CN110350064A - Light-emitting diode component and production method - Google Patents
Light-emitting diode component and production method Download PDFInfo
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- CN110350064A CN110350064A CN201910613609.9A CN201910613609A CN110350064A CN 110350064 A CN110350064 A CN 110350064A CN 201910613609 A CN201910613609 A CN 201910613609A CN 110350064 A CN110350064 A CN 110350064A
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- Engineering & Computer Science (AREA)
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- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The present invention discloses a kind of light-emitting diode component and production method.Light-emitting diode component includes a transparent substrate, several light-emitting diode chip for backlight unit, a route, a transparent encapsulating body and two electrode plates.The transparent substrate has the first surface and a second surface in face of opposite direction.Multiple light-emitting diode chip for backlight unit is fixed on the first surface.The route is electrically connected multiple light-emitting diode chip for backlight unit.The transparent encapsulating body is set on the first surface, substantially wraps up multiple light-emitting diode chip for backlight unit and the route.Multiple electrode plate is set to the first surface or the second surface, is electrically connected to multiple light-emitting diode chip for backlight unit by the route, two power inputs as the light-emitting diode component.
Description
The application be Chinese invention patent application (application number: 201310272229.6, the applying date: on 07 01st, 2013,
Denomination of invention: light-emitting diode component and production method) divisional application.
Technical field
Invention is related to a kind of light emitting diode (light emitting diode, LED) component and production method, especially
It is related to can provide the LED component and relevant production method of complete cycle light light field.
Background technique
The current application in life that can see all kinds of LED commodity, such as traffic sign motor taillight, automobile
Head lamp, street lamp, computer indicating lamp, flashlight, LED backlight etc..These commodity are in addition to the chip fabrication technique of front end, nearly all
Have to pass through the canned program of rear end.
The major function of LED encapsulation is to provide LED chip electricity, light, necessity support in heat.LED chip such half
Conductor product will receive the chemical substance in steam or environment and aging, cause spy if be chronically exposed in atmosphere
Decline in property.In LED encapsulation, epoxy resin is commonly used to coat LED chip effectively to completely cut off atmosphere.In addition, in order to reach more
The target of bright more power saving, LED encapsulation also need good thermal diffusivity and light extraction efficiency.The when institute if LED chip shines
The heat of generation does not shed in time, and heat of the accumulation in LED chip can all generate not the characteristic of element, service life and reliability
Good influence.Optical design is also a ring important in LED packaging manufacturing process, how more effectively light-output, light emitting anger
Degree and direction are all the emphasis in design.
The encapsulation technology of white light LEDs, other than considering the problem of heat, it is also necessary to consider colour temperature (color
Temperature), the problems such as drilling colour system number (color rendering index), fluorescent powder.Moreover, if white light LEDs are to adopt
It is bigger to the injury of human eye because the wavelength of blue light is shorter, it is therefore desirable to will be blue when with blue-light LED chip collocation yellow-green fluorescence powder
Light is effectively denial among encapsulating structure, and blue light is avoided to leak outside.
In order to which LED commodity can have competitiveness on the market, the manufacture craft for how allowing LED to encapsulate is firm, inexpensive, high
Yield and LED encapsulate pursued target.
Summary of the invention
To solve the above problems, the present invention provides a light-emitting diode component, it includes a transparent substrates, several luminous two
Pole pipe chip, a route, a transparent encapsulating body, two electrode plates.The transparent substrate has the first surface in face of opposite direction
An and second surface.Multiple light-emitting diode chip for backlight unit is fixed on the first surface.Route electrical connection is multiple to shine
Diode chip for backlight unit.The transparent encapsulating body (capsule) is set on the first surface, substantially wraps up multiple light-emitting diodes tube core
Piece and the route.Multiple electrode plate is attached at the first surface or the second surface, is electrically connected to by the route multiple
Light-emitting diode chip for backlight unit, two power inputs as the light-emitting diode encapsulation structure.
