WO2015182298A1

WO2015182298A1 - Method for splitting brittle substrate

Info

Publication number: WO2015182298A1
Application number: PCT/JP2015/062223
Authority: WO
Inventors: 曽山　浩
Original assignee: 三星ダイヤモンド工業株式会社
Priority date: 2014-05-30
Filing date: 2015-04-22
Publication date: 2015-12-03
Also published as: JPWO2015182298A1; KR20160147982A; CN106715347A; CN106715347B; JP6288260B2; TW201601889A; TWI647080B; KR101856558B1

Abstract

A cutting edge (51) is slid across the surface (SF1) of a brittle substrate (4) so as to cause plastic deformation and form a trench line (TL) in the form of a groove. The brittle substrate (4) is connected in a continuous fashion directly underneath the trench line (TL). A member (11) is then placed on the aforementioned surface (SF1). Said member (11) has sections that are separated by the trench line (TL). Next, a crack is made to extend in the thickness direction (DT) through the brittle substrate (4) along the trench line (TL), forming a crack line (CL). The continuous connection in the brittle substrate (4) directly underneath the trench line (TL) in a direction that intersects the trench line (TL) is broken by the crack line (CL), and the brittle substrate (4) is split along the crack line (CL).

Description

Method for dividing brittle substrate

The present invention relates to a method for dividing a brittle substrate.

In the manufacture of electrical devices such as flat display panels or solar cell panels, it is often necessary to break a brittle substrate such as a glass substrate. First, a scribe line is formed on the substrate, and then the substrate is divided along the scribe line. For example, Japanese Patent Laid-Open No. 9-188534 discloses a method of forming a scribe line with a glass cutter wheel. When the glass cutter rolls on the substrate, a trench due to plastic deformation is formed on the substrate, and at the same time, a vertical crack is formed immediately below the trench. Thereafter, stress is applied, which is called a break process. The substrate is divided by causing the cracks to advance completely in the thickness direction by the break process.

The process of dividing the substrate is often performed immediately after the process of forming a scribe line on the substrate. However, it has also been proposed to perform a process of providing any member on the substrate between the process of forming the scribe line and the break process.

For example, according to the technique of International Publication No. 2002/104078, in the method of manufacturing an organic EL display, a scribe line is formed on a glass substrate for each region to be an organic EL display before mounting a sealing cap. For this reason, the contact between the sealing cap and the glass cutter, which becomes a problem when the scribe line is formed on the glass substrate after the sealing cap is provided, can be avoided.

JP-A-9-188534 International Publication No. 2002/104078

According to the above conventional technique, the step of providing the sealing cap (member) on the glass substrate (brittle substrate) is performed after the scribe line is formed. Therefore, if this technique is used, a brittle board | substrate can be parted on the boundary of the narrow area | region between members. On the other hand, since vertical cracks already exist during the process of providing a sealing cap on a brittle substrate, further extension in the thickness direction of the vertical cracks tends to occur unintentionally. Therefore, the brittle substrate that should be integrated during this process may be unintentionally divided.

The present invention has been made in order to solve the above-described problems, and its purpose is to prevent the brittle substrate from being unintentionally divided during the process of providing the member on the brittle substrate. It is an object of the present invention to provide a method for dividing a brittle substrate, which can divide the brittle substrate with a narrow region as a boundary.

The brittle substrate cutting method of the present invention includes a step of preparing a brittle substrate having a surface and a thickness direction perpendicular to the surface, a step of pressing a blade edge against the surface of the brittle substrate, and the pressing step. Forming a trench line having a groove shape by causing plastic deformation on the surface of the brittle substrate by sliding the pressed blade edge on the surface of the brittle substrate. The step of forming the trench line is performed so as to obtain a crackless state in which the brittle substrate is continuously connected immediately below the trench line in a direction intersecting the trench line. The brittle substrate cutting method of the present invention further includes a step of providing a member on the surface after the step of forming the trench line. The member has portions separated from each other via the trench line on the surface. The method for dividing a brittle substrate of the present invention further includes a step of forming a crack line by extending a crack of the brittle substrate in the thickness direction along the trench line after the step of disposing the member. . The brittle substrate is disconnected continuously in the direction intersecting the trench line immediately below the trench line by the crack line. The method for dividing a brittle substrate of the present invention further includes a step of dividing the brittle substrate along the crack line.

The above-mentioned “pressing the blade edge against the surface” means pressing the blade edge at an arbitrary position on the “surface”, and thus it can also mean pressing the blade edge against the edge of the “surface”.

