CN110071206B - COB aluminum-based packaging plate and preparation process thereof - Google Patents
COB aluminum-based packaging plate and preparation process thereof Download PDFInfo
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- CN110071206B CN110071206B CN201910172988.2A CN201910172988A CN110071206B CN 110071206 B CN110071206 B CN 110071206B CN 201910172988 A CN201910172988 A CN 201910172988A CN 110071206 B CN110071206 B CN 110071206B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 46
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 41
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 41
- 238000002360 preparation method Methods 0.000 title claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 52
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 29
- 229910052802 copper Inorganic materials 0.000 claims abstract description 29
- 239000010949 copper Substances 0.000 claims abstract description 29
- 229910052751 metal Inorganic materials 0.000 claims abstract description 25
- 239000002184 metal Substances 0.000 claims abstract description 25
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 22
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims abstract description 22
- 230000008569 process Effects 0.000 claims abstract description 15
- 230000003712 anti-aging effect Effects 0.000 claims abstract description 13
- 238000004519 manufacturing process Methods 0.000 claims abstract description 12
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 9
- 239000004033 plastic Substances 0.000 claims abstract description 9
- 229920003023 plastic Polymers 0.000 claims abstract description 9
- 239000000853 adhesive Substances 0.000 claims abstract description 6
- 239000010410 layer Substances 0.000 claims description 91
- 229910052757 nitrogen Inorganic materials 0.000 claims description 17
- 239000007788 liquid Substances 0.000 claims description 15
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 14
- 229910000679 solder Inorganic materials 0.000 claims description 11
- 239000003292 glue Substances 0.000 claims description 10
- 238000012360 testing method Methods 0.000 claims description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 238000005520 cutting process Methods 0.000 claims description 9
- 238000011049 filling Methods 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 9
- 238000004080 punching Methods 0.000 claims description 9
- 238000009713 electroplating Methods 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 239000007789 gas Substances 0.000 claims description 7
- 238000007639 printing Methods 0.000 claims description 7
- 238000007689 inspection Methods 0.000 claims description 6
- 238000005259 measurement Methods 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 239000012790 adhesive layer Substances 0.000 claims description 5
- 238000007650 screen-printing Methods 0.000 claims description 5
- 238000004026 adhesive bonding Methods 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 4
- 230000003647 oxidation Effects 0.000 claims description 4
- 238000007254 oxidation reaction Methods 0.000 claims description 4
- GHKOFFNLGXMVNJ-UHFFFAOYSA-N Didodecyl thiobispropanoate Chemical group CCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCC GHKOFFNLGXMVNJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000012790 confirmation Methods 0.000 claims description 3
- 238000005553 drilling Methods 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 238000004381 surface treatment Methods 0.000 claims description 3
- 238000001291 vacuum drying Methods 0.000 claims description 3
- 238000012795 verification Methods 0.000 claims description 3
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical group CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 claims description 2
- 238000007731 hot pressing Methods 0.000 claims description 2
- 229920002120 photoresistant polymer Polymers 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 20
- 230000032683 aging Effects 0.000 abstract description 6
- 230000006872 improvement Effects 0.000 abstract description 6
- 230000006378 damage Effects 0.000 abstract description 5
- 239000004568 cement Substances 0.000 abstract description 2
- 230000002035 prolonged effect Effects 0.000 abstract description 2
- 239000004743 Polypropylene Substances 0.000 description 14
- 230000000694 effects Effects 0.000 description 6
- -1 polypropylene Polymers 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 229920001155 polypropylene Polymers 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 230000003197 catalytic effect Effects 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- XZBIXDPGRMLSTC-UHFFFAOYSA-N formohydrazide Chemical compound NNC=O XZBIXDPGRMLSTC-UHFFFAOYSA-N 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000002829 reductive effect Effects 0.000 description 2
- UORSDGBOJHYJLV-UHFFFAOYSA-N 2-hydroxy-n'-(2-hydroxybenzoyl)benzohydrazide Chemical compound OC1=CC=CC=C1C(=O)NNC(=O)C1=CC=CC=C1O UORSDGBOJHYJLV-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910019752 Mg2Si Inorganic materials 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 238000000862 absorption spectrum Methods 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002905 metal composite material Substances 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The invention discloses a COB aluminum-based packaging board and a preparation process thereof, belonging to the technical field of circuit board preparation, the COB aluminum-based packaging board and the preparation process thereof can obviously improve the heat dissipation performance and the insulating property of a packaging substrate and reduce the heat resistance of the insulating layer to the heat dissipation of the packaging substrate while reasonably controlling the cost and the process difficulty by matching the insulating layer with a metal base layer, not only improves the service life of a module product along with the improvement of the heat conductivity, but also reduces the overall temperature of the module, improves the product quality of an LED module, is suitable for the high-power LED field, has long service life and lower production cost, obviously improves the aging resistance of the insulating layer by adding a copper-resistant agent, an antioxidant, an auxiliary antioxidant and an anti-aging ball in the preparation process of high-adhesive high-conductivity PP plastic cement while the insulating layer meets the excellent insulating property, can reduce the copper harm caused by direct contact with a circuit layer, the service life of the insulating layer is prolonged.