Detailed description of the invention
Fig. 1 is the stereoscopic schematic diagram of the LED component of an embodiment according to the present invention；
Fig. 2A shows the top view of LED component 100a；
Fig. 2 B shows the lower view of LED component 100a；
Fig. 3 A and Fig. 3 B shows AA and BB diagrammatic cross-section in Fig. 2A respectively；
Fig. 4 shows that LED component 100 is set to a light bulb；
Fig. 5 A, which is shown, fixes LED component 100 with scolding tin；
Fig. 5 B, which is shown, fixes LED component 100 with metal intermediate plate；
Fig. 6 shows the process for making for the LED component to be formed in Fig. 3 A and Fig. 3 B；
Fig. 7 A and Fig. 7 B shows the top view and lower view of LED component 100b respectively；
Fig. 8 A and Fig. 8 B shows AA and BB diagrammatic cross-section in Fig. 7 A；
Fig. 8 C and Fig. 8 D shows two sectional views of LED component 100c；
Fig. 9 shows the process for making of LED component 100b；
Figure 10 is the stereoscopic schematic diagram of the light-emitting diode component 400 of an embodiment according to the present invention；
Figure 11 A and Figure 11 B shows the top view and lower view of LED component 400a；
Figure 12 A and Figure 12 B shows AA and the BB diagrammatic cross-section of LED component 400a in Figure 11 A respectively；
Figure 12 C shows another LED component 400b；
Figure 13 shows the stereoscopic schematic diagram of LED component 200；
Figure 14 and Figure 15 is respectively a top view and one side figure of LED component 200a；
Figure 16 and Figure 17 show another LED component 200b；
Figure 18 shows another LED component 200c；
Figure 19 shows a kind of process for making of LED component 200c；
Figure 20 shows the stereoscopic schematic diagram of the LED component 300 of another embodiment according to the present invention；
Figure 21 A and Figure 21 B shows the top view and lower view of a LED component 300a；
Figure 22 shows a sectional view of LED component 300a；
Figure 23 shows the one side figure of LED component 300b；
Figure 24 shows the stereoscopic schematic diagram of LED component 600；
Figure 25 A and Figure 25 B shows the top view of LED component 600a and 600b；
Figure 26 A and Figure 26 B show two LED bulbs using LED component 300 and 600 as wick respectively.
Symbol description
100,100a, 100b, 100c LED component
102 upper surfaces
104 lower surfaces
106 transparent substrates
107,107A, 107B via hole
108,108a, 108b blue-light LED chip
110 bonding wires
112 transparent colloids
114,116 terminal
118 conductive electrode plates
119 conductive electrode plates
120 conductive electrode plates
122 conductive electrode plates
130 vertical conducting elements
131 fluorescence coatings
132,133 transparent adhesion coating
148,150,151,152,154,154a, 155, the step of 155a, 156,157,158
No. 160 substrates
180 lampshades
182 cooling mechanisms
183 electrical connection mechanisms
190 scolding tin
192 circuit boards
194 metal intermediate plates
200,200a, 200b, 200c LED component
300,300a, 300b LED component
400,400a, 400b LED component
402 conductive bars
500a, 500b LED bulb
502 fixtures
600,600a, 600b LED component
Specific embodiment
Fig. 1 is light emitting diode (light-emitting diode, LED) component of an embodiment according to the present invention
100 stereoscopic schematic diagram.LED component 100 includes a transparent substrate 106, is nonconducting glass base in one embodiment
Plate.Transparent substrate 106 has in face of the upper surface 102 and lower surface 104 of opposite direction.As shown in Figure 1, transparent substrate 106
A substantially strip has two terminals 114 and 116.In this description, it is transparent be used merely to indicate can by light,
It may be fully transparent (transparent) or translucent (translucent, or semitransparent).Another
In one embodiment, the material of transparent substrate 106 can be sapphire, silicon carbide or class and bore carbon.
Fig. 2A shows the top view of LED component 100a.It please also refer to Fig. 1.On upper surface 102, it is fixed with several indigo plants
Light LED chip 108 is electrically connected each other by the formed route of bonding wire (bonding wire) 110.Each blue-light LED chip
108 can be single LED, and forward voltage is about 2~3V (calling " low voltage chip " in the following text), or has several light emitting diode strings
It is linked togather and forward voltage is greater than low voltage chip, such as 12V, 24V, 48V etc. (calls " high voltage chip " in the following text).Specific speech
It, is different from routing mode, and high voltage chip is formed on a common substrate by semiconductor fabrication process and several is electrically connected each other
The light emitting diode (i.e. at least with the light emitting diode construction of luminescent layer) of knot, this common substrate can be long brilliant substrate
Or non-long brilliant substrate.In Fig. 1 and Fig. 2A, blue-light LED chip 108 is along two terminals 114 and 116 for connecting transparent substrate 106
A longitudinal axis two sides, line up two column, be cascaded each other with bonding wire 110, in electrical property, equivalent to become a height forward electric
The light emitting diode of pressure.But the present invention is not limited thereto, and in other embodiments, the blue-light LED chip on upper surface 102
108 can be arranged in arbitrary pattern, and mutual electrical connection can have, series, parallel at the same there is series and parallel to mix,
Or the connection type of bridge architecture.
As shown in Fig. 2A, near terminal 114, transparent substrate 106 has a via hole 107.Via hole 107 has
Have a through-hole, go directly upper surface 102 and lower surface 104 through transparent substrate 106, and be formed with conductive material fill up it is logical
Hole or the inner wall for only covering through-hole, to form via hole 107.Conductive material in through-hole can provide the electrical connection of 107 both ends of via hole.
In the upper surface 102 close to terminal 114, it is provided with a conductive electrode plate 118.Conductive electrode plate 118 does not directly contact
Via hole 107, that is, the conductive material in not direct contact through hole.Close to one of them (mark of the blue-light LED chip 108 of terminal 114
It is shown as 108a) conductive electrode plate 118 is electrically connected to a bonding wire 110.Close to one of the blue-light LED chip 108 of terminal 114
(being denoted as 108b) is electrically connected to via hole 107 with another bonding wire 110.
