CN111328189A - Salt mist resistant PCB - Google Patents
Salt mist resistant PCB Download PDFInfo
- Publication number
- CN111328189A CN111328189A CN202010186478.3A CN202010186478A CN111328189A CN 111328189 A CN111328189 A CN 111328189A CN 202010186478 A CN202010186478 A CN 202010186478A CN 111328189 A CN111328189 A CN 111328189A
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- China
- Prior art keywords
- resistant
- layer
- coating
- salt
- pcb
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention discloses a salt mist resistant PCB which comprises a circuit board, an anti-mist coating, a salt mist resistant coating, a pressure resistant layer, a bubble rubber sheet, a carbon fiber net, an insulating adhesive layer, a heat dissipation layer, a conductive substrate, a protective side band and an electric soldering point. According to the invention, the salt spray resistant coating and the anti-fog coating are sequentially coated on the surface of the circuit board, so that the salt spray resistant function is achieved, the corrosion degree of the circuit board, namely the PCB is reduced, the service life is prolonged, the salt spray is prevented from being attached to the surface of the circuit board, namely the PCB, the heat dissipation layer formed by the superfine glass tube is attached to the corresponding surface of the conductive substrate, and the two ends of the superfine glass tube are connected with the water cooling equipment, so that heat generated during the operation of the PCB can be conducted out.
Description
Technical Field
The invention relates to a PCB (printed circuit board), in particular to a salt mist resistant PCB, and belongs to the technical field of PCB application.
Background
The printed circuit board, namely the CB circuit board, also called as a printed circuit board, is a provider of electrical connection of electronic components, has been developed for more than 100 years, is mainly designed by a domain design, has the main advantages of greatly reducing errors of wiring and assembly, improving the automation level and the production labor rate, and can be divided into single-layer boards, double-sided boards, four-layer boards, six-layer boards and other multi-layer circuit boards according to the number of layers of the circuit board.
To used PCB board in the frequent environment of salt fog can cause the condition of corrosion damage because of with the salt fog on time contact, and PCB board life reduces, the produced heat of PCB board circular telegram operation simultaneously can not be through the timely effectual effluvium of structure that self has, then has the hidden danger of PCB board scaling loss, and the unexpected extrusion of traditional PCB board external force is breakable. Therefore, the salt mist resistant PCB is provided for solving the problems.
Disclosure of Invention
The present invention is directed to solve the above problems and to provide a salt mist resistant PCB.
The invention achieves the aim through the following technical scheme, and the salt mist resistant PCB comprises a circuit board, wherein a conductive substrate is arranged in the middle of the circuit board, heat dissipation layers are attached to the surfaces of the two sides of the conductive substrate, an insulating adhesive layer is coated on the surface of each heat dissipation layer, a pressure resistant layer is arranged on the surface of each insulating adhesive layer, a salt mist resistant coating is coated on the surface of each pressure resistant layer, and an anti-mist coating is coated on the surface of each salt mist resistant coating.
Preferably, the edge of the circuit board is wrapped with a protective sideband, a plurality of electric soldering points are regularly distributed on the surface of one side of the circuit board, and the electric soldering points are electrically connected with the conductive substrate.
Preferably, the heat dissipation layer is composed of superfine glass tubes, the superfine glass tubes are distributed on the corresponding surface of the conductive substrate in a snake-shaped single layer, and ports at two ends of each superfine glass tube are respectively connected with corresponding ports of external water cooling equipment.
Preferably, the heat dissipation layer is fixed on the corresponding side wall of the conductive substrate through an insulating glue layer, and the insulating glue layer is fixed with the outer compression-resistant layer through insulating glue solidification.
Preferably, the compression-resistant layer comprises a bubble rubber sheet and a carbon fiber net, and the carbon fiber net is bonded on the surfaces of the two sides of the bubble rubber sheet.
Preferably, the mixed layer formed by the anti-fog coating, the salt fog resistant coating, the anti-pressure layer, the insulating glue layer and the heat dissipation layer is internally distributed with pore channels, and each pore channel corresponds to one electric soldering point.
