CN110402067A - The assemble method of electronic equipment and electronic equipment - Google Patents
The assemble method of electronic equipment and electronic equipment Download PDFInfo
- Publication number
- CN110402067A CN110402067A CN201910685497.8A CN201910685497A CN110402067A CN 110402067 A CN110402067 A CN 110402067A CN 201910685497 A CN201910685497 A CN 201910685497A CN 110402067 A CN110402067 A CN 110402067A
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- China
- Prior art keywords
- cover board
- electronic equipment
- supporting element
- plate
- structure layer
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Signal Processing (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The embodiment of the present application provides the assemble method of a kind of electronic equipment and electronic equipment.The electronic equipment includes radiator and center, the radiator includes the first cover board, the second cover board, supporting element and capillary structure layer, the center at least partially constitutes first cover board, and second cover board and first cover board enclose and set to form airtight cavity；The supporting element is located in the airtight cavity, and the supporting element extends out from first cover board in face of the surface of second cover board, and the supporting element and first cover board are integration setting；The capillary structure layer is located in the airtight cavity, and the capillary structure layer is fixed on the surface that second cover board faces first cover board, and the capillary structure layer is held in the supporting element.Electronic devices structure provided by the embodiments of the present application is more compact, can reduce the thickness of electronic equipment.
Description
Technical field
This application involves field of mechanical technique more particularly to a kind of electronic equipment and the assemble methods of electronic equipment.
Background technique
Soaking plate has heat sinking function, and electronic equipment generallys use soaking plate and radiates to chip.In the related technology,
It is more independent between each structure of hot plate, so that the volume that soaking plate occupies is larger, when soaking plate is applied to electronic equipment,
It is unfavorable for the lightening design of electronic equipment.
Summary of the invention
The embodiment of the present application provides the assemble method of a kind of electronic equipment and electronic equipment, can reduce the thickness of electronic equipment
Degree.
The embodiment of the present application provides a kind of electronic equipment, and the electronic equipment includes:
Radiator, the radiator include the first cover board, the second cover board, supporting element and capillary structure layer, and described the
Two cover boards and first cover board enclose and set to form airtight cavity, and the supporting element is located in the airtight cavity, the supporting element
It extends out from first cover board in face of the surface of second cover board, the supporting element and first cover board are integration
Setting, the capillary structure layer are located in the airtight cavity, and the capillary structure layer is fixed on second cover board in face of institute
The surface of the first cover board is stated, and the capillary structure layer is held in the supporting element；And
Center, the center at least partially constitute first cover board.
Electronic equipment provided by the embodiments of the present application, the center of the electronic equipment at least partially constitute the radiator
The first cover board, form airtight cavity between the first cover board and the second cover board, supporting element and capillary structure layer be set to close
In closed chamber body, and supporting element and the setting of the first cover board are integrally formed, volume can be not necessarily to the structural strength of heat radiation device
Fixed structure between outer setting supporting element and the first cover board further decreases in addition, capillary structure layer is held in supporting element
The volume of radiator.When radiator is applied to electronic equipment, it is multiplexed the center of electronic equipment, electronics is can reduce and sets
Standby thickness.
The embodiment of the present application also provides the assemble method of a kind of electronic equipment, and the electronic equipment includes center, the electricity
The assemble method of sub- equipment includes:
The first plate is provided, first plate includes the first cover board and supporting element being fixedly connected, first cover board
It is integration setting with the supporting element, first cover board is made of at least partly described center；
The second plate is provided, second plate includes the second cover board being fixedly connected and capillary structure layer；
Second plate and first plate are fixed, so that between second plate and first plate
Airtight cavity is formed, and the supporting element and the capillary structure layer are located in the airtight cavity, the capillary structure
Layer is held in the supporting element.
Detailed description of the invention
It, below will be to use required in embodiment in order to illustrate more clearly of the technical solution of the application embodiment
Attached drawing be briefly described, it should be apparent that, the accompanying drawings in the following description is some embodiments of the application, for this field
For those of ordinary skill, without creative efforts, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is the structural schematic diagram of a kind of electronic equipment provided by the embodiments of the present application.
Fig. 2 is a kind of structural schematic diagram of CC cross-sectional view of the electronic equipment provided in Fig. 1.
Fig. 3 is the structural schematic diagram of the partial enlarged view of the region P of the electronic equipment provided in Fig. 2.
Fig. 4 is the structural schematic diagram of another CC cross-sectional view of the electronic equipment provided in Fig. 1.
Fig. 5 is the structural schematic diagram of the partial enlarged view of the region Q of the electronic equipment provided in Fig. 4.
Fig. 6 is the structural schematic diagram of the first electronic equipment provided by the embodiments of the present application.
Fig. 7 is the structural schematic diagram of second of electronic equipment provided by the embodiments of the present application.
Fig. 8 is the structural schematic diagram of the third electronic equipment provided by the embodiments of the present application.
Fig. 9 is the structural schematic diagram of the 4th kind of electronic equipment provided by the embodiments of the present application.
Figure 10 is the structural schematic diagram of the 5th kind of electronic equipment provided by the embodiments of the present application.
Figure 11 is the structural schematic diagram of a kind of electronic equipment provided by the embodiments of the present application.
Figure 12 is a kind of structural schematic diagram of cross-sectional view of electronic equipment in Figure 11.
Figure 13 is the structural schematic diagram of another cross-sectional view of electronic equipment in Figure 11.
