CN102856475A - Full-angle luminous LED (light-emitting diode) chip encapsulation structure - Google Patents
Full-angle luminous LED (light-emitting diode) chip encapsulation structure Download PDFInfo
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- CN102856475A CN102856475A CN2012103242412A CN201210324241A CN102856475A CN 102856475 A CN102856475 A CN 102856475A CN 2012103242412 A CN2012103242412 A CN 2012103242412A CN 201210324241 A CN201210324241 A CN 201210324241A CN 102856475 A CN102856475 A CN 102856475A
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Abstract
The invention discloses a full-angle luminous LED (light-emitting diode) chip encapsulation structure, which comprises an LED chip. The full-angle luminous LED chip encapsulation structure is characterized by further comprising a base material, an electrode, a first adhesive layer, a second adhesive layer and a protective adhesive layer, wherein the base material is used for bearing the LED chip on the front side; the electrode is arranged on the front side of the base material and is used for being electrically connected with the outside; the first adhesive layer is arranged between the base material and the LED chip; the second adhesive layer is used for covering the LED chip; the protective adhesive layer is coated at the outer side of the second adhesive layer for playing a protection role; the LED chip is completely cladded by the first adhesive layer and the second adhesive layer; the first adhesive layer, the second adhesive layer and the protective adhesive layer are transparent; and the electrode and the LED chip are electrically connected. The full-angle luminous LED chip encapsulation structure has the beneficial effects that full-angle lightening of the LED can be achieved, and meanwhile, the full-angle luminous LED chip encapsulation structure is simple in structure and can fully protect the LED chip, and the machining technology is easy to realize.
Description
Technical field
The present invention relates to the encapsulating structure of led chip, be specifically related to the emitting led chip-packaging structure of a kind of full angle.
Background technology
The LED light-emitting diode is known as the most efficient artificial lighting technology by the whole world, is nowadays all extensively adopting the LED illumination to notebook, TV are backlight again from various indicator lights, street lamp, Colour lamp for fastival and holiday.Because its high energy efficiency, people generally believe that replacing traditional bulb, fluorescent lamp with the LED lamp is a kind of way of very environmental protection.
Since before the power of led chip lower, so existing encapsulating structure all with light reflection and pool a branch of Unidirectional light with increase one party to luminous intensity, but this method can produce light absorption and block, and causes the loss of LED luminosity.Along with the development of technology, the power of led chip improves greatly, can realize the luminous of full angle now, does not still now still have the encapsulating structure that can realize that full angle is luminous.
Summary of the invention
Be to solve the deficiencies in the prior art, the object of the present invention is to provide a kind of can the emitting led chip-packaging structure of full angle.
In order to realize above-mentioned target, the present invention adopts following technical scheme:
The emitting led chip-packaging structure of full angle, comprise: led chip, it is characterized in that, also comprise: be used for being arranged at the transparent base material of the above-mentioned led chip of its positive carrying, equally above-mentioned base material front the electrode that is used for being electrically connected with the external world, be arranged on the first glue-line between above-mentioned base material and the led chip, be used for covering above-mentioned led chip the second glue-line, be used for being coated in the protection glue-line that plays a protective role outside above-mentioned the second glue-line; Above-mentioned led chip is wrapped up fully by above-mentioned the first glue-line and the second glue-line, and above-mentioned the first glue-line, the second glue-line, protection glue-line are all transparent, and above-mentioned electrode is electrically connected with the led chip formation.
Further, above-mentioned electrode is electrically connected with above-mentioned led chip formation by the gold thread that is embedded in above-mentioned the second glue-line and the protection glue-line.
Further, above-mentioned electrode part by above-mentioned the second glue-line or/and the protection glue-line covers, part is exposed the front at above-mentioned base material.Above-mentioned electrode is metal electrode.
Further, above-mentioned the first glue-line is fluorescent glue, and above-mentioned the second glue-line is fluorescent glue, and above-mentioned protection glue-line is transparent colloid.
Further, above-mentioned base material is that transparent resin material is made.Particularly, above-mentioned base material is that transparent PET or PC material made, and above-mentioned base material is sheet material.
Usefulness of the present invention is: the full angle that can realize led chip is luminous, and structure is easy to realize adequately protecting again led chip simultaneously.
Description of drawings
Fig. 1 is the structural representation of a preferred embodiment of the emitting led chip-packaging structure of full angle of the present invention.
