CN110459645B - 电池板与汇流条的焊接方法 - Google Patents
电池板与汇流条的焊接方法 Download PDFInfo
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- CN110459645B CN110459645B CN201910700622.8A CN201910700622A CN110459645B CN 110459645 B CN110459645 B CN 110459645B CN 201910700622 A CN201910700622 A CN 201910700622A CN 110459645 B CN110459645 B CN 110459645B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4885—Wire-like parts or pins
- H01L21/4896—Mechanical treatment, e.g. cutting, bending
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
- H01L31/188—Apparatus specially adapted for automatic interconnection of solar cells in a module
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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CN201910700622.8A CN110459645B (zh) | 2019-07-31 | 2019-07-31 | 电池板与汇流条的焊接方法 |
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CN201910700622.8A CN110459645B (zh) | 2019-07-31 | 2019-07-31 | 电池板与汇流条的焊接方法 |
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CN110459645A CN110459645A (zh) | 2019-11-15 |
CN110459645B true CN110459645B (zh) | 2021-04-02 |
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CN114783929B (zh) * | 2022-06-23 | 2022-09-02 | 丽瀑光能(常熟)有限公司 | 一种光伏组件的汇流带输送装置 |
CN118174111B (zh) * | 2024-05-15 | 2024-07-05 | 翊腾电子科技(昆山)有限公司 | 一种电池接头的组装设备 |
Citations (13)
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---|---|---|---|---|
EP2269757A1 (de) * | 2009-06-30 | 2011-01-05 | Feintool Intellectual Property AG | Vorrichtung zum Verbinden, insbesondere Löten, eines Verbinders mit einer Solarzelle mit einer Reinigungseinrichtung |
CN104966764A (zh) * | 2015-07-21 | 2015-10-07 | 宁波华顺太阳能科技有限公司 | 光伏组件汇流带自动折弯装置及其方法 |
CN105414267A (zh) * | 2015-12-31 | 2016-03-23 | 苏州博阳能源设备有限公司 | 汇流条折弯机 |
CN206010196U (zh) * | 2016-08-31 | 2017-03-15 | 无锡奥特维科技股份有限公司 | 一种汇流条焊接装置 |
CN106825839A (zh) * | 2017-03-22 | 2017-06-13 | 无锡先导智能装备股份有限公司 | 汇流条的供料机构以及供料方法 |
CN106925921A (zh) * | 2015-12-31 | 2017-07-07 | 苏州博阳能源设备有限公司 | 太阳能电池汇流条焊接装置 |
CN107414401A (zh) * | 2017-09-12 | 2017-12-01 | 无锡奥特维科技股份有限公司 | 汇流条焊接装置 |
CN207127362U (zh) * | 2017-06-05 | 2018-03-23 | 博硕皓泽自动化设备无锡有限公司 | 自动汇流条焊接设备 |
CN207344002U (zh) * | 2017-09-25 | 2018-05-11 | 苏州赛历新材料科技股份有限公司 | 一种光伏汇流带焊接用新型自动上料机构 |
CN108067759A (zh) * | 2016-11-16 | 2018-05-25 | 上海涛创自动化科技有限公司 | 一种汇流条自动上料焊接一体设备 |
CN207642649U (zh) * | 2017-10-30 | 2018-07-24 | 昆山盟特展精密机电有限公司 | 一种汇流条自动裁切焊接机 |
CN208358243U (zh) * | 2018-06-19 | 2019-01-11 | 齐河双百数码影像设备有限公司 | 一种汇流条备料机构 |
CN208840862U (zh) * | 2018-08-08 | 2019-05-10 | 苏州德睿联自动化科技有限公司 | 汇流条焊接系统 |
-
2019
- 2019-07-31 CN CN201910700622.8A patent/CN110459645B/zh active Active
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2269757A1 (de) * | 2009-06-30 | 2011-01-05 | Feintool Intellectual Property AG | Vorrichtung zum Verbinden, insbesondere Löten, eines Verbinders mit einer Solarzelle mit einer Reinigungseinrichtung |
CN104966764A (zh) * | 2015-07-21 | 2015-10-07 | 宁波华顺太阳能科技有限公司 | 光伏组件汇流带自动折弯装置及其方法 |
CN106925921A (zh) * | 2015-12-31 | 2017-07-07 | 苏州博阳能源设备有限公司 | 太阳能电池汇流条焊接装置 |
CN105414267A (zh) * | 2015-12-31 | 2016-03-23 | 苏州博阳能源设备有限公司 | 汇流条折弯机 |
CN206010196U (zh) * | 2016-08-31 | 2017-03-15 | 无锡奥特维科技股份有限公司 | 一种汇流条焊接装置 |
CN108067759A (zh) * | 2016-11-16 | 2018-05-25 | 上海涛创自动化科技有限公司 | 一种汇流条自动上料焊接一体设备 |
CN106825839A (zh) * | 2017-03-22 | 2017-06-13 | 无锡先导智能装备股份有限公司 | 汇流条的供料机构以及供料方法 |
CN207127362U (zh) * | 2017-06-05 | 2018-03-23 | 博硕皓泽自动化设备无锡有限公司 | 自动汇流条焊接设备 |
CN107414401A (zh) * | 2017-09-12 | 2017-12-01 | 无锡奥特维科技股份有限公司 | 汇流条焊接装置 |
CN207344002U (zh) * | 2017-09-25 | 2018-05-11 | 苏州赛历新材料科技股份有限公司 | 一种光伏汇流带焊接用新型自动上料机构 |
CN207642649U (zh) * | 2017-10-30 | 2018-07-24 | 昆山盟特展精密机电有限公司 | 一种汇流条自动裁切焊接机 |
CN208358243U (zh) * | 2018-06-19 | 2019-01-11 | 齐河双百数码影像设备有限公司 | 一种汇流条备料机构 |
CN208840862U (zh) * | 2018-08-08 | 2019-05-10 | 苏州德睿联自动化科技有限公司 | 汇流条焊接系统 |
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