CN103747636A - Gold-plated circuit-board lead etch-back method - Google Patents
Gold-plated circuit-board lead etch-back method Download PDFInfo
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- CN103747636A CN103747636A CN201310722364.6A CN201310722364A CN103747636A CN 103747636 A CN103747636 A CN 103747636A CN 201310722364 A CN201310722364 A CN 201310722364A CN 103747636 A CN103747636 A CN 103747636A
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Abstract
The invention discloses a gold-plated circuit-board lead etch-back method and belongs to the technical field of printed circuit boards. The method comprises processes of outer graph making, resistance welding, electrogilding, laser ablative resistance welding and etching. During the process of outer graph making, outer graphs and leads required by gold-plated areas are all manufactured; during the process of resistance welding, areas which require no gold-plating are covered by solder resist ink and areas which require gold-plating are provided with windows; during the process of electrogilding, the areas which require gold-plating are coated with a gold layer in an electroplating way; during the process of laser ablative resistance welding, a solder resist ink layer which covers a lead is burned off by laser; and during the process of etching, exposed leads are removed by a chemical etching mode. According to the invention, solder resist ink is used to cover and protect areas which require no gold-plating; after electrogilding, laser is ingeniously used to directly remove the solder resist ink which covers the leads so as to expose the leads; and after etching, etch-back of the leads can be completed. The method provided by the invention has advantages of short production flow and low cost.
Description
Technical field
The present invention relates to printed wiring board technical field, particularly relate to a kind of method that gold-plated wiring board lead-in wire eat-backs.
Background technology
In conventional art, the current techique of high-density packages electroplating substrate gold is lead-in wire etch-back techniques and without leads plated technology for gold.Wherein, high without leads plated technology for gold difficulty, long flow path and the quality problem such as gold-plated plating easily occur, applies less.And lead-in wire etch-back technics is relatively ripe high-density packages electroplating substrate gold process, the general flow of this technique is as follows: gold-plated dry film pre-treatment-gold-plated dry film pad pasting-gold-plated dry film exposure-gold-plated dry film development-electrogilding-gold-plated dry film moves back film-alkali etching-welding resistance.In this technique, need to increase dry film technique and realize lead-in wire and eat-back, there is the deficiency that long flow path and cost are high.
Laser ablation is a kind of technology of Application and Development just in recent years, also has people this technology to be applied in the production process of gold-plated wiring board, without adopting dry film technique, directly utilizes laser burn off by gold-plated lead-in wire.But because lead-in wire is the metal level with copper nickel gold, need to rely on the UV laser ablation of high-energy-density, working (machining) efficiency is low, and easily burns dielectric layer, initiation layer short circuit etc. are bad.
Summary of the invention
Based on this, the object of the invention is to overcome the defect of prior art, a kind of method that provides gold-plated wiring board lead-in wire to eat-back, adopts the method to go between and eat-backs, and has simplified production procedure, saves dry film, effectively reduces cost.
For achieving the above object, the present invention takes following technical scheme:
The method that gold-plated wiring board lead-in wire eat-backs, comprises that outer graphics making, welding resistance, electrogilding, laser burn welding resistance, etching work procedure; Wherein:
In outer graphics production process, the required lead-in wire of outer field figure and gold-plated region is all produced;
In welding resistance operation, by not needing gold-plated region to cover with welding resistance ink, only in the gold-plated region of needs, window;
In electrogilding operation, in the mode of electroplating, will need gold-plated region plated with gold layer;
Laser burns in welding resistance operation, with laser burn off, covers the welding resistance ink layer on lead-in wire;
In etching work procedure, by the mode of chemical etching, remove the lead-in wire exposing.
In the method that the gold-plated wiring board lead-in wire of the present invention eat-backs; utilize welding resistance ink not need the region covering protection of electrogilding; and after electrogilding; the welding resistance ink that covers lead-in wire need to be removed; in routine techniques; normally adopt the method that chemical solvent soaks to remove, but chemistry is removed the welding resistance ink that the method for welding resistance cannot only be removed covering lead-in wire targetedly.The present invention is by a large amount of explorations and test, finally utilizes cleverly laser directly to remove the welding resistance ink that covers lead-in wire, thereby will go between exposure, then after etching, can complete to go between and eat-back.
In an embodiment, described laser burns in welding resistance operation, with CO therein
2laser or UV laser burn off welding resistance ink layer.Use CO
2laser or UV laser, as the energy of burn off welding resistance ink, have burn off effective, the advantage that reliability is high.
In an embodiment, described laser burns in welding resistance operation therein, controls laser burn off energy and is controlled at 1-10 milli Jiao, and the single-point ablation time is 2-15 microsecond.Adopt above-mentioned technique, there is good burn off welding resistance ink effect.