All bonding wires 110 and blue-light LED chip 108 on upper surface 102 are all covered by transparent colloid 112, are used
To prevent the aging and damage that moisture in atmosphere or chemical substance may cause bonding wire 110 and blue-light LED chip 108
Evil.The main composition object of transparent colloid 112 can be epoxy resin or silica gel (silicone).Transparent colloid 112 includes
At least one fluorescent powder, (for example its crest value is 430nm- to some blue light that can be issued by blue-light LED chip 108
It 480nm) is excited, and generates yellow light (for example its crest value is 570nm-590nm) or green-yellow light (for example its crest value is
540nm-570nm).And yellow light or green-yellow light and remaining blue light be when suitably blending together, human eye can be considered as white light.Fig. 1 is one
A schematic diagram.In an example, LED component 100 in Fig. 1 possibly can not be as because of the fluorescent powder in transparent colloid 112
The bonding wire 110 shown in FIG. 1 seen under transparent colloid 112 and blue-light LED chip 108.
Fig. 2 B shows the lower view of LED component 100a.As shown in Fig. 2 B, on lower surface 104, no any LED core of setting
Piece.On the lower surface 104 close to terminal 114, it is provided with another conductive electrode plate 120, part of it is mutually Chong Die with via hole 107
It is folded, and conductive material directly in contact through hole and be electrically connected to each other with it.In another embodiment, conductive electrode plate 120 can be with
It is not direct to be connected with via hole 107, and by another conductor, such as bonding wire 110, it is electrically connected with the formation of via hole 107.Close to eventually
On the lower surface 104 at end 116, it is provided with to the property of can choose another conductive electrode plate 122.Such design can make conduction
Electrode plate 122 and conductive electrode plate 120 are coplanar, and LED component 100a, which is placed, as a result, relatively to consolidate, and are avoided that transport
Or turned in treatment process fall and caused by damage.In this embodiment, conductive electrode plate 122 can be the suspension joint on circuit, not have
Have and be electrically connected to electronic component any in LED component 100a, circuit or other electrode plates, because main purpose is to make
LED component 100a can be placed steadily.
As shown in the embodiment of Fig. 2A and Fig. 2 B, the boundary of conductive electrode plate 120 and 118 be located at lower surface 104 with it is upper
Within surface 102, that is, substantially it is no more than the boundary of lower surface 104 and upper surface 102.Conductive electrode plate 120,118 and 122
Shape be not required to about rectangle, size is also not required to roughly the same.In another embodiment, conductive electrode plate 120 and 118 its
One of generally rectangle, it is another to be of a generally circular or rounded, to facilitate the positive and negative anodes for identifying LED component 100a.
From electrical property, blue-light LED chip 108 and via hole 107 are serially connected between conductive electrode plate 120 and 118.
Conductive electrode plate 120 and 118 can be as two power inputs of LED component 100a.One driving power (not shown) is just
Power end and negative power end can be electrically connected respectively to conductive electrode plate 120 and 118, to drive blue-light LED chip 108, make it
It shines.
Fig. 3 A Fig. 3 A shows the AA diagrammatic cross-section of LED component 100a in Fig. 2A；And Fig. 3 B Fig. 3 B is LED component in Fig. 2A
The BB diagrammatic cross-section of 100a.
With it is existing described similar, in Fig. 3 A Fig. 3 A, blue-light LED chip 108b is electrically connected to and is led by a bonding wire 110
Through-hole 107 is connected to the conductive electrode plate 120 of lower surface 104；In Fig. 3 B Fig. 3 B, blue-light LED chip 108a passes through another
Bonding wire 110 is electrically connected to the conductive electrode plate 118 on upper surface 102.Fig. 4 shows that LED component 100 is set in a light bulb, lamp
Bubble comprising a lampshade 180, LED component 100, circuit board 192, cooling mechanism 182 and electrical connection mechanism 183 (such as: Edison
Lamp holder).The terminal 114 of LED component 100 is fixed on circuit board 192；Circuit board 192 is connected with cooling mechanism 182, to
By the torrid zone caused by LED component 100 from light bulb；Electrical connection mechanism 183 is connected with cooling mechanism 182.Because being used to drive
The conductive electrode plate 120 and 118 of blue-light LED chip 108a is located at the upper surface of 114 side of same terminal of transparent substrate 106
102 with lower surface 104, it is possible to the electric conductor of scolding tin etc, it is electric that conductive electrode plate 120 and 118 is welded in one simultaneously
On the plate of road, as shown in Fig. 5 A.The electrical connection that scolding tin 190 can not only provide driving power makes LED component 100 shine, also together
When provide mechanical support to terminal 114, stand upright at LED component 100 on circuit board 192 and enclose around luminous, can mention
For the light field of complete cycle light.In fig. 5, LED component 100 only leans on the mechanism supports of scolding tin 190, standing that can be substantially vertical
In on circuit board 192, circuit board 192 simultaneously powers to LED component 100 by scolding tin 190.Fig. 5 B is with 194 institute of metal intermediate plate
The clip of composition is clamped LED component 100 and is fixed on circuit board 192 approximately perpendicularly.Metal intermediate plate 194 provides simultaneously
Two functions are fixed by power supply and mechanism, also can achieve the effect for reducing production process complexity and cost.Only, LED
Component 100 can also be with non-perpendicular fashion oblique cutting on circuit board 192.