According to the present invention, a trench line having no crack is formed immediately below the line that defines the position where the brittle substrate is divided. The crack line to be used as a direct trigger for the division is formed by extending the crack along the trench line in a self-aligning manner. Therefore, the brittle substrate after the formation of the trench line and before the formation of the crack line is in a stable state in which the position to be divided is defined by the trench line, but the crack line has not yet been formed and the division is not easily caused. Since the step of providing the member on the brittle substrate is performed in this stable state, it is possible to prevent the brittle substrate from being unintentionally divided during this step. Further, since this step is performed after the trench line is formed, the movement of the blade edge for forming the trench line is not hindered by the member. Thereby, arrangement | positioning of a trench line and arrangement | positioning of a member can be freely defined mutually. Therefore, it is possible to obtain a structure in which the trench line passes through a narrow region between the members. Thereafter, by forming a crack line using the trench line and dividing the brittle substrate along the trench line, the brittle substrate can be divided with a narrow region between the members as a boundary. As described above, the brittle substrate can be divided at a narrow region between the members as a boundary while avoiding the brittle substrate being unintentionally divided during the step of providing the member on the brittle substrate.

FIG. 2 is a top view schematically showing a method for cutting a brittle substrate in Embodiment 1 of the present invention ((A) to (E)). 1A is a schematic end view along line IIA-IIA in FIG. 1A, a schematic end view along line IIB-IIB in FIG. 1B is taken along line IIC-IIC in FIG. FIG. 2 is a schematic end view (C), a schematic end view (D) along line IID-IID in FIG. 1 (D), and a schematic end view (E) along line IIE-IIE in FIG. 1 (E). It is the end view (A) which shows roughly the structure of the trench line formed in the cutting method of the brittle board | substrate in Embodiment 1 of this invention, and the end view (B) which shows the structure of a crack line roughly. It is a flowchart which shows schematically the structure of the brittle board | substrate parting method in Embodiment 1 of this invention. FIG. 5A is a side view schematically showing the configuration of the instrument used in the brittle substrate cutting method according to Embodiment 2 of the present invention, and the configuration of the blade edge of the instrument is the viewpoint of arrow VB in FIG. It is a top view (B) shown roughly by. It is a top view which shows roughly the cutting method of the brittle board | substrate in Embodiment 2 of this invention ((A) and (B)). It is a top view which shows roughly the cutting method of the brittle board | substrate of the 1st modification of Embodiment 2 of this invention ((A) and (B)). It is a top view which shows roughly the division | segmentation method of the brittle board | substrate of the 2nd modification of Embodiment 2 of this invention. It is a top view which shows roughly the division | segmentation method of the brittle board | substrate of the 3rd modification of Embodiment 2 of this invention. It is a top view which shows roughly the 1st process of the cutting method of the brittle board | substrate in Embodiment 3 of this invention. It is a top view which shows roughly the 2nd process of the cutting method of a brittle board | substrate in Embodiment 3 of this invention. It is a top view which shows roughly the 3rd process of the cutting method of a brittle board | substrate in Embodiment 3 of this invention. It is a top view which shows roughly the cutting method of the brittle board | substrate of the 1st modification of Embodiment 3 of this invention ((A) and (B)). It is a top view which shows roughly the division | segmentation method of the brittle board | substrate of the 2nd modification of Embodiment 3 of this invention. It is a top view which shows roughly the cutting method of the brittle board | substrate in Embodiment 4 of this invention ((A) and (B)). It is a top view which shows roughly the cutting method of the brittle board | substrate in Embodiment 5 of this invention ((A) and (B)). It is a top view which shows roughly the cutting method of the brittle board | substrate of the modification of Embodiment 5 of this invention. A side view (A) schematically showing the configuration of the instrument used in the method for cutting a brittle substrate in Embodiment 6 of the present invention, and the configuration of the blade edge of the instrument shown in FIG. 18 (A) as viewed from arrow XVIIIB It is a top view (B) shown roughly by.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following drawings, the same or corresponding parts are denoted by the same reference numerals, and description thereof will not be repeated.

(Embodiment 1)
A method for dividing a brittle substrate according to this embodiment will be described below.

1A and 2A, first, a glass substrate 4 (brittle substrate) is prepared (FIG. 4: step S10). The glass substrate 4 has an upper surface SF1 (front surface) and an opposite lower surface SF2. The glass substrate 4 has a thickness direction DT perpendicular to the upper surface SF1. A cutting instrument 50 having a cutting edge 51 and a shank 52 is prepared. The blade edge 51 is held by being fixed to a shank 52 as its holder. A more detailed structure of the cutting tool will be described in the second and sixth embodiments.

