CN111183514A - A device and method for cutting a display panel from a mother substrate - Google Patents
A device and method for cutting a display panel from a mother substrate Download PDFInfo
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- CN111183514A CN111183514A CN201780095702.4A CN201780095702A CN111183514A CN 111183514 A CN111183514 A CN 111183514A CN 201780095702 A CN201780095702 A CN 201780095702A CN 111183514 A CN111183514 A CN 111183514A
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- 239000000758 substrate Substances 0.000 title claims abstract description 184
- 238000005520 cutting process Methods 0.000 title claims abstract description 175
- 238000000034 method Methods 0.000 title claims description 69
- 238000010008 shearing Methods 0.000 claims abstract description 63
- 239000011521 glass Substances 0.000 claims abstract description 19
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims 2
- 238000000748 compression moulding Methods 0.000 claims 1
- 230000001788 irregular Effects 0.000 description 13
- 238000005452 bending Methods 0.000 description 10
- 238000007906 compression Methods 0.000 description 10
- 238000003698 laser cutting Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 230000006835 compression Effects 0.000 description 6
- 238000007796 conventional method Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 210000002858 crystal cell Anatomy 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
- H10D86/021—Manufacture or treatment of multiple TFTs
- H10D86/0214—Manufacture or treatment of multiple TFTs using temporary substrates
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
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Abstract
本发明涉及一种用于从包括至少一块玻璃板的母基板切割出一块或多块显示面板的装置，其中所述母基板具有两个相对的表面，其上彼此相对的微槽沿待切割出的所述显示面板的轮廓分别延伸，所述装置包括：带剪切刃口的支撑台，其中所述支撑台用于放置所述母基板，使得在朝向所述支撑台的基板表面上延伸的微槽与所述支撑台边缘对齐；以及带剪切刃口的剪切工具，其中所述母基板放置于所述支撑台和所述剪切工具之间时，可以移动所述剪切工具靠近或远离所述支撑台，使得在朝向所述剪切工具的基板表面上延伸的微槽与所述剪切工具刃口对齐；其中，所述剪切工具的所述刃口与朝向所述剪切工具的所述基板表面形成合适的剪切角度，且所述剪切工具刃口和所述支撑台边缘之间的平面距离和/或所述剪切工具刃口和在朝向所述剪切工具的所述基板表面上延伸的所述微槽之间的平面距离足够小，使得当移动所述剪切工具靠近所述支撑台时，产生的剪切应力足以在所述母基板上所述相对的微槽之间进行切割。
The present invention relates to an apparatus for cutting one or more display panels from a mother substrate comprising at least one glass plate, wherein the mother substrate has two opposing surfaces on which microgrooves opposite each other are to be cut along the The contours of the display panels are respectively extended, and the device includes: a support table with a cutting edge, wherein the support table is used to place the mother substrate, so that the surface of the substrate extending toward the support table a microgroove aligned with the edge of the support table; and a shearing tool with a shearing edge, wherein when the mother substrate is placed between the support table and the shearing tool, the shearing tool can be moved closer to or away from the support table so that the microgrooves extending on the surface of the substrate facing the shearing tool are aligned with the cutting tool edge; wherein the cutting edge of the shearing tool is aligned with the cutting tool facing the shearing tool The substrate surface of the cutting tool forms a suitable shearing angle, and the plane distance between the cutting edge of the cutting tool and the edge of the support table and/or the cutting edge of the cutting tool and the direction of the cutting tool The planar distance between the microgrooves extending on the substrate surface of the tool is sufficiently small that when the shearing tool is moved close to the support table, sufficient shear stress is generated on the mother substrate. Cuts are made between opposing microgrooves.
Description
Technical Field
The present invention relates to a cutting apparatus, and more particularly, to an apparatus for cutting one or more display panels from a mother substrate including at least one glass plate. The invention also relates to a method for cutting out one or more display panels from a mother substrate, and a display panel cut out from a mother substrate by the method.
Background
Generally, a rigid flat panel display (e.g., a liquid crystal display LCD and an organic light emitting diode OLED) is fabricated on a large-sized glass mother substrate, and then individual display panels are cut out of the mother substrate. The display panel is usually cut from the mother substrate by using a conventional glass material cutting method such as a "scribe and break method" and a "laser scribe and break method".