In the embodiment in fig. 3 a, on 107 position of via hole of upper surface 102, it may be provided with vertical conducting member
Part 130, as being electrically connected between via hole 107 and a bonding wire 110.For example, vertical conducting element 130 is a pn junction
Diode (such as: vertical type light emitting diode, Schottky diode or zener diode), resistance or a metal block, with conduction
Elargol is adhered on via hole 107.In another embodiment, vertical conducting element 130 can be omitted with conductive silver glue, and a weldering
Line 110 can directly contact via hole 107, generate electrical connection.
In Fig. 3 A and Fig. 3 B, there is a transparent adhesion coating 132 under each blue-light LED chip 108, to by blue-light LED chip
108 are bonded on the upper surface 102 of transparent substrate 106.In Fig. 3 A and Fig. 3 B, have under each blue-light LED chip 108 corresponding
A transparent adhesion coating 132, be each other one-to-one relationship, however, the present invention is not limited thereto.In one embodiment, upper surface 102
On have several transparent adhesion coatings 132, and several blue-light LED chips 108 are adhered in each transparent adhesion coating 132；At another
In embodiment, there was only single one transparent adhesion coating 132 on upper surface 102, carry all blue-light LED chips 108 thereon.
132 area of transparent adhesion coating is bigger, better to 108 heat dissipation effect of blue-light LED chip thereon, but there may be because of heat
The bigger disadvantage of stress caused by expansion coefficient difference (shear).Therefore, the size of transparent adhesion coating 132, Yi Jicheng
The quantity for carrying blue-light LED chip 108, can be depending on practical application.In one embodiment, one is mixed in transparent adhesion coating 132
The heat conduction particle of a little high thermal conductivity coefficients, for example alumina powder, class bore carbon (diamond-like carbon) or silicon carbide
(SiC), thermal coefficient is greater than 20W/mK, other than heat dissipation effect can be improved, can also there is the effect of light scattering.
In Fig. 3 A and Fig. 3 B, the material of transparent adhesion coating 132, for example, can be epoxy resin (epoxy resin)
Or silica gel (silicone), and be mixed with fluorescent powder identical, similar or different in transparent colloid 112.For example, glimmering
Light powder can be YAG or TAG fluorescent powder.As described above, the transparent colloid 112 with fluorescent powder covers bonding wire
110 surrounding and top with blue-light LED chip 108, and transparent adhesion coating 132 is located at the lower section of blue-light LED chip 108.Change sentence
It talks about, each blue-light LED chip 108 is more than and is sandwiched by transparent colloid 112 and transparent adhesion coating 132, also generally complete
A transparent encapsulating body (capsule) is formed by by transparent colloid 112 and transparent adhesion coating 132 entirely to wrap up.Blue-ray LED core
The blue light that piece 108 is issued is not to be converted into green-yellow light by fluorescent powder, is exactly to mix with green-yellow light.Therefore, in Fig. 3 A and Fig. 3 B
LED component 100a, the problem of can preventing blue light from leaking outside.
Fig. 6 shows the process for making for the LED component 100a to be formed in Fig. 3 A and Fig. 3 B.Firstly, providing a transparent base
Plate 106.107 (step 148) of via hole is pre-formed on transparent substrate 106.For example, laser light can be used from glass material
The transparent substrate 106 of matter melts out a through-hole, inserts conductive material in through-holes then to form via hole 107.Step 150 is cut through in advance
Bright substrate 106.It is initially formed some grooves on transparent substrate 106, has generally pre-defined each LED component 100 transparent
Position on substrate 106, with cutting after facilitating.Conductive electrode plate 118 and 120 is attached to transparent base by step 152 respectively
Plate 106, on the upper surface 102 of terminal 114 and the position of lower surface 104.If conductive electrode plate 112, step
152 are also formed on transparent substrate 106.In another embodiment, conductive electrode plate is formed in the mode of printing
On surface 102 or lower surface 104.Step 154 forms the transparent adhesion coating 132 with fluorescent powder in upper surface 102, and position is first
It designs to place blue-light LED chip 108 thereon.The forming method of transparent adhesion coating 132, for example, can with dispensing,
The mode of printing or spraying, transparent adhesion coating 132 is formed on upper surface 102.
