CN114466557A - Housing for electronic device, and method for manufacturing housing for electronic device - Google Patents
Housing for electronic device, and method for manufacturing housing for electronic device Download PDFInfo
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- CN114466557A CN114466557A CN202110937265.4A CN202110937265A CN114466557A CN 114466557 A CN114466557 A CN 114466557A CN 202110937265 A CN202110937265 A CN 202110937265A CN 114466557 A CN114466557 A CN 114466557A
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- Prior art keywords
- heat
- support frame
- electronic device
- conductive sheet
- heat conducting
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The embodiment of the application provides a shell of electronic equipment, the electronic equipment and a shell manufacturing method of the electronic equipment. The housing of the electronic device comprises at least: a support frame; the heat conducting fin is connected with the supporting frame to form a sealed cavity, the heat conducting fin comprises an evaporation end and a condensation end, the wall surface of the heat conducting fin facing the sealed cavity is provided with a capillary structure, and the capillary structure and the heat conducting fin are integrally formed; the working medium is filled in the sealed chamber, and the capillary structure is used for enabling the working medium to flow back to the evaporation end from the condensation end. The electronic equipment shell provided by the embodiment of the application can solve the problem that the whole thickness of the electronic equipment is relatively thicker in the prior art.
Description
Technical Field
The embodiment of the application relates to the technical field of mobile terminals, in particular to a shell of electronic equipment, the electronic equipment and a shell manufacturing method of the electronic equipment.
Background
As electronic devices such as smart phones or tablet computers (PADs) have increased in explosive manner, the functions of the electronic devices have become more and more. The housing of the electronic device integrates various electronic components, such as a central processing unit, an intelligent algorithm chip or sensor, etc. These electronic components generate a large amount of heat during operation. This heat, when concentrated inside the electronic device, can affect the performance of the electronic components. Therefore, the heat needs to be dissipated in time through the heat dissipation structure. At present, a vapor chamber is independently provided inside a case of an electronic device to perform heat exchange with an electronic component, and then the vapor chamber transfers heat to the case to perform heat dissipation. However, the overall thickness of the electronic device using the vapor chamber is relatively thick, which affects the development of miniaturization and lightness of the electronic device.
Disclosure of Invention
The embodiment of the application provides a shell of electronic equipment, the electronic equipment and a shell manufacturing method of the electronic equipment, and can solve the problem that the whole thickness of the electronic equipment is relatively thicker in the prior art.
A first aspect of the present application provides a housing of an electronic device, comprising at least:
a support frame;
the heat conducting fin is connected with the supporting frame to form a sealed cavity, the heat conducting fin comprises an evaporation end and a condensation end, the wall surface of the heat conducting fin facing the sealed cavity is provided with a capillary structure, and the capillary structure and the heat conducting fin are integrally formed;
the working medium is filled in the sealed chamber, and the capillary structure is used for enabling the working medium to flow back to the evaporation end from the condensation end.
The shell of the electronic equipment of the embodiment of the application comprises a supporting frame and a heat conducting sheet. The heat-conducting sheet is connected to the support frame and the heat-conducting sheet and the support frame form a sealed chamber. The heat conducting sheet is directly provided with a capillary structure. After the working medium is filled in the sealed cavity, the working medium can circulate between the evaporation end and the condensation end of the heat conducting sheet so as to transfer the heat of the heat source to the supporting frame and then to the outside of the electronic equipment through the supporting frame, thereby cooling the heat source. The electronic equipment's of this application embodiment casing passes through the mode that forms heat transfer structure after conducting strip and the carriage equipment, for the heat transfer structure that adopts heat-conducting plate down and the mutual lock of last heat-conducting plate to form among the prior art, can reduce a heat-conducting plate down to no longer need additionally use the piece that bonds to bond heat transfer structure in the carriage, thereby be favorable to reducing heat transfer structure's thickness, and then be favorable to reducing electronic equipment's whole thickness. Because the capillary structure is directly formed on the heat-conducting sheet, the capillary structure does not need to be additionally arranged and needs to be connected with the heat-conducting sheet, and the capillary structure does not need to be arranged between the heat-conducting sheet and the supporting frame in a reserved space, so that the heat exchange structure is more compact, the thickness of the heat exchange structure is favorably further reduced, the overall thickness of the electronic equipment is favorably further reduced, and the miniaturization and the light weight of the electronic equipment are realized.
In a possible embodiment, the wall surface of the heat conducting sheet facing the sealed chamber is provided with a capillary groove extending in a direction from the evaporation end to the condensation end, the capillary groove forming a capillary structure.
In a possible embodiment, the wall surface of the heat conducting sheet facing the sealed chamber further has a first steam flow channel, the first steam flow channel is arranged in a direction from the evaporation end to the condensation end, and the capillary structure is arranged at a distance from the first steam flow channel.
In one possible embodiment, the wall of the support frame facing the sealed chamber has a second steam flow channel, which is arranged in the direction from the evaporation end to the condensation end.
In a possible embodiment, at least part of the surface of the heat conducting sheet facing the support frame is in contact with the surface of the support frame facing the heat conducting sheet within the sealed chamber.
In one possible embodiment, the support frame is provided with an accommodating portion in which at least a part of the heat-conducting sheet is accommodated.
In one possible embodiment, the sealed chamber is a vacuum chamber.
In one possible embodiment, the heat conducting sheet is welded and sealed to the support frame.
In a possible embodiment, at least one of the wall surface of the support frame facing the sealed chamber and the wall surface of the heat-conducting fin facing the sealed chamber is provided with a protective coating.
In a possible embodiment, the supporting frame includes a battery accommodating cavity, and the heat conducting sheet is disposed on a side of the supporting frame opposite to the battery accommodating cavity.
In a possible implementation manner, the supporting frame comprises an avoiding hole for avoiding the camera module, and the evaporation end is arranged close to the avoiding hole.
A second aspect of the embodiments of the present application provides an electronic device, which includes a housing of the electronic device according to the above embodiments.
In a possible implementation manner, the electronic device further comprises a screen assembly, the heat conducting sheet is arranged on one side, facing the screen assembly, of the supporting frame, and a gap is formed between the heat conducting sheet and the screen assembly.
In a possible implementation manner, the electronic device further includes a circuit board, and the evaporation end of the heat conduction sheet is disposed corresponding to the circuit board, and the evaporation end is configured to absorb heat of the circuit board.
A third aspect of the embodiments of the present application provides a method for manufacturing a housing of an electronic device, including at least:
providing a support frame;
providing a heat conducting fin with a capillary structure, wherein the capillary structure and the heat conducting fin are integrally formed, and the heat conducting fin is connected with a support frame to form a cavity and a preformed hole communicated with the cavity;
injecting working medium into the cavity through the reserved hole;
the preformed hole is sealed, and the heat conducting fins and the supporting frame form a sealed chamber.