Fig. 1 is a schematic view of a display panel 10 'cut out of a mother substrate 100' by a conventional scribing and breaking method. The scribe-and-break method basically includes two steps of scribing and breaking. In the scribing step, the scribe lines 104' and 105' are drawn on the mother substrate 100' in, for example, a grid shape. Any scriber, such as a scribing knife, may be used to draw the cutting lines 104' and 105', thereby forming micro grooves on the surface of the mother substrate 100 '. In the laser scribing and breaking method, the scribe lines 104' and 105' may be formed on the surface of the mother substrate 100' by laser processing. In the breaking step, the mother substrate 100' is placed on the support stage 2' and clamped by the clamp 4', and when the mother substrate 100' is pushed down (F ') by the pusher 3', a bending stress is applied to the mother substrate 100' placed on the support stage 2' and clamped by the clamp 4' (S)Bending of). Due to bending stress (S)Bending of) The existence of (S) generates a tensile stress (S) on the cutting line 105' on the surface of one side of the mother substrate 100Stretching) While compressive stress (S) is generated on the cutting line 104' on the opposite side surface of the mother substrate 100Compression). These tensile stresses and compressionsStress (S)Stretching，SCompression) An intermediate fracture (C ') may be created between the cutting line 105' and the opposite cutting line 104 '. The intermediate cracks (C') may be initially formed to generate tensile stress (S)Stretching) Then extends until compressive stress (S) is generated on the cutting line 105' on the surface of (b)Compression) Finally, the mother substrate 100 'is broken due to the opposite cutting lines 104' on the corresponding surface.
The above scribe-and-break method is most commonly used in the industry to cut out a rectangular display panel from a mother substrate, but it is not suitable for cutting out an irregular display panel having a non-rectangular profile, such as a curved profile, a chamfered profile, and a notched profile. When bending stress is applied to the mother substrate 100 'by the pusher 3' (S)Bending of) In this case, only a tensile stress (S) capable of causing an intermediate crack is generated around the straight cut line (cut line 105') (S)Stretching) As shown in fig. 2, while not only tensile stress (S) is generated around a non-linear cutting line such as a curved cutting line or a notched cutting line (cutting line 105')Stretching) Compressive stress (S) is also generatedCompression) As shown in fig. 3. Therefore, when bending stress (S)Bending of) When applied to the mother substrate 100' having the non-linear cutting lines, non-uniform composite stress is generated around the non-linear cutting lines. Therefore, cutting the mother glass substrate along the non-linear cutting line is difficult to achieve using the conventional scribe and break method.
The process of cutting out individual pieces from the mother glass substrate may be performed by a laser cutting method. According to the laser cutting method, a plate member can be cut out from a mother substrate in a thickness direction by a laser beam according to any one cutting line. Thus, the laser cutting method is suitable for cutting out irregular plate members having non-rectangular profiles. However, if the display panel is cut out of the mother substrate using a laser cutting method, laser light generated during the laser cutting process may cause unacceptable damage to display panel components located near or below the cut line.
Therefore, there is a need to solve the above-mentioned problems that the conventional cutting method cannot solve, especially to cut out not only a typical display panel having a rectangular profile but also an irregular display panel having a non-rectangular profile, which is difficult to handle with the conventional method, without causing unacceptable damage to the components of the display panel.
Disclosure of Invention
It is an object of the present invention to provide an apparatus and method that can cut out display panels of various shapes having arbitrary profiles without causing unacceptable damage to the components of the display panel.
According to one aspect of the invention, the object is achieved by a device for cutting out one or more display panels from a mother substrate comprising at least one glass sheet, the mother substrate having two opposite surfaces on which mutually opposite microgrooves respectively extend along a contour of the display panel to be cut out, the device comprising: a support table with a cutting edge for placing the mother substrate such that micro-grooves extending on a surface of the substrate facing the support table are aligned with an edge of the support table; and a shear tool having a shear edge, wherein the shear tool is movable toward and away from the support table such that the microgrooves extending on the surface of the substrate facing the shear tool are aligned with the shear tool edge when the master substrate is placed between the support table and the shear tool; wherein the cutting tool edge forms a suitable cutting angle with the substrate surface facing the cutting tool and the planar distance between the cutting tool edge and the edge of the support table and/or the planar distance between the cutting tool edge and the micro-grooves extending on the substrate surface facing the cutting tool is sufficiently small such that when the cutting tool is moved close to the support table, a shear stress is generated that is sufficient to cut between the opposing micro-grooves on the mother substrate.