Preferably, the salt spray resistant coating mainly comprises a salt spray resistant auxiliary agent, and the acid value of resin in the salt spray resistant auxiliary agent is required to be lower than 50 mgKOH/g.
Preferably, the anti-fog coating takes a high polymer material with a hydrophobic group as a main component, the high polymer material with the hydrophobic group, other additives and an organic solvent are mixed to form mixed slurry, and the mixed slurry is uniformly sprayed and solidified through spraying equipment to form the anti-fog coating.
Preferably, the thickness of the anti-fog coating, the salt fog resistant coating, the anti-pressure layer, the insulating adhesive layer and the heat dissipation layer is 0.1cm, the edges of the anti-fog coating, the salt fog resistant coating, the anti-pressure layer, the insulating adhesive layer and the heat dissipation layer are all surrounded by the protection side band, and the end of the corresponding super-thin pipe body of the heat dissipation layer penetrates through the protection side band and is located outside.
Preferably, the whole thickness of the circuit board is 1.2cm, and one side of the circuit board is electrically connected with corresponding external electrical equipment through a flat cable.
The invention has the beneficial effects that:
1. this kind of salt spray resistant type PCB board reasonable in design through outside coating in proper order has salt spray resistant coating and anti-fog coating on the circuit board surface to have salt spray resistant function, reduce the circuit board and be the degree of corrosion of PCB board, postpone life, can avoid salt spray to adhere to on the circuit board promptly PCB board surface simultaneously.
2. This kind of salt mist resistant type PCB board reasonable in design is through the attached corresponding surface of conducting substrate and superfine glass pipe both ends and the water-cooling equipment of the heat dissipation layer that will be formed by superfine glass pipe are connected to can go out the heat conduction that produces when the PCB board operation.
3. This kind of salt mist resistant type PCB board reasonable in design through being equipped with the resistance to compression layer that is formed by bubble sheet rubber and carbon fiber net between insulating glue layer and salt mist resistant coating, can improve PCB board compressive strength, reaches the effect on protection conducting substrate and heat dissipation layer.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
FIG. 1 is a perspective view of the overall structure of the present invention;
FIG. 2 is a cross-sectional view of the overall structure of the present invention;
FIG. 3 is a schematic view of the structure of the anti-crush layer of the present invention.
In the figure: 1. the circuit board comprises a circuit board body 111, an anti-fog coating layer 112, a salt fog resistant coating layer 12, a pressure-resistant layer 121, a bubble rubber sheet 122, a carbon fiber net 13, an insulating glue layer 14, a heat dissipation layer 15, a conductive substrate 2, a protective side band 3 and an electric soldering point.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
Referring to fig. 1-3, a salt mist resistant PCB comprises a circuit board 1, a conductive substrate 15 is disposed in the middle of the circuit board 1, heat dissipation layers 14 are attached to the surfaces of the two sides of the conductive substrate 15, an insulating adhesive layer 13 is coated on the surface of the heat dissipation layer 14, a pressure resistant layer 12 is disposed on the surface of the insulating adhesive layer 13, a salt mist resistant coating 112 is coated on the surface of the pressure resistant layer 12, and a salt mist resistant coating 111 is coated on the surface of the salt mist resistant coating 112.