In a possible implementation mode, the carriage includes first trompil and treats the cutting board, and the conducting strip includes and treats the range upon range of district that the cutting board folded the setting, and the conducting strip is connected the back with the carriage, at range upon range of district with treat that the cutting board forms the preformed hole, after sealed preformed hole step, the excision is treated cutting board and range upon range of district in order to form the second trompil, and first trompil and second trompil intercommunication form dodges the hole, dodges the hole and is used for dodging the module of making a video recording.
Drawings
Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application;
fig. 2 is a schematic partial exploded view of an electronic device according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of a housing of an electronic device according to an embodiment of the present disclosure;
FIG. 4 is a schematic front view of the electronic device of the embodiment shown in FIG. 1;
FIG. 5 is a schematic sectional view taken along line A-A in FIG. 4;
FIG. 6 is an enlarged view of B in FIG. 5;
fig. 7 is a schematic partial cross-sectional structural diagram of an electronic device according to an embodiment of the present application;
fig. 8 is a schematic flowchart of a method for manufacturing a housing of an electronic device according to an embodiment of the present disclosure;
fig. 9 is a schematic diagram illustrating a first state of a housing of an electronic device during a processing process according to an embodiment of the present application;
fig. 10 is a schematic diagram of a second state of the electronic device in the process of manufacturing the housing according to the embodiment of the present application.
In the drawings, the drawings are not necessarily to scale.
Description of reference numerals:
10. an electronic device; 11. a housing;
20. a support frame; 21. an inner frame; 22. an outer frame; 23. a second steam flow path; 24. an accommodating portion; 25. a battery receiving cavity; 26. avoiding holes; 261. a first opening; 262. a second opening; 27. a plate to be cut;
30. a heat conductive sheet; 31. an evaporation end; 32. a condensing end; 33. a capillary structure; 34. a first steam flow path; 35. a laminating area;
40. welding and printing;
50. a protective coating;
60. a circuit board; 61. a circuit board main body; 62. an electronic component;
70. a battery;
80. a screen assembly;
90. a gap;
100. a rear cover;
110. a heat sink;
120. a delivery pipe;
130. cutting an interface;
x, thickness direction.
Detailed Description
Fig. 1 schematically shows the structure of an electronic apparatus 1 of an embodiment. Referring to fig. 1, an electronic device 1 in the embodiment of the present application may be referred to as a User Equipment (UE), a terminal (terminal), or the like, for example, the electronic device 1 may be a mobile terminal or a fixed terminal having a display screen, such as a tablet computer (PAD), a Personal Digital Assistant (PDA), a handheld device having a wireless communication function, a computing device, a vehicle-mounted device, a wearable device, a Virtual Reality (VR) terminal device, an Augmented Reality (AR) terminal device, a wireless terminal in industrial control (industrial control), a wireless terminal in self driving (self driving), a wireless terminal in remote medical (remote medical), a wireless terminal in smart grid (smart grid), a wireless terminal in transportation safety (transportation safety), a wireless terminal in smart city (smart city), and a wireless terminal in smart home (smart home). The form of the terminal device is not particularly limited in the embodiment of the present application.
In the embodiment of the present application, the electronic device 1 is taken as an example of a handheld device having a wireless communication function. The handheld device of the wireless communication function may be, for example, a handheld telephone.
Fig. 2 schematically shows a partially exploded structure of the electronic apparatus 1 of an embodiment. Referring to fig. 1 and 2, an electronic device 1 of the embodiment of the present application includes a housing 11, a screen assembly 80, a circuit board 60, and a battery 70. The screen assembly 80 is mounted to the housing 11 with the display area of the screen assembly 80 exposed for presentation of image information to a user. The circuit board 60 and the battery 70 are disposed within the housing 11 and located inside the screen assembly 80, so that the circuit board 60 and the battery 70 are not easily visible to a user outside the electronic device 1. The circuit board 60 includes a circuit board main body 61 and an electronic component 62 mounted on the circuit board main body 61. The electronic components 62 include, but are not limited to, a processor, an antenna module, a bluetooth module, a WiFi module, a GPS module, a power and charging module, a screen display and operation module, a camera, a distance sensor, a light sensor, a headset interface, and a USB interface. Since the internal space of the electronic device 1 is relatively narrow, the electronic components 62 are highly integrated on the circuit board main body 61, so as to sufficiently reduce the volume of the circuit board 60 and reduce the space occupancy rate of the circuit board 60. After the electronic components 62 are highly integrated, heat generated by the electronic components 62 is also easily accumulated in a certain space, which causes the temperature of the electronic components 62 to increase, and affects the working performance of the electronic components 62. For example, in a scene where a user plays a game, plays a video, or calls for a long time using the electronic apparatus 1, the electronic component 62 of the electronic apparatus 1 generates a large amount of heat due to continuous operation for a long time, and thus forms a heat source. The user can obviously feel the temperature rise of the electronic apparatus 1 from the outside of the electronic apparatus 1. Therefore, the heat needs to be dissipated from the inside of the electronic device 1 to the outside of the electronic device 1 in time, so that the ambient temperature at the position of the electronic element 62 is within the normal operating temperature range, and the stable operation of the electronic element 62 is ensured.
In order to improve the heat dissipation efficiency of the electronic component 62, the heat spreader is applied to the electronic apparatus 1 with good heat dissipation performance. The soaking plate comprises a lower heat conducting plate, an upper heat conducting plate and a capillary structural part additionally arranged between the lower heat conducting plate and the upper heat conducting plate. The upper heat conducting plate and the lower heat conducting plate are connected in a welding mode. A cavity is formed between the upper heat conducting plate and the lower heat conducting plate, and the capillary structure is positioned in the cavity. Working medium is filled in the cavity. It should be noted that the working medium refers to a medium that can be used for heat exchange. The working substance may be a liquid, for example the working substance may be water. The vapor chamber includes an evaporation end and a condensation end. The working medium at the evaporation end absorbs heat from the heat source to be vaporized to form steam. The steam diffuses and flows to the condensation end and is condensed at the condensation end to emit heat. The heat is transferred to the housing 11 and dissipated to the outside of the electronic device 1 through the housing 11. The capillary structure absorbs the condensed working medium from the condensation end to the evaporation end through the capillary action, so that the working medium exchanges heat in a reciprocating circulation mode, and the heat is continuously transferred to the shell 11.
