CN110996539A - Method for improving chemical plating layer overflow plating and adhesive force performance in LDS process - Google Patents
Method for improving chemical plating layer overflow plating and adhesive force performance in LDS process Download PDFInfo
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- CN110996539A CN110996539A CN201911421564.1A CN201911421564A CN110996539A CN 110996539 A CN110996539 A CN 110996539A CN 201911421564 A CN201911421564 A CN 201911421564A CN 110996539 A CN110996539 A CN 110996539A
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- laser
- lds
- conductive areas
- plating layer
- chemical plating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention provides a method for improving the overflow plating and adhesive force performance of a chemical plating layer in an LDS process, which comprises the following steps: performing laser activation on the substrate by using an LDS technology to activate a plurality of first conductive areas; scanning the boundaries of the first conductive areas by using laser beams to obtain second conductive areas, wherein the energy of the laser beams adopted in the second laser processing is lower than that of the laser beams adopted in the first laser processing; and metalizing the second conductive areas to form circuits, wherein the distance between every two adjacent circuits is 0.1-0.3 mm. The invention adds a laser processing technology on the basis of the existing LDS technology, firstly adopts laser with larger power to carry out laser activation on the substrate, and then adopts laser with smaller power to carry out laser activation on the boundary of an activation area.
Description
Technical Field
The invention belongs to the technical field of LDS, and particularly relates to a method for improving the overplating and adhesive force performance of a chemical plating layer in an LDS process.
Background
Laser Direct Structuring (LDS) technology, which uses a computer to control the movement of a laser according to the trajectory of a conductive pattern, projects the laser onto a plastic device, and activates a circuit pattern in a few seconds.
The conventional LDS technology process flow at present is as follows: referring to fig. 1, the LDS substrate is first laser-activated, the activation path is shown as an arrow, and then metallization is performed on the activated area to form a circuit. However, the existing plastic material usually contains glass fiber components for increasing the strength, the glass fibers are often protruded during high-strength laser irradiation, the glass fibers are very easy to be plated, particularly for small-distance circuits, if the plastic material is subjected to laser activation by using high-power laser, the phenomenon of short circuit in adjacent circuits is easily caused, and as shown in fig. 2, plated layers of the adjacent circuits are communicated; in order to avoid the overflow plating situation, the laser activation of the plastic material by using low-power laser can cause that the metal particles in the LDS substrate are not completely activated, and further cause that the adhesion force of the chemical plating layer is insufficient, and the product test cannot pass.
Disclosure of Invention
The invention aims to provide a method for improving the overplating and adhesive force performance of a chemical plating layer in an LDS (laser direct structuring) process.
In order to solve the problems, the technical scheme of the invention is as follows:
a method for improving the overflow plating and adhesive force performance of a chemical plating layer in an LDS process comprises the following steps:
providing an LDS substrate;
first laser processing: performing laser activation on the LDS substrate by using an LDS technology to activate a plurality of first conductive areas;
and (3) second laser treatment: scanning the boundaries of the first conductive areas by using laser beams to obtain second conductive areas, wherein the energy of the laser beams used in the second laser processing is lower than that of the laser beams used in the first laser processing;
and metalizing the plurality of second conductive areas to form lines, wherein the distance between every two adjacent lines is 0.1-0.3 mm.
Preferably, the energy of the laser beam adopted in the first laser treatment is 5-9W, the laser spot is 0.05-0.08 mm, the energy of the laser beam adopted in the second laser treatment is 2-4W, and the laser spot is 0.05-0.08 mm.
Preferably, the metallizing the plurality of second conductive regions to form a line specifically includes: and metallizing the plurality of second conductive areas in a chemical copper plating mode, and forming chemical copper layers on the plurality of second conductive areas to form the circuit.
Due to the adoption of the technical scheme, compared with the prior art, the invention has the following advantages and positive effects:
1) the invention provides a method for improving the overflow plating and adhesive force performance of a chemical plating layer in an LDS process, which comprises the following steps: providing an LDS substrate; performing laser activation on the LDS substrate by using an LDS technology to activate a plurality of first conductive areas; scanning the boundaries of the first conductive areas by using laser beams to obtain second conductive areas, wherein the energy of the laser beams adopted in the second laser processing is lower than that of the laser beams adopted in the first laser processing; and metalizing the second conductive areas to form circuits, wherein the distance between every two adjacent circuits is 0.1-0.3 mm. The invention adds a laser processing technology on the basis of the existing LDS technology, namely, firstly, laser activation is carried out on the LDS substrate by adopting laser with larger power to obtain a first conductive area, and then laser activation is carried out on the boundary of the first conductive area by adopting laser with smaller power.