Description
Technical Field
The invention relates to the technical field of circuit board preparation, in particular to a COB aluminum-based packaging board and a preparation process thereof.
Background
The common substrate types at present are a hard printed circuit board, a high thermal conductivity aluminum substrate, a ceramic substrate, a soft printed circuit board, a metal composite material and the like, the common low-power LED package can meet the requirements by adopting a PCB used in the common electronic industry, but most LED packages with the power of more than 0.5W are changed into metal-system and ceramic-system high-heat-dissipation substrates, the main reason is that the heat dissipation performance of the substrates directly influences the service life and the performance of the LED, so the package substrate becomes an important element when designing high-brightness LED commodity application, aluminum substrate series (COB aluminum substrate), the market demand of the COB aluminum substrate is increasingly vigorous at present, the COB aluminum substrate packaging technology is slowly matured, the traditional COB package plate is generally produced by adopting a high-light-reflection mirror aluminum substrate, the mirror aluminum is expensive, the connection of pressure and pressing in the production process is very difficult, and delamination easily occurs, air bubbles.
The encapsulation plays the decisive action as the link of holding down in the COB industrial chain to COB's industrial performance, and its key technology lies in improvement luminous efficacy as much as possible in limited cost range, reduces encapsulation thermal resistance simultaneously, improves the reliability, and development many years now COB packaging structure mainly has four kinds: upright, inverted, vertical and three-dimensional vertical; meanwhile, the packaging form is from single chip packaging to multi-chip packaging, from pin type (Lamp) to surface mount type (SMD) to substrate plane assembly (COB), system packaging (SIP), remote fluorescent (RP) packaging and the like, and with the rapid improvement of the performance of high-power LED chips, new high-efficiency packaging technologies such as emc (epoxy encapsulation) packaging, csp (chip package) chip-level packaging, 3D array packaging and the like are developed.
For a COB lamp, heat is first generated by the COB chip and then transferred by three ways, namely heat conduction, convection and radiation, please refer to fig. 6 in the attached drawings of the specification, which shows a high-power COB heat dissipation channel: for the 1 channel, the radiation heat dissipation mode of the lens to the air is limited and can be ignored; the channel 2 is a main process of heat dissipation, and represents that a chip is radiated to a packaging substrate and then to air; the channel 3 is radiated by using a gold wire and is limited by the slender geometric shape of the metal wire; the 4 channels adopt an eutectic bonding mode, an electrode wire is connected to a system circuit board for heat dissipation, and the efficiency is higher than that of a gold wire mode.