The vapor chamber manufactured separately needs to be assembled with the case 11. When the soaking plate and the casing 11 are assembled, the soaking plate needs to be adhered to the casing 11 by an adhesive member, for example, the lower heat conducting plate of the soaking plate is adhered to the casing 11 by an adhesive member. In the thickness direction X of the electronic apparatus 1, a space is required to be provided between the vapor chamber and the case 11 for an adhesive member, thereby increasing the thickness of the electronic apparatus 1 as a whole.
In addition, in order to improve the cruising ability of the electronic apparatus 1, the capacity of the battery 70 is continuously increased, so that the size of the battery 70 is increased, and more space is occupied, thereby increasing the overall thickness of the electronic apparatus 1. The heat spreader itself needs to have a sufficiently large area in order to ensure the heat dissipation efficiency, so that the heat spreader may overlap the battery 70, and the overall thickness of the electronic apparatus 1 is further increased for the same capacity of the battery 70.
Based on the above-mentioned problem of finding, the embodiment of the present application provides a casing 11 of electronic equipment 1, forms heat transfer structure through the mode that directly sets up conducting strip 30 on carriage 20 to can effectively improve heat transfer structure's compactedness, reduce heat transfer structure's thickness, and then be favorable to reducing electronic equipment 1's whole thickness.
The following describes in detail an implementation of the housing 11 of the electronic device 1 provided in the embodiment of the present application.
Fig. 3 schematically shows the structure of the housing 11 of the electronic apparatus 1 of an embodiment. Referring to fig. 2 and 3, the housing 11 of the electronic apparatus 1 of the embodiment of the present application includes at least a support frame 20 and a heat conductive sheet 30. The thermally conductive sheet 30 and the support frame 20 are joined to form a sealed chamber. The sealed chamber is filled with working medium. The heat conductive sheet 30 includes an evaporation end 31 and a condensation end 32.
Fig. 4 schematically shows a front view structure of the electronic apparatus 1 of an embodiment. Referring to fig. 4 to 6, the heat conductive sheet 30 has a capillary structure 33 on a wall surface facing the sealed chamber. The capillary structure 33 is integrally formed with the heat conductive sheet 30. The capillary structure 33 is used to return the working substance from the condensation end 32 to the evaporation end 31.
The support frame 20 may provide a support base and a mounting base for the circuit board 60 or the screen assembly 80. The support frame 20 includes an inner frame 21 and an outer frame 22 disposed around the inner frame 21. In the assembled electronic device 1, the inner frame 21 of the support frame 20 is hidden inside the electronic device 1. The circuit board 60 or the battery 70 may be connected to the inner frame 21. The outer side of the outer frame 22 of the supporting frame 20 is exposed outside the electronic device 1. The outer frame 22 can be provided with a power key mounting hole, a volume control key mounting hole, an earphone interface mounting hole, a speaker opening hole and a charging interface mounting hole. Exemplarily, the support frame 20 may be a middle frame of the electronic device 1.
The thermally conductive sheet 30 itself has good thermal conductivity and high thermal conductivity. The heat conduction sheet 30 may be hermetically connected to the support frame 20 by welding or bonding, so that the heat conduction sheet 30 and the support frame 20 form a sealed chamber. The evaporation end 31 of the heat conduction sheet 30 can absorb heat from a heat source, so that the working medium on the wall surface of the evaporation end 31 facing the sealed chamber can be vaporized after absorbing heat, and is converted from a liquid state to a gas state. The vaporized working substance forms a vapor and is released from the capillary structure 33. The steam can diffuse along the sealed chamber from the evaporation end 31 (high pressure zone) to the condensation end 32 (low pressure zone). When the vapor contacts the cooler condensation end 32, it condenses into a liquid and releases heat. The heat released from the condensation end 32 is transferred to the support frame 20 and dissipated to the outside of the electronic device 1 through the support frame 20. The liquid in the condensation end 32 flows back to the evaporation end 31 to absorb heat again under the capillary action of the capillary structure 33, so that a circulating heat exchange system with two liquid phases is formed, heat is continuously absorbed from a heat source, and heat is released in the condensation end 32. The working substance may be water, for example.
The integral molding of the capillary structure 33 with the heat conductive sheet 30 means that the capillary structure 33 is formed directly on the heat conductive sheet 30, so that the capillary structure 33 and the heat conductive sheet 30 are an integral structure. The wall surface of the heat-conducting sheet 30 facing the sealed chamber may be provided with a micro-porous channel or a micro-groove. The micro-pore channel or micro-groove forms a capillary structure 33.
The housing 11 of the electronic apparatus 1 of the embodiment of the present application includes the support frame 20 and the heat conductive sheet 30. The thermally conductive sheet 30 is attached to the support frame 20 and the thermally conductive sheet 30 and the support frame 20 form a sealed chamber. The heat conductive sheet 30 is directly provided with the capillary structure 33. After the sealed chamber is filled with the working medium, the working medium can circulate between the evaporation end 31 and the condensation end 32 of the heat conducting sheet 30 to transfer the heat of the heat source to the supporting frame 20, and then the heat is transferred to the outside of the electronic device 1 through the supporting frame 20, so that the heat source is cooled. The shell 11 of the electronic device 1 of the embodiment of the application forms the mode of heat transfer structure after assembling through the heat-conducting fins 30 and the support frame 20, for the heat transfer structure that adopts the mutual lock of heat-conducting plate down and last heat-conducting plate to form among the prior art, can reduce a lower heat-conducting plate, and no longer need additionally use the piece that bonds to bond heat transfer structure in support frame 20, thereby be favorable to reducing heat transfer structure's thickness, and then be favorable to reducing the whole thickness of electronic device 1. Because capillary structure 33 is directly formed on heat conducting strip 30, it is not necessary to additionally provide a capillary structure and to connect the capillary structure with heat conducting strip 30, and it is not necessary to provide a capillary structure between heat conducting strip 30 and support frame 20, so that the heat exchange structure is more compact, and the thickness of the heat exchange structure is further reduced, and further the whole thickness of electronic device 1 is further reduced, and the miniaturization and the lightness of electronic device 1 are realized.
Compared with the way of assembling the heat conducting sheet 30 and the capillary structure, the way of directly forming the capillary structure 33 on the heat conducting sheet 30 is relatively simple and compact in structure; on the other hand, the working procedure of assembling and connecting the heat-conducting fin 30 and the additionally arranged capillary structure is reduced, and the processing difficulty is favorably reduced; on the other hand, if the heat conductive sheet 30 and the capillary structure are separate structures, when the capillary structure receives an external force, the capillary structure may be separated from the heat conductive sheet 30 or the capillary structure may be misaligned with respect to the heat conductive sheet 30, and the capillary structure 33 is directly formed on the heat conductive sheet 30 of the present application, which may reduce the possibility of the above problem.