By means of the apparatus, the mother substrate may be sheared along the micro-groove while moving the shearing tool close to the support table on which the mother substrate is placed. Specifically, a shear stress may be generated at the micro groove position of the mother substrate, and a pair of intermediate cracks may be generated between a pair of micro grooves facing each other. One of the intermediate cracks may be initially formed on one of the pair of micro grooves while the other intermediate crack may be initially formed on the other micro groove, and then the intermediate cracks may approach each other in the thickness direction of the mother substrate. When the intermediate cracks merge, the propagation is stopped, eventually resulting in the mother substrate being completely cut in the thickness direction. With the device, various shapes of display panels having arbitrary profiles can be cut without causing unacceptable damage to the components of the display panels.
In one embodiment of the apparatus, the support table edge and the cutting tool edge may have a planar shape corresponding to a non-rectangular outline of the display panel.
In a preferred embodiment of the apparatus, the support table may comprise a compression mold having one or more cavities shaped to follow the contours of the display panel, and the cutting tool may comprise one or more stampings having a peripheral shape that fits into the cavities of the compression mold.
In another preferred embodiment of the apparatus, the planar distance between the cutting edge of the cutting tool and the edge of the support table may satisfy the following inequality (1):
G<3t…(1)
wherein G is the plane distance between the cutting edge of the shearing tool and the edge of the support table, and t is the thickness of the mother substrate.
In yet another preferred embodiment of the apparatus, a planar distance between the cutting edge of the shearing tool and the microgrooves extending on the substrate surface facing the shearing tool may satisfy the following inequality (2):
P<2t…(2)
wherein P is a planar distance between the cutting edge of the shear tool and the micro-grooves extending on the substrate surface facing the shear tool, and t is a thickness of the master substrate.
According to another aspect of the present invention, there is provided a method of cutting one or more display panels from a mother substrate including at least one glass plate, the method comprising the steps of:
-grooving on two opposite faces of the mother substrate, forming microgrooves opposite each other extending along the outline of the display panel to be cut;
-preparing a support table with a cutting edge;
-placing and positioning the mother substrate on the support table such that the micro-grooves extending on the substrate surface facing the support table are aligned with the support table edge;
-preparing a cutting tool with cutting edges, wherein the cutting tool can be moved closer to or further from the support table while the mother substrate is placed between the support table and the cutting tool, such that the micro-grooves extending on the substrate surface facing the cutting tool are aligned with the cutting edges of the cutting tool; and
-moving the shearing tool close to the support table such that the shear stress generated is sufficient to cut between the opposing microgrooves on the mother substrate placed on the support table.
In one embodiment of the method, the support table edge and the cutting tool edge may have a planar shape corresponding to a non-rectangular outline of the display panel.
In a preferred embodiment of the method, the support table and the cutting tool may be prepared, the support table comprising a compression mold having one or more cavities shaped according to the contour of the display panel, and the cutting tool comprising one or more stampings having a peripheral shape fitting the cavities of the compression mold.
In another preferred embodiment of the method, the cutting tool and the support table are opposite each other such that the planar distance between the cutting edge of the cutting tool and the edge of the support table satisfies the following inequality (3):
G<3t…(3)
wherein G is the plane distance between the cutting edge of the shearing tool and the edge of the support table, and t is the thickness of the mother substrate.
In yet another preferred embodiment of the method, the cutting tool and the mother substrate are opposed to each other such that a planar distance between the cutting edge of the cutting tool and the micro grooves extending on the substrate surface facing the cutting tool satisfies the following inequality (4):
P<2t…(4)
wherein P is a planar distance between the cutting edge of the shear tool and the micro-grooves extending on the substrate surface facing the shear tool, and t is a thickness of the master substrate.
