CN212903703U - Gauge pressure sensor - Google Patents
Gauge pressure sensor Download PDFInfo
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- CN212903703U CN212903703U CN202022034314.7U CN202022034314U CN212903703U CN 212903703 U CN212903703 U CN 212903703U CN 202022034314 U CN202022034314 U CN 202022034314U CN 212903703 U CN212903703 U CN 212903703U
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Abstract
The utility model discloses a gauge pressure sensor, concretely relates to gauge pressure sensor technical field, which comprises a substrate, the fixed nonrust steel ring that is equipped with in base plate one side, the inside opening of having seted up of nonrust steel ring, the inside first chip that is equipped with of opening, first chip bottom is equipped with the second chip. The utility model discloses an in sensor packaging process, glue with traditional machine drawing of silk screen printing replacement, the uniformity of low hardness silica gel after the silk screen printing is high, with the stainless steel ring, to first chip, the embedment anticorrosive coating processing has been done to the second chip, anticorrosive coating adopts and accords with biocompatible, the environmental oxide has been kept apart, corrosive gas and liquid, the malleation calibration, MEMS's malleation linearity is obviously better a lot than what the backpressure, can save a pressure point during the calibration, the production efficiency has been improved, the production cost is reduced, the life of product has been prolonged, reduce the influence of external environment to the sensor, in addition both satisfied the precision and improved calibration efficiency.
Description
Technical Field
The embodiment of the utility model provides a gauge pressure sensor technical field, concretely relates to gauge pressure sensor.
Background
The sensor is a detection device which can sense the measured information and convert the sensed information into electric signals or other information in required form according to a certain rule for output so as to meet the requirements of information transmission, processing, storage, display, recording, control and the like, and has the characteristics of miniaturization, digitalization, intellectualization, multifunctionalization, systematization and networking. The method is the first link for realizing automatic detection and automatic control. The existence and development of the sensor enable the object to have the senses of touch, taste, smell and the like, and the object slowly becomes alive. Generally, the sensor is classified into ten categories, i.e. a thermosensitive element, a photosensitive element, a gas-sensitive element, a force-sensitive element, a magnetic-sensitive element, a humidity-sensitive element, a sound-sensitive element, a radiation-sensitive element, a color-sensitive element and a flavor-sensitive element according to the basic sensing functions, and in the modern industrial production process, particularly the automatic production process, various sensors are used for monitoring and controlling various parameters in the production process, so that the equipment works in a normal state or an optimal state, and the product achieves the best quality. Thus, modern production is without much of its excellence, and gage pressure sensors are sensors that sense pressure relative to ambient pressure and convert it to a usable output signal.
The prior art has the following defects: although the precision of the gauge pressure sensor packaged by the SOP male die is not high, the cost is low, and in order to reduce the cost of the sensor, a ceramic circuit board cannot be used, so that the hard force problem of the sensor is challenged.
Accordingly, there is a need to invent a gauge pressure sensor.
SUMMERY OF THE UTILITY MODEL
Therefore, the embodiment of the utility model provides a gauge pressure sensor, through in the sensor packaging process, with the traditional machine drawing glue of silk screen printing replacement, the uniformity of the low rigidity silica gel after the silk screen printing is high, then with the stainless steel ring, and to first chip, second chip have made encapsulation anticorrosion glue to handle, anticorrosion glue adopts and accords with biocompatible, has kept apart environment oxide, corrosive gas and liquid, the malleation is calibrated, MEMS's malleation linearity is obviously better than the back pressure a lot, can save a pressure point during the calibration, production efficiency is improved, production cost is reduced, the life of product has been prolonged, reduce the influence of external environment to the sensor, in addition both satisfied the precision and improved calibration efficiency, in order to solve in the prior art gauge pressure sensor that market is packed with SOP's public mould although the precision is not high, but the cost is lower, in order to reduce the cost of sensor, the ceramic circuit board cannot be used, which poses a challenge to the hard force problem of the sensor.
In order to achieve the above object, the embodiment of the present invention provides the following technical solutions: the utility model provides a gauge pressure sensor, includes the base plate, the fixed nonrust steel ring that is equipped with in base plate one side, the inside opening that has seted up of nonrust steel ring, the inside first chip that is equipped with of opening, a first chip lateral wall is through low hardness silica gel and opening a lateral wall bonding connection, first chip bottom is equipped with the second chip, the second chip is established inside the opening, the second chip is through low hardness silica gel and opening a lateral wall bonding connection, the inside packing of opening has anticorrosive adhesive, the fixed dustproof steel wire protective sheath that is equipped with in base plate one side, dustproof steel wire protective sheath establishes in the nonrust steel ring outside.
Furthermore, the substrate is provided with a vent hole, and the vent hole is positioned on one side of the first chip.