Drawings
FIG. 1 is a schematic diagram of laser activation in a prior art LDS process;
FIG. 2 is a schematic diagram illustrating the connection of chemical plating layers on adjacent lines in the prior art;
FIG. 3 is a flowchart of a method for improving the overplating and adhesion properties of a chemical plating layer in an LDS process according to an embodiment of the present invention;
FIG. 4 is a schematic flow chart illustrating a method for improving the chemical plating overplating and adhesion performance in the LDS process according to an embodiment of the present invention;
FIG. 5 is a diagram illustrating an improvement of chemical plating overfill in a method for improving chemical plating overfill and adhesion performance in an LDS process according to an embodiment of the present invention;
fig. 6 is a schematic diagram of a hundred grid test provided in the embodiment of the present invention.
Detailed Description
The method for improving the chemical plating layer overflow and the adhesion performance in the LDS process provided by the invention is further described in detail with reference to the accompanying drawings and the specific embodiment. Advantages and features of the present invention will become apparent from the following description and from the claims.
Referring to fig. 3 and 4, the invention provides a method for improving the overplating and adhesive force performance of a chemical plating layer in an LDS process, comprising the following steps:
providing an LDS substrate, wherein the LDS substrate of the embodiment is made of LCP (liquid Crystal Polymer) material containing glass fibers of Celanese company, and the strength of the substrate is good;
first laser processing: performing laser activation on the LDS substrate by using an LDS technology to activate a plurality of first conductive areas, wherein in the first laser processing step, referring to fig. 4, the moving track of a laser spot is shown by an arrow in the middle of the area;
and (3) second laser treatment: scanning the boundaries of the first conductive areas by using laser beams to obtain second conductive areas, wherein in the second laser processing step, referring to fig. 4, the moving tracks of laser spots are shown by arrows at the boundaries of the areas, and the energy of the laser beams used in the second laser processing is lower than that of the laser beams used in the first laser processing, in this embodiment, the energy of the laser beams used in the first laser processing is 5-9W, the laser spots are 0.05-0.08 mm, the energy of the laser beams used in the second laser processing is 2-4W, and the laser spots are 0.05-0.08 mm;
after two laser processing, a plurality of second conductive areas are metalized to form a circuit, in this embodiment, the step specifically includes metalizing the plurality of second conductive areas in a chemical copper plating manner to form a chemical copper layer on the plurality of second conductive areas, and the specific step of chemical copper plating is as follows: the method comprises the steps of firstly immersing a second conductive area into a copper chloride solution, then adding a reducing agent formaldehyde into the copper chloride solution, finally adding a sodium hydroxide solution to adjust the pH value of the solution, carrying out a reduction reaction at the pH value of about 11, and generating a copper layer on the second conductive area to deposit to form a chemical copper layer, wherein in general practical production, the concentration of copper chloride in the chemical copper plating solution is 2-6 g/L, the concentration of formaldehyde is 3-5%, the concentration of sodium hydroxide is 4-6%, the reaction temperature of chemical copper plating is about 60 ℃, and the chemical plating time is 4-6 h.
In addition, the method for improving the chemical plating layer overflow plating and the adhesion performance in the LDS process provided in this embodiment is mainly applied to the situation that circuits with small spacing need to be arranged on the LDS substrate, as shown in fig. 4, the spacing between the circuits arranged on the LDS substrate is small, the spacing between adjacent circuits is 0.1-0.3 mm, and in this embodiment, the spacing between adjacent circuits is 0.2 mm.
Referring to fig. 5 and 6, a circuit board manufactured by the method for improving the chemical plating layer flash plating and adhesion performance in the LDS process provided in this embodiment needs to be tested for chemical plating layer flash plating and for chemical plating layer adhesion;
referring to fig. 5, fig. 5 is a chemical plating layer overflow improvement diagram of the method for improving chemical plating layer overflow and adhesion performance in the LDS process provided in this embodiment, as is apparent from fig. 5, when the circuit board after chemical plating is placed under a microscope for observation, it is found that no overflow occurs in the chemical plating layer between adjacent circuits, and therefore no short circuit between adjacent circuits is caused.