The edge of the circuit board 1 is wrapped with a protective sideband 2, a plurality of electric soldering points 3 are regularly distributed on the surface of one side of the circuit board 1, the electric soldering points 3 are electrically connected with a conductive substrate 15, and subsequent electric soldering is facilitated through the installed electric soldering points 3; the heat dissipation layer 14 is composed of superfine glass tubes, the superfine glass tubes are distributed on the corresponding surface of the conductive substrate 15 in a snake-shaped single layer, ports at two ends of each superfine glass tube are respectively connected with the corresponding ports of external water cooling equipment, and the superfine glass tubes distributed in a snake shape can be fully covered on the corresponding surface of the conductive substrate 15; the heat dissipation layer 14 is fixed on the corresponding side wall of the conductive substrate 15 through the insulating adhesive layer 13, and the insulating adhesive layer 13 is adhered to the outer compression-resistant layer 12 through insulating adhesive solidification, so that the effects of firm connection and insulation between the corresponding layers are achieved; the pressure-resistant layer 12 comprises a bubble rubber sheet 121 and a carbon fiber net 122, and the carbon fiber net 122 is bonded on the two side surfaces of the bubble rubber sheet 121; the mixed layer formed by the anti-fog coating 111, the salt fog resistant coating 112, the compression-resistant layer 12, the insulating glue layer 13 and the heat dissipation layer 14 is internally provided with a plurality of pore channels, and each pore channel corresponds to one electric soldering point 3, which is beneficial to forming a matched layer structure; the salt spray resistant coating 112 mainly adopts a salt spray resistant auxiliary agent as a main selected component, and the acid value of resin in the salt spray resistant auxiliary agent is required to be lower than 50mgKOH/g, so that the effect of the salt spray resistant coating 112 can be improved; the anti-fog coating 111 takes a high polymer material with a hydrophobic group as a main component, the high polymer material with the hydrophobic group, other additives and an organic solvent are prepared into mixed slurry, the mixed slurry is uniformly sprayed and solidified through spraying equipment to form the anti-fog coating 111, and the anti-fog coating 111 can be formed by corresponding material components; the thicknesses of the anti-fog coating 111, the salt fog resistant coating 112, the pressure-resistant layer 12, the insulating glue layer 13 and the heat dissipation layer 14 are all 0.1cm, the edges of the anti-fog coating 111, the salt fog resistant coating 112, the pressure-resistant layer 12, the insulating glue layer 13 and the heat dissipation layer 14 are all surrounded by the protective side band 2, the corresponding superfine tube body end of the heat dissipation layer 14 penetrates through the protective side band 2 and is located outside, and edge components of the corresponding circuit board 1 can be protected from being damaged through the installed protective side band 2; the whole thickness of the circuit board 1 is 1.2cm, and one side of the circuit board 1 is electrically connected with corresponding external electrical equipment through a flat cable, so that the thickness and the size of the circuit board 1 are determined, and the circuit board is convenient to electrically connect with the external electrical equipment.
When the anti-salt-fog circuit board is used, the salt-fog-resistant coating 112 and the anti-fog coating 111 are sequentially coated on the surface of the circuit board 1 outwards, so that the anti-salt-fog circuit board has a salt-fog resistant function, reduces the corrosion degree of the circuit board 1, namely a PCB (printed circuit board), prolongs the service life, and can prevent salt fog from attaching to the surface of the circuit board 1, namely the PCB;
the heat dissipation layer 14 formed by the superfine glass tube is attached to the corresponding surface of the conductive substrate 15, and two ends of the superfine glass tube are connected with water cooling equipment, so that heat generated during the operation of the PCB can be conducted out;
through being equipped with the resistance to compression layer 12 that is formed by bubble rubber piece 121 and carbon fiber net 122 between insulating glue layer 13 and salt spray resistant coating 112, can improve PCB board compressive strength, reach the effect of protection conductive substrate 15 and heat dissipation layer 14.
It is well within the skill of those in the art to implement and protect the present invention without undue experimentation and without undue experimentation that the present invention is directed to software and process improvements.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. The utility model provides a salt resistant fog type PCB board which characterized in that: including circuit board (1), middle part is conducting substrate (15) in circuit board (1), conducting substrate (15) both sides surface is attached and is equipped with heat dissipation layer (14), and heat dissipation layer (14) surface coating has insulating glue film (13), insulating glue film (13) surface is equipped with crushing resistant layer (12), and crushing resistant layer (12) surface coating has salt spray resistant coating (112), salt spray resistant coating (112) surface coating has anti fog coating (111).
2. The salt mist resistant PCB of claim 1, wherein: the edge of the circuit board (1) is wrapped with the protective side band (2), a plurality of electric soldering points (3) are regularly distributed on the surface of one side of the circuit board (1), and the electric soldering points (3) are electrically connected with the conductive substrate (15).
3. The salt mist resistant PCB of claim 1, wherein: the heat dissipation layer (14) is composed of superfine glass tubes, the superfine glass tubes are distributed on the corresponding surface of the conductive substrate (15) in a snake-shaped single-layer mode, and ports at two ends of each superfine glass tube are connected with corresponding ports of external water cooling equipment respectively.