Figure 14 is the structural schematic diagram of another electronic equipment provided by the embodiments of the present application.
Figure 15 is the flow diagram of the assemble method of a kind of electronic equipment provided by the embodiments of the present application.
Figure 16 is the corresponding structural schematic diagram of S100 in Figure 15.
Figure 17 is the corresponding structural schematic diagram of S200 in Figure 15.
Figure 18 is the corresponding structural schematic diagram of S300 in Figure 15.
Figure 19 is the flow diagram of the assemble method of another electronic equipment provided by the embodiments of the present application.
Figure 20 is the corresponding structural schematic diagram of S110 in Figure 19.
Figure 21 is the corresponding structural schematic diagram of S120 in Figure 19.
Figure 22 is the flow diagram of the assemble method of another electronic equipment provided by the embodiments of the present application.
Figure 23 is the corresponding structural schematic diagram of S130 in Figure 22.
Figure 24 is the corresponding structural schematic diagram of S140 in Figure 22.
Figure 25 is the flow diagram of the assemble method of another electronic equipment provided by the embodiments of the present application.
Figure 26 is the corresponding structural schematic diagram of S210 in Figure 25.
Figure 27 is the corresponding structural schematic diagram of S220 in Figure 25.
Figure 28 is the flow diagram of the assemble method of another electronic equipment provided by the embodiments of the present application.
Figure 29 is the corresponding structural schematic diagram of S230 in Figure 28.
Figure 30 is the corresponding structural schematic diagram of S240 in Figure 28.
Figure 31 is the corresponding structural schematic diagram of S250 in Figure 28.
Figure 32 is the flow diagram of the assemble method of another electronic equipment provided by the embodiments of the present application.
Figure 33 is the flow diagram of the assemble method of another electronic equipment provided by the embodiments of the present application.
Specific embodiment
Below in conjunction with the attached drawing in the application embodiment, the technical solution in the application embodiment is carried out clear
Chu is fully described by, it is clear that described embodiment is only a part of embodiment of the application, rather than whole realities
Apply mode.Based on the embodiment in the application, those of ordinary skill in the art institute under that premise of not paying creative labor
The every other embodiment obtained, shall fall in the protection scope of this application.Equal first, second occurred herein is nominally
Differentiation, neither expression quantity, also do not indicate sequencing.
Also referring to Fig. 1, Fig. 2 and Fig. 3, electronic equipment 1 provided by the embodiments of the present application includes radiator 10 in
Frame 20, radiator 10 include the first cover board 100, the second cover board 200, supporting element 300 and capillary structure layer 400.Described second
Cover board 200 and first cover board 100 enclose and set to form airtight cavity A；The supporting element 300 is located in the airtight cavity A, institute
It states supporting element 300 and extends out from first cover board 100 in face of the surface of second cover board 200,300 He of supporting element
First cover board 100 is integration setting；The capillary structure layer 400 is located in the airtight cavity A, the capillary structure
Layer 400 is fixed on the surface that second cover board 200 faces first cover board 100, and the capillary structure layer 400 is held in
The supporting element 300.
When radiator 10 is applied to electronic equipment 1, the first cover board 100 of the radiator 10 can be by the electronics
The center 20 of equipment 1 is constituted, and by being multiplexed the part-structure of electronic equipment 1, can make the Structural assignments of electronic equipment 1 more
It is compact, help to realize the lightening design of electronic equipment 1.
Wherein, the electronic equipment 1 can be any equipment for having display function.Such as: tablet computer, hand are mechanical, electrical
Sub- reader, remote controler, personal computer (Personal Computer, PC), laptop, mobile unit, network electricity
Depending on smart machines having a display function such as, wearable devices.
The radiator 10 is used to radiate for the electronic component 30 of electronic equipment 1, and the electronic component 30 can be with
The heating devices such as circuit board, chip, battery for electronic equipment 1.The center 20 of the electronic equipment 1 constitutes the first cover board 100,
Since radiator 10 has been multiplexed 20 structure of center of electronic equipment 1, relative in traditional technology, heat dissipation is filled using double-sided adhesive
10 modes for being adhered to center 20 are set, the radiator 10 that present embodiment provides is not necessarily to two-sided glue sticking, so that center 20 1
The heat of side can be quickly transmitted in the airtight cavity A of radiator 10, facilitate improving radiating effect.
First cover board 100, the supporting element 300 are aluminum alloy material, and second cover board 200 is copper material.Institute
It is integrated setting that supporting element 300, which is stated, with the first cover board 100, i.e. supporting element 300 and the first cover board 100 is in same manufacturing procedure
It is formed together.The supporting element 300 and the capillary structure layer 400 are respectively positioned in the airtight cavity A, the supporting element 300
It is supported between the first cover board 100 and capillary structure layer 400, so that the guarantor between the first cover board 100 and capillary structure layer 400
Default spacing is held, and the first cover board 100 and capillary structure layer 400 is avoided to be deformed due to external force.
In one embodiment, the supporting element 300 and first cover board 100 form integration by die-casting process
Structure.In another embodiment, the supporting element 300 and first cover board 100 form integration by etching process
Structure.
