CN110246794A - LED double end chip attachment machine - Google Patents
LED double end chip attachment machine Download PDFInfo
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- CN110246794A CN110246794A CN201910549674.XA CN201910549674A CN110246794A CN 110246794 A CN110246794 A CN 110246794A CN 201910549674 A CN201910549674 A CN 201910549674A CN 110246794 A CN110246794 A CN 110246794A
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- 239000000758 substrate Substances 0.000 claims description 40
- 230000003028 elevating effect Effects 0.000 claims description 12
- 238000012546 transfer Methods 0.000 claims description 12
- 230000006835 compression Effects 0.000 claims description 10
- 238000007906 compression Methods 0.000 claims description 10
- 239000003292 glue Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 238000005538 encapsulation Methods 0.000 abstract description 2
- 238000004880 explosion Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
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- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The present invention relates to technical field of semiconductor encapsulation, specifically disclose a kind of LED double end chip attachment machine, including platen, bracket are into rewinding component and two chip attachment components；The bracket is located at the middle position of the platen front end into rewinding component comprising two be set side by side are into receiving mechanism；The chip attachment component includes that bracket mobile platform, chip mobile platform, the chip in the middle part of the platen jack up component and the chip attachment mechanism positioned at the platen rear end.The present invention provides a kind of LED double end chip attachment machine, and chip attachment speed can be improved, and reduces production cost.
Description
Technical field
The present invention relates to technical field of semiconductor encapsulation more particularly to a kind of LED double end chip attachment machines.
Background technique
Light emitting diode (Light Emitting Diode) is referred to as LED, is one of semiconductor diode, can be with
Electric energy is converted to luminous energy.LED is referred to as forth generation light source, has energy-saving and environmental protection, safety, service life length, low-power consumption and maintenance letter
Just the features such as, is widely used for the fields such as various instructions, display, decoration, backlight and general lighting.
LED chip mounting device be it is a kind of will draw LED wafer from brilliant ring after by LED wafer attachment on LED support, use
In the automation equipment for the automatic attaching for realizing LED wafer, can meet the needs of most of LED producing lines.With LED popularization and
Various application and developments, demand of the people to LED is growing day by day, production capacity and essence of major LED manufacturer to LED chip mounting device
Degree requires also higher and higher
The chip attachment machine core piece placement speed of traditional single head LED chip placement equipment is slow, and working efficiency is low, occupies empty
Between it is big, cause production cost higher.
Drawbacks described above and market in view of the prior art need, there is an urgent need to research and develop a kind of novel LED chip placement equipment,
Chip attachment speed can be improved, reduce production cost.
Summary of the invention
It is an advantage of the invention to provide a kind of LED double end chip attachment machines, and chip attachment speed can be improved,
Reduce production cost.
To achieve these objectives, the present invention provides a kind of LED double end chip attachment machine, including platen, bracket are into rewinding component
With two chip attachment components；
The bracket is located at the middle position of the platen front end into rewinding component comprising two be set side by side are into rewinding
Mechanism, it is described into receiving mechanism include transfer bar mechanism, magazine and elevating mechanism；The magazine is both ends open structure, inside
Equipped with several storing layers arranged from top to bottom, every layer of storing layer can place row's LED support；The transfer bar mechanism position
In the front open at one end of the magazine, ejected for the LED support in storing layer to be open from the other end of the magazine；
The bottom of the elevating mechanism and the magazine is affixed, for driving the magazine to move up and down；
The chip attachment component includes:
Bracket mobile platform in the middle part of the platen, the bracket mobile platform are located at close to the magazine other end
The side of opening, for receiving the LED support for not pasting core of the magazine supply and having pasted described in the LED support return of core
Magazine；
Chip mobile platform, the bracket are respectively positioned on two cores into rewinding component and the two bracket mobile platforms
Between piece mobile platform；
Chip jacks up component, and the chip jacks up component for jacking up chip；The chip mobile platform and the core
Piece jack-up component is affixed, moves in the horizontal direction along X-axis and Y-axis for driving the chip to jack up component；
Chip attachment mechanism positioned at the platen rear end, the chip attachment mechanism is equipped with can be from the chip jack-up group
Chip is picked up above part and turns to the suction nozzle being put into chip above the bracket mobile platform in LED support.