In an embodiment, described laser burns in welding resistance operation therein, and when welding resistance ink film thickness is 10-25 μ m, controlling laser burn off energy is that 1-5 milli is burnt, and the single-point ablation time is 2-10 microsecond; When welding resistance ink film thickness is 26-50 μ m, to control laser burn off energy and be controlled at 2-10 milli Jiao, the single-point ablation time is 2-15 microsecond.According to different welding resistance ink film thicknesses, select targetedly laser burn off condition, can welding resistance ink layer burn off is clean, can avoid again producing the problem that wiring board dielectric layer is burnt.
In an embodiment, described laser burns in welding resistance operation therein, and when needing the welding resistance inked areas width≤200 μ m of burn off, the diameter of controlling laser beam equals to need the width of burn off welding resistance inked areas, and moves along the length direction in this region; When needing the welding resistance inked areas width G reatT.GreaT.GT 200 μ m of burn off, make laser turn back path along needing welding resistance inked areas length or the Width of burn off to move with S shape.According to different actual conditions, select flexibly laser ablation mode, can reach better ablation effect.
In an embodiment, described laser burns between welding resistance and etching work procedure and also comprises plasma treatment operation therein, in plasma treatment operation, utilizes plasma treatment to remove laser and burns the residue that welding resistance produces.When laser ablation produces residue, utilize plasma treatment to clean wiring board, to obtain clean wiring board plate face, utilize the making of subsequent technique.
In an embodiment, in described etching work procedure, utilize alkali etching to remove lead-in wire therein.Avoid acid etching by Gold plated Layer corrosion.In addition,, in this process, spray can also effectively be removed the fragmentary welding resistance ink residue in ablation edge at the alkalies of plate face.
Compared with prior art, the present invention has following beneficial effect:
The method that a kind of gold-plated wiring board lead-in wire of the present invention eat-backs; utilize welding resistance ink not need the region covering protection of electrogilding, and after electrogilding, utilize cleverly laser directly to remove the welding resistance ink that covers lead-in wire; thereby will go between exposure, then after etching, can complete lead-in wire eat-back.The method is not used dry film, therefore without carrying out dry film pre-treatment, pad pasting, exposure, developing and move back the steps such as film, has shortened production procedure.And the method, without consuming dry film, has reduced cost.When shortening production procedure, reducing costs, it is in full accord that lead-in wire prepared by product prepared by the method and conventional method eat-backs the performance of gold-plated product, can finely meet the requirement of high-density packages electroplating substrate gold process.
Accompanying drawing explanation
Fig. 1 is schematic diagram after welding resistance operation in the method for embodiment 1;
Fig. 2 is that in the method for embodiment 1, laser burns welding resistance operation schematic diagram;
Fig. 3 is laser beam path schematic diagram in the method for embodiment 1;
Fig. 4 is laser beam path schematic diagram in the method for embodiment 3;
Fig. 5 is laser beam path schematic diagram in the method for embodiment 4.
Wherein: 1. gold-plated region; 2. go between; 3. burn off welding resistance inked areas; 4. laser beam.
Embodiment
Below in conjunction with the drawings and specific embodiments, describe the present invention in detail.
Embodiment 1
The method that gold-plated wiring board lead-in wire eat-backs, comprises that outer graphics making, welding resistance, electrogilding, laser burn welding resistance, etching work procedure; Wherein:
In outer graphics production process, the required lead-in wire 2 of outer field figure and gold-plated region is all produced.
In welding resistance operation, by not needing gold-plated region to cover with welding resistance ink, only in the gold-plated region 1 of needs, window, as shown in Figure 1, this welding resistance ink film thickness is 10 μ m.
In electrogilding operation, in the mode of electroplating, will need gold-plated region plated with gold layer.
Laser burns in welding resistance operation, uses CO
2laser burn off covers the welding resistance ink layer on lead-in wire, wherein, needing burn off welding resistance inked areas 3 width is 150 μ m, controlling laser burn off energy is that 1 milli is burnt, the single-point ablation time is 10 microseconds, and the diameter of laser beam 4 equals to need the width of burn off welding resistance inked areas, and moves along the length direction in this region, as Fig. 2, shown in Fig. 3.
In etching work procedure, by the mode of alkali etching, remove the lead-in wire exposing.
By the method for the present embodiment, prepare wiring board A.
Embodiment 2
Method and the method in embodiment 1 that a kind of gold-plated wiring board lead-in wire of the present embodiment eat-backs are basic identical, and difference is:
In welding resistance operation, welding resistance ink film thickness is 25 μ m.