The capillary structure layer 400 is for providing capillary force.The generation of capillary force is that interior meniscus produces on three phase boundary
Raw.The direction of capillary force: action direction is directed toward the concave surface of curved liquid surface always, and (concave-convex meniscus refers to relative to liquid phase side
Speech).The radiator 10 can be soaking plate, and soaking plate is the airtight cavity A that an inner wall has capillary structure, usually
It is made of copper.When the heat from electronic component 30 is conducted to airtight cavity A, the coolant liquid in airtight cavity A is in low vacuum
Start the gasification phenomenon of generation coolant liquid after being heated in the environment of degree, absorbs thermal energy and rapid spatial expansion at this time, gas phase
The phenomenon that cooling medium quickly fills with entire cavity, will generate condensation when gas phase media is touched than colder region.It borrows
The phenomenon that by condensing, releases the heat accumulated in evaporation, and the coolant liquid after condensation can return again by the capillary channel of capillary structure
To at evaporation heat source, progress of this operation workflow in airtight cavity A in cycles.
Wherein, the capillary structure layer 400 be metal mesh structure, and the capillary structure layer 400 be held in it is described close
The inner wall of closed chamber body A.The capillary structure layer 400 is fixed on the surface of the second cover board 200, in one embodiment, described
Capillary structure layer 400 is fixed on the surface of second cover board 200 by sintering process.In another embodiment, described
Capillary structure layer 400 is fixed on the surface of second cover board 200 by welding procedure.The capillary structure layer 400 can also be with
With 200 integrated setting of the second cover board, i.e., formed together in same manufacturing procedure.
Electronic equipment 1 provided by the embodiments of the present application includes radiator 10 and center 20, by by radiator 10
100 integrated molding of supporting element 300 and the first cover board, and supporting element 300 is held in capillary structure layer 400, it can to dissipate
The Structural assignments of thermal 10 are more compact, can reduce the volume of radiator 10.Further, when radiator 10 is applied
When electronic equipment 1, the first cover board 100 of the radiator 10 is constituted using the center 20 of electronic equipment 1, passes through multiplexing electricity
20 structure of center of sub- equipment 1, can reduce the thickness of electronic equipment 1.And relative in traditional technology, will be dissipated using double-sided adhesive
Thermal 10 is adhered to the mode of center 20, and radiator 10 provided by the embodiments of the present application is not necessarily to two-sided glue sticking, so that in
The heat of 20 side of frame can be quickly transmitted in the airtight cavity A of radiator 10, facilitate improving radiating effect.And into
One step, supporting element 300 and the center 20 of electronic equipment 1 are integrally formed, it can be with the structural strength of heat radiation device 10.
Please continue to refer to Fig. 4 and Fig. 5, the supporting element 300 includes several support columns 310, several described support columns
310 are arranged in array on the surface of first cover board 100, to form the channel for intersecting connection in the airtight cavity A
320。
It is uniformly distributed specifically, array is presented in several support columns 310 on the first cover board 100, the support column 310
It supports between capillary structure layer 400 and the first cover board 100, so that the closed chamber between the second cover board 200 and the first cover board 100
The volume of body A keeps stablizing, and reduces the deformation that the second cover board 200 and the first cover board 100 generate.In one embodiment, if
The height of the dry support column 310 is consistent, so that the spacing between the second cover board 200 and the first cover board 100 is protected
It holds constant, helps to reduce the deformation that the second cover board 200 and the first cover board 100 generate.
The support column 310 is located in the airtight cavity A, intersects connection for being formed in the airtight cavity A
Channel 320 can make heat be sufficiently mixed and be transmitted in airtight cavity A, and then the heat dissipation of heat radiation device 10
Effect.
Further, the overall size of the supporting element 300 is covered from the side of first cover board 100 towards described second
The side of plate 200 is gradually reduced, when using the supporting element 300 and the first cover board 100 of mold process integration, due to supporting element
300 design for vertebral body structure, convenient for demoulding.And cone angle design is used, facilitate the supporting element 300 and for improving integrated design
One cover board 100.
Please continue to refer to Fig. 6, first cover board 100 has container 100a, and second cover board 200 is covered on described
The aperture position of container 100a, to form the airtight cavity between first cover board 100 and second cover board 200
A。
Specifically, the surface of first cover board 100 offers container 100a, the supporting element 300 is from described first
The surface that cover board 100 opens up container 100a extends out, and the supporting element 300 is located in the container 100a, and described
Two cover boards 200 are covered on the aperture position of the container 100a, and the capillary structure layer 400 is located at second cover board 200
In face of the surface of the supporting element 300, and the supporting element 300 is held in the capillary structure layer 400, so that described first
The airtight cavity A that volume stability is formed between cover board 100 and second cover board 200, can reduce the first cover board 100 and second
The case where cover board 200 is deformed under external force.
Please continue to refer to Fig. 7, second cover board 200 includes covering part 210 and extends from 210 side of covering part
The interconnecting piece 220 come, the interconnecting piece 220 are connected to first cover board 100, the covering part 210, the interconnecting piece 220
It encloses to set with first cover board 100 to form the airtight cavity A.
It sets to form the accommodating area 230, the interconnecting piece specifically, the covering part 210 and the interconnecting piece 220 enclose
220 are connected to first cover board 100, and setting is spaced between the covering part 210 and first cover board 100.
In one embodiment, the covering part 210 and the interconnecting piece 220 are arranged for integration, and the connection
Portion 220 extends out from the direction perpendicular to the 210 place plane of covering part.