According to still another aspect of the present invention, there is provided a display panel cut out of a mother substrate by the above method.
The term "display panel" is understood to mean various panels belonging to the field of electronic display technology, including, for example, liquid crystal display panels, organic EL display panels, plasma display panels, field emission display panels, and the like.
Drawings
The invention will be better understood from the following detailed description of non-limiting embodiments thereof, taken together with the accompanying drawings, in which:
fig. 1 is a schematic view of a conventional technique (conventional scribe-and-break method) for cutting out at least one display panel from a mother substrate;
fig. 2 is a schematic plan view of a portion around a straight cutting line when a bending force is applied to a mother substrate according to a conventional scribe and break method;
fig. 3 is a schematic top view of a portion around a non-linear cutting line when a bending force is applied to a mother substrate according to a conventional scribe and break method;
FIG. 4 is a schematic diagram of a device and method for cutting at least one display panel from a mother substrate according to an embodiment of the present invention;
FIG. 5 is a schematic front view of at least one display panel cut from a mother substrate by an apparatus and method according to embodiments of the present invention;
FIG. 6 is a schematic side view of at least one display panel cut from a mother substrate by an apparatus and method according to embodiments of the present invention;
FIG. 7 is a top view of a mother substrate to be processed according to the apparatus and method provided by an embodiment of the present invention;
FIG. 8 is a perspective view of a support table of the apparatus provided by an embodiment of the present invention;
FIG. 9 is a top view of a support stage of the apparatus according to an embodiment of the present invention;
3 FIG. 3 10 3 is 3 a 3 cross 3- 3 sectional 3 view 3 of 3 the 3 support 3 table 3 of 3 the 3 apparatus 3 of 3 the 3 present 3 invention 3 taken 3 along 3 line 3 A 3- 3 A 3 of 3 FIG. 3 9 3; 3
FIG. 11 is a cross-sectional view of the support table of the apparatus of the present invention taken along line B-B of FIG. 9;
FIG. 12 is a perspective view of a shear tool of the apparatus provided by an embodiment of the present invention;
FIG. 13 is a top view of a shear tool of the apparatus provided in accordance with an embodiment of the present invention;
FIG. 14 is a cross-sectional view of the shear tool of the apparatus provided in accordance with an embodiment of the present invention, taken along line C-C of FIG. 13;
FIG. 15 is an elevation view of a shear tool of the apparatus provided by an embodiment of the present invention;
FIG. 16 is a perspective view of a stamping of the shear tool of the apparatus provided by an embodiment of the present invention;
fig. 17 and 18 are schematic views showing the starting state of the fracture process provided by the embodiment of the present invention;
FIGS. 19 and 20 are schematic views showing intermediate states of the fracturing process provided by an embodiment of the present invention;
fig. 21 and 22 are schematic views showing an end state of a fracture process provided by an embodiment of the present invention;
FIG. 23 is a partial top view of a workpiece processed by a conventional method for cutting an irregular display panel having a non-rectangular outline;
FIG. 24 is a partial top view of a workpiece processed by an apparatus and method provided by embodiments of the invention for cutting irregular display panels having non-rectangular contours.
Detailed Description
According to the embodiment shown in fig. 4, at least one individual display panel 10 may be cut out of a large-sized mother substrate 100 called a "liquid crystal cell" by a micro-groove shear-break method different from the conventional scribing-break method. In this embodiment, the mother substrate 100 is cut along a cutting line and broken by the device 1 capable of punching the single display panel 10, wherein the mother substrate 100 has at least one cutting line corresponding to the contour of the display panel 10.
The mother substrate 100 includes two glass plates 101 and 102 and a sealing member 103 interposed between the glass plates 101 and 102, and has two opposite surfaces 100a and 100 b. Any kind of welding wires and/or metal wires (not shown in the figures) may be arranged on the glass plates 101 and 102. The sealing member 103 is disposed along the outer edge of the display panel 10 to be cut. For example, the thickness (t) of the mother substrate 100 and the display panel 10 to be cut out from the mother substrate 100 may be less than 1.4 mm, and the glass plates 101 and 102 may be made of non-alkali glass.