The rate of the atmospheric environment of a heat dissipation system circuit value depends on the design of the whole light-emitting lamp system, and meanwhile, the packaging substrate is used as a key link of the whole LED heat dissipation system, so that the chip is borne, and most importantly, the heat generated by the chip is conducted to a carrier of a cooling device to play a role in starting and stopping, so that the selection of the heat dissipation substrate is very important, the MCPCB generally comprises three layers including a circuit layer, an insulating layer and a metal substrate layer, and is usually used as a system circuit substrate to achieve the heat dissipation effect in high efficiency and high speed; the Coefficient of Thermal Expansion (CTE) is not matched, the stress of a solid crystal interface is large, and the problems of cracks and delamination are easy to generate; the use temperature is low, which limits the use temperature, the key problem of the COB substrate is to improve the thermal conductivity and heat resistance of the intermediate layer, and the following introduces the current technical approaches:
firstly, the method comprises the following steps: a kind of diamond-Like carbon material DLC (diamond Like carbon), its thermal conductivity (475W/(m.K)), the characteristic such as being good, intensity, etc., will replace the insulating layer of epoxy resin, apply it to MCPCB base plate preparation, can greatly raise the thermal conductivity, the actual application effect must pass the market test;
II, secondly: the ceramic layer is adopted to replace the insulating layer, the high-heat-conductivity ceramic is adopted to replace the organic insulating layer, the heat conduction and heat resistance of the metal substrate are greatly improved, the heat conductivity of the novel MCPCB is improved to 200W/(m.K), the heat resistance is reduced by one third, and the novel MCPCB can bear higher service temperature (200 ℃);
the key point of the approach lies in growing a layer of alumina film with the thickness of 20-30um, then performing hole sealing treatment on the film layer to improve the insulativity and the corrosion resistance, and finally manufacturing a circuit layer by screen printing or sputtering, wherein the specific structure is shown in figure 6, and the method has the biggest characteristics of strong bonding force between metal aluminum and alumina (the peel strength is more than 5N/mm), high thermal conductivity (10-20W/(m.K)) and good heat resistance, and the market acceptance of the method needs to be observed due to complex process and high cost.
And the COB chip is directly and fixedly crystallized on the silver-plated aluminum substrate by removing the local insulating layer, so that the heat conducting capacity of the substrate is greatly improved, and meanwhile, the light emitting efficiency of the LED can be improved due to high reflectivity of the mirror aluminum substrate, but the safety problems of low breakdown voltage resistance and the like exist.
Therefore, how to prepare the packaging substrate which can meet the requirements of high heat dissipation performance and excellent insulating performance and can reasonably control the cost is an urgent and unaddressed problem in the traditional circuit board manufacturing industry.
Disclosure of Invention
1. Technical problem to be solved
Aiming at the problems in the prior art, the invention aims to provide a COB aluminum-based packaging board and a preparation process thereof, which can obviously improve the heat dissipation performance and the insulating performance of a packaging substrate and reduce the heat resistance of an insulating layer to the heat dissipation of the packaging substrate while reasonably controlling the cost and the process difficulty, not only improves the service life of a module product along with the improvement of heat conductivity, but also reduces the overall temperature of the module and improves the product quality of an LED module.
2. Technical scheme
In order to solve the above problems, the present invention adopts the following technical solutions.
A COB aluminum-based packaging board comprises a metal base layer, wherein the metal base layer is made of 6-series high-conductivity aluminum-based plates, an insulating layer is arranged on the metal base layer and is made of high-viscosity high-conductivity PP (polypropylene) plastics, 0.4% -0.5% of copper resisting agent, 0.05% -0.1% of antioxidant, 0.05% -0.1% of auxiliary antioxidant and 1% of anti-aging balls are added in the preparation process, the copper resisting agent comprises equivalent N, N '-disalicylhydrazine and N, N' -double-pair formylhydrazine, the antioxidant is antioxidant 1010, the auxiliary antioxidant is DLTP, the anti-aging balls comprise a film shell and filling gas, the filling gas is compressed nitrogen, a circuit layer is arranged on the insulating layer and is a BT resin-based copper-clad plate, and the copper electroplating mode can adopt any one of acid copper plating, pulse copper plating or rotary copper plating, the metal-based layer includes basic unit, fin portion and boss portion, and integrated into one piece between basic unit, fin portion and the boss portion, insulating layer and circuit layer have respectively with boss portion assorted first through-hole and second through-hole, and boss portion runs through first through-hole and second through-hole respectively, be provided with the LED chip on the boss portion, be provided with on the circuit layer with LED chip electric connection's wire, metal-based layer and circuit layer surface all cover have from the type membrane.