Specifically, the covering part 210 and the institute that Sheet Metal Forming Technology forms integrated setting can be used in second cover board 200
Interconnecting piece 220 is stated, covering part 210 and the leakproofness that interconnecting piece 220 connects on the one hand can be enhanced, on the other hand can increase lid
Bonding strength between conjunction portion 210 and interconnecting piece 220.When interconnecting piece 220 from the direction perpendicular to the plane where covering part 210
When extending out, interconnecting piece 220, perpendicular to covering part 210, further increases the second cover board to the active force of covering part 210
200 structural strength.
In another embodiment, the covering part 210 and the interconnecting piece 220 are respectively two independent structures,
Covering part 210 and interconnecting piece 220 independently form, and then fix covering part 210 and interconnecting piece 220 by welding
To obtain the second cover board 200.
Please continue to refer to Fig. 8, first cover board 100 has the first holding tank 100b, and second cover board 200 has the
Two holding tank 200a, the first holding tank 100b and the second holding tank 200a constitute the airtight cavity A.
Specifically, in the present embodiment, the second of the first holding tank 100b of the first cover board 100 and the second cover board 200
Holding tank 200a collectively forms the airtight cavity A.The first holding tank 100b and the second holding tank 200a face, institute
It states supporting element 300 to be at least partially disposed in the first holding tank 100b, the capillary structure layer 400 is at least partially disposed at described
In second holding tank 200a.
Please continue to refer to Fig. 9, the electronic equipment 1 further includes sealing element 150, and the sealing element 150 surround and is set to institute
The side of the second cover board 200 and 100 connecting portion of the first cover board is stated, to promote the leakproofness of the airtight cavity A.
Wherein, the sealing element 150 can be sealing ring, or sealant.The sealing element 150 is set to described
The side of second cover board 200 and 100 connecting portion of the first cover board, for the company to the second cover board 200 and the first cover board 100
Socket part position carries out secondary seal, to promote the sealing performance of airtight cavity A.
Please continue to refer to Figure 10, the electronic equipment 1 further includes sprue gate 250, and the sprue gate 250 is used for described close
Heat eliminating medium 260 is injected in closed chamber body A.
Wherein, the heat eliminating medium 260 can be air, or other heat-absorbing mediums.The heat eliminating medium 260
It can also be the cooling medium of liquid, e.g., water, alcohol, liquid nitrogen etc..The heat eliminating medium 260 passes through 250 note of sprue gate
Enter.Vacuumize process is carried out to the airtight cavity A first, heat eliminating medium 260 is then injected in the airtight cavity A, then
Sprue gate 250 is sealed, heat eliminating medium 260 is sealed in airtight cavity A.The capillary structure layer 400 is for being
The heat eliminating medium 260 provides capillary force, so that the heat eliminating medium 260 can preferably flow in the airtight cavity A,
To facilitate the heat dissipation effect of heat radiation device 10.
Please continue to refer to Figure 11 and Figure 12, electronic equipment 1 provided by the embodiments of the present application is other than including center 20, institute
Stating electronic equipment 1 further includes display screen 40 and electronic component 30, and the center 20 at least partially constitutes first cover board 100,
The display screen 40 is carried on the radiator 10, and the electronic component 30 is located at the radiator 10 away from the display
The side of screen 40, the radiator 10 is for conducting the heat from the electronic component 30, to avoid to described
Display screen 40 forms interference.
Wherein, the electronic equipment 1 can be any equipment for having display function.Such as: tablet computer, hand are mechanical, electrical
Sub- reader, remote controler, personal computer (Personal Computer, PC), laptop, mobile unit, network electricity
Depending on smart machines having a display function such as, wearable devices.
The display screen 40 includes display panel 41 and cover-plate glass 42, and the display panel 41 can be LCD display
Plate 41, or flexible display panels 41.The electronic component 30 can be circuit board, chip, the battery etc. of electronic equipment 1
Heating device.The radiator 10 is used to radiate for the electronic component 30 of electronic equipment 1, in the electronic equipment 1
Frame 20 constitutes the first cover board 100, since radiator 10 has been multiplexed 20 structure of center of electronic equipment 1, relative to traditional technology
In, in such a way that radiator 10 is adhered to center 20 by double-sided adhesive, the radiator 10 that present embodiment provides is without connecing
It touches and is transmitted to the heat of 20 side of center quickly in the airtight cavity A of radiator 10, have
Help improving radiating effect.
The area of first cover board 100 is greater than the area of second cover board 200, and first cover board 100 is by described
The center 20 of electronic equipment 1 is constituted, and the display screen 40 is carried on first cover board 100, and is located at first cover board 100
The side of neighbouring second cover board 200, the electronic component 30 are located at first cover board 100 away from second cover board
200 side, i.e., the described electronic component 30 are located at the opposite two sides of first cover board 100.The radiator 10
Between the electronic component 30 and the display screen 40, the heat from the electronic component 30 is passed through into radiator
10 transfer out, and generate interference to display screen 40 to avoid the heat from electronic component 30, influence the display function of display screen 40
Energy.
Please continue to refer to Figure 13, the electronic equipment 1 further includes bond 50, and the bond 50 is used for the display
Screen 40 is fixed on first cover board 100, and the bond 50 is avoided second cover board 200 and is arranged.
Specifically, the bond 50 can be colloid, the bond 50 is used for display screen 40 and the first cover board 100
It is fixed.In one embodiment, the bond 50 is set to the side of display screen 40, and display screen 40 is fixed on
On first cover board 100, at this point, bond 50 is not covered with the region between the second cover board 200 and display screen 40, electricity can reduce
The size of sub- 1 thickness direction of equipment realizes the lightening design of electronic equipment 1.That is, the bond 50 avoids second
Cover board 200 is arranged, at this point it is possible to reduce the thickness of electronic equipment 1.