Preferably, the LED double end chip attachment machine further include:
Horizontal guide rail, the two bracket mobile platforms be respectively positioned on the top of the horizontal guide rail and with the horizontal guide rail edge
X-direction is slidably connected.
Preferably, the bracket mobile platform includes:
First support bottom plate, the first support bottom plate are slidably connected with the horizontal guide rail；
Second support bottom plate, the second support bottom plate be located at the top of the first support bottom plate and with described first
The top of frame bottom plate is slidably connected along the y axis；
Support positioning component, the support positioning component include compressing frame and the roller group below the compression frame
Part, the roll wheel assembly are used to cooperate with the compression frame along the y axis between compression frame and the roll wheel assembly
LED support is shifted.
Preferably, the chip mobile platform includes:
First die substrate, first die substrate are fixedly arranged on the top of the platen；
Second die substrate, second die substrate be located at the top of first die substrate and with first core
The top of piece bottom plate is slidably connected along the y axis；
Third die substrate, the third die substrate be located at the top of second die substrate and with second core
The top of piece bottom plate is slidably connected along the x axis；
Load plate positioning component, the load plate positioning component are fixedly arranged on the top of the third die substrate.
Preferably, the chip jack-up component includes:
Jack up main body, the lower section for jacking up main body and being located at the load plate positioning component, for jacking up chip；
XOY plane adjusts platform, and the XOY plane adjusts platform and the load plate positioning component is fixedly installed, the top
Play main body and be located at the XOY plane and adjust on platform, the XOY plane adjust platform be used to adjust the jack-up main body with it is described
Relative position of both load plate positioning components on XOY plane.
Preferably, the chip attachment mechanism further include:
Rotating electric machine；
Arm is mounted, one end of the attachment arm and the driving end of the rotating electric machine are affixed, and the other end and the suction nozzle are solid
It connects；
Brilliant camera lens is taken, it is described to take brilliant camera lens for obtaining first location information of the chip in the chip mobile platform,
The chip is picked up so that the rotating electric machine controls the suction nozzle according to the first location information；
Dispensing component, the dispensing component is for glue to be placed into the pad of LED support；
Camera lens is mounted, the attachment camera lens is used to obtain second location information of the pad in LED support, in favor of
The rotating electric machine controls the suction nozzle according to the second location information and the chip is put into pad for dispensing glue.
Preferably, the rotating electric machine takes between brilliant camera lens and attachment camera lens positioned at described, and the two dispensing components are located at
Between the two attachment camera lenses.
Preferably, described into receiving mechanism is duplexing bit architecture, and each station is equipped with the transfer bar mechanism, magazine
And elevating mechanism.
The beneficial effects of the present invention are: a kind of LED double end chip attachment machine is provided, chip attachment speed can be improved,
Reduce production cost.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention without any creative labor, may be used also for those of ordinary skill in the art
To obtain other attached drawings according to these attached drawings.
Fig. 1 is the structural schematic diagram for the LED double end chip attachment machine that embodiment provides；
Fig. 2 is the perspective view of the explosion for the LED double end chip attachment machine that embodiment provides；
Fig. 3 is structural schematic diagram of the bracket that provides of embodiment into rewinding component；
Fig. 4 is the perspective view of the explosion for the bracket mobile platform that embodiment provides；
Fig. 5 is the perspective view of the explosion for the chip mobile platform that embodiment provides；
Fig. 6 is the perspective view of the explosion that the chip that embodiment provides jacks up component；
Fig. 7 is the structural schematic diagram for the chip attachment mechanism that embodiment provides.