Next, the blade edge 51 is pressed against the upper surface SF1 of the glass substrate 4 (FIG. 4: step S20). Next, the pressed blade edge 51 is slid on the upper surface SF1 of the glass substrate 4 (see the arrow in FIG. 1A).

1 (B) and 2 (B), plastic deformation is generated on the upper surface SF1 of the glass substrate 4 by the sliding of the blade edge 51. As a result, a trench line TL having a groove shape is formed on the upper surface SF1 (FIG. 4: Step S30). Referring to FIG. 3A, the step of forming trench line TL is a direction in which glass substrate 4 intersects the extending direction of trench line TL (lateral direction in FIG. 1B) immediately below trench line TL. This is performed so as to obtain a crackless state in which DC are continuously connected. In the crackless state, the trench line TL is formed by plastic deformation, but no crack is formed along the trench line TL. Therefore, even if an external force that simply generates a bending moment or the like is applied to the glass substrate 4 as in the conventional break process, the division along the trench line TL does not easily occur. For this reason, in the crackless state, the dividing step along the trench line TL is not performed. In order to obtain a crackless state, the load applied to the blade edge 51 is so small that cracks do not occur and is large enough to cause plastic deformation.

The crackless state is maintained for a necessary time (FIG. 4: Step S40). In order to maintain the crackless state, an operation in which excessive stress is applied to the glass substrate 4 in the trench line TL, for example, heating with application of a large external stress that causes damage to the substrate or a large temperature change, Should be avoided. While the crackless state is maintained, the glass substrate 4 can be transported to a place where the next step is performed. Further, the glass substrate 4 can be stored until the next step while the crackless state is maintained.

Referring to FIGS. 1C and 2C, after forming trench line TL, laminated material 11 (member) is provided on upper surface SF1 while maintaining a crackless state. The step of providing the laminated material 11 can be performed, for example, by joining members prepared in advance or by depositing raw materials.

The laminated material 11 has

portions

11a and 11b separated from each other via the trench line TL on the upper surface SF1. In other words, the

portions

11a and 11b sandwich the trench line TL on the upper surface SF1. The

portions

11a and 11b may be disposed on the upper surface SF1 of the glass substrate 4 with a gap W via the trench line TL. The interval W may be so small that the operation of sliding the blade edge 51 so as to pass between the

portions

11a and 11b on the surface SF1 is impossible. This is because according to the present embodiment, such an operation is unnecessary. The cause that the above operation of the blade edge 51 becomes impossible is a collision between the member 11 and the blade edge 51 or the shank 52. The interval W can be set to 100 μm or less, for example. Each of the

portions

11a and 11b may be in close proximity to the trench line TL.

The laminated material 11 is preferably provided so that the trench line TL protrudes from between the

portions

11a and 11b on the upper surface SF1. In FIG. 1C, each of the right end portion and the left end portion of the trench line TL protrudes from the region between the

portions

11a and 11b. Only one end of the trench line TL may protrude.

Note that the laminated material 12 may also be provided on the lower surface SF2. The laminate 12 may have

portions

12a and 12b separated from each other.

Further, referring to FIGS. 1D and 2D, after the laminated material 11 is provided, the crack of the glass substrate 4 in the thickness direction DT is extended along the trench line TL. Thereby, the crack line CL is formed in a self-aligned manner with respect to the trench line TL (FIG. 4: Step S50). Referring to FIG. 3B, the glass substrate 4 is continuous in the direction DC intersecting the extending direction of the trench line TL (lateral direction in FIG. 1B) immediately below the trench line TL by the crack line CL. The connection is broken. Here, “continuous connection” means a connection that is not interrupted by a crack. In addition, in the state where the continuous connection is cut as described above, the portions of the glass substrate 4 may be in contact with each other through the cracks of the crack line CL.

Formation of the crack line CL is started, for example, by applying a stress to the glass substrate 4 at the end of the trench line TL so as to release the distortion of the internal stress in the vicinity of the trench line TL. In the example of FIG. 1C, stress is applied to the glass substrate 4 at the right end or the left end of the trench line TL. As shown in FIG. 1C, when the trench line TL protrudes from between the

portions

11a and 11b, the

portions

11a and 11b are unlikely to become obstacles when stress is applied. Although details will be described later in the second and subsequent embodiments, there may be a more preferable one of the both end portions to which stress is applied. The stress can be applied, for example, by applying an external stress by pressing the blade edge again onto the formed trench line TL, or by heating with laser light irradiation.