In one embodiment, the bond 50 is set to the side of display screen 40, and display screen 40 is fixed on
On first cover board 100, and the surface of second cover board 200 is provided with heat insulation layer in display screen 40, the heat insulation layer is used for
The heat from electronic component 30 is obstructed, the heat from electronic component 30 is avoided to interfere the display of display screen 40.This
Process may be considered secondary heat-insulated process, be passed for the first time by radiator 10 to the heat from electronic component 30
It leads, to avoid heat aggregation；It is to be obstructed by heat insulation layer to the heat from electronic component 30 for the second time, avoids heat direction
The side of display screen 40 is conducted, so as to further solve electronic component 30 under the premise of reducing the thickness of electronic equipment 1
Adverse effect of the fever to display screen 40.
Please continue to refer to Figure 14, the display screen 40 has viewing area 40a and the non-display area around the viewing area 40a
40b, viewing area 40a described in the radiator 10 at least partly face setting.
Specifically, for the ease of the trace arrangements inside display screen 40, by that electronic component 30 can be set to display screen
The viewing area position 40a of the corresponding display screen 40 in 40 inside, it is possible to reduce the winding problem of route.For this purpose, in the present embodiment,
At least partly face viewing area 40a of radiator 10 is arranged, and radiator 10 is set to display screen 40 and electronic component
Between 30, it can be conducted to avoid the heat from electronic component 30 on display screen 40 and then causing to show bad problem.And
It, can also be preferable by the way that the corresponding viewing area 40a of radiator 10 to be arranged since non-display area 40b is arranged around viewing area 40a
Realization radiate to non-display area 40b.
Please continue to refer to Figure 15, the assemble method of electronic equipment provided by the embodiments of the present application include but is not limited to S100,
S200 and S300, is described below about S100, S200 and S300.
S100: providing the first plate 510, and first plate 510 includes the first cover board 100 and supporting element being fixedly connected
300, first cover board 100 and the supporting element 300 are integration setting, and first cover board 100 is by least partly described
Center 20 is constituted.Please refer to Figure 16.
Wherein, the first plate 510 is aluminum alloy material, and first cover board 100, the supporting element 300 are aluminium alloy material
Matter, first cover board 100 and the supporting element 300 are integrated, i.e., supporting element 300 is with the first cover board 100 same
It is formed together in manufacturing procedure.In one embodiment, the supporting element 300 and first cover board 100 are added by die casting
Work forms integral structure.In another embodiment, the supporting element 300 and first cover board 100 pass through at etching
Reason forms integral structure.
S200: providing the second plate 520, and second plate 520 includes the second cover board 200 and capillary knot being fixedly connected
Structure layer 400.Please refer to Figure 17.
Wherein, the second plate 520 is copper material, and second cover board 200 and the capillary structure layer 400 are copper material
Matter.
S300: second plate 520 and first plate 510 is fixed, so that second plate 520 and institute
Formation airtight cavity A between the first plate 510 is stated, and it is described that the supporting element 300 and the capillary structure layer 400 are located at
In airtight cavity A, the capillary structure layer 400 is held in the supporting element 300.Please refer to Figure 18.
About the structure of radiator 10, details are not described herein again, referring to the description of front.
Specifically, the second plate 520 and the first plate 510 mutually lid are closed and are fixed, in the first plate 510 and the second plate
Airtight cavity A is formed between material 520, supporting element 300 and capillary structure layer 400 are located in airtight cavity A, and supporting element 300 supports
It is held in capillary structure layer 400.It can be laser welding by the fixed mode of the second plate 520 and the first plate 510, or
Laser welding and the mutually matched mode of dispensing can also be other fixed forms.
Wherein, the capillary structure layer 400 be metal mesh structure, and the capillary structure layer 400 be held in it is described close
The inner wall of closed chamber body A.The capillary structure layer 400 is fixed on the surface of the second cover board 200, in one embodiment, described
Capillary structure layer 400 is fixed on the surface of second cover board 200 by sintering process.In another embodiment, described
Capillary structure layer 400 is fixed on the surface of second cover board 200 by welding procedure.The capillary structure layer 400 can also be with
With 200 integrated setting of the second cover board, i.e., formed together in same manufacturing procedure.
It is in one embodiment, described " S100: to provide the first plate 510, first plate please continue to refer to Figure 19
Material 510 includes the first cover board 100 and supporting element 300 being fixedly connected, and first cover board 100 and the supporting element 300 are one
Bodyization setting " includes but is not limited to S110 and S120, is described below about S110 and S120.
S110: the first plate 550 is provided.Please refer to Figure 20.
S120: die-casting process is carried out to first plate 550 using stamping parts 555, to form the of integrated setting
One cover board 100 and supporting element 300, and the supporting element 300 is located at the side of first cover board 100.Please refer to Figure 21.
Wherein, the first plate 550 is aluminum alloy material, die-casting process is carried out to the first plate 550, so that the first plate
510 deformations, to obtain the first cover board 100 and supporting element 300 of integrated setting, and supporting element 300 is located at the first cover board 100
Side.Further, after carrying out die casting processing to the first plate 550, then to by die casting treated the first plate 550 into
Row CNC processing, to obtain first cover board 100 with pre-set dimension and supporting element 300.