In figure:
1, platen；
2, bracket is into rewinding component；201, transfer bar mechanism；202, magazine；203, elevating mechanism；204, second station；
3, bracket mobile platform；301, first support bottom plate；302, second support bottom plate；303, support positioning component；
3031, frame is compressed；3032, roll wheel assembly；
4, chip mobile platform；401, the first die substrate；402, the second die substrate；403, third die substrate；
404, load plate positioning component；
5, chip jacks up component；501, main body is jacked up；502, XOY plane adjusts platform；
6, chip attachment mechanism；601, rotating electric machine；602, arm is mounted；603, brilliant camera lens is taken；604, dispensing component；605,
Mount camera lens；
7, horizontal guide rail.
Specific embodiment
To enable the purpose of the present invention, feature, advantage more obvious and understandable, implement below in conjunction with the present invention
Attached drawing in example, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that reality disclosed below
Applying example is only a part of the embodiment of the present invention, and not all embodiment.Based on the embodiments of the present invention, this field is common
Technical staff's all other embodiment obtained without making creative work belongs to the model that the present invention protects
It encloses.
In the description of the present invention, it is to be understood that, when a component is considered as " connection " another component, it can
To be directly to another component or may be simultaneously present the component being centrally located.When a component is considered as " setting
Set " another component, it, which can be, is set up directly on another component or may be simultaneously present the component being centrally located.
In addition, the indicating positions such as term " length " " short " "inner" "outside" or positional relationship for the orientation that is shown based on attached drawing or
Person's positional relationship is merely for convenience of the description present invention, rather than the device or original part of indication or suggestion meaning must have this
Specific orientation is operated with specific orientation construction, should not be understood as limitation of the invention with this.
To further illustrate the technical scheme of the present invention below with reference to the accompanying drawings and specific embodiments.
Referring to FIG. 1 to FIG. 7, the present embodiment provides a kind of LED double end chip attachment machine, including platen 1, bracket are into rewinding group
Part 2 and two chip attachment components.
The bracket is located at the middle position of 1 front end of platen into rewinding component 2 comprising two be set side by side are into receipts
Expect mechanism, it is described into receiving mechanism include transfer bar mechanism 201, magazine 202 and elevating mechanism 203；The magazine 202 is opened for both ends
Mouth structure, is internally provided with several storing layers arranged from top to bottom, and every layer of storing layer can place row's LED support；
The transfer bar mechanism 201 is located at the front open at one end of the magazine 202, for by the LED support in storing layer from described
The other end of magazine 202, which is open, to be ejected；The bottom of the elevating mechanism 203 and the magazine 202 is affixed, for driving the material
Box 202 moves up and down.Preferably, described into receiving mechanism is duplexing bit architecture, and each station is equipped with the push rod machine
Structure 201, magazine 202 and elevating mechanism 203.
The chip attachment component includes bracket mobile platform 3, the chip mobile platform 4, core positioned at 1 middle part of platen
Piece jacks up component 5 and the chip attachment mechanism 6 positioned at 1 rear end of platen.The bracket mobile platform 3 is located at close to the material
The side of another end opening of box 202, for receiving the LED support for not pasting core and core will have been pasted that the magazine 202 supplies
LED support returns to the magazine 202.The bracket is respectively positioned on two institutes into rewinding component 2 and the two bracket mobile platforms 3
It states between chip mobile platform 4.The chip jacks up component 5 for jacking up chip；The chip mobile platform 4 and the core
Piece jack-up component 5 is affixed, moves in the horizontal direction along X-axis and Y-axis for driving the chip to jack up component 5.The chip patch
Mounting mechanism 6 is equipped with to jack up pick up chip above component 5 and turn to above the bracket mobile platform 3 from the chip and incite somebody to action
Chip is put into the suction nozzle in LED support.
Preferably, LED double end chip attachment machine further includes horizontal guide rail 7, and the two bracket mobile platforms 3 are respectively positioned on described
The top of horizontal guide rail 7 is simultaneously slidably connected with the horizontal guide rail 7 along the x axis.Specifically, it is supplied using one group of horizontal guide rail 7
Two pack support mobile platforms 3 share, and can effectively reduce equipment volume, improve the compactness of equipment.