The mother substrate 100 has a pair of micro grooves 104 and 105 as scribe lines, which constitute one or more display panel sections 110 on the mother substrate 100. The pair of micro grooves 104 and 105 are formed on two opposite surfaces 100a and 100b of the mother substrate 100, respectively. In an exemplary embodiment, each micro groove 104 and 105 may be a cutting line drawn on the substrate surfaces 100a and 100b by any one of a scribing knife or a laser scriber, and the cross section thereof has a V-shape (as shown in fig. 4) or a U-shape. The pairs of micro grooves 104 and 105 are disposed opposite to each other and symmetrical to each other. The micro grooves 104 and 105 each extend along the outline of the display panel 10 to be cut. That is, the micro grooves 104 and 105 are aligned with the outline of the display panel 10. The micro grooves 104 and 105 are not limited to any specific micro grooves such as a cutting line, and should be capable of generating an intermediate crack on the mother substrate 100 and continuously breaking to break the mother substrate 100 along a target cutting line.
The apparatus 1 for cutting one or more display panels 10 out of the above mother substrate 100 includes a support stage 2 having a cutting edge 20, a cutting tool 3 having a cutting edge 30, and a jig 4 for fixing the mother substrate 100 during cutting.
The support stage 2 is a fixture used in a process of cutting the mother substrate 100, on which the mother substrate 100 is placed. The support stage 2 is configured to support the edge portion 111 around the display panel portion 110 on the mother substrate 100, but not to support the display panel portion 110 on the mother substrate 100. Specifically, the supporting surface 21 of the supporting stage 2 is used to place the edge portion 111 of the mother substrate 100. The edge 20 of the support table 2 corresponds to the contour of the display panel 10 to be cut out, so that the micro-grooves 104 extending on the substrate surface 100a facing the support table 2 can be close to or close to the edge 20 of the support table 2 and aligned with the edge 20.
The jig 4 is a fixing device for preventing the mother substrate 100 from moving during the cutting process. The jig 4 is disposed on the substrate surface 100b, the substrate surface 100b being opposite to the substrate surface 100a, the substrate surface 100a facing the support table 2. Specifically, the jig 4 is located at the edge portion 111 of the mother substrate 100.
The cutting tool 3 is a moving device used in cutting the mother substrate 100, wherein the cutting tool 3 can be moved closer to or away from the support stage 2 when the mother substrate 100 is placed between the support stage 2 and the cutting tool 3. The device 1 may comprise any means (not shown in the figures) for moving the cutting tool 3. Such moving means is not limited to any particular mechanism. The cutting tool 3 is disposed above the display panel section 110 of the mother substrate 100. The cutting edge 30 of the cutting tool 3 corresponds to the contour of the display panel 10 to be cut out, so that the micro grooves 105 extending on the substrate surface 100b facing the cutting tool 3 may be close to or close to the cutting edge 30 of the cutting tool 3 and aligned with the cutting edge 30. And, the cutting edge 30 of the cutting tool 3 forms a suitable cutting angle (θ) with the substrate surface 100b facing the cutting tool 3.
While moving the cutting tool 3 close to the support stage 2 and applying a pushing force to the display panel part 110 of the mother substrate 100(F) Shear stress (S) generated on the micro grooves 104 and 105 of the mother substrate 100Shearing) Sufficient to make a cut between the opposing microgrooves 104 and 105. The shear stress (S)Shearing) A pair of oppositely directed intermediate fractures (C1 and C2) may be created simultaneously between the pair of micro grooves 104 and 105. The intermediate crack (C1) may originate from the bottom of the micro groove 104 extending on the substrate surface 100a towards the support table 2 and propagate towards the micro groove 105 extending on the substrate surface 100b towards the shear tool 3. At the same time, another of the intermediate cracks (C2) may originate from the bottom of the micro grooves 105 extending on the substrate surface 100b towards the shear tool 3 and propagate towards the micro grooves 104 extending on the substrate surface 100a towards the support table 2. That is, the pair of intermediate cracks (C1 and C2) may be close to each other in the thickness direction of the mother substrate 100. When the pair of intermediate cracks (C1 and C2) meet, the propagation is stopped, eventually resulting in the mother substrate 100 being completely cut in the thickness direction and then continuing to be cut along the micro grooves 104 and 105.