Please continue to refer to Figure 22, in another embodiment, described " S100: the first plate 510 of offer, described first
Plate 510 includes the first cover board 100 and supporting element 300 being fixedly connected, and first cover board 100 and the supporting element 300 are
Integrated setting " includes but is not limited to S130 and S140, is described below about S130 and S140.
S130: the second plate 560 is provided.Please refer to Figure 23.
S140: being etched second plate 560, to form the first cover board 100 and branch of integrated setting
Support member 300, and the supporting element 300 is located at the side of first cover board 100.Please refer to Figure 24.
Wherein, the second plate 560 is aluminum alloy material, is etched to the second plate 560, so that the second plate
520 deformations, to obtain the first cover board 100 and supporting element 300 of integrated setting, and supporting element 300 is located at the first cover board 100
Side.Further, after being etched to the second plate 560, then to the second plate 560 after etching process into
Row CNC processing, to obtain first cover board 100 with pre-set dimension and supporting element 300.
It is in one embodiment, described " S200: to provide the second plate 520, second plate please continue to refer to Figure 25
Material 520 includes the second cover board 200 being fixedly connected and capillary structure layer 400 " includes but is not limited to S210 and S220, about S210
It is described below with S220.
S210: the first blank 610 is provided.Please refer to Figure 26.
Wherein, the first blank 610 is copper material.
S220: handling the surface of first blank 610 using imprint process, to form the of integrated setting
Two cover boards 200 and capillary structure layer 400, and the capillary structure layer 400 is located at the side of second cover board 200.It please refers to
Figure 27.
Wherein, imprint process is placed on material between upper and lower mould, under pressure becomes its material thickness
Change, and by the material outside extruding, fill having that the mold cavity of fluctuating microgroove is convex, recess, and obtains having been formed in workpiece surface
Lie prostrate a kind of manufacturing process of the convex and printed words of drum or decorative pattern.Such as coin, souvenir badge etc. is shaped with the method for coining.
The capillary structure layer 400 is metal mesh structure.Specifically, using mold to the surface of the first blank 610 into
Row coining, so that the pattern of mold is revealed in the surface of the first blank 610, to obtain the second cover board of integrated setting
200 and capillary structure layer 400, and capillary structure layer 400 is located at the side of the second cover board 200.Second cover board 200 constitutes heat dissipation dress
10 the second cover board 200 is set, capillary structure layer 400 constitutes the capillary structure layer 400 of radiator 10.
Please continue to refer to Figure 28, in another embodiment, described " S200: the second plate 520 of offer, described second
Plate 520 include the second cover board 200 for being fixedly connected and capillary structure layer 400 " include but is not limited to S230, S240, S250 and
S260 is described below about S230, S240, S250 and S260.
S230: the second blank 620 and third blank 630 are provided.Please refer to Figure 29.
S240: being etched second blank 620, to obtain the capillary structure layer 400 of network.It please join
Read Figure 30.
S250: CNC processing is carried out to the third blank 630, to obtain the second cover board 200.
S260: the capillary structure layer 400 of the network and second cover board 200 are fixed, wherein described
" capillary structure layer 400 of the network and second cover board 200 are fixed " includes being fixed using sintering process
Or it is fixed using welding procedure.Please refer to Figure 31.
Wherein, the second blank 620 and third blank 630 are copper material, and the second blank 620 and third blank 630 are only
Vertical structure.By being etched to the second blank 620, the capillary structure layer 400 of network, the capillary structure are obtained
Layer 400 constitutes the capillary structure layer 400 of radiator 10.Second cover board 200 of the composition radiator 10 of third blank 630.It will
The capillary structure layer 400 of the network obtained by etching process is fixed on third blank 630.
In one embodiment, the capillary structure layer 400 of network is fixed on by the second cover board by sintering process
200.Wherein, sintering process is the temperature being heated to powder or powder compact lower than the wherein fusing point of basis, then with
Certain method and speed is cooled to the process of room temperature.Sintering the result is that bonded between powder particle, sintered body it is strong
Degree increases, and the aggregation of powder particle is turned into the agglomerate of crystal grain, thus the product of physics, mechanical performance needed for obtaining
Or material.Specifically, the capillary structure layer 400 of network is fitted on the surface of the second cover board 200, it is then heated to one
Determine temperature, so that the capillary structure layer 400 of network and the second the intermolecular of cover board 200 generate binding force at high temperature, connects
After heat preservation 20-30 minutes, the capillary structure layer 400 of network can be fixed on the second cover board 200.
In another embodiment, the capillary structure layer 400 of network is fixed on by the second lid by welding procedure
Plate 200.Specifically, can be by the way of laser welding.
Please continue to refer to Figure 32, in one embodiment, " the S300: by second plate 520 and described first
Plate 510 is fixed, so that forming airtight cavity A " between second plate 520 and first plate 510 and including but not
It is limited to S310 and S320, is described below about S310 and S320.
S310: first cover board 100 and second cover board 200 are spliced.
S320: it is carried out using connecting portion of the laser welding process to first cover board 100 and second cover board 200
Welding, so that forming airtight cavity A between first cover board 100 and second cover board 200.
Specifically, it is by the way of laser welding that first cover board 100 and second cover board 200 is fixed, and
Airtight cavity A is formed between first cover board 100 and the second cover board 200.Laser welding is made using the laser beam of high-energy density
For a kind of high-efficiency and precision welding method of heat source.It is mainly used for welding thin-walled material and low speed welding, welding process category heat transfer
Type, i.e. laser emission heat workpiece surface, and surface heat is internally spread by heat transfer, by the width for controlling laser pulse
The parameters such as degree, energy, peak power and repetition rate, melt workpiece, form specific molten bath.Due to its unique advantage,
It has been successfully applied in micro-, small parts precision welding.