In the present embodiment, the bracket mobile platform 3 includes first support bottom plate 301, second support bottom plate 302 and bracket
Positioning component 303.The first support bottom plate 301 is slidably connected with the horizontal guide rail 7.The second support bottom plate 302
In the first support bottom plate 301 top and be slidably connected along the y axis with the top of the first support bottom plate 301.Institute
Stating support positioning component 303 includes compressing frame 3031 and the roll wheel assembly 3032 positioned at 3031 lower section of compression frame, the rolling
Wheel assembly 3032 is used for the compression frame 3031 cooperation along the y axis to positioned at the compression frame 3031 and roll wheel assembly 3032
Between LED support shifted.Specifically, by control first support bottom plate 301 and second support bottom plate 302 sliding away from
From, so that it may realize the control to the position on XOY plane of load plate positioning component 404.
The chip mobile platform 4 includes the first die substrate 401, the second die substrate 402, third die substrate 403
With load plate positioning component 404.First die substrate 401 is fixedly arranged on the top of the platen 1.Second die substrate
402 be located at the top of first die substrate 401 and with the top of first die substrate 401 company of sliding along the y axis
It connects.The third die substrate 403 be located at the top of second die substrate 402 and with second die substrate 402
Top is slidably connected along the x axis.The load plate positioning component 404 is fixedly arranged on the top of the third die substrate 403.Specifically
Ground, by the sliding distance for controlling the second die substrate 402 and third die substrate 403, so that it may realize to load plate positioning group
The control of the position on XOY plane of part 404.
It includes jacking up main body 501 and XOY plane adjusting platform 502 that the chip, which jacks up component 5,.The jack-up main body 501
Positioned at the lower section of the load plate positioning component 404, for chip to be jacked up.The XOY plane adjusts platform 502 and the load plate
Positioning component 404 is fixedly installed, and the jack-up main body 501 is located at the XOY plane and adjusts on platform 502, the XOY plane tune
Section platform 502 is used to adjust the opposite position of both the jack-up main body 501 and described load plate positioning component 404 on XOY plane
It sets.
The chip attachment mechanism 6 further includes rotating electric machine 601, attachment arm 602, takes brilliant camera lens 603, dispensing component 604
With attachment camera lens 605.One end of the attachment arm 602 and the driving end of the rotating electric machine 601 are affixed, the other end and the suction
Mouth is affixed.It is described to take brilliant camera lens 603 for obtaining first location information of the chip in the chip mobile platform 4, in favor of
The rotating electric machine 601 controls the suction nozzle according to the first location information and picks up the chip.The dispensing component 604
For glue to be placed into the pad of LED support.The attachment camera lens 605 is for obtaining the pad in LED support
Second location information, so that the rotating electric machine 601 controls the suction nozzle for the chip according to the second location information
It is put into pad for dispensing glue.Specifically, the rotating electric machine 601 be located at it is described take brilliant camera lens 603 and attachment camera lens 605 it
Between, the two dispensing components 604 are between the two attachment camera lenses 605.It is understood that such mechanism position cloth
Office, can make full use of occupied area provided by platen 1, improve the compactness of equipment.