Laser burns in welding resistance operation, uses CO
2laser burn off covers the welding resistance ink layer on lead-in wire, wherein, the welding resistance inked areas width that needs burn off is 200 μ m, controlling laser burn off energy is that 5 millis are burnt, the single-point ablation time is 2 microseconds, the diameter of controlling laser beam equals to need the width of burn off welding resistance inked areas, and moves along the length direction in this region.
By the method for the present embodiment, prepare wiring board B.
The method that gold-plated wiring board lead-in wire eat-backs, comprises that outer graphics making, welding resistance, electrogilding, laser burn welding resistance, plasma treatment, etching work procedure; Wherein:
In outer graphics production process, the required lead-in wire of outer field figure and gold-plated region is all produced.
In welding resistance operation, by not needing gold-plated region to cover with welding resistance ink, only in the gold-plated region of needs, window, this welding resistance ink film thickness is 50 μ m.
In electrogilding operation, in the mode of electroplating, will need gold-plated region plated with gold layer.
Laser burns in welding resistance operation, with UV laser burn off, cover the welding resistance ink layer on lead-in wire, wherein, the welding resistance inked areas width that needs burn off is 300 μ m, controlling laser burn off energy is that 10 millis are burnt, the single-point ablation time is 2 microseconds, makes laser turn back path along needing the welding resistance inked areas Width of burn off to move, as shown in Figure 4 with S shape.
In plasma treatment operation, utilize plasma treatment to remove laser and burn the residue that welding resistance produces.
In etching work procedure, by the mode of alkali etching, remove the lead-in wire exposing.
By the method for the present embodiment, prepare wiring board C.
Method and the method in embodiment 3 that a kind of gold-plated wiring board lead-in wire of the present embodiment eat-backs are basic identical, and difference is:
In welding resistance operation, welding resistance ink film thickness is 26 μ m.
Laser burns in welding resistance operation, uses CO
2laser burn off covers the welding resistance ink layer on lead-in wire, wherein, the welding resistance inked areas width that needs burn off is 400 μ m, controlling laser burn off energy is that 2 millis are burnt, the single-point ablation time is 15 microseconds, make laser turn back path along needing the welding resistance inked areas length direction of burn off to move, as shown in Figure 5 with S shape.
By the method for the present embodiment, prepare wiring board D.
Comparative example 1
A manufacture method for gold-plated wiring board, comprises that outer graphics is made, gold-plated, laser scorification lead-in wire operation; Wherein:
In outer graphics production process, the required lead-in wire of outer field figure and gold-plated region is all produced.
In gold-plated process, utilize lead-in wire conduction, to gold-plated region and lead-in wire on wiring board, carry out gold-plated.
In laser scorification lead-in wire operation, adopt laser fixed point fuse technique, utilize UV laser, controlling laser burn off energy is that 20 millis are burnt, and the region ablation time is 1min, connection go between with gold-plated region by laser cutting.
By the method for the present embodiment, prepare wiring board E.
Comparative example 2
A manufacture method for gold-plated wiring board, comprises that outer graphics is made, gold-plated, laser scorification lead-in wire operation; Wherein:
In outer graphics production process, the required lead-in wire of outer field figure and gold-plated region is all produced.
In gold-plated process, utilize lead-in wire conduction, to gold-plated region and lead-in wire on wiring board, carry out gold-plated.
In laser scorification lead-in wire operation, adopt laser fixed point fuse technique, utilize CO
2laser, controlling laser burn off energy is that 10 millis are burnt, the region ablation time is 1min, connection go between with gold-plated region by laser cutting.
By the method for the present embodiment, prepare wiring board F.
Test example
Wiring board A, B, C, D, E, F that embodiment 1-4 and comparative example 1-2 are prepared carry out performance test.
One, laser ablation effect
Investigate laser and burn after welding resistance operation, wiring board plate face occur welding resistance not ablation completely, the outer field situation of laser damage plate face, result is as shown in table 1.
Table 1 laser ablation situation
By upper table 1, we can find out, adopt the method for embodiment 1-4 to eat-back the lead-in wire of gold-plated wiring board, welding resistance removal effect is good, also can not burn dielectric layer, the gold-plated wiring board performance of preparing with the conventional method that needs dry film process is consistent, and useless plate rate is 0.And in comparative example 1, adopt the method for laser ablation lead-in wire, and when selecting energy, be the burnt UV laser ablation 1min of 20 milli, easily burn dielectric layer, cause the bad problems such as layer short circuit, and there is the shortcoming that working (machining) efficiency is low.In comparative example 2, utilize CO
2laser ablation lead-in wire, due to CO
2the ablation principle of laser is to utilize heat energy to carry out melting, is difficult to the lead-in wire of plated with copper nickel gold to blow, and reaches the object of fixed point fuse.