In some embodiments, referring to fig. 3, the support frame 20 includes an avoidance hole 26 for avoiding the camera module. The camera module is used for shooting pictures or recording videos. Dodge hole 26 is used for corresponding the setting module of making a video recording. The evaporation end 31 of the heat conductive sheet 30 is disposed near the relief hole 26 of the support frame 20. The evaporation end 31 of the heat conduction sheet 30 is spaced apart from the avoiding hole 26, so that a predetermined distance is provided between the evaporation end 31 of the heat conduction sheet 30 and the edge of the avoiding hole 26.
In some embodiments, the heat-conducting sheet 30 is provided with capillary grooves on the wall surface facing the sealed chamber. The capillary groove extends in the direction from the evaporation end 31 to the condensation end 32. The capillary groove forms a capillary structure 33. The capillary groove can be a continuously extending groove structure, so that the working medium can smoothly flow in the capillary groove. The working medium in the capillary groove of the evaporation end 31 is vaporized to form steam after absorbing heat from the outside, and the steam is separated from the capillary groove and flows to the condensation end 32. The vapor condenses at the condensation end 32 releasing heat and liquefies. The capillary grooves of the condensation end 32 will suck the working medium and deliver it to the evaporation end 31. Therefore, the capillary grooves on the heat conducting fins 30 can continuously convey the working medium from the condensation end 32 to the evaporation end 31, and the working medium absorbs heat at the evaporation end 31, evaporates and departs from the capillary grooves, flows to the condensation end 32, condenses and releases heat, so that the working medium circularly flows and continuously exchanges heat. During the condensation of the vapor, the heat released can be conducted to the support frame 20 and then conducted from the support frame 20 to the outside of the electronic device 1. Illustratively, the capillary groove is a micro groove having a width of 0.1 mm or less. For example, the width of the capillary groove may range from 0.02 mm to 0.1 mm. The thickness of the heat conductive sheet 30 may be 0.18 mm, and the maximum depth of the capillary groove may be 0.12 mm. For example, the depth of the capillary groove may range from 0.03 mm to 0.12 mm. The capillary groove may be directly formed on the wall surface of the heat conductive sheet 30 by using a laser engraving technique or a chemical etching process.
The heat conducting fins 30 are provided with a plurality of capillary grooves, so that more working media can be sucked to the evaporation end 31 for heat exchange in unit time, and the heat exchange efficiency can be improved. A plurality of capillary grooves may be spaced apart from one another.
Referring to fig. 6, the wall surface of the heat-conducting sheet 30 facing the sealed chamber further has a first steam flow path 34. The first steam flow channel 34 is disposed in a direction from the evaporation end 31 to the condensation end 32. The capillary structure 33 is arranged spaced apart from the first vapor flow channel 34. It should be noted that, the capillary structure 33 is spaced from the first vapor flow channel 34, which means that there is a predetermined distance between the capillary structure 33 and the first vapor flow channel 34. Vapor formed at the evaporation end 31 flows through the first vapor flow passage 34 to the condensation end 32. The first steam flow channel 34 can guide the steam to flow, so that the steam flow resistance can be reduced, the steam can be rapidly diffused, and the possibility that the steam is greatly accumulated at the evaporation end 31 to influence the heat exchange efficiency is reduced. The capillary structure 33 and the first vapor flow channel 34 are provided at different regions on the heat conductive sheet 30. For example, the first vapor flow channel 34 may be disposed on an edge region of the heat conductive sheet 30 near itself, and the capillary structure 33 may be disposed on a middle region of the heat conductive sheet 30 near itself, and the capillary structure 33 is located inside the first vapor flow channel 34. For example, the first steam flow passage 34 may be a groove extending in a direction from the evaporation end 31 to the condensation end 32, and the steam may smoothly flow in the groove. The width of the first steam flow channel 34 is above 0.2 mm. For example, the width of the first steam flow channel 34 ranges from 0.2 mm to 0.9 mm. The first vapor flow passage 34 may be directly formed on the wall surface of the heat conductive sheet 30 using a laser engraving technique or a chemical etching process.
The wall of the support frame 20 facing the sealed chamber has a second steam flow channel 23. The second steam flow channel 23 is provided in a direction from the evaporation end 31 to the condensation end 32. The vapor formed at the evaporation end 31 will diffuse through the second vapor flow path 23 to the condensation end 32. The second steam flow channel 23 can guide the steam to flow, so that the flow resistance of the steam can be reduced, the steam can be rapidly diffused, and the possibility that the steam is greatly accumulated at the evaporation end 31 to influence the heat exchange efficiency is reduced. When the first steam flow channel 34 is disposed on the heat conducting sheet 30, the first steam flow channel 34 and the second steam flow channel 23 can simultaneously guide the steam to flow, so that the steam can be more quickly diffused to the condensation end 32, which is beneficial to improving the heat exchange efficiency. For example, in the thickness direction X of the electronic apparatus 1, the position of the first vapor flow path 34 and the position of the second vapor flow path 23 may correspond to each other. The opening of the first steam flow channel 34 faces the opening of the second steam flow channel 23. For example, the second steam flow channel 23 may be a groove extending in a direction from the evaporation end 31 to the condensation end 32, and the steam may smoothly flow in the groove. The width of the second steam flow channel 23 is above 0.2 mm. For example, the width of the second steam flow channel 23 ranges from 0.2 mm to 0.9 mm. The second vapor flow channel 23 may be directly formed on the wall surface of the support frame 20 using a laser engraving technique or a chemical etching process.
The heat-conducting sheet 30 itself has a small thickness, which can ensure that the heat-conducting sheet 30 has good heat-conducting performance, but the heat-conducting sheet 30 with the small thickness is easy to deform. In the sealed chamber, at least a part of the surface of the heat conductive sheet 30 facing the support frame 20 is in contact with the surface of the support frame 20 facing the heat conductive sheet 30. In the contact area between the heat-conducting sheet 30 and the support frame 20, the support frame 20 can directly provide a supporting force for the heat-conducting sheet 30, and the possibility of the heat-conducting sheet 30 collapsing and deforming towards the support frame 20 due to the absence of support below is reduced, so that the surface of the heat-conducting sheet 30 opposite to the support frame 20 can be in a flat state. If the heat conducting fin 30 is deformed due to collapse, the problem that the sealing chamber is compressed or the capillary structure 33 on the heat conducting fin 30 is deformed due to extrusion and fails exists, so that the normal circulating heat exchange of the working medium is influenced, and the heat exchange efficiency is reduced. Through the mode that carriage 20 directly provided the holding power for conducting strip 30, can need not the headspace additionally to set up the support column and come to provide the holding power to conducting strip 30 to be favorable to improving the compactness of the heat transfer structure that carriage 20 and conducting strip 30 formed, reduce heat transfer structure's thickness, further reduce the space occupancy of heat transfer structure on the thickness direction X of electronic equipment 1, and then be favorable to further reducing electronic equipment 1's whole thickness.