The LED double end chip attachment machine course of work provided in this embodiment is as follows:
1. according to attachment arm 602 length adjustment XOY plane adjust platform 502, allow jack up main body 501 be located at and suction
The corresponding position of mouth；
2. being put into the magazine 202 that one piles LED support into the first station in receiving mechanism, elevating mechanism 203 makes most
The storing layer of top is aligned with transfer bar mechanism 201；
3. transfer bar mechanism 201 stretches out, the LED support in the storing layer of the top is released to compression frame 3031 and roller group
Between part 3032, roll wheel assembly 3032 is rotated forward, and LED support is moved to the central location of bracket mobile platform 3；
4. first support bottom plate 301 is slided along horizontal guide rail 7, second support bottom plate 302 is sliding along first support bottom plate 301
It is dynamic, all around LED support is adjusted so that LED support is located at the position that dispensing component 604 and suction nozzle can contact；
4. dispensing component 604 acts, glue is placed in the pad of LED support；
5. the second die substrate 402 is slided along the first die substrate 401, third die substrate 403 is along the second die substrate
402 slidings all around adjust the position for jacking up main body 501 so that jacking up main body 501 is located at the position that suction nozzle can contact；
6. brilliant camera lens 603 is taken to work, the location information of load plate positioning component 404 and chip is obtained, adjusts rotating electric machine 601
Running parameter, so that suction nozzle is moved to the surface of chip；
7. jacking up main body 501 to act, chip is jacked up, suction nozzle decline picks up chip, and suction nozzle rises；
8. mounting camera lens 605 to work, the position of pad for dispensing glue is obtained, the running parameter of rotating electric machine 601 is adjusted, makes
Suction nozzle turns to above pad, and chip is put into pad, completes the attachment of a pad by suction nozzle decline；
9. first support bottom plate 301 slides along horizontal guide rail 7 after completing the attachment of all pads between entire LED, the
Two bracket bottom plates 302 slide along first support bottom plate 301, all around adjust LED support so that LED support and top layer
The alignment of storing layer；Roll wheel assembly 3032 rotates backward, and LED support is sent back to the storing layer of top layer；
10. magazine 202 is driven to move downward suitable distance for elevating mechanism 203 so that second layer storing layer and transfer bar mechanism 201
Alignment repeats the above steps until the LED support in all storing layers is all completed to mount；By charged another magazine
202 are put into second station 204, when the LED support in the magazine 202 in the first station is fully completed attachment, switch to second
LED support in station 204 is mounted；When LED support in the magazine 202 to second station 204 mounts, take away
The LED support in magazine 202 in first station is laid equal stress on new charging, and so on, attachment is not shut down to realize, to improve life
Produce efficiency.
LED double end chip attachment machine provided in this embodiment, has following advantages:
1. using dual head design, the chip attachment period is short, high-efficient.
2. compact-sized, component feature space utilization rate is high, and occupied area is small, saves venue cost.
The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although with reference to the foregoing embodiments
Invention is explained in detail, those skilled in the art should understand that: it still can be to aforementioned each implementation
Technical solution documented by example is modified or equivalent replacement of some of the technical features；And these modification or
Replacement, the spirit and scope for technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution.
Claims (8)
1. a kind of LED double end chip attachment machine, which is characterized in that including platen (1), bracket into rewinding component (2) and two chips
Mounted Device；
The bracket is located at the middle position of the platen (1) front end into rewinding component (2) comprising two be set side by side are into receipts
Expect mechanism, it is described into receiving mechanism include transfer bar mechanism (201), magazine (202) and elevating mechanism (203)；The magazine (202)
For both ends open structure, several storing layers arranged from top to bottom are internally provided with, every layer of storing layer can place a row
LED support；The transfer bar mechanism (201) is located at the front open at one end of the magazine (202), for will be in storing layer
LED support is open from the other end of the magazine (202) and ejects；The bottom of the elevating mechanism (203) and the magazine (202)
It is affixed, for driving the magazine (202) to move up and down；
The chip attachment component includes:
Bracket mobile platform (3) in the middle part of the platen (1), the bracket mobile platform (3) are located at close to the magazine
(202) side of another end opening, for receiving the LED support for not pasting core of the magazine (202) supply and core having been pasted
LED support return to the magazine (202)；
Chip mobile platform (4), the bracket are respectively positioned on described in two into rewinding component (2) and the two bracket mobile platforms (3)
Between the chip mobile platform (4)；
Chip jacks up component (5), and the chip jacks up component (5) for jacking up chip；The chip mobile platform (4) and institute
It is affixed to state chip jack-up component (5), is moved in the horizontal direction along X-axis and Y-axis for driving the chip to jack up component (5)；
Chip attachment mechanism (6) positioned at the platen (1) rear end, the chip attachment mechanism (6) is equipped with can be from the chip
It jacks up to pick up chip above component (5) and turn to and chip is put into LED support above the bracket mobile platform (3)
Suction nozzle.