Please continue to refer to Figure 33, in one embodiment, in " the S320: using laser welding process to described the
The connecting portion of one cover board 100 and second cover board 200 is welded " after, the assemble method of the electronic equipment also wraps
S321 is included but be not limited to, is described below about S321.
S321: to the week of the connecting portion of first cover board 100 and second cover board 200 after soldering
Side carries out dispensing processing, to promote the leakproofness of the airtight cavity A.
Specifically, in the present embodiment, first to the connecting portion of first cover board 100 and second cover board 200
Laser welding is carried out, then again to the connecting portion of first cover board 100 and second cover board 200 after welding
Side carries out gluing process processing, is the equal of the leakproofness of second lift airtight cavity A.
It further, can be using multiple mode for dispensing glue to the company of first cover board 100 and second cover board 200
Socket part position carries out dispensing sealing.And it can be carried out using continuous dispensing and interruption mode for dispensing glue.
The embodiment of the present application is described in detail above, specific case used herein to the principle of the application and
Embodiment is expounded, the description of the example is only used to help understand the method for the present application and its core ideas；
At the same time, for those skilled in the art can in specific embodiments and applications according to the thought of the application
There is change place, in conclusion the contents of this specification should not be construed as limiting the present application.
Claims (19)
1. a kind of electronic equipment, which is characterized in that the electronic equipment includes:
Radiator, the radiator include the first cover board, the second cover board, supporting element and capillary structure layer, second lid
Plate and first cover board enclose and set to form airtight cavity, and the supporting element is located in the airtight cavity, and the supporting element is from institute
It states the first cover board to extend out in face of the surface of second cover board, the supporting element and first cover board set for integration
It sets, the capillary structure layer is located in the airtight cavity, and the capillary structure layer is fixed on second cover board in face of described
The surface of first cover board, and the capillary structure layer is held in the supporting element；And
Center, the center at least partially constitute first cover board.
2. electronic equipment as described in claim 1, which is characterized in that the supporting element includes several support columns, several
The support column is arranged in array on the surface of first cover board, intersects the logical of connection to be formed in the airtight cavity
Road.
3. electronic equipment as described in claim 1, which is characterized in that first cover board has container, second lid
Plate is covered on the aperture position of the container, to form the closed chamber between first cover board and second cover board
Body.
4. electronic equipment as described in claim 1, which is characterized in that second cover board includes covering part and closes from the lid
The interconnecting piece that portion side extends out, the interconnecting piece are connected to first cover board, the covering part, the interconnecting piece and institute
It states the first cover board and encloses and set to form the airtight cavity.
5. electronic equipment as claimed in claim 4, which is characterized in that the covering part and the interconnecting piece set for integration
It sets, and interconnecting piece direction of plane from where perpendicular to the covering part extends out.
6. electronic equipment as described in claim 1, which is characterized in that first cover board has the first holding tank, and described the
Two cover boards have the second holding tank, and first holding tank and second holding tank constitute the airtight cavity.
7. electronic equipment as described in claim 1, which is characterized in that the capillary structure layer is metal mesh structure, and institute
State the inner wall that capillary structure layer is held in the airtight cavity.
8. the electronic equipment as described in claim 1-7 any one, which is characterized in that the radiator further includes sealing
Part, the sealing ring is around the side for being set to second cover board Yu the first cover board connecting portion.
9. electronic equipment as described in claim 1, which is characterized in that the radiator further includes sprue gate, the casting
Mouth is for injecting heat eliminating medium into the airtight cavity.
10. electronic equipment as described in claim 1, which is characterized in that the electronic equipment further includes display screen and electronics member
Part, the display screen are carried on the radiator, and the electronic component is located at the radiator away from the display screen
Side, the radiator is for conducting the heat from the electronic component.
11. electronic equipment as claimed in claim 10, which is characterized in that the electronic equipment further includes bond, described viscous
Fitting is used to for the display screen being fixed on first cover board, and the bond avoids the second cover board setting.
12. electronic equipment as claimed in claim 10, which is characterized in that the display screen has viewing area and around described aobvious
Show the non-display area in area, the setting of viewing area described in the radiator at least partly face.
13. the assemble method of a kind of electronic equipment, which is characterized in that the electronic equipment includes center, the electronic equipment
Assemble method includes:
The first plate is provided, first plate includes the first cover board and supporting element being fixedly connected, first cover board and institute
Supporting element is stated as integration setting, first cover board is made of at least partly described center；
The second plate is provided, second plate includes the second cover board being fixedly connected and capillary structure layer；
Second plate and first plate are fixed, so that being formed between second plate and first plate
Airtight cavity, and the supporting element and the capillary structure layer are located in the airtight cavity, the capillary structure layer is supported
It is held in the supporting element.
14. the assemble method of electronic equipment as claimed in claim 13, which is characterized in that described " first plate includes
The first cover board and supporting element being fixedly connected, first cover board and the supporting element are integration setting " include:
First plate is provided；
First plate is processed using die-casting process, to form the first cover board and supporting element of integrated setting, and
The supporting element is located at the side of first cover board.
