CN110125828A - A kind of preparation method of diamond tool - Google Patents
A kind of preparation method of diamond tool Download PDFInfo
- Publication number
- CN110125828A CN110125828A CN201910448627.6A CN201910448627A CN110125828A CN 110125828 A CN110125828 A CN 110125828A CN 201910448627 A CN201910448627 A CN 201910448627A CN 110125828 A CN110125828 A CN 110125828A
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- CN
- China
- Prior art keywords
- diamond tool
- diamond
- preparation
- film
- matrix
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0018—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by electrolytic deposition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0054—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by impressing abrasive powder in a matrix
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The present invention discloses a kind of preparation method of diamond tool, comprising the following steps: S1, prepares diamond tool matrix；S2, film is covered in the working face of diamond tool matrix, film surface is equipped with one group of through-hole, and through-hole is in array distribution；S3, using film as template layer, diamond particles are plated on to the working face of diamond tool matrix by electroplating technology, diamond particles are arranged in the through-hole in array；S4, removal film, and solder is added in the working face of diamond tool matrix；S5, diamond tool matrix is brazed, obtains diamond tool；By film as template, make diamond particles ordered arrangement in solder, both the bond strength that can have possessed high-melting-point brazed diamond tool is high, resistance to grinding, the features such as solder is good to diamond wetability, brazing temperature can be reduced again, diamond thermal damage is reduced, performance and the service life of diamond tool are improved.
Description
Technical field
The present invention relates to diamond tool technical field, the preparation method of specifically a kind of diamond tool.
Background technique
Brazed diamond tool bond strength is high, and height of protrusion is big, and resistance to grinding, high temperature resistance are good, but due to soldering temperature
Degree is high, diamond heat damage and strength reduction, during heavy load grinding, diamond often occurs it is broken, be broken or even whole
It falls off.Solder used at present mainly has Ni base, Ag base and Cu base.
In order to improve brazing filler metal fusing point, researcher is using Ag-Cu or Cu-Sn low-melting alloy as solder, and solder is to gold
Hard rock wellability is good, and diamond thermal damage is small, and low-melting alloy solder hardness is not high, and resistance to grinding, high temperature resistance are poor, though
It is to manufacture the ideal solder of diamond tool, but application range is restricted.
Summary of the invention
The purpose of the present invention is to provide a kind of preparation method of diamond tool, this method can both possess high-melting-point pricker
The bond strength for welding diamond tool is high, resistance to grinding, the features such as solder is good to diamond wetability, and can reduce soldering temperature
Degree reduces diamond thermal damage, improves performance and the service life of diamond tool.
The technical solution adopted by the present invention to solve the technical problems is:
A kind of preparation method of diamond tool, comprising the following steps:
S1, diamond tool matrix is prepared；
S2, film is covered in the working face of diamond tool matrix, film surface is equipped with one group of through-hole, and through-hole is in array distribution；
S3, using film as template layer, diamond particles are plated on to the working face of diamond tool matrix by electroplating technology, gold
Hard rock particle is arranged in the through-hole in array；
S4, removal film, and solder is added in the working face of diamond tool matrix；
S5, diamond tool matrix is brazed, obtains diamond tool.
Further, diamond tool matrix described in step S1 is prepared in the way of machining using 45# steel.
Further, 0.15~0.22mm of film thickness described in step S2, through-hole diameter 0.35mm, the spacing of adjacent through-holes
For 1.1mm.
Further, diamond particle size described in step S3 is 250~350 μm, and diamond particle surfaces are coated with Ti gold
Belong to layer.
Further, after diamond particles have been electroplated in step S3, the shape between diamond particles and diamond tool matrix
At electroplated layer, electroplated layer is Ni-Co bianry alloy.
Further, solder described in step S4 is Cu-Sn alloy.
Further, temperature when step S5 is brazed is 800~900 DEG C, keeps the temperature 15~20min.
Further, step S5 soldering uses vacuum brazing process or brazing in controlled atmosphere method.
Further, the step of carrying out insulation processing the method also includes the non-working surface to diamond tool matrix.
The invention has the advantages that making diamond particles ordered arrangement in solder as template by film, both may be used
Bond strength to possess high-melting-point brazed diamond tool is high, resistance to grinding, the features such as solder is good to diamond wetability, again
Brazing temperature can be reduced, diamond thermal damage is reduced, improves performance and the service life of diamond tool；Using plating Ti diamond
It may be implemented during the brazing process, Ti forms the chemical bonding of TiC with the C in diamond first, and solder is good to diamond wetability,
The interface bond strength of diamond is improved, diamond order arrangement to avoid being segregated and gathering, can improve the work effect of tool
Rate can reduce brazing temperature using low-temperature brazing filler metal, reduce diamond thermal damage, improve the service life of diamond tool.