Further, the second chip is located at the bottom of the first chip.
Further, the first chip and the second chip are both arranged inside the anti-corrosion glue.
Further, one side of the anti-corrosion glue is provided with an arc surface.
Further, the stainless steel ring is symmetrical about a horizontal center line of the substrate.
Furthermore, an annular groove is formed in one side of the stainless steel ring, and the annular groove is formed in one side of the opening.
The embodiment of the utility model provides a have following advantage:
1. through in the sensor packaging process, drawing glue with the traditional machine that silk screen printing replaced, the uniformity of the low rigidity silica gel after the silk screen printing is high, has stopped the problem of disconnected glue, and the low rigidity silica gel thickness of silk screen printing also is not drawing glue can be compared in addition, compares with prior art, has improved production efficiency, reduction in production cost.
2. Through adopting the stainless steel ring, and to first chip, the processing of embedment anticorrosive cement has been done to the second chip, anticorrosive cement adopts and accords with biocompatible, can satisfy more customer's requirements like this, because first chip and second chip surface all have anticorrosive cement, the environmental oxide has been kept apart in other words, corrosive gas and liquid, the malleation is calibrated, MEMS's malleation linearity is obviously better than the wanting of backpressure a lot, can save a pressure point during the calibration, compare with prior art, the life of extension product, reduce the influence of external environment to the sensor, meanwhile both satisfied the precision and improved calibration efficiency.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It should be apparent that the drawings in the following description are merely exemplary, and that other embodiments can be derived from the drawings provided by those of ordinary skill in the art without inventive effort.
The structure, ratio, size and the like shown in the present specification are only used for matching with the content disclosed in the specification, so as to be known and read by people familiar with the technology, and are not used for limiting the limit conditions which can be implemented by the present invention, so that the present invention has no technical essential significance, and any structure modification, ratio relationship change or size adjustment should still fall within the scope which can be covered by the technical content disclosed by the present invention without affecting the efficacy and the achievable purpose of the present invention.
FIG. 1 is a perspective view of the overall structure provided by the present invention;
fig. 2 is a cross-sectional view of the overall structure provided by the present invention;
fig. 3 is a left side view of the overall structure provided by the present invention;
fig. 4 is a rear view of the overall structure provided by the present invention;
fig. 5 is a block diagram of a sensor provided by the present invention;
in the figure: 1 base plate, 2 stainless steel rings, 3 first chips, 4 second chips, 5 openings, 6 anticorrosive glues, 7 dustproof steel wire protective sheaths, 8 ventilation holes.
Detailed Description
The present invention is described in terms of specific embodiments, and other advantages and benefits of the present invention will become apparent to those skilled in the art from the following disclosure. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to the attached drawings 1-5 in the specification, the gauge pressure sensor of the embodiment comprises a substrate 1, a stainless steel ring 2 is fixedly arranged on one side of the substrate 1, an opening 5 is formed in the stainless steel ring 2, a first chip 3 is arranged in the opening 5, one side wall of the first chip 3 is in adhesive connection with one side wall of the opening 5 through low-hardness silica gel, a second chip 4 is arranged at the bottom of the first chip 3, the second chip 4 is arranged in the opening 5, the second chip 4 is in adhesive connection with one side wall of the opening 5 through low-hardness silica gel, an anti-corrosion glue 6 is filled in the opening 5, a dustproof steel wire protective sleeve 7 is fixedly arranged on one side of the substrate 1, and the dustproof steel wire protective sleeve 7 is sleeved on the outer side of the stainless steel ring 2.
Furthermore, the base plate 1 is provided with a vent hole 8, the vent hole 8 is located on one side of the first chip 3, and the heat in the opening 5 can be volatilized by arranging the vent hole 8, so that the damage to the first chip 3 or the second chip 4 caused by overhigh temperature in the opening 5 is avoided.
Further, the second chip 4 is located at the bottom of the first chip 3.
Further, the first chip 3 and the second chip 4 are both arranged inside the anti-corrosion glue 6, and the anti-corrosion glue 6 is filled to isolate oxide, corrosive gas and liquid in the environment, so that the service life of the first chip 3 and the service life of the second chip 4 are prolonged.
Further, one side of the anti-corrosion glue 6 is set to be an arc surface.
Further, stainless steel ring 2 is symmetrical about 1 horizontal center line of base plate, and stainless steel ring 2 is circular and 1 center coincidence of base plate, has improved to a certain extent the utility model discloses an aesthetic property still provides certain effect to the stability of structure simultaneously.
Furthermore, an annular groove is formed in one side of the stainless steel ring 2, and the annular groove is formed in one side of the opening 5.