Further referring to FIG. 1 (E) and FIG. 2 (E), next, glass substrate 4 is divided into

substrate pieces

4a and 4b along crack line CL (FIG. 4: step S60). That is, a so-called break process is performed. The break process can be performed, for example, by applying an external force FB (FIG. 2D) to the glass substrate 4. Thereby, the board | substrate piece 4a provided with the

parts

11a and 12a and the board | substrate piece 4b provided with the

parts

11b and 12b are obtained.

According to the present embodiment, a trench line TL having no cracks is formed immediately below the line that defines the position where the glass substrate 4 is divided. The crack line CL to be used as a direct trigger for the division is formed by extending the crack in a self-aligned manner along the trench line TL. Therefore, the glass substrate 4 after the formation of the trench line TL and before the formation of the crack line CL is not easily divided because the position to be divided is defined by the trench line TL but the crack line CL is not yet formed. It is in a stable state. Since the step of providing the laminated material 11 on the glass substrate 4 is performed in this stable state, it is possible to avoid the glass substrate 4 being unintentionally divided during this step.

Further, since this step is performed after the trench line TL is formed, the movement of the blade edge for forming the trench line TL is not hindered by the laminated material 11. Thereby, arrangement | positioning of the trench line TL and arrangement | positioning of the laminated material 11 can be freely defined mutually. Therefore, it is possible to obtain a structure in which the trench line TL passes through a narrow region between the laminated materials 11. Thereafter, the crack line CL is formed using the trench line TL, and the glass substrate 4 is divided along the crack line CL, thereby narrowing the region between the laminated materials 11 (the region between the

portions

11a and 11b in FIG. 1D). ) As a boundary, the glass substrate 4 can be divided.

As described above, the glass substrate 4 is divided at a narrow region between the laminated materials 11 while avoiding the glass substrate 4 being unintentionally divided during the step of providing the laminated material 11 on the glass substrate 4. be able to.

Further, according to the present embodiment, the width W between the

portions

11a and 11b of the laminated material 11 can be arbitrarily reduced. Thereby, the

parts

11a and 11b can be arranged more densely. Therefore, the glass substrate 4 can be used more efficiently.

Further, this embodiment is particularly advantageous when the laminated material 11 includes a portion made of a material having low heat resistance, for example, a synthetic resin. This is because in such a case, using a technique of scribing with a laser beam having a narrow width corresponding to a narrow gap between the laminated materials in place of the method of the present embodiment may adversely affect the laminated materials. This is because it is difficult to consider.

Note that the process of forming the crack line CL in the present embodiment is essentially different from a so-called break process. In the break process, the already formed cracks are further extended in the thickness direction to completely separate the substrate. On the other hand, the formation process of the crack line CL brings about a change from a crackless state obtained by forming the trench line TL to a state having cracks. This change is considered to be caused by the release of internal stress that the crackless state has. The state of plastic deformation at the time of forming the trench line TL and the state of the internal stress generated by the formation of the trench line TL, such as the direction and the direction of the rolling blade rolling, and the state of this embodiment Thus, it is considered that this is different from the case where sliding of the cutting edge is used, and when sliding of the cutting edge is used, cracks are likely to occur under wider scribe conditions. Moreover, some kind of trigger is necessary to release the internal stress, and it is considered that the occurrence of cracks on the trench line TL due to the application of external stress as described above acts as such a trigger. Details of a preferable method of forming the trench line TL and the crack line CL will be described in the following second to sixth embodiments.

(Embodiment 2)
First, the cutting edge used in the brittle substrate cutting method according to the present embodiment will be described below.

5A and 5B, the blade edge 51 is provided with a top surface SD1 (first surface) and a plurality of surfaces surrounding the top surface SD1. The plurality of surfaces include a side surface SD2 (second surface) and a side surface SD3 (third surface). The top surface SD1, the side surfaces SD2, and SD3 (first to third surfaces) face different directions and are adjacent to each other. The blade edge 51 has a vertex at which the top surface SD1, the side surfaces SD2 and SD3 merge, and the protrusion PP of the blade edge 51 is configured by this vertex. Further, the side surfaces SD2 and SD3 form ridge lines constituting the side portion PS of the blade edge 51. The side part PS extends linearly from the protrusion part PP. Moreover, since the side part PS is a ridgeline as mentioned above, it has the convex shape extended linearly.