Blue-light LED chip 108 is bonded in transparent adhesion coating 132 by step 155.For example, vacuum available suction nozzle will
Blue-light LED chip 108 is picked up from blue film (blue tape), is placed in transparent adhesion coating 132.Blue-light LED chip 108
Placement location is preferably surrounded by the periphery of a transparent adhesion coating 132 completely, also that is, the area of transparent adhesion coating 132 is greater than
The area of blue-light LED chip 108, the problem of leakage to avoid blue light.Vertical conducting element 130 can use conductive silver glue at this moment
It is adhered on the via hole 107 of upper surface 102.Step 156 forms bonding wire 110, to be electrically connected a blue-light LED chip 108 to separately
One blue-light LED chip 108, blue-light LED chip 108a to conductive electrode plate 118 and blue-light LED chip 108b are to vertical conducting
Element 130.Step 157 can use dispensing (dispense) or mode of printing, and the transparent colloid 112 with fluorescent powder is formed
On upper surface 102, bonding wire 110 and blue-light LED chip 108 are covered.Step 158 can manually pull split or machine cutting
Mode along previously pre-formed groove, will one by one LED component 100 it is independent.
From the process for making of Fig. 6 it is found that in the forming process of LED component, in addition to formed conductive electrode plate 120 or
122 except lower surface 104, other the step of substantially handled both for upper surface 102.Because lower surface 104 only has
The such large area of conductive electrode plate, and it is not easy the pattern being scraped off, so manufacture craft carrier can be kept with adsorbing or holding
Stay the mode on surface 104, to carry or fix transparent substrate 106, to avoid the fine and smooth structure being located on upper surface 102 by
It is injured to caused by the mechanical stresses such as friction, scratch.Manufacture craft yield can be promoted considerably.
In the embodiment in Fig. 3 A, Fig. 3 B and Fig. 6, there is no by any for the light emission direction of blue-light LED chip 108
Limitation.For lower section, blue-light LED chip 108 can be provided and be blended together by transparent adhesion coating 132 and transparent substrate 106
Light；For surrounding and top, by transparent colloid 112, blue-light LED chip 108 can also provide the light blended together.
Therefore, LED component 100a, which can be considered a kind of, can provide six faces luminous light-emitting component, and have the lamp of LED component 100 in Fig. 4
Bubble, then can be considered a kind of complete cycle light (Omnidirectional) lighting device.
In Fig. 2A, Fig. 2 B, Fig. 3 A and Fig. 3 B, blue-light LED chip 108 is directly to be adhered to transparent adhesion coating 132
On bright substrate 106, but the present invention is not limited thereto.Fig. 7 A and Fig. 7 B shows respectively, in another embodiment, LED component
The top view of 100b and lower view.Two sectional views of LED component 100b are then shown in Fig. 8 A and Fig. 8 B.Fig. 9 shows LED component
The process for making of 100b.Fig. 7 A, Fig. 7 B, Fig. 8 A, Fig. 8 B and Fig. 9 are similar with corresponding diagram 2A, Fig. 2 B, Fig. 3 A, Fig. 3 B respectively
With Fig. 6, wherein element corresponding to identical symbol or mark, device or step, be with similar or identical element,
Device or step.For succinct event, explanation may omit in this description.
Different from Fig. 2A, more one substrate (submount) 160 of Fig. 7 A are placed in the week of transparent adhesion coating 132
Within side, it is sandwiched between blue-light LED chip 108 and transparent adhesion coating 132.The material of secondary substrate 160 can be transparent glass,
Sapphire, silicon carbide or class bore carbon.It is different from Fig. 3 B with Fig. 3 A, the portion in blue-light LED chip 108 in Fig. 8 A and Fig. 8 B
Divide or is entirely bonded on time substrate 160, and secondary substrate 160 is bonded on transparent substrate 106 with transparent adhesion coating 132.
In Fig. 9, step 154a and step 155a are respectively instead of the step 154 and step 155 in Fig. 6.Step
Secondary substrate 160 is fixed on transparent substrate 106 by 154a with the transparent adhesion coating 132 with fluorescent powder.In one embodiment, thoroughly
Bright adhesion coating 132 is initially formed in the back side of secondary substrate 160, and then secondary substrate 160 is just attached on transparent substrate 106；Another
In a embodiment, transparent adhesion coating 132 is first coated with and is formed on the upper surface 102 of transparent substrate 106, then secondary 160 ability of substrate
It is attached in transparent adhesion coating 132.Blue-light LED chip 108 is then then bonded on time substrate 160 by step 155a.
In embodiment in Fig. 7 A, Fig. 7 B, Fig. 8 A, Fig. 8 B and Fig. 9, blue-light LED chip 108 can be with transparent adhesion coating
132 the same or similar materials, are bonded on time substrate 160.But the present invention is not limited thereto, it is in one embodiment, blue
Light LED chip 108 can use transparent adhesive tape or eutectic metal without fluorescent powder, be bonded on time substrate 160.In another reality
It applies in example, conductive bar is printed on secondary substrate 160, and (flip chip) mode in a manner of upside-down mounting of blue-light LED chip 108 is fixed
Thereon, therefore the step 156 in Fig. 9 may can be omitted, so, blue-light LED chip 108b still need to by bonding wire 100 with lead
Through-hole 107 is electrically connected；And blue-light LED chip 108a is also needed through bonding wire 100 to be electrically connected with conductive electrode plate 118.Another
In a embodiment, blue-light LED chip 108 is with anisotropy (anisotropy) conductive adhesive film (anisotropic conductive
Film, ACF) it is bonded on time substrate 160.