The following are key factors of the shear fracture process of the mother substrate 100, as shown in fig. 5 and 6.
-the depth (d) and width (w) of said micro-grooves 104 and 105;
-the tool gap (G), i.e. the planar distance between the edge 20 of the support table 2 and the cutting edge 30 of the cutting tool 3;
the tool position (P), i.e. the planar distance between the cutting edge 30 of the cutting tool 3 and the microgrooves 105 extending on the substrate surface 100b facing the cutting tool 3;
the shearing angle (θ) of the shearing tool 3, i.e. the angle formed between the cutting edge 30 of the shearing tool 3 and the substrate surface 100b facing the shearing tool 3; and
a sequential cutting from a cutting start point to a cutting end point of the mother substrate 100.
The above key factors can be optimized by the following parameters:
-the material of the glass plates 101 and 102 and the thickness (t) of the mother substrate 100;
shape design of the display panel 10 outline; and
the position of the display panel part 110 on the mother substrate 100 and the edge part 111 (preferably, as many of the display panels 10 as possible are cut out of the mother substrate 100).
Referring to fig. 5 and 6, the tool position (P) and/or tool gap (G) is small enough to generate shear stress to cut between the opposing microgrooves 104 and 105. Moreover, the occurrence and propagation of the intermediate cracks (C1 and C2) depend on the tensile stress and the compressive stress (S)Stretching，SCompression) The balance between them and the thickness (t) and material of the mother substrate 100. Said tensile stress (S)Stretching) Is dependent on the thickness (t), the tool gap (G) and the thrust force (F). The compressive stress (S)Compression) Is dependent on the shear angle (theta), the tool position (P) and the thrust force (F).
The tool gap (G), i.e. the planar distance between the cutting edge 30 of the cutting tool 3 and the edge 20 of the support table 2, preferably satisfies the following inequality (1):
G<3t…(1)
where G is a planar distance between the cutting edge 30 of the cutting tool 3 and the edge 20 of the support stage 2, and t is a thickness of the mother substrate 100.
The tool position (P), i.e., the planar distance between the cutting edge 30 of the cutting tool 3 and the microgrooves 105 extending toward the substrate surface 100b of the cutting tool 3, satisfies the following inequality (2):
P<2t…(2)
where P is a planar distance between the cutting edge 30 of the cutting tool 3 and the micro groove 105 extending on the substrate surface 100b facing the cutting tool 3, and t is a thickness of the mother substrate 100.
Fig. 7 is a specific example of the mother substrate 100 from which a plurality of irregular display panels 10 having a non-rectangular profile may be cut. The mother substrate 100 is provided with a plurality of micro grooves 104(105) and a plurality of display panel sections 110. The micro grooves 104(105) are arranged in such a manner that as many display panels 10 as possible are cut out of the mother substrate 100. Specifically, the plurality of micro grooves 104(105) are arranged in a matrix. The single microgroove 104(105) has a non-rectangular shape corresponding to the non-rectangular outline of the irregular display panel 10. The single microgroove 104(105) includes a combination of straight lines 106 and non-straight lines 107 and 108. The non-straight lines include a rounded line 107 and a curved cut line 108.
As a specific example of the apparatus for cutting the irregular display panel 10 from the mother substrate 100 shown in fig. 7, the apparatus may include the supporting stage 2 shown in fig. 8 to 11 and the shearing tool 3 shown in fig. 12 to 15.
Referring to fig. 8 to 11, the support table 2 comprises a die member having a plurality of cavities 22, which may be made of a hard material such as steel. The support stage 2 has a support surface 21 surrounding the cavity 22, and supports the mother substrate 100 placed thereon. The plurality of cavities 22 are arranged in a matrix in correspondence with the micro grooves 104(105) extending on the mother substrate 100. The single cavity 22 is shaped according to the outline of the display panel 10, and the edge 20 of the single cavity 22 has a planar shape corresponding to the non-rectangular outline of the display panel 10 shown in fig. 7.