Referring to fig. 2 and 6, the support frame 20 is provided with an accommodating portion 24. At least a portion of the heat conductive sheet 30 is accommodated in the accommodating portion 24, so that at least a portion of the heat conductive sheet 30 sinks into the support frame 20, thereby facilitating reduction of the thickness of the heat exchange structure formed by the heat conductive sheet 30 and the support frame 20 in the thickness direction X of the electronic apparatus 1, and further reducing the overall thickness of the electronic apparatus 1. Meanwhile, at least part of the heat-conducting sheet 30 is accommodated in the accommodating portion 24, so that a gap between the surface of the supporting frame 20, on which the opening of the accommodating portion 24 is formed, and other structural members can be reduced, which is also beneficial to saving space in the thickness direction X and reducing the overall thickness of the electronic device 1. In addition, the support frame 20 can protect the portion of the thermally conductive sheet 30 that is accommodated in the accommodating portion 24, so that the portion of the thermally conductive sheet 30 is less likely to be broken or deformed by an impact from an external structural member. When the thermally conductive sheet 30 and the support frame 20 are connected by welding, the solder mark 40 is located in the accommodating portion 24, so that the support frame 20 can also protect the welding area, and the possibility that the solder mark 40 is cracked due to impact is reduced. Illustratively, the heat conductive sheet 30 is entirely accommodated in the accommodating portion 24. The outer surface of the heat-conducting sheet 30 facing away from the sealed chamber is flush with the surface of the support frame 20. The heat conductive sheet 30 has an outer contour shape matching the shape of the accommodating portion 24. Illustratively, the receiving portion 24 may be formed by machining or molding.
The sealed chamber is a vacuum chamber. The working medium at the evaporation end 31 of the heat conducting sheet 30 can generate liquid phase vaporization phenomenon in a vacuum environment to form steam. The working medium has a large amount of latent heat when the phase change phenomenon occurs, and the volume can expand rapidly in a vacuum environment after steam is formed, which is beneficial to improving the heat dissipation effect of the heat exchange structure formed by the heat conducting fins 30 and the supporting frame 20. For example, the heat-conducting sheet 30 and the support frame 20 may be connected in a vacuum environment, so as to ensure that the sealed chamber is in a vacuum environment. Alternatively, the thermally conductive sheet 30 and the support frame 20 may be connected in a non-vacuum environment, and then the sealed chamber is evacuated to form a vacuum environment.
The heat conducting sheet 30 is welded and sealed with the support frame 20, so that the connection strength between the heat conducting sheet 30 and the support frame 20 is high, the connection stability is high, the heat conducting sheet 30 and the support frame 20 are not easy to separate, and the sealing reliability between the heat conducting sheet 30 and the support frame 20 can be effectively improved. Meanwhile, the heat conducting fin 30 and the supporting frame 20 are directly welded and connected without using an additional connecting piece (such as a fastening piece or an adhesive piece) to connect the heat conducting fin 30 and the supporting frame 20, which is beneficial to simplifying the structure of the heat exchange structure formed by the heat conducting fin 30 and the supporting frame 20 and reducing the whole volume of the heat exchange structure, thereby being beneficial to reducing the thickness of the heat exchange structure. The edge area of the heat-conductive sheet 30 may be welded with the support frame 20 to form the annular weld 40. Illustratively, the material of the support frame 20 may be aluminum or an aluminum alloy. The material of the heat conductive sheet 30 may be steel, copper, a copper alloy, aluminum, or an aluminum alloy. The thermally conductive sheet 30 and the support frame 20 may be joined by ultrasonic welding.
The support frame 20 may be made of a metal material, which is beneficial to improving heat dissipation performance. The possibility of chemical reaction between the working medium in the sealed cavity and the support frame 20 exists, so that the support frame 20 is oxidized or corroded, and the heat dissipation performance of the support frame 20 is affected. Fig. 7 schematically shows a partially cut-away structure of the electronic apparatus 1 of an embodiment. Referring to fig. 7, the wall of the support frame 20 facing the sealed chamber is provided with a protective coating 50. The protective coating 50 may protect the support frame 20. The protective coating 50 can isolate the working medium from the support frame 20, so that the working medium is not easy to contact with the support frame 20 to cause chemical reaction. Illustratively, the protective coating 50 may be an oxidation resistant layer, for example, the protective coating 50 may be a copper or silver plated layer.
The heat conductive sheet 30 may be made of a metal material, which is advantageous for improving heat dissipation performance. The possibility of chemical reaction between the working medium in the sealed chamber and the heat conducting sheet 30 exists, so that the heat conducting sheet 30 is oxidized or corroded, and the heat radiation performance of the heat conducting sheet 30 is affected. The wall surface of the heat-conducting sheet 30 facing the sealed chamber is provided with a protective coating 50. The protective coating 50 can protect the thermally conductive sheet 30. The protective coating 50 can isolate the working medium from the heat-conducting fin 30, so that the working medium is not easy to contact with the heat-conducting fin 30 to cause chemical reaction. Illustratively, the protective coating 50 may be an oxidation resistant layer, for example, the protective coating 50 may be a silver plated layer.
It is understood that, in order to reduce the possibility of chemical reaction occurring when the support frame 20 and the heat conductive sheet 30 are both in contact with the working medium, the protective coating 50 is provided on both the support frame 20 and the heat conductive sheet 30.
Referring to fig. 6, the support frame 20 further includes a battery receiving cavity 25 for receiving a battery 70. The heat conductive sheet 30 is disposed on a side of the support frame 20 facing away from the battery receiving cavity 25. The battery 70 is used for supplying power to the electronic components 62 of the electronic device 1 to ensure that the electronic components 62 operate normally. After the battery 70 is mounted in the battery receiving cavity 25, the support frame 20 may protect the battery 70 in the circumferential direction of the battery 70. In the thickness direction X of the electronic apparatus 1, the surface of the battery 70 facing the support frame 20 is bonded to the surface of the support frame 20 facing the battery accommodating chamber 25, so that the battery 70 is less likely to shake in the battery accommodating chamber 25. For example, the battery 70 and the support frame 20 may be bonded using glue or double-sided tape. The glue or the double-sided adhesive tape has good heat-conducting property. During the discharging or charging of the battery 70, the battery 70 generates heat. The heat generated by the battery 70 may be conducted to the support frame 20 and then transmitted to the outside of the electronic apparatus 1 through the support frame 20. The electronic device 1 further includes a rear cover 100 connected to the support frame 20. The surface of the battery 70 facing the rear cover 100 is provided with a heat sink 110. The heat sink 110 has good thermal conductivity and is used to conduct heat of the battery 70 to the rear cover 100 and then dissipated to the outside of the electronic device 1 through the rear cover 100. Illustratively, the fins 110 may be graphite fins.