LED component 100b in Fig. 7 A, Fig. 7 B, Fig. 8 A, Fig. 8 B and Fig. 9 is enjoyed with Fig. 2A, Fig. 2 B, Fig. 3 A, Fig. 3 B and figure
LED component 100a in 6 the same benefit.For example, the terminal 114 of LED component 100b can be fixed only with scolding tin vertical
The electrical connection of driving power on a circuit board and is simultaneously provided；The lower surface 104 of LED component 100b, which is compared, is not afraid of scratch,
Manufacture craft yield can be promoted effectively；LED component 100b can be adapted for being a complete cycle illuminating apparatus；LED component 100b can
With mitigate or prevent blue light leak the problem of.
Fig. 8 C and Fig. 8 D shows two sectional views of LED component 100c, the respectively deformation of Fig. 8 A and Fig. 8 B.LED component
Single transparent adhesion coating 132 is used in 100b (in Fig. 8 A and Fig. 8 B), secondary substrate 160 is bonded on transparent substrate 106.With
LED component 100b is different, and LED component 100c (in Fig. 8 C and Fig. 8 D) is with two transparent adhesion coatings 132 and 133, by secondary base
Plate 160 is bonded on transparent substrate 106.At least one of transparent adhesion coating 132 and 133 includes fluorescent powder.Fig. 8 C with
In the embodiment of Fig. 8 D, transparent adhesion coating 132 has fluorescent powder, and transparent adhesion coating 133 does not have.The material of transparent adhesion coating 133
Material, for example, can be epoxy resin (epoxy resin) or silica gel (silicone).Because transparent adhesion coating 133 does not have
There is fluorescent powder, so being capable of providing relatively good adhesion effect, is attached on transparent substrate 106.Transparent adhesion coating 132,133 can
For identical or different material.In another embodiment, it can also be formed between secondary substrate 160 and transparent adhesion coating 132 another
Bright adhesion coating 133 is in wherein, to increase mutual adherence.
Blue-light LED chip 108 in the light-emitting diode component 100 of Fig. 1 is electrically connected to each other by bonding wire 110 each other,
However, the present invention is not limited thereto.Figure 10 is the stereoscopic schematic diagram of the light-emitting diode component 400 of an embodiment according to the present invention,
In blue-light LED chip 108 be to be bonded in a manner of upside-down mounting on upper surface 102.Figure 11 A and Figure 11 B shows LED component 400a's
Top view and lower view.Figure 12 A shows the AA diagrammatic cross-section of LED component 400a in Figure 11 A；And Figure 12 B is LED in Figure 11 A
The BB diagrammatic cross-section of component 400a.Figure 10, Figure 11 A, Figure 11 B, Figure 12 A and Figure 12 B are similar with corresponding diagram 1, Fig. 2A, figure respectively
2B, Fig. 3 A and Fig. 3 B, wherein element corresponding to identical symbol or mark, device or step, are with similar or phase
Same element, device or step.For succinct event, explanation may omit in this description.
Figure 12 A and Figure 12 B are different from Fig. 3 A Fig. 3 A and Fig. 3 B, are in Figure 12 A and Figure 12 B, print on transparent substrate 106
There is conductive bar 402, and blue-light LED chip 108 is electrically connected by conductive bar 402 each other.So in Figure 12 A and Figure 12 B
Blue-light LED chip 108 can emit beam for surrounding and upper and lower, therefore LED component 400a can be considered a kind of
It can provide six faces luminous light-emitting component.Figure 12 C shows another LED component 400b, and it is glimmering to be coated with one on lower surface 104 therein
Photosphere 131, has fluorescent powder in fluorescence coating 131, and the light that can be issued blue-light LED chip 108 is converted into another color
Light.In this way, the chance for leaking blue light from lower surface 104 can be reduced.In another embodiment, in LED component 400a
Blue-light LED chip 108 can be replaced with White-light LED chip, and each White-light LED chip is substantially that surface is formed with a fluorescence coating
A blue-light LED chip.In this way, can be to avoid blue light leakage the problem of.
Although the LED component 100a and 100b in preceding embodiment have via hole 107, one as a route
Point, make the conductive electrode plate 120 and 118 in the upper and lower surface 102 and 104 of transparent substrate 106 can be used as LED component 100a and
The two driving power input terminals of 100b, but the present invention is not limited to have to via hole.