Detailed description of the invention
Present invention will be further explained below with reference to the attached drawings and examples:
Fig. 1 is the schematic diagram of step S2 of the present invention；
Fig. 2 is the schematic diagram of step S3 of the present invention；
Fig. 3 is the schematic diagram of step S4 of the present invention.
Specific embodiment
The present invention provides a kind of preparation method of diamond tool, comprising the following steps:
S1, diamond tool matrix is prepared；45# steel can be used to be prepared in the way of machining, diamond tool matrix
Shape according to the diamond tool shape of actually required preparation, the present invention unlimited fixture external shape first uses grinding wheel after preparation
It polishes diamond tool matrix surface, removes rusty stain and grease stain, recycle acetone in ultrasonic cleaner to diamond
Tool base cleans 10min, drying；
S2, as shown in Figure 1, the working face in diamond tool matrix 1 is covered with film 2,2 surface of film is equipped with one group of through-hole 3, leads to
Hole 3 is in array distribution；Preferably, film 2 0.15~0.22mm of thickness, through-hole diameter 0.35mm, the spacing of adjacent through-holes
For 1.1mm；
S3, as shown in connection with fig. 2, is template layer with film 2, diamond particles 4 is plated on diamond tool by electroplating technology
The working face of matrix 1, diamond particles 4 are arranged in the through-hole 3 in array；
For diamond particles 4 having a size of 250~350 μm, 4 surface of diamond particles is coated with Ti metal layer；Diamond particles 4 are being electroplated
The method that alkali process is combined with acid processing can be used to purify diamond particles table in preceding progress surface cleaning and hydrophilicity-imparting treatment
Face, the sodium hydroxide solution of alkali process 2:1, diamond is placed in sodium hydroxide solution and boils half an hour on electric furnace,
It cools down out, is washed to neutrality with distillation, is then impregnated with dust technology, then thoroughly cleaned up through hot water wash, cold water-washing step；
Before plating, diamond tool matrix 1 also carries out surface degreasing processing of rust removing again, makes diamond tool matrix metal inside
Fresh lattice expose, convenient for the metal ion deposition in electroplate liquid in the state of activation metal crystal surface on, mainly
Steps are as follows: strong acid etch → cold water embathes → again cold water wash → electrochemical activation → cold water embathes → again cold water wash →
Mild acid etching activation → cold water is washed, and rear electrification enters electroplating bath and carries out rush of current, carries out pre-galvanized, dash current density is
2.0A/dm2, current density is adjusted to 1.5A/dm after 1min2, keep 10min；Then formal electroplated diamond particle；It has been electroplated
After diamond particles, electroplated layer 5 is formed between diamond particles and diamond tool matrix, electroplated layer 5 is the conjunction of Ni-Co binary
Gold；
S4, as shown in connection with fig. 3 removes film 2, and adds solder 6 in the working face of diamond tool matrix 1, and solder 6 uses
Cu-Sn alloy；
S5, diamond tool matrix is brazed, soldering uses vacuum brazing process or brazing in controlled atmosphere method, temperature when soldering
Degree is 800~900 DEG C, keeps the temperature 15~20min, obtains diamond tool.
This method further includes the steps that the non-working surface progress insulation processing to diamond tool matrix, insulation processing can adopt
With plating insulation processing.
The above described is only a preferred embodiment of the present invention, being not intended to limit the present invention in any form；Appoint
What those skilled in the art, without departing from the scope of the technical proposal of the invention, all using the side of the disclosure above
Method and technology contents make many possible changes and modifications to technical solution of the present invention, or are revised as the equivalent reality of equivalent variations
Apply example.Therefore, anything that does not depart from the technical scheme of the invention according to the technical essence of the invention do above embodiments
Any simple modification, equivalent replacement, equivalence changes and modification, all of which are still within the scope of protection of the technical scheme of the invention.
Claims (9)
1. a kind of preparation method of diamond tool, which comprises the following steps:
S1, diamond tool matrix is prepared；
S2, film is covered in the working face of diamond tool matrix, film surface is equipped with one group of through-hole, and through-hole is in array distribution；
S3, using film as template layer, diamond particles are plated on to the working face of diamond tool matrix by electroplating technology, gold
Hard rock particle is arranged in the through-hole in array；
S4, removal film, and solder is added in the working face of diamond tool matrix；
S5, diamond tool matrix is brazed, obtains diamond tool.
2. a kind of preparation method of diamond tool according to claim 1, which is characterized in that diamond described in step S1
Tool base is prepared in the way of machining using 45# steel.
3. a kind of preparation method of diamond tool according to claim 1, which is characterized in that film described in step S2 is thick
0.15~0.22mm, through-hole diameter 0.35mm are spent, the spacing of adjacent through-holes is 1.1mm.