The implication of Reference numeral among the figure: the 1-LED chip, the 2-base material, the 3-electrode, 4-the first glue-line, 5-the second glue-line, 6-protects glue-line, 7-gold thread.
Embodiment
Below in conjunction with the drawings and specific embodiments the present invention is done concrete introduction.
As shown in Figure 1, the emitting led chip-packaging structure of full angle mainly comprises: led chip 1, base material 2, electrode 3, the first glue-line 4, the second glue-line 5 and protection glue-line 6.
Wherein, base material 2 is as the carrier of carrying led chip 1, and led chip 1 is arranged on the front of base material 2, and some circuit also can be set in the front of corresponding base material 2 or other are in order to install the structure of led chip.As a kind of preferred version, base material 2 is sheet material, and makes for transparent resin material, and particularly, base material 2 is made for transparent PET or PC material.The base material 2 of sheet material is convenient to fixed L ED chip 1.Be provided with the first glue-line 4 between led chip 1 and the base material 2, its role is to, with the front location of led chip 1 at base material 2.
Be coated with the second glue-line 5 on the led chip 1, led chip 1 is wrapped up fully by the first glue-line 4 and the second glue-line 5.The effect of the second glue-line 5 is to cover led chip 1, and it is protected, and need to prove, before applying the second glue-line 5, should first gold thread 7 be arranged, in a single day because set the second glue-line 5, led chip 1 namely has been isolated from the outside.
The second glue-line 5 outer side covers have the protection glue-line 6 that plays a protective role.Protective layer 6 is mainly used to the electrode 3 protecting gold thread 7 and be arranged on equally base material 2 fronts, is metal electrode as preferred electrode 3.The main usefulness of electrode 3 is to make led chip 1 can be connected in the extraneous power supply circuits; because electrode 3 parts need to be exposed to the front of base material 2; another is convenient for can fixed electrode 3; we need colloid that it is covered or are fixing; it is played fixation can be protective layer 6, also can be the second glue-line 5; certainly as preferred, also they all contact with electrode 3 and jointly play fixation.
As a kind of preferred version, the first glue-line 4 and the second glue-line 5 are fluorescent glue, and protection glue-line 6 is transparent colloid.
More than show and described basic principle of the present invention, principal character and advantage.The technical staff of the industry should understand, and above-described embodiment does not limit the present invention in any form, and all employings are equal to replaces or technical scheme that the mode of equivalent transformation obtains, all drops in protection scope of the present invention.
Claims (10)
1. the emitting led chip-packaging structure of full angle, comprise: led chip, it is characterized in that, also comprise: be used for being arranged at the transparent base material of the above-mentioned led chip of its positive carrying, equally above-mentioned base material front the electrode that is used for being electrically connected with the external world, be arranged on the first glue-line between above-mentioned base material and the led chip, be used for covering above-mentioned led chip the second glue-line, be used for being coated in the protection glue-line that plays a protective role outside above-mentioned the second glue-line; Above-mentioned led chip is wrapped up fully by above-mentioned the first glue-line and the second glue-line, and above-mentioned the first glue-line, the second glue-line, protection glue-line are all transparent, and above-mentioned electrode is electrically connected with the led chip formation.
2. the emitting led chip-packaging structure of full angle according to claim 1 is characterized in that, above-mentioned electrode is electrically connected with above-mentioned led chip formation by the gold thread that is embedded in above-mentioned the second glue-line and the protection glue-line.
3. the emitting led chip-packaging structure of full angle according to claim 1 is characterized in that, above-mentioned electrode part by above-mentioned the second glue-line or/and the protection glue-line covers, part is exposed the front at above-mentioned base material.
4. the emitting led chip-packaging structure of full angle according to claim 1 is characterized in that, above-mentioned electrode is metal electrode.
5. the emitting led chip-packaging structure of full angle according to claim 1 is characterized in that, above-mentioned the first glue-line is fluorescent glue.
6. the emitting led chip-packaging structure of full angle according to claim 1 is characterized in that, above-mentioned the second glue-line is fluorescent glue.
7. the emitting led chip-packaging structure of full angle according to claim 1 is characterized in that, above-mentioned protection glue-line is transparent colloid.
8. according to claim 1 to the emitting led chip-packaging structure of 7 each described full angles, it is characterized in that above-mentioned base material is that transparent resin material is made.