As the number and variety of electronic components 62 in the electronic device 1 are greater, the demand for electrical power is correspondingly increased. In order to allow the electronic apparatus 1 to have a longer cruising time, the capacity of the battery 70 becomes larger and larger. The capacity of the battery 70 increases, so that the volume of the battery 70 also increases. The heat conduction sheet 30 is arranged opposite to the battery 70, so that the heat conduction sheet 30 does not invade the space of the battery accommodating cavity 25, and the space of the battery accommodating cavity 25 is mainly used by the battery 70, thereby being beneficial to installing the battery 70 with larger capacity in the battery accommodating cavity 25. Meanwhile, the circuit board 60 and the battery receiving cavity 25 are disposed on the same side of the supporting frame 20, and the heat conductive sheet 30 can also absorb heat at the circuit board 60.
In some examples, after the battery 70 is mounted in the battery receiving cavity 25, at least a portion of the thermally conductive sheet 30 overlaps the battery 70 in the thickness direction X of the electronic device 1, that is, at least a portion of the thermally conductive sheet 30 is located on one side of the battery 70. In the embodiment of the present application, the heat exchange structure formed by connecting one heat conducting sheet 30 and the supporting frame 20 has a small thickness, and occupies a small space in the thickness direction X of the electronic device 1, so that the heat conducting sheet 30 can overlap with the battery 70 without affecting the overall thickness of the electronic device 1, and the concentration degree of the battery 70, the heat exchange structure and the circuit board 60 can be improved, and the internal space of the electronic device 1 can be fully utilized.
Referring to fig. 2 and 6, the electronic device 1 of the embodiment of the present application further includes a screen assembly 80. The screen assembly 80 is used to display image information. The user can view the image information displayed by the screen assembly 80 on the electronic device 1. The screen assembly 80 is coupled to the support frame 20 so as to be supported by the support frame 20. The screen assembly 80 also generates heat during use. Since most of the screen assembly 80 is exposed to the external environment and the overall thickness of the screen assembly 80 is small, a part of heat generated by the screen assembly 80 itself can be conducted to the outside of the electronic apparatus 1 through the screen assembly 80 itself to achieve heat dissipation. The heat conductive sheet 30 is disposed on a side of the support frame 20 facing the screen assembly 80. A part of the heat generated by the screen assembly 80 itself can also be dissipated through the heat conductive sheet 30. The heat conductive sheet 30 has a gap 90 with the screen assembly 80. The screen assembly 80 has a small overall thickness and the edge region of the screen assembly 80 is coupled to the support frame 20, so that the screen assembly 80 is recoverably deformed when the screen assembly 80 is subjected to an external force or an external impact. For example, when the screen assembly 80 is pressed by a large force or the electronic device 1 is dropped by an accident and is impacted, the screen assembly 80 may be deformed toward the supporting frame 20, and the screen assembly 80 may return to the original flat state after the external force is removed. If the area of the screen assembly 80 that the swelling warp directly extrudes the conducting strip 30, then can lead to the conducting strip 30 to take place to sink and warp to the problem that sealed chamber receives compression or capillary structure 33 on the conducting strip 30 receives extrusion deformation and inefficacy appears, and then influences the normal circulation heat transfer of working medium, reduces heat exchange efficiency. The gap 90 between the heat-conducting sheet 30 and the screen assembly 80 according to the embodiment of the present application may be used to buffer the deformation amount of the screen assembly 80, so that the deformation region of the screen assembly 80 is not easily contacted with the heat-conducting sheet 30, thereby reducing the possibility that the heat-conducting sheet 30 is pressed by the deformation region of the screen assembly 80.
The electronic device 1 further comprises a circuit board 60. The circuit board 60 is provided with electronic components 62 for performing corresponding functions. The electronic components 62 have ambient temperature requirements that can maintain good operating conditions. The electronic component 62 may generate heat continuously during operation. If this heat is not dissipated in a timely manner, it can cause the temperature of the environment in which the electronic component 62 is located to rise. When the ambient temperature to which the electronic component 62 is exposed rises and exceeds the required upper limit of the ambient temperature, the operational performance of the electronic component 62 will be adversely affected, thereby affecting the normal use of the electronic device 1. The evaporation end 31 of the heat conductive sheet 30 is disposed in correspondence with the circuit board 60. The evaporation end 31 is used for absorbing heat of the circuit board 60 to reduce the possibility that the heat is accumulated around the electronic component 62 to cause the ambient temperature to rise continuously. The heat absorbed by the evaporation end 31 is conducted to the working medium inside. The working medium absorbs heat and evaporates to form steam, and the heat is carried to the condensation end 32 for heat dissipation.
Referring to fig. 8, an embodiment of the present application further provides a method for manufacturing a housing 11 of an electronic device 1, which includes at least:
step S100: providing a support frame 20;
step S110: providing a heat conducting sheet 30 with a capillary structure 33, wherein the capillary structure 33 and the heat conducting sheet 30 are integrally formed, and the heat conducting sheet 30 is connected with a support frame 20 to form a cavity and a preformed hole communicated with the cavity;
step S120: injecting working medium into the cavity through the reserved hole;
step S130: the prepared hole is sealed, and the heat conduction sheet 30 and the support frame 20 form a sealed chamber.
According to the method for manufacturing the shell 11 of the electronic device 1, the heat exchange structure is formed by directly connecting the heat conducting fins 30 to the supporting frame 20, the working medium is filled in the sealed cavity formed by the heat conducting fins 30 and the supporting frame 20, the whole machining process is simplified, the operation is easy, and the machining difficulty and the machining cost of the shell 11 of the electronic device 1 are reduced. The case 11 manufactured by the method of manufacturing the case 11 of the electronic apparatus 1 of the embodiment of the present application includes the support frame 20 and the heat conductive sheet 30. The thermally conductive sheet 30 is attached to the support frame 20 and the thermally conductive sheet 30 and the support frame 20 form a sealed chamber. The heat conductive sheet 30 is directly provided with the capillary structure 33. The working medium in the sealed chamber can circulate between the evaporation end 31 and the condensation end 32 of the heat-conducting fin 30 to transfer the heat of the heat source to the support frame 20, and then transferred to the outside of the electronic device 1 through the support frame 20, thereby cooling the heat source. The mode that casing 11 formed heat transfer structure after assembling through conducting strip 30 and carriage 20 can reduce a lower heat-conducting plate for the heat transfer structure that adopts heat-conducting plate and last heat-conducting plate lock each other down among the prior art, and no longer need additionally use the piece that bonds to bond heat transfer structure in carriage 20, thereby be favorable to reducing heat transfer structure's thickness, and then be favorable to reducing electronic equipment 1's whole thickness. Because capillary structure 33 is directly formed on heat conducting fin 30, it is not necessary to additionally provide a capillary structure and connect the capillary structure with heat conducting fin 30, so that the heat exchange structure is more compact, the thickness of the heat exchange structure is further reduced, and the overall thickness of electronic device 1 is further reduced.