The above embodiment has only expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (7)
1. the method that gold-plated wiring board lead-in wire eat-backs, is characterized in that, comprises that outer graphics making, welding resistance, electrogilding, laser burn welding resistance, etching work procedure; Wherein:
In outer graphics production process, the required lead-in wire of outer field figure and gold-plated region is all produced;
In welding resistance operation, by not needing gold-plated region to cover with welding resistance ink, only in the gold-plated region of needs, window;
In electrogilding operation, in the mode of electroplating, will need gold-plated region plated with gold layer;
Laser burns in welding resistance operation, with laser burn off, covers the welding resistance ink layer on lead-in wire;
In etching work procedure, by the mode of chemical etching, remove the lead-in wire exposing.
2. the method that gold-plated wiring board lead-in wire according to claim 1 eat-backs, is characterized in that, described laser burns in welding resistance operation, with CO
2laser or UV laser burn off welding resistance ink layer.
3. the method that gold-plated wiring board lead-in wire according to claim 2 eat-backs, is characterized in that, described laser burns in welding resistance operation, controls laser burn off energy and is controlled at 1-10 milli Jiao, and the single-point ablation time is 2-15 microsecond.
4. the method that gold-plated wiring board lead-in wire according to claim 3 eat-backs, is characterized in that, described laser burns in welding resistance operation, and when welding resistance ink film thickness is 10-25 μ m, controlling laser burn off energy is that 1-5 milli is burnt, and the single-point ablation time is 2-10 microsecond; When welding resistance ink film thickness is 26-50 μ m, to control laser burn off energy and be controlled at 2-10 milli Jiao, the single-point ablation time is 2-15 microsecond.
5. the method that gold-plated wiring board lead-in wire according to claim 1 eat-backs, it is characterized in that, described laser burns in welding resistance operation, when needing the welding resistance inked areas width≤200 μ m of burn off, the diameter of controlling laser beam equals to need the width of burn off welding resistance inked areas, and moves along the length direction in this region; When needing the welding resistance inked areas width G reatT.GreaT.GT 200 μ m of burn off, make laser turn back path along needing welding resistance inked areas length or the Width of burn off to move with S shape.
6. the method that gold-plated wiring board lead-in wire according to claim 1 eat-backs, it is characterized in that, described laser burns between welding resistance and etching work procedure and also comprises plasma treatment operation, in ion processing operation, utilizes plasma treatment to remove laser and burns the residue that welding resistance produces.
7. the method that gold-plated wiring board lead-in wire according to claim 1 eat-backs, is characterized in that, in described etching work procedure, utilizes alkali etching to remove lead-in wire.
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107241873A (en) * | 2017-07-17 | 2017-10-10 | 胜宏科技（惠州）股份有限公司 | A kind of improved golden finger gold plating method |
| CN107708321A (en) * | 2017-09-20 | 2018-02-16 | 东莞康源电子有限公司 | A kind of minimizing technology of PCB electroplate lead wires |
| CN110324983A (en) * | 2019-07-29 | 2019-10-11 | 广州兴森快捷电路科技有限公司 | The production method of wiring board |
| CN111065210A (en) * | 2019-12-25 | 2020-04-24 | 上海嘉捷通电路科技股份有限公司 | Method for replacing manual PCB (printed circuit board) process lead wire picking |
| CN112492763A (en) * | 2021-01-14 | 2021-03-12 | 深圳和美精艺半导体科技股份有限公司 | Solder-resisting laser windowing and ink-removing method for packaging substrate |
| CN112601374A (en) * | 2020-11-16 | 2021-04-02 | 淮安特创科技有限公司 | Laser oil burning reworking method for circuit board |
| CN112654155A (en) * | 2020-11-24 | 2021-04-13 | 深圳和美精艺半导体科技股份有限公司 | Laser-fired lead windowing method and substrate preparation method |
| CN112867275A (en) * | 2021-01-06 | 2021-05-28 | 深圳市迅捷兴科技股份有限公司 | Method for plating nickel and gold on part without lead |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112601374B (en) * | 2020-11-16 | 2021-12-07 | 淮安特创科技有限公司 | Laser oil burning reworking method for circuit board |
| CN112654155A (en) * | 2020-11-24 | 2021-04-13 | 深圳和美精艺半导体科技股份有限公司 | Laser-fired lead windowing method and substrate preparation method |
| CN112867275A (en) * | 2021-01-06 | 2021-05-28 | 深圳市迅捷兴科技股份有限公司 | Method for plating nickel and gold on part without lead |
| CN112492763A (en) * | 2021-01-14 | 2021-03-12 | 深圳和美精艺半导体科技股份有限公司 | Solder-resisting laser windowing and ink-removing method for packaging substrate |
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