Referring to fig. 12 to 15, the shearing tool 3 includes a base 31 and a plurality of stampings 32, which may be made of a hard material such as steel, supported on the base 31. The plurality of stampings 32 are arranged in a matrix corresponding to the micro-grooves 104(105) extending on the mother substrate 100 shown in fig. 7 or the cavities 22 on the submount 2 shown in fig. 8 to 11. The single stamping 32 is a piece protruding from the base 31 and having an outer peripheral shape that fits into the cavity 22 of the support platform 2 shown in figures 8 to 11. Specifically, the edge 30 defining the protruding end of the stamping 32 has a planar shape corresponding to the non-rectangular outline of the display panel 10 shown in fig. 7. The periphery of the single stamping 32 is slightly smaller than the periphery of the corresponding cavity 22 on the support table 2 shown in figures 8 to 11.
Fig. 16 is a perspective view of the single stamping 32. As shown in fig. 16, the edge 30 of the stamping 32 rises and falls in the height direction of the stamping 32, so that when the substrate 100 is sheared using the shearing tool 3, the edge 30 forms a suitable shearing angle (θ) with the substrate surface 100b facing the shearing tool 3, as shown in fig. 6. Specifically, the edge 30 rises at the corner portions of the planar shape to form protruding portions 30a, and falls at portions between the corners to form recessed portions 30 b.
One specific method example of cutting the irregular display panel 10 from the mother substrate 100 shown in fig. 7 includes the steps of:
-grooving both opposite substrate surfaces 100a and 100b of the mother substrate 100, forming microgrooves 104 and 105 opposite to each other;
-preparing said support table 2;
-placing and positioning the mother substrate 100 on the support table 2;
-preparing the above-mentioned shearing tool 3; and
-moving the cutting tool close to the support table.
In the step of forming the micro grooves 104 and 105 by slotting, the single micro grooves 104 and 105 each extend along the outline of the display panel 10 to be cut. The micro grooves 104 and 105 may be formed by a conventional grooving method. Of course, the manner of forming the micro grooves 104 and 105 on the substrate surfaces 100a and 100b is not limited to any particular manner, and the micro grooves 104 and 105 may be implemented in any manner other than the illustrated manner of scribing with any scriber such as a scribing knife or a laser scriber.
In the step of placing and positioning the mother substrate 100 on the support stage 2, the mother substrate 100 is positioned according to the support stage 2 such that the single micro-groove 104 extending on the substrate surface 100a facing the support stage 2 is aligned with the edge 20 of the corresponding cavity 22 on the support stage 2. That is, the position of the mother substrate 100 is adjusted so that all the display panel sections 110 on the mother substrate 100 are aligned with the corresponding cavities 22 on the support stage 2, respectively. The mother substrate 100 placed on the support table 2 may be held by the clamper 4, and the mother substrate 100 may be prevented from moving.
In the step of preparing the shearing tool 3, the shearing tool 3 and the mother substrate 100 are opposed to each other so that the single micro groove 105 extending on the substrate surface 100b facing the shearing tool 3 is aligned with the edge 30 of the corresponding stamping 32 on the shearing tool 3. That is, the cutting tool 3 is adjusted so that all the display panel sections 110 on the mother substrate 100 are aligned with the corresponding stamping parts 32 on the cutting tool 3, respectively.
In the step of moving the shearing tool 3, a sufficient shearing stress is generated between the opposing micro grooves 104 and 105 on the mother substrate 100 placed on the support stage 2 due to the thrust generated by moving the shearing tool 3.
In more detail, as shown in fig. 17 and 18, the cutting tool 3 generates a pushing force applied to the display panel section 110 of the mother substrate 100 during the movement toward the support stage 2, and presses the display panel section 110 toward the corresponding cavity 22 on the support stage 2. By pressing on the display panel section 110, a shear stress is generated between the opposing micro grooves 104 and 105 on the mother substrate 100. At this time, the protruding portion 30a of the edge 30 of the cutting tool 3 shown in fig. 16 is in contact with the corner of the display panel portion 110. Therefore, the above shear stress starts to shear from the corner of the display panel section 110.