In some embodiments, capillary grooves are machined on the heat-conductive sheet 30 before the heat-conductive sheet 30 is attached to the support frame 20. The capillary groove forms a capillary structure 33. Illustratively, the capillary grooves may be directly formed on the wall surfaces of the heat conductive sheet 30 using a laser engraving technique or a chemical etching process.
In some embodiments, the first steam flow channel 34 is formed on the heat conductive sheet 30 before the heat conductive sheet 30 is coupled to the support frame 20. The first steam flow path 34 is located in the chamber after the heat conduction sheet 30 is connected to the support frame 20. The first steam flow channel 34 can guide the steam to flow, so that the steam flow resistance can be reduced, and the possibility that the steam is greatly accumulated at the evaporation end 31 to influence the heat exchange efficiency is reduced. The capillary structure 33 and the first vapor flow channel 34 are provided at different regions on the heat conductive sheet 30. Illustratively, a groove is machined in the heat conductive sheet 30. The grooves form a first steam flow channel 34. The first steam flow channel 34 may extend in a direction from the evaporation end 31 to the condensation end 32. For example, the first vapor flow passage 34 may be directly formed on the wall surface of the heat conductive sheet 30 using a laser engraving technique or a chemical etching process.
In some embodiments, the accommodating portion 24 is formed on the wall surface of the support frame 20 before the thermally conductive sheet 30 is attached to the support frame 20. At least a part of the thermally conductive sheet 30 is accommodated in the accommodating portion 24, and then the thermally conductive sheet 30 is connected to the support frame 20, thereby facilitating reduction in thickness of the heat exchange structure formed by the thermally conductive sheet 30 and the support frame 20 in the thickness direction X of the electronic apparatus 1.
In some embodiments, the second steam flow channel 23 is formed on the wall surface or the accommodating portion 24 of the support frame 20 before the thermally conductive sheet 30 is connected to the support frame 20. The second steam flow path 23 is located in the chamber after the heat conduction sheet 30 is connected to the support frame 20. The second steam flow channel 23 can guide the steam to flow, so that the steam flow resistance can be reduced, and the possibility that the steam is greatly accumulated at the evaporation end 31 to influence the heat exchange efficiency is reduced. Illustratively, a groove is machined in the support frame 20. The grooves form a second steam flow channel 23. The second vapor flow passage 23 may be formed directly on the wall surface of the support frame 20, for example, using a laser engraving technique or a chemical etching process.
In some embodiments, referring to fig. 9, before the step of injecting the working medium into the chamber through the preformed hole, the chamber is evacuated through the preformed hole, so that after the preformed hole is sealed, the sealed chamber formed by the heat-conducting sheet 30 and the supporting frame 20 is a vacuum environment. Illustratively, a delivery tube 120 may be used and an end of the delivery tube 120 inserted into the preformed hole. The chamber is evacuated through the delivery tube 120. The working fluid is then injected through the delivery pipe 120. After the preformed hole sealing process is completed, the duct 120 is removed.
In some embodiments, the thermally conductive sheet 30 and the support frame 20 are connected using a welding process. Illustratively, the material of the support frame 20 may be aluminum or an aluminum alloy. The material of the heat conductive sheet 30 may be steel, copper, a copper alloy, aluminum, or an aluminum alloy. The thermally conductive sheet 30 and the support frame 20 may be joined by ultrasonic welding.
In some embodiments, the material of the support frame 20 is aluminum or aluminum alloy, and the material of the heat-conducting sheet 30 is steel, aluminum or aluminum alloy. When the heat-conducting sheet 30 and the support frame 20 are respectively in contact with the working medium, the working medium oxidizes or corrodes the heat-conducting sheet 30 or the support frame 20. Therefore, before the thermally conductive sheet 30 is connected to the support frame 20, the protective coating 50 is provided on at least one of the support frame 20 and the thermally conductive sheet 30. When the protective coating 50 is disposed on the support frame 20, after the heat-conducting strip 30 and the support frame 20 are connected, the protective coating 50 can effectively reduce the possibility of oxidation or corrosion caused by the contact between the working medium and the support frame 20. When the heat-conducting fin 30 is provided with the protective coating 50, after the heat-conducting fin 30 and the support frame 20 are connected, the protective coating 50 can effectively reduce the possibility of oxidation or corrosion caused by contact between the working medium and the heat-conducting fin 30. Similarly, when the protective coatings 50 are disposed on the supporting frame 20 and the heat-conducting fin 30, after the heat-conducting fin 30 and the supporting frame 20 are connected, the protective coatings 50 can effectively reduce the possibility of oxidation or corrosion caused by contact between the working medium and the supporting frame 20 and between the working medium and the heat-conducting fin 30. Illustratively, the protective coating 50 may be formed on at least one of the support frame 20 and the heat conductive sheet 30 using an electroplating process, for example, the protective coating 50 may be a copper plated layer or a silver plated layer.
In some embodiments, as shown in fig. 9 and 10, the support frame 20 includes a first aperture 261 and a plate 27 to be cut. A portion of the plate 27 to be cut forms the walls of the first opening 261. The heat conductive sheet 30 includes a lamination area 35 provided in lamination with the board to be cut 27. After the heat-conducting sheet 30 is connected to the support frame 20, the laminated area 35 of the heat-conducting sheet 30 and the board 27 to be cut form a prepared hole. After the step of sealing the prepared hole, the board to be cut 27 and the laminated area 35 are cut off. After cutting off the board 27 to be cut and the stacking area 35, a second opening 262 is formed in the corresponding area of the support frame 20. The first opening 261 and the second opening 262 communicate to form the relief hole 26. The avoiding hole 26 is used for avoiding the camera module. Illustratively, relief holes 26 are rectangular. The position of the plate 27 to be cut utilizes the area for forming the avoiding hole 26 on the support frame 20, so that after the plate 27 to be cut is cut, the avoiding hole 26 can be formed, and thus, holes without functionality do not need to be formed in other areas of the support frame 20, the number of the holes formed in the support frame 20 is reduced, and the possibility that the strength of the support frame 20 is reduced due to the large number of the holes is reduced.