9. the emitting led chip-packaging structure of full angle according to claim 8 is characterized in that, above-mentioned base material is that transparent PET or PC material made.
10. the emitting led chip-packaging structure of full angle according to claim 9 is characterized in that, above-mentioned base material is sheet material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103242412A CN102856475A (en) | 2012-09-05 | 2012-09-05 | Full-angle luminous LED (light-emitting diode) chip encapsulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103242412A CN102856475A (en) | 2012-09-05 | 2012-09-05 | Full-angle luminous LED (light-emitting diode) chip encapsulation structure |
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| CN102856475A true CN102856475A (en) | 2013-01-02 |
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| CN2012103242412A Pending CN102856475A (en) | 2012-09-05 | 2012-09-05 | Full-angle luminous LED (light-emitting diode) chip encapsulation structure |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103075667A (en) * | 2013-01-11 | 2013-05-01 | 郑香奕 | Full-angle light emitting diode (LED) light source body and production process for same |
| CN103700653A (en) * | 2013-12-14 | 2014-04-02 | 立达信绿色照明股份有限公司 | LED (Light-Emitting Diode) light source packaging structure |
| CN104078548A (en) * | 2013-03-29 | 2014-10-01 | 易美芯光（北京）科技有限公司 | Full-angle light-emitting LED white light source and manufacturing method thereof |
| CN109599475A (en) * | 2019-01-28 | 2019-04-09 | 宁波升谱光电股份有限公司 | A kind of light modulation COB light source and its manufacturing method |
| CN110350064A (en) * | 2013-07-01 | 2019-10-18 | 晶元光电股份有限公司 | Light-emitting diode component and production method |
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| CN1510766A (en) * | 2002-12-24 | 2004-07-07 | 斯坦雷电气株式会社 | Surface installation white light emitting diodes |
| EP1693904A2 (en) * | 2005-02-18 | 2006-08-23 | Nichia Corporation | Light emitting device provided with lens for controlling light distribution characteristic |
| US20070139949A1 (en) * | 2005-12-16 | 2007-06-21 | Nichia Corporation | Light emitting device |
| JP2007311626A (en) * | 2006-05-19 | 2007-11-29 | Fujikura Ltd | Light source device |
| CN202797076U (en) * | 2012-09-05 | 2013-03-13 | 苏州金科信汇光电科技有限公司 | Packaging structure capable of achieving all-angle luminescence of LED chip |
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2012
- 2012-09-05 CN CN2012103242412A patent/CN102856475A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1510766A (en) * | 2002-12-24 | 2004-07-07 | 斯坦雷电气株式会社 | Surface installation white light emitting diodes |
| EP1693904A2 (en) * | 2005-02-18 | 2006-08-23 | Nichia Corporation | Light emitting device provided with lens for controlling light distribution characteristic |
| US20070139949A1 (en) * | 2005-12-16 | 2007-06-21 | Nichia Corporation | Light emitting device |
| JP2007311626A (en) * | 2006-05-19 | 2007-11-29 | Fujikura Ltd | Light source device |
| CN202797076U (en) * | 2012-09-05 | 2013-03-13 | 苏州金科信汇光电科技有限公司 | Packaging structure capable of achieving all-angle luminescence of LED chip |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103075667A (en) * | 2013-01-11 | 2013-05-01 | 郑香奕 | Full-angle light emitting diode (LED) light source body and production process for same |
| CN104078548A (en) * | 2013-03-29 | 2014-10-01 | 易美芯光（北京）科技有限公司 | Full-angle light-emitting LED white light source and manufacturing method thereof |
| CN110350064A (en) * | 2013-07-01 | 2019-10-18 | 晶元光电股份有限公司 | Light-emitting diode component and production method |
| CN103700653A (en) * | 2013-12-14 | 2014-04-02 | 立达信绿色照明股份有限公司 | LED (Light-Emitting Diode) light source packaging structure |
| CN103700653B (en) * | 2013-12-14 | 2017-01-18 | 立达信绿色照明股份有限公司 | LED (Light-Emitting Diode) light source packaging structure |
| CN109599475A (en) * | 2019-01-28 | 2019-04-09 | 宁波升谱光电股份有限公司 | A kind of light modulation COB light source and its manufacturing method |
| CN109599475B (en) * | 2019-01-28 | 2024-05-03 | 宁波升谱光电股份有限公司 | Dimming COB light source and manufacturing method thereof |
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Application publication date: 20130102 |