2. LED double end chip attachment machine according to claim 1, which is characterized in that further include:
Horizontal guide rail (7), the two bracket mobile platforms (3) be respectively positioned on the top of the horizontal guide rail (7) and with the level
Guide rail (7) is slidably connected along the x axis.
3. LED double end chip attachment machine according to claim 2, which is characterized in that bracket mobile platform (3) packet
It includes:
First support bottom plate (301), the first support bottom plate (301) are slidably connected with the horizontal guide rail (7)；
Second support bottom plate (302), the second support bottom plate (302) are located at the top of the first support bottom plate (301) simultaneously
It is slidably connected along the y axis with the top of the first support bottom plate (301)；
Support positioning component (303), the support positioning component (303) include compressing frame (3031) and positioned at the compression frame
(3031) roll wheel assembly (3032) below, the roll wheel assembly (3032) are used to cooperate with the compression frame (3031) along Y-axis
The LED support being located between compression frame (3031) and roll wheel assembly (3032) is shifted in direction.
4. LED double end chip attachment machine according to claim 1, which is characterized in that chip mobile platform (4) packet
It includes:
First die substrate (401), first die substrate (401) are fixedly arranged on the top of the platen (1)；
Second die substrate (402), second die substrate (402) are located at the top of first die substrate (401) simultaneously
It is slidably connected along the y axis with the top of first die substrate (401)；
Third die substrate (403), the third die substrate (403) are located at the top of second die substrate (402) simultaneously
It is slidably connected along the x axis with the top of second die substrate (402)；
Load plate positioning component (404), the load plate positioning component (404) are fixedly arranged on the top of the third die substrate (403).
5. LED double end chip attachment machine according to claim 4, which is characterized in that the chip jacks up component (5) packet
It includes:
It jacks up main body (501), the lower section for jacking up main body (501) and being located at the load plate positioning component (404) is used for chip
It jacks up；
XOY plane adjusts platform (502), and the XOY plane adjusts platform (502) and the load plate positioning component (404) is fixed
Setting, the jack-up main body (501) are located at the XOY plane and adjust on platform (502), and the XOY plane adjusts platform (502)
For adjusting the relative position of both jack-up main body (501) and described load plate positioning component (404) on XOY plane.
6. LED double end chip attachment machine according to claim 1, which is characterized in that the chip attachment mechanism (6) is also wrapped
It includes:
Rotating electric machine (601)；
Mount arm (602), it is described attachment arm (602) one end and the rotating electric machine (601) driving end it is affixed, the other end and
The suction nozzle is affixed；
It takes brilliant camera lens (603), it is described to take brilliant camera lens (603) for obtaining chip first in the chip mobile platform (4)
Location information inhales the chip so that the rotating electric machine (601) controls the suction nozzle according to the first location information
It rises；
Dispensing component (604), the dispensing component (604) is for glue to be placed into the pad of LED support；
It mounting camera lens (605), the attachment camera lens (605) is used to obtain second location information of the pad in LED support,
In favor of the rotating electric machine (601) according to the second location information control the suction nozzle chip is put into it is for dispensing glue
In pad.
7. LED double end chip attachment machine according to claim 6, which is characterized in that the rotating electric machine (601) is located at institute
It states and takes between brilliant camera lens (603) and attachment camera lens (605), the two dispensing components (604) are located at the two attachment camera lenses (605)
Between.
8. LED double end chip attachment machine according to claim 1, which is characterized in that it is described into receiving mechanism be double-station
Structure, each station are equipped with the transfer bar mechanism (201), magazine (202) and elevating mechanism (203).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910549674.XA CN110246794B (en) | 2019-06-24 | 2019-06-24 | LED double-end chip mounting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910549674.XA CN110246794B (en) | 2019-06-24 | 2019-06-24 | LED double-end chip mounting machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110246794A true CN110246794A (en) | 2019-09-17 |
| CN110246794B CN110246794B (en) | 2024-08-20 |
Family
ID=67889057
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910549674.XA Active CN110246794B (en) | 2019-06-24 | 2019-06-24 | LED double-end chip mounting machine |
Country Status (1)
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