For example, referring to fig. 10, after the cutting is completed, the support frame 20 or the heat conductive sheet 30 may have a burr structure left at the cutting interface 130. Since the board 27 to be cut is located outside the battery accommodating cavity 25 on the supporting frame 20, that is, in the thickness direction X of the electronic device 1, there is no overlapping area between the board 27 to be cut and the battery accommodating cavity 25, the cutting interface 130 is far from the battery accommodating cavity 25, so that after the battery 70 is installed in the battery accommodating cavity 25, the burr structure is not easy to contact the battery 70 and pierce the battery 70, which causes a short circuit inside the battery 70, and the safety and reliability of the battery 70 are effectively ensured.
In some embodiments, the method for manufacturing the housing 11 of the electronic device 1 according to the embodiment of the present application may be used to manufacture the housing 11 of the electronic device 1 according to any of the embodiments described above.
In the description of the embodiments of the present application, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, a fixed connection, an indirect connection via an intermediary, a connection between two elements, or an interaction between two elements. The specific meanings of the above terms in the embodiments of the present application can be understood by those of ordinary skill in the art according to specific situations.
Reference throughout this specification to apparatus or components, in embodiments or applications, means or components must be constructed and operated in a particular orientation and therefore should not be construed as limiting the present embodiments. In the description of the embodiments of the present application, "a plurality" means two or more unless specifically stated otherwise.
The terms "first," "second," "third," "fourth," and the like in the description and in the claims of the embodiments of the application and in the drawings described above, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The term "plurality" herein means two or more. The term "and/or" herein is merely an association describing an associated object, meaning that three relationships may exist, e.g., a and/or B, may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship; in the formula, the character "/" indicates that the preceding and following related objects are in a relationship of "division".
It is to be understood that the various numerical references referred to in the embodiments of the present application are merely for descriptive convenience and are not intended to limit the scope of the embodiments of the present application.
It should be understood that, in the embodiment of the present application, the sequence numbers of the above-mentioned processes do not mean the execution sequence, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiment of the present application.
Claims (16)
1. A housing for an electronic device, comprising at least:
a support frame;
the heat conducting fin is connected with the supporting frame to form a sealed cavity, the heat conducting fin comprises an evaporation end and a condensation end, a capillary structure is arranged on the wall surface of the heat conducting fin facing the sealed cavity, and the capillary structure and the heat conducting fin are integrally formed;
the working medium is filled in the sealed cavity, and the capillary structure is used for enabling the working medium to flow back to the evaporation end from the condensation end.
2. A casing of an electronic device according to claim 1, wherein a capillary groove is provided on a wall surface of the heat conducting sheet facing the sealed chamber, the capillary groove extending in a direction from the evaporation end to the condensation end, the capillary groove forming the capillary structure.
3. The casing of the electronic device according to claim 1 or 2, wherein the wall surface of the heat conducting sheet facing the sealed chamber further has a first vapor flow channel, the first vapor flow channel is disposed in a direction from the evaporation end to the condensation end, and the capillary structure is disposed at a distance from the first vapor flow channel.
4. The electronic device casing according to any one of claims 1 to 3, wherein a wall surface of the support frame facing the sealed chamber has a second vapor flow path provided in a direction from the evaporation end to the condensation end.
5. The electronic device casing according to any one of claims 1 to 4, wherein at least a part of a surface of the heat conductive sheet facing the support frame is in contact with a surface of the support frame facing the heat conductive sheet in the sealed chamber.
6. The electronic device casing according to any one of claims 1 to 5, wherein the receiving portion is provided on the support frame, and at least a part of the heat conductive sheet is received in the receiving portion.
7. The electronic device enclosure of any of claims 1-6, wherein the sealed chamber is a vacuum chamber.
8. The electronic device casing according to any one of claims 1 to 7, wherein the heat conductive sheet is welded and sealed to the support frame.
9. The electronic device casing according to any one of claims 1 to 8, wherein at least one of a wall surface of the support frame facing the sealed chamber and a wall surface of the heat conductive sheet facing the sealed chamber is provided with a protective coating.
10. The casing of the electronic device according to any one of claims 1 to 9, wherein the support frame includes a battery receiving cavity, and the heat conductive sheet is disposed on a side of the support frame facing away from the battery receiving cavity.
11. The casing of electronic equipment according to any one of claims 1 to 10, wherein the support frame includes an avoidance hole for avoiding the camera module, and the evaporation end is disposed close to the avoidance hole.
12. An electronic device characterized by comprising a housing of the electronic device according to any one of claims 1 to 11.
13. The electronic device of claim 12, further comprising a screen assembly, wherein the heat conducting sheet is disposed on a side of the support frame facing the screen assembly, and a gap is provided between the heat conducting sheet and the screen assembly.
14. The electronic apparatus according to claim 12 or 13, further comprising a circuit board, wherein the evaporation end of the heat conductive sheet is disposed corresponding to the circuit board, and the evaporation end is configured to absorb heat of the circuit board.
15. A method for manufacturing a housing of an electronic device, comprising at least:
providing a support frame;
providing a heat conducting sheet with a capillary structure, wherein the capillary structure and the heat conducting sheet are integrally formed, and the heat conducting sheet is connected with the support frame to form a cavity and a reserved hole communicated with the cavity;
injecting working medium into the cavity through the reserved hole;
and sealing the prepared hole, wherein the heat conducting fins and the supporting frame form a sealed chamber.
16. The method for manufacturing the housing of the electronic device according to claim 15, wherein the support frame includes a first opening and a board to be cut, the thermal conductive sheet includes a stacking area stacked on the board to be cut, the thermal conductive sheet is connected to the support frame, the stacking area and the board to be cut form the reserved hole, the board to be cut and the stacking area are cut to form a second opening after the step of sealing the reserved hole, the first opening and the second opening are communicated to form an avoiding hole, and the avoiding hole is used for avoiding the camera module.
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| CN202110937265.4A CN114466557B (en) | 2021-08-16 | 2021-08-16 | Housing for electronic device, and method for manufacturing housing for electronic device |
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| CN202110937265.4A CN114466557B (en) | 2021-08-16 | 2021-08-16 | Housing for electronic device, and method for manufacturing housing for electronic device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116627225A (en) * | 2022-12-02 | 2023-08-22 | 荣耀终端有限公司 | Electronic equipment |
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| CN116627225B (en) * | 2022-12-02 | 2024-04-19 | 荣耀终端有限公司 | Electronic equipment |
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