The implementation scenario is specifically as follows: the technique provides a high-efficiency way for integrating and packaging MEMS devices, the MEMS and ASIC are packaged in the same sensor without changing the manufacturing process of MEMS and circuit, and IIC digital output is realized, after the technique is used, the product performance can be obviously improved, the production cost is reduced, in addition, a circuit board of FR4 is adopted, low-hardness silica gel is used as the first layer, a silk-screen printing mode is adopted to print a low-hardness silica gel, then high-temperature curing is carried out, a die bonder is used for spotting the naturally curable glue on the low-hardness silica gel of the first layer, then the die bonder is used for controlling the height of chip paster, thereby solving the problem of BLT consistency in the batch production process, the problem of PCB hard power to MEMS has been solved simultaneously to suitable BLT and the glue that hardness is low, stainless steel ring 2 of heavy-calibre 6mm (internal diameter), inject anticorrosive glue 6 in the opening 5, and stainless steel ring 2 is outer optionally to be joined in marriage 3000 mesh dustproof steel wire protective sheath 7, dust or the solid matter of aquatic that can the effective filtration air, also can normally work in polluted environment, this embodiment has specifically solved among the prior art gauge pressure sensor of market with SOP's public mould encapsulation although the precision is not high, but the cost is lower, in order to reduce the cost of sensor, then can not use ceramic circuit board, have the problem of certain challenge to the hard power problem of sensor like this.
Although the invention has been described in detail with respect to the general description and the specific embodiments, it will be apparent to those skilled in the art that modifications and improvements can be made based on the invention. Therefore, such modifications and improvements are intended to be within the scope of the invention as claimed.
Claims (7)
1. A gauge pressure sensor comprising a base plate (1), characterized in that: the stainless steel ring-shaped light-emitting diode is characterized in that a stainless steel ring (2) is fixedly arranged on one side of a substrate (1), an opening (5) is formed in the stainless steel ring (2), a first chip (3) is arranged in the opening (5), a side wall of the first chip (3) is connected with a side wall of the opening (5) in a bonding mode through low-hardness silica gel, a second chip (4) is arranged at the bottom of the first chip (3), the second chip (4) is arranged in the opening (5) in the bonding mode, the second chip (4) is connected with a side wall of the opening (5) in a bonding mode through the low-hardness silica gel, an anticorrosive adhesive (6) is filled in the opening (5), a dustproof steel wire protective sleeve (7) is fixedly arranged on one side of the substrate (1), and the dustproof steel wire protective sleeve (.
2. A gauge pressure sensor as defined in claim 1, wherein: the substrate (1) is provided with a vent hole (8), and the vent hole (8) is located on one side of the first chip (3).
3. A gauge pressure sensor as defined in claim 1, wherein: the second chip (4) is positioned at the bottom of the first chip (3).
4. A gauge pressure sensor as defined in claim 1, wherein: the first chip (3) and the second chip (4) are both arranged inside the anti-corrosion glue (6).
5. A gauge pressure sensor as defined in claim 1, wherein: one side of the anti-corrosion glue (6) is provided with an arc surface.
6. A gauge pressure sensor as defined in claim 1, wherein: the stainless steel ring (2) is symmetrical about the horizontal center line of the substrate (1).
7. A gauge pressure sensor as defined in claim 1, wherein: an annular groove is formed in one side of the stainless steel ring (2), and the annular groove is formed in one side of the opening (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022034314.7U CN212903703U (en) | 2020-09-16 | 2020-09-16 | Gauge pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022034314.7U CN212903703U (en) | 2020-09-16 | 2020-09-16 | Gauge pressure sensor |
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| Publication Number | Publication Date |
|---|---|
| CN212903703U true CN212903703U (en) | 2021-04-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022034314.7U Active CN212903703U (en) | 2020-09-16 | 2020-09-16 | Gauge pressure sensor |
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| CN (1) | CN212903703U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113218567A (en) * | 2021-05-21 | 2021-08-06 | 深圳市伟烽恒科技有限公司 | Digital pressure sensor for measuring air pressure height and liquid level depth |
-
2020
- 2020-09-16 CN CN202022034314.7U patent/CN212903703U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113218567A (en) * | 2021-05-21 | 2021-08-06 | 深圳市伟烽恒科技有限公司 | Digital pressure sensor for measuring air pressure height and liquid level depth |
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Address after: 518000 room 3001, room 3002, room 3003, room 3004, room 3005, block a, block 8, block C, Wanke Yuncheng phase III, Liuxin Fourth Street, Xili community, Xili street, Nanshan District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Huapu Microelectronics Co.,Ltd. Address before: 518000 room 3001, room 3002, room 3003, room 3004, room 3005, block a, block 8, block C, Wanke Yuncheng phase III, Liuxin Fourth Street, Xili community, Xili street, Nanshan District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Huapu Microelectronics Co.,Ltd. |
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