The preparation process of the COB aluminum-based packaging board comprises a first stage and a second stage, wherein the first stage comprises the following steps:
a: cutting BT: cutting the BT resin-based copper-clad plate into required breadth according to the process requirement and specification size;
b: a circuit: making double-sided circuit patterns by using liquid photosensitive adhesive, etching the patterns, coating the liquid photosensitive adhesive by adopting a curtain type, easily obtaining fine circuit patterns by using the liquid electroplating-resistant photosensitive adhesive with high resolution and no bottom layer in development, and removing redundant photosensitive adhesive layers by using 5% NaOH after etching the circuit patterns;
c: resistance welding: coating liquid photosensitive solder resist on the curtain to prepare a solder resist pattern, coating the surface of the board with the liquid photosensitive resist, and exposing and developing the board again with the solder resist film;
d: surface treatment: cleaning surface garbage and oxidation phenomena;
e: assembling/attaching glue: printing high-glue high-conductivity PP plastic on a metal base layer serving as a carrier by adopting a screen printing mode to form an insulating layer to obtain a glue-coated substrate; the printing thickness of the insulating layer is 40-210 mu m;
f: grooving: punching a second through hole on the circuit layer;
g: assembling/mirror surface false pasting: sequentially molding the circuit layer and the gluing substrate;
the two stages comprise:
h: pressure transmission: pushing the aluminum-based copper-clad plate into a vacuum hot press after the mold filling is finished, performing hot pressing on the lower layer under a vacuum condition to form the aluminum-based copper-clad plate, finishing primary curing of an adhesive layer on the adhesive-coated substrate in the laminating process, and curing the prepared aluminum-based copper-clad plate in a vacuum drying box at the temperature of 180-;
i: drilling: in step H, a punching machine is used for punching holes on the packaging substrate body;
j: v-cut: cutting the dividing line on the packaging substrate body by using a turntable cutter;
k: the appearance is as follows: carving the outline on the packaging substrate body;
l: electrical measurement: sequentially carrying out a line test, a voltage withstanding test and an OSP test;
m: and (4) final measurement: FQC carries out full inspection and confirmation on the product, and FQA spot inspection and verification;
n: packaging: and packaging and delivering qualified products.
3. Advantageous effects
Compared with the prior art, the invention has the advantages that:
(1) the scheme can obviously improve the heat dissipation performance and the insulating performance of the packaging substrate and reduce the heat resistance of the insulating layer to the heat dissipation of the packaging substrate while reasonably controlling the cost and the process difficulty, not only prolongs the service life of a module product along with the improvement of the heat conductivity, but also reduces the overall temperature of the module, improves the product quality of the LED module, is suitable for the field of high-power LEDs, has long service life and lower production cost, meets the condition of large-scale industrial application, and meets the European Union standard and the American standard in the product quality standard.
(2) The insulating layer satisfies excellent insulating properties, reduces the thermal resistance when dispelling the heat simultaneously, high temperature resistant corrosion-resistant, has excellent mechanical strength, and through adding anti copper agent, antioxidant, supplementary antioxidant and anti-aging ball in the preparation process of high gluey high conductive PP plastic and showing the ageing resistance that improves the insulating layer, can reduce the copper harm that brings with circuit layer direct contact, prolongs the life of insulating layer.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural diagram of a metal substrate portion according to the present invention;
FIG. 3 is a schematic structural diagram of an anti-aging ball portion of the present invention;
FIG. 4 is a schematic flow chart of a portion of a stage of the present invention;
FIG. 5 is a schematic flow diagram of a two-stage portion of the present invention;
fig. 6 is a schematic structural diagram of a heat dissipation channel portion of an LED lamp module in the prior art.
The reference numbers in the figures illustrate:
1 metal base layer, 101 base part, 102 fin part, 103 boss part, 2 insulating layers, 3 circuit layers, 4 LED chips, 5 anti-aging balls and 6 compressed nitrogen.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention; it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise specifically stated or limited, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are used in a broad sense, and for example, "connected" may be a fixed connection, a detachable connection, an integral connection, a mechanical connection, an electrical connection, a direct connection, an indirect connection through an intermediate medium, and a communication between two elements.