Then, as shown in fig. 19 and 20, during further movement of the shearing tool 3 toward the support stage 2, a shearing force is further generated between the opposing microgrooves 104 and 105. Further shear forces continue to advance the shearing process. Specifically, the cutting proceeds along the microgrooves 104 and 105 toward the middle portion between the corners of the display panel section 110.
As shown in fig. 21 and 22, when the cutting tool 3 moves upward to a position where the middle point of the concave portion 30b on the cutting edge 30 of the cutting tool 3 meets the middle portion between the corners of the display panel section 110, cutting is performed along the entire display panel section 110, and the display panel 10 is cut out from the mother substrate 100.
According to the above-described apparatus 1 and/or the above-described method, it is possible to cut out irregular display panels 10 having non-rectangular contours without causing unacceptable damage to the components of the display panels 10. Moreover, not only the display panel 10 as shown in the figures, but also display panels of various shapes having arbitrary profiles can be cut out by the above apparatus 1 and/or the above method.
The laser light generated by conventional laser cutting methods can cause unacceptable damage to the components of the display panel 10. One or more components of the display panel may have a greater laser absorption ratio (e.g., infrared, etc.) than the glass material to be cut and be placed near or below the cut line. For example, the seal of polymeric material and/or the wire of metallic material may have a greater laser absorption ratio than the glass material to be cut and be placed in the vicinity of or below the cutting line. Such a structure is generally mainly applied to the design of flat panel displays. If the display panel is cut out of the mother substrate using a conventional laser cutting method, the laser may damage these components of the display panel.
Unlike the conventional laser cutting method, the display panel 10 may be cut according to the apparatus 1 and/or the method described above without unacceptable damage to the components of the display panel 10.
The conventional scribe-and-break method has difficulty in cutting the mother glass substrate 100' along a non-linear cutting line. In general, after cutting the rectangular display panel 10 'from the mother substrate 100' by scribing the straight cutting lines 104'(105') and breaking the lines, the rectangular cut piece 10 ″ needs to be subjected to a post-Grinding (GR) process, as shown in fig. 23. During the grinding process, the rectangular profile of the cutting member 10 ″ cut out from the mother substrate 100' may be ground into a curved profile, a chamfered profile, a notched profile and/or a hole by a Grinder (GR). However, this process lengthens the tact time and causes a reduction in productivity since the grinding process of the individual display panels 10' requires precise process control.
Unlike the conventional scribe and break method, the irregular display panel 10 having a non-rectangular profile may be cut according to the above apparatus 1 and/or the above method without grinding, as shown in fig. 24, thereby improving productivity/efficiency of the irregular display panel. However, after cutting by the device 1 and/or method provided by the present invention, grinding may be performed for any purpose.
The above embodiment describes the process of cutting the irregular display panel 10 having a non-rectangular outline, wherein the shape of the display panel outline may be changed accordingly. The display panel with any shape can be cut by the device and the method provided by the invention.
The above embodiments describe the process of cutting a plurality of display panels 10 from the mother substrate 100, wherein the number of display panels cut from the mother substrate may be changed accordingly. According to the present invention, only one display panel may be cut out of the mother substrate.
The starting point of the cropping is preferably the portion of the outline of the display panel 10 where the most critical shape is located, for example, the starting point of the cropping may be set on a curved segment of the outline of the display panel 10, although the starting point of the cropping is not limited to any particular position.
Although the preferred embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims.
Claims (11)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2017/108407 WO2019084727A1 (en) | 2017-10-30 | 2017-10-30 | Apparatus and method for cutting out display panel(s) from mother substrate |
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| CN111183514A true CN111183514A (en) | 2020-05-19 |
| CN111183514B CN111183514B (en) | 2022-12-27 |
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| WO (1) | WO2019084727A1 (en) |
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| CN112130354A (en) * | 2020-09-16 | 2020-12-25 | 江西合力泰科技有限公司 | 3D glasses product processing technology |
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| CN113103071B (en) * | 2021-03-22 | 2022-05-27 | 深圳市华星光电半导体显示技术有限公司 | Display panel and edging method thereof |
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| WO2019084727A1 (en) | 2019-05-09 |
| CN111183514B (en) | 2022-12-27 |
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