4. The salt mist resistant PCB of claim 1, wherein: the heat dissipation layer (14) is fixed on the corresponding side wall of the conductive substrate (15) through an insulating glue layer (13), and the insulating glue layer (13) is adhered to the outer pressure-resistant layer (12) through insulating glue solidification.
5. The salt mist resistant PCB of claim 1, wherein: the pressure-resistant layer (12) comprises a bubble rubber sheet (121) and a carbon fiber net (122), and the carbon fiber net (122) is bonded on the surfaces of the two sides of the bubble rubber sheet (121).
6. The salt mist resistant PCB of claim 1, wherein: and the mixed layer formed by the anti-fog coating (111), the salt-fog resistant coating (112), the compression-resistant layer (12), the insulating glue layer (13) and the heat dissipation layer (14) is internally and uniformly distributed with pore channels, and each pore channel corresponds to one electric soldering point (3).
7. The salt mist resistant PCB of claim 1, wherein: the salt spray resistant coating (112) mainly comprises a salt spray resistant auxiliary agent, and the acid value of resin in the salt spray resistant auxiliary agent is required to be lower than 50 mgKOH/g.
8. The salt mist resistant PCB of claim 1, wherein: the anti-fog coating (111) takes a high polymer material with a hydrophobic group as a main component, the high polymer material with the hydrophobic group, other additives and an organic solvent are prepared into mixed slurry, and the mixed slurry is uniformly sprayed and solidified through spraying equipment to form the anti-fog coating (111).
9. The salt mist resistant PCB of claim 1, wherein: the thickness of anti-fog coating (111), salt spray resistant coating (112), resistance to compression layer (12), insulating glue layer (13) and heat dissipation layer (14) is 0.1cm, and anti-fog coating (111), salt spray resistant coating (112), resistance to compression layer (12), insulating glue layer (13) and heat dissipation layer (14) edge all are surrounded by protection sideband (2), the corresponding super tubule end of heat dissipation layer (14) passes protection sideband (2) and is located the outside.
10. The salt mist resistant PCB of claim 1, wherein: the whole thickness of the circuit board (1) is 1.2cm, and one side of the circuit board (1) is electrically connected with corresponding external electrical equipment through flat cables.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010186478.3A CN111328189A (en) | 2020-03-17 | 2020-03-17 | Salt mist resistant PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010186478.3A CN111328189A (en) | 2020-03-17 | 2020-03-17 | Salt mist resistant PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111328189A true CN111328189A (en) | 2020-06-23 |
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ID=71165850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010186478.3A Pending CN111328189A (en) | 2020-03-17 | 2020-03-17 | Salt mist resistant PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111328189A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998030072A1 (en) * | 1996-12-30 | 1998-07-09 | Derochemont L Pierre Doing Bus | Ceramic composite wiring structures for semiconductor devices and method of manufacture |
| CN107613652A (en) * | 2017-09-20 | 2018-01-19 | 四川海英电子科技有限公司 | The manufacture method of high-density interconnected printed circuit board |
| CN207939820U (en) * | 2017-12-19 | 2018-10-02 | 苏州泰精圣电子科技有限公司 | A kind of novel printed circuit board |
| CN209448982U (en) * | 2019-01-07 | 2019-09-27 | 深圳市顺荣昌电路有限公司 | A kind of light and thin type SMT side back light source wiring board |
-
2020
- 2020-03-17 CN CN202010186478.3A patent/CN111328189A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998030072A1 (en) * | 1996-12-30 | 1998-07-09 | Derochemont L Pierre Doing Bus | Ceramic composite wiring structures for semiconductor devices and method of manufacture |
| CN107613652A (en) * | 2017-09-20 | 2018-01-19 | 四川海英电子科技有限公司 | The manufacture method of high-density interconnected printed circuit board |
| CN207939820U (en) * | 2017-12-19 | 2018-10-02 | 苏州泰精圣电子科技有限公司 | A kind of novel printed circuit board |
| CN209448982U (en) * | 2019-01-07 | 2019-09-27 | 深圳市顺荣昌电路有限公司 | A kind of light and thin type SMT side back light source wiring board |
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Application publication date: 20200623 |