Example 1:
referring to fig. 1, a COB aluminum-based package board includes a metal base layer 1, the metal base layer 1 is made of a 6-series high-conductivity aluminum-based board, the main elements of the 6-series aluminum alloy are magnesium and silicon, and the main strengthening phase is Mg2Si, which can be strengthened by heat treatment and has excellent thermal conductivity.
Referring to fig. 1, an insulating layer 2 is disposed on a metal substrate 1, the insulating layer 2 is made of high-glue high-conductivity PP plastic, PP is polypropylene, which has high crystallinity and regular structure, thus having excellent mechanical properties, and polypropylene has good heat resistance, the product can be sterilized at a temperature above 100 ℃, and does not deform at 150 ℃ without external force, the polypropylene has good chemical stability, is stable to other chemical reagents except for being eroded by concentrated sulfuric acid and concentrated nitric acid, has a high dielectric coefficient, can be used to manufacture heated electrical insulation products as temperature rises, has a high breakdown voltage, is suitable for electrical fittings, and the like, has good voltage resistance and arc resistance, but has high static electricity, is easy to age when contacting with copper, and has a tertiary carbon atom on the main chain of PP, and is easy to chemically change under the action of external factors such as heat, oxygen, ultraviolet rays, and the like, it is shown that carbonyl peak appears in infrared absorption spectrum, then peroxide is generated, free radicals are formed after the cracking, the free radicals further cause the cracking, branching and crosslinking of the whole macromolecular chain, so that PP loses the characteristics of macromolecular material and loses the performance of the PP, including high temperature resistance, insulating property, high mechanical strength and other properties, 0.4% of copper resistant agent, 0.05% of antioxidant, 0.05% of auxiliary antioxidant and 1% of anti-aging ball 5 are added in the preparation process, the copper resistant agent is 0.2% of N, N '-disalicylhydrazide and 0.2% of N, N' -dual-pair formylhydrazine, the copper ion catalytic aging inhibiting capability is very strong, the copper harm resisting effect is obvious, the copper ion catalytic aging capability is good, the copper harm resisting effect is good, the resin has good solubility, the dispersibility is good, the migration is not polluted, the water resistance and the oil extraction performance is good, the insulating electrical energy and other properties of the resin are not influenced, and the like, the antioxidant can exert more remarkable inhibition effect when being matched with the antioxidant for use, wherein the antioxidant is 1010, the auxiliary antioxidant is DLTP, and the synergistic effect is exerted when being matched with the antioxidant for use.
Referring to fig. 3, the anti-aging ball 5 includes a film shell and a filling gas, the anti-aging ball 5 is easy to break under an external force condition, the filling gas is compressed nitrogen 6, and nitrogen is used as an inert gas and can be used as a protective gas under a general condition, even if the insulating layer 2 is aged, the anti-aging ball 5 in the insulating layer 2 breaks and releases nitrogen when being aged, the compressed nitrogen 6 expands and escapes rapidly to squeeze the surrounding air away, so as to create an approximately oxygen-free environment, thereby playing an anti-oxidation role and preventing the insulating layer 2 from further aging, the insulating layer 2 is provided with a circuit layer 3, the circuit layer 3 is a BT resin-based copper clad plate, and the electroplating copper mode can adopt any one of acid copper plating, pulse copper plating or rotary copper plating.
Referring to fig. 2, the metal base layer 1 includes a base portion 101, a fin portion 102 and a boss portion 103, and the base portion 101, the fin portion 102 and the boss portion 103 are integrally formed, the fin portion 102 is used for increasing a contact area with air, and improving thermal conductivity, the insulating layer 2 and the circuit layer 3 respectively have a first through hole and a second through hole matched with the boss portion 103, and the boss portion 103 respectively penetrates through the first through hole and the second through hole, the boss portion 103 is provided with the LED chip 4, the circuit layer 3 is provided with a lead wire electrically connected with the LED chip 4, and the surfaces of the metal base layer 1 and the circuit layer 3 are both covered with a release film.