The cutting edge 51 is preferably a diamond point. That is, the cutting edge 51 is preferably made of diamond from the viewpoint that the hardness and the surface roughness can be reduced. More preferably, the cutting edge 51 is made of single crystal diamond. More preferably, crystallographically, the top surface SD1 is a {001} plane, and each of the side surfaces SD2 and SD3 is a {111} plane. In this case, although the side surfaces SD2 and SD3 have different orientations, they are crystal surfaces that are equivalent to each other in terms of crystallography.

Diamond that is not a single crystal may be used. For example, polycrystalline diamond synthesized by a CVD (Chemical Vapor Deposition) method may be used. Alternatively, sintered diamond obtained by bonding polycrystalline diamond particles, which are sintered from fine graphite or non-graphitic carbon without containing a binder such as an iron group element, with a binder such as an iron group element is used. May be.

The shank 52 extends along the axial direction AX. The blade edge 51 is preferably attached to the shank 52 so that the normal direction of the top surface SD1 is approximately along the axial direction AX.

In order to form the trench line TL (FIG. 3 (A)) using the cutting tool 50, the protrusion PP and the side PS of the blade edge 51 on the upper surface SF1 of the glass substrate 4 have a thickness that the glass substrate 4 has. Pressed in the direction DT. Next, the blade edge 51 is slid on the upper surface SF1 substantially along the direction in which the side portion PS is projected onto the upper surface SF1. As a result, a groove-like trench line TL without a vertical crack is formed on the upper surface SF1. Although the trench line TL is generated by plastic deformation of the glass substrate 4, the glass substrate 4 may be slightly shaved at this time. However, since such scraping can generate fine fragments, it is preferable that the amount is as small as possible.

There are cases where the trench line TL and the crack line CL (FIG. 3B) are formed simultaneously by sliding of the blade edge 51, or only the trench line TL is formed. The crack line CL is a crack extending in the thickness direction DT from the recess of the trench line TL, and extends linearly on the upper surface SF1. According to the method described later, after only the trench line TL is formed, the crack line CL can be formed along the trench line TL.

Next, a method for dividing the glass substrate 4 will be described below.

Referring to FIG. 6A, glass substrate 4 is first prepared in step S10 (FIG. 4). The glass substrate 4 has a flat upper surface SF1. The edge surrounding the upper surface SF1 includes a side ED1 (first side) and a side ED2 (second side) that face each other. In the example shown in FIG. 6A, the edges are rectangular. Therefore, the sides ED1 and ED2 are sides parallel to each other. In the example shown in FIG. 6A, the sides ED1 and ED2 are rectangular short sides. The glass substrate 4 has a thickness direction DT (FIG. 5A) perpendicular to the upper surface SF1.

Next, in step S20 (FIG. 4), the blade edge 51 is pressed against the upper surface SF1 at the position N1. Details of the position N1 will be described later. With reference to FIG. 5A, the cutting edge 51 is pressed such that the projection PP of the cutting edge 51 is disposed between the side ED1 and the side portion PS on the upper surface SF1 of the glass substrate 4 and the cutting edge 51 is pressed. The side PS is arranged between the protrusion PP and the side ED2.

Next, in step S30 (FIG. 4), a plurality of trench lines TL (five lines in the figure) are formed on the upper surface SF1. The formation of the trench line TL is performed between the position N1 (first position) and the position N3. A position N2 (second position) is located between the positions N1 and N3. Therefore, trench line TL is formed between positions N1 and N2 and between positions N2 and N3.

The positions N1 and N3 may be located away from the edge of the upper surface SF1 of the glass substrate 4 as shown in FIG. 6A, or one or both of them may be located at the edge of the upper surface SF1. The formed trench line TL is separated from the edge of the glass substrate 4 in the former case, and is in contact with the edge of the glass substrate 4 in the latter case.

Among the positions N1 and N2, the position N1 is closer to the side ED1, and the position N2 is closer to the side ED2 among the positions N1 and N2. In the example shown in FIG. 6A, the position N1 is close to the side ED1 of the sides ED1 and ED2, and the position N2 is close to the side ED2 of the sides ED1 and ED2, but both the positions N1 and N2 are the side ED1 or It may be located near either one of ED2.

When the trench line TL is formed, in the present embodiment, the blade edge 51 is displaced from the position N1 to the position N2, and is further displaced from the position N2 to the position N3. That is, referring to FIG. 5A, the blade edge 51 is displaced in a direction DA that is a direction from the side ED1 toward the side ED2. The direction DA corresponds to the direction in which the axis AX extending from the blade edge 51 is projected onto the upper surface SF1. In this case, the blade edge 51 is dragged on the upper surface SF <b> 1 by the shank 52.