The method comprises the specific operation steps of using a hundred-grid test method to test the adhesive force of a chemical plating layer, wherein the hundred-grid test is an experiment for testing the adhesive force performance of electroplating industry/silk screen printing and paint surfaces, using a hundred-knife to scratch 10 ＊ 10 small grids of 1mm ＊ 1mm on the surface of a test sample, enabling each scratch to reach the bottom layer of the chemical plating layer deeply, brushing fragments of a test area with a brush, firmly sticking the tested small grids with 3M600 size gummed paper or gummed paper with the same effect, wiping an adhesive tape with an eraser to increase the contact area and force between the adhesive tape and the tested area, holding one end of the adhesive tape with a hand after standing for 3-5 minutes, rapidly pulling the adhesive tape down in the vertical direction, and carrying out the same experiment twice at the same position.
In this embodiment, six groups of samples with different laser energy parameters are selected to perform the one-hundred-grid test, where the number of each group of samples is three, and the parameters selected by the six groups of samples and the results of the one-hundred-grid test are shown in table one.
TABLE-hundred lattice test results for samples of different laser energy parameters
Referring to fig. 6, after the above six groups of samples are subjected to the hundred-grid test, the chemical plating layer on the surface does not fall off, the adhesion of the chemical plating layer is good, and the chemical plating layer can be applied in production.
The method is characterized in that a laser processing process is added on the basis of the existing LDS process, namely, laser activation is carried out on the inner part of the metal circuit area by adopting high-power laser, and then laser activation is carried out on the boundary of the metal circuit area by adopting low-power laser.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments. Even if various changes are made to the present invention, it is still within the scope of the present invention if they fall within the scope of the claims of the present invention and their equivalents.
Claims (3)
1. A method for improving the overflow plating and the adhesive force performance of a chemical plating layer in an LDS process is characterized by comprising the following steps:
providing an LDS substrate;
first laser processing: performing laser activation on the LDS substrate by using an LDS technology to activate a plurality of first conductive areas;
and (3) second laser treatment: scanning the boundaries of the first conductive areas by using laser beams to obtain second conductive areas, wherein the energy of the laser beams used in the second laser processing is lower than that of the laser beams used in the first laser processing;
and metalizing the plurality of second conductive areas to form lines, wherein the distance between every two adjacent lines is 0.1-0.3 mm.
2. The method as claimed in claim 1, wherein the energy of the laser beam used in the first laser treatment is 5-9W, the laser spot is 0.05-0.08 mm, the energy of the laser beam used in the second laser treatment is 2-4W, and the laser spot is 0.05-0.08 mm.
3. The method of claim 1, wherein the metallizing the second conductive regions to form a circuit comprises: and metallizing the plurality of second conductive areas in a chemical copper plating mode, and forming chemical copper layers on the plurality of second conductive areas to form the circuit.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911421564.1A CN110996539A (en) | 2019-12-31 | 2019-12-31 | Method for improving chemical plating layer overflow plating and adhesive force performance in LDS process |
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| CN201911421564.1A CN110996539A (en) | 2019-12-31 | 2019-12-31 | Method for improving chemical plating layer overflow plating and adhesive force performance in LDS process |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104073789A (en) * | 2012-10-26 | 2014-10-01 | 罗门哈斯电子材料有限公司 | Process for electroless plating and a solution used for the same |
| WO2017149535A1 (en) * | 2016-02-29 | 2017-09-08 | Yissum Research Development Company Of The Hebrew University Of Jerusalem Ltd | Complexes of nucleic acid molecules and metals |
| CN108558413A (en) * | 2018-07-02 | 2018-09-21 | 上海安费诺永亿通讯电子有限公司 | A kind of preparation method of ceramic base electronic circuit |
| CN208078172U (en) * | 2018-05-08 | 2018-11-09 | 深圳市臻鼎盛通讯有限公司 | LDS Mobile phone antenna brackets |
-
2019
- 2019-12-31 CN CN201911421564.1A patent/CN110996539A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104073789A (en) * | 2012-10-26 | 2014-10-01 | 罗门哈斯电子材料有限公司 | Process for electroless plating and a solution used for the same |
| WO2017149535A1 (en) * | 2016-02-29 | 2017-09-08 | Yissum Research Development Company Of The Hebrew University Of Jerusalem Ltd | Complexes of nucleic acid molecules and metals |
| CN208078172U (en) * | 2018-05-08 | 2018-11-09 | 深圳市臻鼎盛通讯有限公司 | LDS Mobile phone antenna brackets |
| CN108558413A (en) * | 2018-07-02 | 2018-09-21 | 上海安费诺永亿通讯电子有限公司 | A kind of preparation method of ceramic base electronic circuit |
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Application publication date: 20200410 |
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