Referring to fig. 4, a manufacturing process of a COB aluminum-based package board includes a first stage and a second stage, where the first stage includes:
a: cutting BT: cutting the BT resin-based copper-clad plate into required breadth according to the process requirement and specification size;
b: a circuit: the liquid photosensitive resist electroplating material is used for manufacturing double-sided circuit patterns, then the patterns are etched, the liquid photosensitive resist is coated by a curtain type, the production efficiency of the curtain method is high, the coating is uniform and has no pinholes, the screen printing method is easy to generate air hole pinholes, the resolution ratio of the liquid electroplating resistant photosensitive resist is very high, no bottom layer is developed, fine circuit patterns are easily obtained, the price is cheaper than that of a dry film, a redundant photosensitive adhesive layer is removed by 5% of NaOH after the circuit patterns are etched, and the following attention points exist in the etching process: 1. note that the etch is not clean, over-etch; 2. note line width and line thinness; 3. the copper surface is not allowed to have oxidation and scraping phenomena; 4. removing the dry film completely;
c, solder resist: coating a liquid photosensitive solder resist on a curtain to prepare a solder resist pattern, coating the surface of the board with the liquid photosensitive resist, and exposing and developing the solder resist film again to protect circuits which do not need soldering tin and prevent the short circuit caused by the entering of the tin;
d: surface treatment: cleaning surface garbage and oxidation phenomena;
e: assembling/attaching glue: printing high-glue high-conductivity PP plastic on a metal base layer 1 serving as a carrier by adopting a screen printing mode to form an insulating layer 2 to obtain a glue-coated substrate; the printing thickness of the insulating layer 2 was 200 μm;
f: grooving: punching a second through hole on the circuit layer 3;
g: assembling/mirror surface false pasting: sequentially molding the circuit layer 3 and the gluing substrate;
referring to fig. 5, the two stages include:
h: pressure transmission: pushing the aluminum-based copper-clad plate into a vacuum hot press after the die filling is finished, carrying out thermal pressing on the lower layer under the vacuum condition to obtain an aluminum-based copper-clad plate, finishing primary curing of an adhesive layer on the gluing substrate in the laminating process, and curing the prepared aluminum-based copper-clad plate in a vacuum drying oven at 200 ℃ for 4 hours to obtain a packaging substrate body;
i: drilling: in step H, a punching machine is used for punching holes on the packaging substrate body;
j: v-cut: cutting the dividing line on the packaging substrate body by using a turntable cutter;
k: the appearance is as follows: carving the outline on the packaging substrate body;
l: electrical measurement: sequentially carrying out a line test, a voltage withstanding test and an OSP test;
m: and (4) final measurement: FQC carries out full inspection and confirmation on the product, and FQA spot inspection and verification;
n: packaging: and packaging and delivering qualified products.
The invention can obviously improve the heat dissipation performance and the insulating performance of the packaging substrate and reduce the heat resistance of the insulating layer 2 to the heat dissipation of the packaging substrate while reasonably controlling the cost and the process difficulty, not only improves the service life of a module product along with the improvement of the heat conductivity, but also reduces the overall temperature of the module, improves the product quality of an LED module, is suitable for the field of high-power LEDs, has long service life and lower production cost, meets the condition of large-scale industrial application, meets the product quality standard with European Union standard and American standard, reduces the heat resistance during the heat dissipation while the insulating layer 2 meets the excellent insulating performance, simultaneously resists high temperature and corrosion, has excellent mechanical strength, and obviously improves the aging resistance of the insulating layer by adding a copper-resistant agent, an antioxidant, an auxiliary antioxidant and an anti-aging ball 5 in the preparation process of high-conductivity high-viscosity PP plastic cement, copper damage caused by direct contact with the circuit layer 3 can be reduced, and the service life of the insulating layer 2 is prolonged.
The foregoing is only a preferred embodiment of the present invention; the scope of the invention is not limited thereto. Any person skilled in the art should be able to cover the technical scope of the present invention by equivalent or modified solutions and modifications within the technical scope of the present invention.