Referring to FIG. 6B, next, the crackless state (FIG. 3A) described in the first embodiment is maintained for a desired time. In the meantime, as step S40 (FIG. 4), the laminated material 11 is provided as in the first embodiment. The laminated material 11 is provided on the upper surface SF1 so that the trench line TL protrudes from between the portions of the laminated material 11 toward the side ED2.

Next, in step S50 (FIG. 4), the position of the glass substrate 4 in the thickness direction DT (FIG. 3B) from the position N2 to the position N1 along the trench line TL (see the broken line arrow in the figure). A crack line CL is formed by extending the crack. Formation of the crack line CL is started when the assist line AL and the trench line TL intersect each other at the position N2. For this purpose, the assist line AL is formed after the trench line TL is formed. The assist line AL is a normal scribe line with a crack in the thickness direction DT, and releases internal stress distortion in the vicinity of the trench line TL. The method of forming the assist line AL is not particularly limited, but may be formed using the edge of the upper surface SF1 as a base point as shown in FIG. 6B.

Note that the crack line CL is less likely to be formed in the direction from the position N2 to the position N3 than in the direction from the position N2 to the position N1. That is, the ease of extension of the crack line CL has a direction dependency. Therefore, the phenomenon that the crack line CL is formed between the positions N1 and N2 but not between the positions N2 and N3 may occur. The present embodiment is intended to divide the glass substrate 4 along the positions N1 and N2, and is not intended to separate the glass substrate 4 along the positions N2 and N3. Therefore, while it is necessary to form the crack line CL between the positions N1 and N2, the difficulty of forming the crack line CL between the positions N2 and N3 is not a problem.

Next, in step S60 (FIG. 4), the glass substrate 4 is divided along the crack line CL. Specifically, a break process is performed. Note that, when the crack line CL is completely advanced in the thickness direction DT at the time of formation, the formation of the crack line CL and the division of the glass substrate 4 may occur at the same time. In this case, the break process can be omitted.

Thus, the glass substrate 4 is divided.

Next, first to third modifications of the above dividing method will be described below.

Referring to FIG. 7A, the first modified example relates to a case where the intersection of the assist line AL and the trench line TL is insufficient as a trigger for starting the formation of the crack line CL (FIG. 6B). Is. With reference to FIG. 7B, the glass substrate 4 is separated along the assist line AL by applying an external force that generates a bending moment or the like to the glass substrate 4. Thereby, formation of the crack line CL is started.

7A, the assist line AL is formed on the upper surface SF1 of the glass substrate 4. However, the assist line AL for separating the glass substrate 4 may be formed on the lower surface SF2 of the glass substrate 4. Good. In this case, the assist line AL and the trench line TL intersect each other at the position N2 in the planar layout, but do not directly contact each other.

In the first modification, the internal stress distortion in the vicinity of the trench line TL is released by the separation of the glass substrate 4, thereby starting the formation of the crack line CL. Therefore, the assist line AL itself may be a crack line CL formed by applying stress to the trench line TL.

Referring to FIG. 8, in the second modification, the blade edge 51 is pressed against the upper surface SF1 of the glass substrate 4 at the position N3 in step S20 (FIG. 4). In step S30 (FIG. 4), when the trench line TL is formed, in the present modification, the blade edge 51 is displaced from the position N3 to the position N2, and is further displaced from the position N2 to the position N1. That is, referring to FIG. 5, the blade edge 51 is displaced in the direction DB that is the direction from the side ED2 toward the side ED1. The direction DB corresponds to a direction opposite to the direction in which the axis AX extending from the blade edge 51 is projected onto the upper surface SF1. In this case, the blade edge 51 is pushed forward on the upper surface SF 1 by the shank 52.

Referring to FIG. 9, in the third modification, when the trench line TL is formed in step S30 (FIG. 4), the blade edge 51 is positioned on the upper surface SF1 of the glass substrate 4 relative to the position N1. Pressed with greater force at N2. Specifically, the load on the blade edge 51 is increased when the position of the trench line TL reaches the position N4 with the position N4 as the position between the positions N1 and N2. In other words, the load on the trench line TL is increased between the positions N4 and N3, which are the end portions of the trench line TL, as compared with the position N1. Thereby, formation of the crack line CL from the position N2 can be easily induced while reducing a load at a portion other than the terminal portion.

According to the present embodiment, the crack line CL can be more reliably formed from the trench line TL.