Figure 13 shows the stereoscopic schematic diagram of the LED component 200 of an embodiment according to the present invention.Figure 14 is respectively with Figure 15
A top view and one side figure of LED component 200a.LED groups different from 100b with LED component 100a, in Figure 14 and Figure 15
Part 200a in two terminals 114 and 116 of the upper surface of transparent substrate 106 102, be respectively formed with conductive electrode plate 118 and
119.In LED component 200a, conductive electrode plate 118 and 119 has two terminals for partially stepping out or extending beyond transparent substrate 106
114,116.Moreover, there is no via holes 107 by LED component 200a.LED component 200 or 200a in Figure 13, Figure 14 and Figure 15
Manufacturing method can deduce with step with reference to preceding description, therefore be not repeated.
In LED component 200a, there are single corresponding transparent adhesion coating 132, but this under each blue-light LED chip 108
It invents without being limited thereto.As previously described, in other examples, many a blue-light LED chips 108 can share one
Transparent adhesion coating 132 or all blue-light LED chip 108 are adhered to transparent substrate 106 by a transparent adhesion coating 132
On.
Figure 16 and Figure 17 show another LED component 200b, similar with the LED component 200a in Figure 15 with Figure 14, but scheme
Each blue-light LED chip 108 in 16 and Figure 17 is to be bonded on a substrate 160, and secondary substrate 160 is by transparent adhesion
Layer 132 is bonded on transparent substrate 106.Details in LED component 200b, can be with reference to the LED component in Fig. 8 A and Fig. 8 B
100b and associated description and deduce, be not repeated.
Figure 18 shows the side view of another LED component 200c.Figure 19 then shows a kind of manufacture craft side of LED component 200c
Method.Figure 18 is approximate with Figure 17, and the top view of Figure 18 can be similar to Figure 16, and Figure 19 is approximate with Fig. 9, and wherein something in common is no longer tired
It states.Different from Figure 17, in Figure 18, conductive electrode plate 118 and 119 is attached in transparent adhesion coating 132.In Figure 19
Process for making is inserted with step 151 between step 150 and 152, is coated with transparent adhesion coating 132 in transparent substrate 106
On.In other words, the formation of transparent adhesion coating 132, can be before the attaching of conductive electrode plate 118 and 119 with regard to carrying out.It is transparent viscous
Layer 132 can be epoxy resin (epoxy resin) or silica gel (silicone), and be mixed with in transparent colloid 112
Identical or similar fluorescent powder.For example, fluorescent powder can be YAG or TAG fluorescent powder.
LED component 200b and 200c in Figure 17 and Figure 18 are to be consolidated secondary substrate 160 using single transparent adhesion coating 132
In on transparent substrate 106.But the present invention is not limited thereto.In other embodiments, LED component 200b and 200c can be changed
Become, using two layers of transparent adhesion coating 132 and 133 in Fig. 8 C and Fig. 8 D, secondary substrate 160 is bonded on transparent substrate 106.?
In another embodiment, another transparent adhesion coating 133 can also be formed between secondary substrate 160 and transparent adhesion coating 132 in wherein, to increase
Add mutual adherence.
What the absolutely not pattern of lower surface 104 of LED component 200a, 200b and 200c, absolutely not lower surface 104 scratched
Problem.LED component 200a, 200b can be adapted for the application of complete cycle light light field as 200c, and compared with no blue light leak problem.
For example, a light bulb can use scolding tin or conductive fixture, to fix in LED component 200a, 200b or 200c, be located at two eventually
The conductive electrode plate 118 and 119 at end 114 and 116, and the electrical connection of driving power is provided by this two electrode plate simultaneously.
Figure 20 shows the stereoscopic schematic diagram of the LED component 300 of another embodiment of the present invention.Figure 21 A and Figure 21 B show one
The top view of LED component 300a and lower view.Figure 22 shows a sectional view of LED component 300a.LED component 300a is in transparent base
Two terminals 114 and 116 of the lower surface 104 of plate 106, are respectively formed with conductive electrode plate 120 and 122.In Figure 21 A, Figure 21 B
In Figure 22, there are LED component 300a two via hole 107A, 107B to be respectively formed at close to the position of terminal 114,116.It is conductive
Electrode plate 120 is by via hole 107A, and conductive electrode plate 122 is electrically connected to by via hole 107B positioned at upper surface 102
Blue-light LED chip 108.Blue-light LED chip 108 is arranged and is electrically coupled between via hole 107A and 107B, is also provided with simultaneously
It is electrically connected between conductive electrode plate 120 and 122.Details and possible variation in LED component 300a can be said with reference to this
The description of other embodiments in bright book and deduce, be not repeated.
Figure 23 shows the one side figure of LED component 300b.Wherein, secondary substrate 160 be sandwiched in blue-light LED chip 108 with it is transparent
Between adhesion coating 132.Details and possible variation in LED component 300b, can be with reference to other embodiments in this specification
It describes and deduces, be not repeated.
