV glue on the inner side of the tube shell by using an automatic glue dispenser, pasting an optical filter on the inner side of the tube shell, and sending the tube shell into an ultraviolet curing machine for curing;
s6, attaching a waterproof sound-transmitting film, and attaching the waterproof sound-transmitting film to the pipe shell by using automatic equipment to cover the sound inlet hole by using the mesh, so that the influence of water vapor entering the cavity on the temperature measurement sensor is reduced;
s7, pasting a shell, drawing the solder paste on a frame of the PCB substrate by using automatic dispensing equipment, pasting a tube shell on the PCB substrate by using the automatic pasting equipment, and melting the solder paste by using a reflow furnace;
s8, dividing the whole substrate into single temperature sensing elements by using an automatic cutting machine through a thin diamond blade rotating at 30000 revolutions per minute;
and S9, detecting, namely automatically sucking the element to detect the photoelectric property and the electric property, automatically finishing BIN by the element, and removing defective products.
Claims (6)
1. A combined sensor of MEMS microphone and temperature measurement is characterized in that: including PCB substrate (1), be provided with on PCB substrate (1) resistance-capacitance (4), NTC (3), MEMS thermopile (2), ADC (5), microphone MEMSSensor (8) and ASIC (9), PCB substrate (1) overcoat is equipped with tube (6), optical window and sound inlet hole (11) have been seted up on tube (6), be provided with light filter (7) of closed optical window on tube (6), PCB substrate (1) is provided with annular pad (10) around electronic components, electronic components on PCB substrate (1) passes through the gold thread and is connected with annular pad (10) electricity.
2. The combined MEMS microphone and thermometry sensor of claim 1, wherein: microphone MEMSSensor (8) contain little capacitive sensor of MEMS, little integrated conversion circuit, sound chamber and RF anti-jamming circuit in, little capacitive sensor of MEMS includes silicon vibrating diaphragm and silicon back electrode, the silicon vibrating diaphragm is used for receiving audio signal.
3. The combined MEMS microphone and thermometry sensor of claim 2, wherein: the sound inlet hole (11) is sealed by a waterproof sound-transmitting membrane.
4. A MEMS microphone and thermometry combination sensor according to claim 3, wherein: the ADC (5) comprises a reference voltage output, a multiplexer, a 4-64X programmable operational amplifier, a 24-bit digital-to-analog conversion, a digital filter and a DSP, and the ADC (5) supports a 12C interface and an SPI interface.
5. The combined sensor of claim 4, wherein: NTC (3) resistance and MEMS thermopile (2) are fixed on PCB substrate (1) through the silver colloid, microphone MEMSSensor (8) and ADC (5) are fixed on PCB substrate (1) through silica gel, ASIC (9) and ADC (5) are piled up on PCB substrate (1) through the stack die mode, long lead to infrared lens and pass through glue to be fixed on the resin casing.
6. A production process for a combined MEMS microphone and thermometry sensor according to any one of claims 3-5, comprising the steps of:
s1, mounting a chip, namely mounting a resistance-capacitance (4) device on a PCB substrate by using a chip mounter;
s2, die bonding, namely sucking chips (a microphone MEMSsensor (8), an ASIC (9), an ADC (5), an MEMS thermopile (2) and an NTC (3)) by using automatic equipment, wherein the microphone MEMSsensor (8) and the ADC (5) are fixed on a PCB substrate (1) by using silica gel, the ASIC (9) and the ADC (5) stack two chips by using a stack die process for die bonding, and the MEMS thermopile (2) and the NTC (3) are fixed on the PCB substrate (1) by using silver gel;
s3, baking, namely putting the PCB substrate (1) attached with the chip into a baking oven at 150 ℃;
s4, bonding, namely welding a gold wire to a bonding pad between the chip and the PCB by using ultrasonic waves by using automatic equipment to complete the electrical connection of the chip;
s5, pasting, namely placing the tube shell (6) on a special TRAY disc by means of a disc placing machine, enabling the inner side of the tube shell (6) to face upwards, applying UV glue on the inner side of the tube shell (6) by using an automatic glue dispenser, pasting the optical filter (7) on the inner side of the tube shell (6), and sending the tube shell into an ultraviolet curing machine for curing;
s6, attaching a waterproof sound-transmitting film, and attaching the waterproof sound-transmitting film to the pipe shell (6) by using automatic equipment to cover the sound inlet hole by the mesh, so that the influence of water vapor entering the cavity on the temperature measurement sensor is reduced;
s7, pasting a shell, drawing the solder paste on a frame of the PCB base material (1) by using automatic glue dispensing equipment, pasting a tube shell (6) on the PCB base material (1) by using automatic pasting equipment, and melting the solder paste by using a reflow furnace;
s8, dividing the whole substrate into single temperature sensing elements by using an automatic cutting machine through a thin diamond blade rotating at 30000 revolutions per minute;
and S9, detecting, namely automatically sucking the element to detect the photoelectric property and the electric property, automatically finishing BIN by the element, and removing defective products.
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| CN202010832392.3A CN111866682A (en) | 2020-08-18 | 2020-08-18 | MEMS microphone and temperature measurement combined sensor and production process thereof |
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| US20170238107A1 (en) * | 2016-02-16 | 2017-08-17 | Infineon Technologies Ag | MEMS Microphone, Apparatus comprising a MEMS Microphone and Method for Fabricating a MEMS Microphone |
| CN109314828A (en) * | 2016-05-26 | 2019-02-05 | 美商楼氏电子有限公司 | Microphone apparatus with integrated pressure sensor |
| CN212588511U (en) * | 2020-08-18 | 2021-02-23 | 无锡芯奥微传感技术有限公司 | MEMS microphone and temperature measurement combined sensor |
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