Further, unlike the third embodiment described later, in the present embodiment, the assist line AL has not yet been formed at the time when the trench line TL is formed (FIG. 6A). Therefore, the crackless state can be maintained more stably without being affected by the assist line AL. If stability in the crackless state is not a problem, lamination is performed in the state of FIG. 7A where the assist line AL is formed instead of the state of FIG. 6A where the assist line AL is not formed. A material 11 may be provided.

(Embodiment 3)
A method for dividing a brittle substrate in the present embodiment will be described below with reference to FIGS.

Referring to FIG. 10, in the present embodiment, assist line AL is formed before formation of trench line TL. The method of forming the assist line AL is the same as that in FIG. 6B (Embodiment 2).

Referring to FIG. 11, next, the blade edge 51 is pressed against the upper surface SF1 in step S20 (FIG. 4), and the trench line TL is formed in step S30 (FIG. 4). The formation method itself of the trench line TL is the same as that in FIG. 6A (Embodiment 2). The assist line AL and the trench line TL intersect each other at the position N2. Next, step S40 (FIG. 4) is performed as in the second embodiment.

Referring to FIG. 12, next, as step S40 (FIG. 4), the laminated material 11 is provided as in the second embodiment. Next, the glass substrate 4 is separated along the assist line AL by a normal break process in which an external force that generates a bending moment or the like is applied to the glass substrate 4. Thereby, as step S50 (FIG. 5), formation of the crack line CL similar to that of the first embodiment is started (see the broken line arrow in the figure). In FIG. 10, the assist line AL is formed on the upper surface SF <b> 1 of the glass substrate 4, but the assist line AL for separating the glass substrate 4 may be formed on the lower surface SF <b> 2 of the glass substrate 4. In this case, the assist line AL and the trench line TL intersect each other at the position N2 in the planar layout, but do not directly contact each other.

The configuration other than the above is almost the same as the configuration of the second embodiment described above.

Referring to FIG. 13A, in the first modification, assist line AL is formed on lower surface SF2 of glass substrate 4. Then, as in FIG. 8 (Embodiment 2), trench line TL is formed from position N3 to position N1. Referring to FIG. 13B, after the laminated material 11 is provided, the glass substrate 4 is separated along the assist line AL by applying an external force that generates a bending moment or the like to the glass substrate 4. Thereby, formation of the crack line CL is started (see the broken line arrow in the figure).

Referring to FIG. 14, in the second modification, when the trench line TL is formed in step S30 (FIG. 4), the blade edge 51 is positioned on the upper surface SF1 of the glass substrate 4 relative to the position N1. Pressed with greater force at N2. Specifically, the load on the blade edge 51 is increased when the position of the trench line TL reaches the position N4 with the position N4 as the position between the positions N1 and N2. In other words, the load on the trench line TL is increased between the positions N4 and N3, which are the end portions of the trench line TL, as compared with the position N1. Thereby, formation of the crack line CL from the position N2 can be easily induced while reducing a load at a portion other than the terminal portion.

(Embodiment 4)
Referring to FIG. 15A, in the method for dividing a brittle substrate in the present embodiment, a trench line TL reaching from the position N1 to the side ED2 via the position N2 is formed in step S30 (FIG. 4). Is done.

Referring to FIG. 15B, next, as in Embodiment 2, the laminated material 11 is provided as step S40 (FIG. 4). Next, a stress is applied between the position N2 and the side ED2 so as to release the distortion of the internal stress near the trench line TL. This induces formation of a crack line along the trench line TL (FIG. 4: step S50).

Specifically, as the application of stress, the pressed blade edge 51 is slid between the position N2 and the side ED2 (the region between the broken line and the side ED2 in the drawing) on the upper surface SF1. This sliding is performed until the side ED2 is reached. The cutting edge 51 is preferably slid so as to intersect the track of the trench line TL formed first, and more preferably to overlap the track of the trench line TL formed first. The length of this second sliding is, for example, about 0.5 mm. This re-sliding may be performed on each of the plurality of trench lines TL (FIG. 15A) after they are formed, or the formation and re-sliding of one trench line TL may be performed. The process to be performed may be sequentially performed for each trench line TL.

As a modification, in order to apply a stress between the position N2 and the side ED2, a laser beam is irradiated between the position N2 and the side ED2 on the upper surface SF1 instead of the sliding of the cutting edge 51 described above. May be. Due to the thermal stress generated thereby, the distortion of the internal stress in the vicinity of the trench line TL is released, thereby inducing the start of formation of the crack line.