Although thering is part to step out or extend beyond positioned at the conductive electrode plate of two terminals in LED component 200 and 300
Two terminals 114,116 of bright substrate 106, however, the present invention is not limited thereto.Figure 24 shows the stereoscopic schematic diagram of LED component 600.Figure
25A shows LED component 600a, is a kind of possible top view of LED component 600.In Figure 25 A, conductive electrode plate 118 with
And 119 have and trim on one side with the edge of transparent substrate 106.Figure 25 B shows LED component 600b, is the another of LED component 600
A kind of possible top view.In Figure 25 B, conductive electrode plate 118 and 119 is fully seated within transparent substrate 106.
Figure 26 A shows the LED bulb 500a using LED component 300 as a wick.There are two fixtures by LED bulb 500a
502.Fixture 502 can be V-type or Y type.In one embodiment, fixture 502 can be for rectangle and with a groove, to fixation
LED component 300.Each fixture 502 is all constituted with conductive material, with two tips of fixture 502, the fixed LED component 300 of strangulation
The conductive electrode plate of two terminals, and make the upper surface 102 of LED component 300 upward (direction of Z).Fixture 502 also makes LED component
The conductive electrode plate at 300 both ends is electrically connected to the Edison base of LED bulb 500a, to provide the luminous needs of LED component 300
Electric energy.Figure 26 B is similar to Figure 26 A, but using LED component 600 as the LED bulb 500b of a wick.It is different from LED bulb 500a
, the upper surface 102 of LED component 600 is towards the direction of Y in LED bulb 500b, substantially with the rotary shaft (Z of LED bulb 500b
Direction) it is vertical.Of course, the LED component 300 or 600 in Figure 26 A and Figure 26 B, can use the LED component previously introduced
200 replacements, details and possible variation can refer to the description of other embodiments in this specification and deduce, be not repeated.
The lower surface 104 of LED component 300a and 300b only have large area, less fear the conductive electrode plate 120 of scratch with
And 122, manufacture craft yield can obtain comparable improvement.Absolutely not scheme the lower surface 104 of LED component 600a and 600b
Case is not afraid of scratch more.LED component 300a, 300b, 600a can be adapted for the application of complete cycle light light field, compared with nothing as 600b
Blue light leak problem.
Although above embodiment all uses blue-light LED chip 108 as light source, however, the present invention is not limited thereto.At other
In embodiment, having some or whole LED chips is not blue light, but feux rouges or green light.
Some embodiments of the present invention can be towards four sides because there is the presence of transparent substrate 106 Yu transparent adhesion coating 132
It shines from all directions, so being applicable to the application of complete cycle light.In some embodiments, all blue-light LED chips 108 all substantially by
Transparent adhesion coating 132 and transparent colloid 112 are wrapped up, so not having blue light leak problem.LED component in some embodiments
As long as power supply power supply and mechanism supports can be received simultaneously to fix a terminal；LED component in some embodiments can
When in mechanism fixing two terminals, while receiving power supply power supply from two terminals；The lower surface of LED component in some embodiments
There is no careful pattern or circuit, compare and be not afraid of scratch, can be convenient taking in manufacturing process or fix, improves manufacture craft
Yield.
The foregoing is merely several embodiments of the invention, and each embodiment be not in conflict with each other it is lower when can be each other
Referring to, merge or replacement, all equivalent changes and modifications done according to the claims in the present invention, should all belong to of the invention and cover model
It encloses.
Claims (9)
1. a kind of light-emitting diode component, which is characterized in that include:
Substrate has upper surface, lower surface and end relative to the upper surface；
First conductive bar is located on the upper surface；
Second conductive bar is located on the upper surface, separates with first conductive bar, and compared with first conductive bar close to the end；
LED chip is bonded on first conductive bar and second conductive bar in a manner of upside-down mounting；
Transparent colloid includes fluorescent powder, is set on the upper surface, and cover the LED chip and first conductive bar；
First conductive electrode plate is set on second conductive bar, and is electrically connected to the LED chip；And
Fluorescence coating is set to the lower surface.
2. light-emitting diode component as described in claim 1, wherein, the light which issues can pass through the substrate.
3. light-emitting diode component as described in claim 1, wherein, which has different thickness from the fluorescence coating
Degree.
4. light-emitting diode component as described in claim 1, wherein, which covers the part of second conductive bar.
5. light-emitting diode component as described in claim 1 also includes the second conductive electrode plate, the lower surface is set to, with this
The electrical connection of first conductive electrode plate, and do not contacted with the fluorescence coating.
6. light-emitting diode component as described in claim 1, wherein, the substrate include be located at the upper surface and the lower surface it
Between side, the transparent colloid and the fluorescence coating do not cover the side.
7. light-emitting diode component as described in claim 1, wherein, which has two parts of different in width.
8. light-emitting diode component as described in claim 1, wherein, which does not have via hole.
9. light-emitting diode component as described in claim 1, wherein, the thickness of second conductive bar is less than the first conductive electricity
Pole plate.
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Also Published As
| Publication number | Publication date |
|---|---|
| CN104282817B (en) | 2019-08-06 |
| CN110335932A (en) | 2019-10-15 |
| CN104282817A (en) | 2015-01-14 |
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