4. a kind of preparation method of diamond tool according to claim 1, which is characterized in that diamond described in step S3
Particle size is 250~350 μm, and diamond particle surfaces are coated with Ti metal layer.
5. a kind of preparation method of diamond tool according to claim 1, which is characterized in that Buddha's warrior attendant has been electroplated in step S3
After stone particle, electroplated layer is formed between diamond particles and diamond tool matrix, electroplated layer is Ni-Co bianry alloy.
6. a kind of preparation method of diamond tool according to claim 1, which is characterized in that solder described in step S4 is
Cu-Sn alloy.
7. a kind of preparation method of diamond tool according to claim 1, which is characterized in that temperature when step S5 is brazed
Degree is 800~900 DEG C, keeps the temperature 15~20min.
8. a kind of preparation method of diamond tool according to claim 1, which is characterized in that step S5 soldering is using true
Empty method for brazing or brazing in controlled atmosphere method.
9. a kind of preparation method of diamond tool according to claim 1, which is characterized in that the method also includes right
The non-working surface of diamond tool matrix carries out the step of insulation processing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910448627.6A CN110125828A (en) | 2019-05-28 | 2019-05-28 | A kind of preparation method of diamond tool |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910448627.6A CN110125828A (en) | 2019-05-28 | 2019-05-28 | A kind of preparation method of diamond tool |
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| CN110125828A true CN110125828A (en) | 2019-08-16 |
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| CN201910448627.6A Pending CN110125828A (en) | 2019-05-28 | 2019-05-28 | A kind of preparation method of diamond tool |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110936303A (en) * | 2019-12-26 | 2020-03-31 | 华侨大学 | Electroplating-brazing composite preparation method of fine-grained superhard abrasive tool |
| CN111152143A (en) * | 2020-01-16 | 2020-05-15 | 深圳西斯特科技有限公司 | Directional arrangement method for superhard abrasives |
| CN113043178A (en) * | 2021-03-17 | 2021-06-29 | 江苏韦尔博新材料科技有限公司 | Brazing diamond grinding and polishing sheet and preparation process thereof |
| CN115026730A (en) * | 2022-07-11 | 2022-09-09 | 河北锟洲科技有限公司 | Roller diamond arrangement implantation method based on 3D printing |
| CN115106936A (en) * | 2022-06-24 | 2022-09-27 | 中国地质大学（武汉） | Diamond dressing disc and preparation method thereof |
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| CN106735778A (en) * | 2016-12-14 | 2017-05-31 | 青岛科技大学 | A kind of new method for making Study on Brazed Superabrasive Tools by arc cold-welding legal system |
| US20180311772A1 (en) * | 2014-07-02 | 2018-11-01 | United Technologies Corporation | Abrasive Preforms and Manufacture and Use Methods |
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| CN109702660A (en) * | 2019-01-09 | 2019-05-03 | 南京航空航天大学 | One kind being used for the precision machined super hard abrasive compliant tool of micro hole and its manufacturing method |
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2019
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| US20180311772A1 (en) * | 2014-07-02 | 2018-11-01 | United Technologies Corporation | Abrasive Preforms and Manufacture and Use Methods |
| CN106735778A (en) * | 2016-12-14 | 2017-05-31 | 青岛科技大学 | A kind of new method for making Study on Brazed Superabrasive Tools by arc cold-welding legal system |
| CN109352542A (en) * | 2018-11-15 | 2019-02-19 | 娄底市安地亚斯电子陶瓷有限公司 | Diamond abrasive tool and preparation method thereof |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110936303A (en) * | 2019-12-26 | 2020-03-31 | 华侨大学 | Electroplating-brazing composite preparation method of fine-grained superhard abrasive tool |
| CN111152143A (en) * | 2020-01-16 | 2020-05-15 | 深圳西斯特科技有限公司 | Directional arrangement method for superhard abrasives |
| CN113043178A (en) * | 2021-03-17 | 2021-06-29 | 江苏韦尔博新材料科技有限公司 | Brazing diamond grinding and polishing sheet and preparation process thereof |
| CN115106936A (en) * | 2022-06-24 | 2022-09-27 | 中国地质大学（武汉） | Diamond dressing disc and preparation method thereof |
| CN115106936B (en) * | 2022-06-24 | 2023-03-28 | 中国地质大学（武汉） | Diamond dressing disc and preparation method thereof |
| CN115026730A (en) * | 2022-07-11 | 2022-09-09 | 河北锟洲科技有限公司 | Roller diamond arrangement implantation method based on 3D printing |
| CN115026730B (en) * | 2022-07-11 | 2024-03-01 | 河北锟洲科技有限公司 | Roller diamond arrangement implantation method based on 3D printing |
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Application publication date: 20190816 |
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