(Embodiment 5)
Referring to FIG. 16 (A), in the brittle substrate cutting method according to the present embodiment, in step S30 (FIG. 4), blade edge 51 is displaced from position N1 to position N2, and further to position N3. Thus, a trench line TL separated from the edge of the upper surface SF1 is formed. The method of forming the trench line TL itself is almost the same as that in FIG. 6A (Embodiment 2).

Referring to FIG. 16B, next, as in Embodiment 2, the laminated material 11 is provided as step S40 (FIG. 4). Next, stress application similar to that in FIG. 15B (Embodiment 4 or a modification thereof) is performed. This induces formation of a crack line along the trench line TL (FIG. 4: step S50).

Referring to FIG. 17, as a modification of the process of FIG. 16A, the blade edge 51 may be displaced from the position N3 to the position N2 and from the position N2 to the position N1 in the formation of the trench line TL.

(Embodiment 6)
Referring to FIGS. 18A and 18B, in each of the embodiments described above, blade edge 51v may be used instead of blade edge 51 (FIGS. 5A and 5B). The blade edge 51v has a conical shape having a vertex and a conical surface SC. The protruding part PPv of the blade edge 51v is constituted by a vertex. The side part PSv of the blade edge is configured along a virtual line (broken line in FIG. 18B) extending from the apex to the conical surface SC. Thereby, the side part PSv has a convex shape extending linearly.

In the above-described embodiments, the first and second sides of the edge of the glass substrate are rectangular short sides, but the first and second sides may be rectangular long sides. The shape of the edge is not limited to a rectangle, and may be a square, for example. Further, the first and second sides are not limited to being linear, and may be curved. In each of the above embodiments, the surface of the glass substrate is flat, but the surface of the glass substrate may be curved.

Although a glass substrate is used as the brittle substrate particularly suitable for the above-described cutting method, the brittle substrate is not limited to the glass substrate. In addition to glass, the brittle substrate can be made of, for example, ceramics, silicon, compound semiconductors, sapphire, or quartz.

In the present invention, it is possible to freely combine the respective embodiments within the scope of the invention, and to appropriately modify and omit the respective embodiments.

4 Glass substrate (brittle substrate)
11 Laminate (member)
50

Cutting tool

51, 51v Cutting edge 52 Shank AL Assist line CL Crack line ED1 side (first side)
ED2 side (second side)
N1 position (first position)
N2 position (second position)
SF1 Upper surface (surface)
SF2 Lower surface TL Trench line PP, PPv Protrusion PS, PSv Side

Claims

Providing a brittle substrate having a surface and having a thickness direction perpendicular to the surface;
Pressing the blade edge against the surface of the brittle substrate;
Forming a trench line having a groove shape by causing plastic deformation on the surface of the brittle substrate by sliding the blade edge pressed by the pressing step on the surface of the brittle substrate; The step of forming the trench line is performed so as to obtain a crackless state in which the brittle substrate is continuously connected in a direction intersecting the trench line immediately below the trench line, Further, after the step of forming the trench line, a step of providing a member on the surface is provided, and the member has portions separated from each other via the trench line on the surface, and further arranges the member After the process, the brittle substrate is cracked in the thickness direction along the trench line. A step of forming a crack line by extending the fragile substrate, and the brittle substrate is disconnected from the crack line immediately below the trench line in a direction intersecting the trench line. A method for dividing a brittle substrate, comprising a step of dividing the brittle substrate along a line.
2. The method for dividing a brittle substrate according to claim 1, wherein the step of providing the member is performed such that the trench line protrudes between the portions separated from each other on the surface.
3. The method for dividing a brittle substrate according to claim 1, wherein, in the step of providing the member, the portions are arranged on the surface of the brittle substrate at intervals of 100 μm or less via the trench lines.
The method for cutting a brittle substrate according to any one of claims 1 to 3, wherein in the step of preparing the brittle substrate, the brittle substrate is made of glass.
In the step of preparing the brittle substrate, the surface is surrounded by edges including first and second sides facing each other,
In the step of pressing the blade edge, the blade edge has a protrusion and a side portion extending from the protrusion and having a convex shape, and the step of pressing the blade edge includes the step of pressing the blade edge on the surface of the brittle substrate. A side portion is disposed between the protrusion and the second side;
In the step of forming the trench line, the trench line is formed between a first position and a second position closer to the second side than the first position;
The step of forming the crack line is performed by extending a crack of the brittle substrate in the thickness direction from the second position toward the first position along the trench line.
The method for dividing a brittle substrate according to any one of claims 1 to 4.