15. the assemble method of electronic equipment as claimed in claim 13, which is characterized in that described " first plate includes
The first cover board and supporting element being fixedly connected, first cover board and the supporting element are integration setting " include:
Second plate is provided；
Second plate is etched, to form the first cover board and supporting element of integrated setting, and the support
Part is located at the side of first cover board.
16. the assemble method of electronic equipment as claimed in claim 13, which is characterized in that described " second plate includes
The second cover board and capillary structure layer being fixedly connected " include:
First blank is provided；
The surface of first blank is handled using imprint process, to form the second cover board and capillary of integrated setting
Structure sheaf, and the capillary structure layer is located at the side of second cover board.
17. the assemble method of electronic equipment as claimed in claim 13, which is characterized in that described " second plate includes
The second cover board and capillary structure layer being fixedly connected " include:
Second blank and third blank are provided；
Second blank is etched, to obtain the capillary structure layer of network；
CNC processing is carried out to the third blank, to obtain the second cover board；
The capillary structure layer of the network and second cover board are fixed, wherein described " by the network
Capillary structure layer be fixed with second cover board " include fixing or being fixed using welding procedure using sintering process.
18. the assemble method of electronic equipment as claimed in claim 13, which is characterized in that it is described " by second plate with
First plate is fixed, so that forming airtight cavity between second plate and first plate " include:
First cover board and second cover board are spliced；
It is welded using connecting portion of the laser welding process to first cover board and second cover board, so that described
Airtight cavity is formed between first cover board and second cover board.
19. the assemble method of electronic equipment as claimed in claim 18, which is characterized in that " use laser welding work described
Skill welds the connecting portion of first cover board and second cover board " after, the assemble method of the electronic equipment
Further include:
Dispensing processing is carried out to the side of the connecting portion of first cover board and second cover board after soldering,
To promote the leakproofness of the airtight cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910685497.8A CN110402067A (en) | 2019-07-27 | 2019-07-27 | The assemble method of electronic equipment and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910685497.8A CN110402067A (en) | 2019-07-27 | 2019-07-27 | The assemble method of electronic equipment and electronic equipment |
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| Publication Number | Publication Date |
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| CN110402067A true CN110402067A (en) | 2019-11-01 |
Family
ID=68326131
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910685497.8A Pending CN110402067A (en) | 2019-07-27 | 2019-07-27 | The assemble method of electronic equipment and electronic equipment |
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| CN (1) | CN110402067A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110278700A (en) * | 2019-07-27 | 2019-09-24 | Oppo（重庆）智能科技有限公司 | Electronic equipment and its assemble method |
| CN111031157A (en) * | 2019-12-13 | 2020-04-17 | Oppo广东移动通信有限公司 | Glass cover plate, manufacturing method thereof and electronic equipment |
| CN111356345A (en) * | 2020-04-08 | 2020-06-30 | 江苏精研科技股份有限公司 | Mobile phone middle frame |
| CN111432598A (en) * | 2020-03-04 | 2020-07-17 | Oppo广东移动通信有限公司 | Shell assembly of electronic equipment and electronic equipment |
| CN111712082A (en) * | 2020-07-02 | 2020-09-25 | Oppo广东移动通信有限公司 | Shell assembly of electronic equipment, electronic equipment and assembling method |
| CN114466557A (en) * | 2021-08-16 | 2022-05-10 | 荣耀终端有限公司 | Housing for electronic device, and method for manufacturing housing for electronic device |
| WO2022135262A1 (en) * | 2020-12-21 | 2022-06-30 | 维沃移动通信有限公司 | Electronic device |
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| EP0524460B1 (en) * | 1991-07-23 | 1997-06-11 | Siemens Aktiengesellschaft | Housing for a handheld radio transceiver |
| CN201805672U (en) * | 2010-09-29 | 2011-04-20 | 游明郎 | Uniform temperature plate with supporting columns |
| CN109890174A (en) * | 2018-12-14 | 2019-06-14 | 奇鋐科技股份有限公司 | Center radiator structure |
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| EP0524460B1 (en) * | 1991-07-23 | 1997-06-11 | Siemens Aktiengesellschaft | Housing for a handheld radio transceiver |
| CN201805672U (en) * | 2010-09-29 | 2011-04-20 | 游明郎 | Uniform temperature plate with supporting columns |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110278700A (en) * | 2019-07-27 | 2019-09-24 | Oppo（重庆）智能科技有限公司 | Electronic equipment and its assemble method |
| CN111031157A (en) * | 2019-12-13 | 2020-04-17 | Oppo广东移动通信有限公司 | Glass cover plate, manufacturing method thereof and electronic equipment |
| CN111432598A (en) * | 2020-03-04 | 2020-07-17 | Oppo广东移动通信有限公司 | Shell assembly of electronic equipment and electronic equipment |
| CN111356345A (en) * | 2020-04-08 | 2020-06-30 | 江苏精研科技股份有限公司 | Mobile phone middle frame |
| CN111712082A (en) * | 2020-07-02 | 2020-09-25 | Oppo广东移动通信有限公司 | Shell assembly of electronic equipment, electronic equipment and assembling method |
| WO2022135262A1 (en) * | 2020-12-21 | 2022-06-30 | 维沃移动通信有限公司 | Electronic device |
| CN114466557A (en) * | 2021-08-16 | 2022-05-10 | 荣耀终端有限公司 | Housing for electronic device, and method for manufacturing housing for electronic device |
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Application publication date: 20191101 |