Claims (9)
1. A COB aluminum-based packaging board comprises a metal base layer (1), and is characterized in that: the LED packaging structure is characterized in that an insulating layer (2) is arranged on the metal base layer (1), a circuit layer (3) is arranged on the insulating layer (2), the metal base layer (1) comprises a base portion (101), a fin portion (102) and a boss portion (103), the base portion (101), the fin portion (102) and the boss portion (103) are integrally formed, the insulating layer (2) and the circuit layer (3) are respectively provided with a first through hole and a second through hole which are matched with the boss portion (103), the boss portion (103) penetrates through the first through hole and the second through hole respectively, an LED chip (4) is arranged on the boss portion (103), a lead electrically connected with the LED chip (4) is arranged on the circuit layer (3), the insulating layer (2) is made of high-conductivity PP plastic, and 0.4% -0.5% of copper resisting agent, 0.05% -0.1% of antioxidant, 0.5% of antioxidant and the boss portion are added in the preparation process, 0.05 to 0.1 percent of auxiliary antioxidant and 1 percent of anti-aging ball (5).
2. The COB aluminum-based package board of claim 1, wherein: the metal base layer (1) is made of a 6-series high-conductivity aluminum-based plate.
3. The COB aluminum-based package board of claim 1, wherein: the copper-resistant agent is N, N '-disalicylic hydrazide and N, N' -double-para-formylhydrazine which are equal in quantity, the antioxidant is antioxidant 1010, and the auxiliary antioxidant is DLTP.
4. The COB aluminum-based package board of claim 1, wherein: the anti-aging ball (5) comprises a film shell and filling gas, wherein the filling gas is compressed nitrogen (6).
5. The COB aluminum-based package board of claim 1, wherein: the circuit layer (3) is a BT resin-based copper-clad plate, and the copper electroplating mode can adopt any one of acid copper plating, pulse copper plating or rotary copper plating.
6. The COB aluminum-based package board of claim 1, wherein: the surfaces of the metal base layer (1) and the circuit layer (3) are covered with release films.
7. The manufacturing process of a COB aluminum-based package board according to claim 1, characterized in that: the method comprises the following steps: a stage one and a stage two, the stage one comprising:
a: cutting BT: cutting the BT resin-based copper-clad plate into required breadth according to the process requirement and specification size;
b: a circuit: the method comprises the steps of manufacturing a double-sided circuit pattern by using liquid photosensitive resist (electroplating-resistant printing material), etching the circuit pattern, coating the liquid photosensitive resist by adopting a curtain type, wherein the liquid electroplating-resistant photosensitive resist has very high resolution, and can be developed without a bottom layer to easily obtain a fine circuit pattern;
c, solder resist: coating liquid photosensitive solder resist on the curtain to prepare a solder resist pattern, coating the surface of the board with the liquid photosensitive resist, and exposing and developing the board again with the solder resist film;
d: surface treatment: cleaning surface garbage and oxidation phenomena;
e: assembling/attaching glue: printing high-glue high-conductivity PP plastic on a metal base layer (1) serving as a carrier by adopting a screen printing mode to form an insulating layer (2) to obtain a glue-coated substrate; the printing thickness of the insulating layer (2) is 40-210 mu m;
f: grooving: punching a second through hole on the circuit layer (3) by a target;
g: assembling/mirror surface false pasting: and sequentially molding the circuit layer (3) and the gluing substrate.
8. The process of claim 7, wherein the COB aluminum-based package board comprises: the two stages comprise:
h: pressure transmission: pushing the aluminum-based copper-clad plate into a vacuum hot press after the mold filling is finished, performing hot pressing on the lower layer under a vacuum condition to form the aluminum-based copper-clad plate, finishing primary curing of an adhesive layer on the adhesive-coated substrate in the laminating process, and curing the prepared aluminum-based copper-clad plate in a vacuum drying box at the temperature of 180-;
i: drilling: in step H, a punching machine is used for punching holes on the packaging substrate body;
j: v-cut: cutting the dividing line on the packaging substrate body by using a turntable cutter;
k: the appearance is as follows: carving the outline on the packaging substrate body;
l: electrical measurement: sequentially carrying out a line test, a voltage withstanding test and an OSP test;
m: and (4) final measurement: FQC carries out full inspection and confirmation on the product, and FQA spot inspection and verification;
n: packaging: and packaging and delivering qualified products.
9. The process of claim 7, wherein the COB aluminum-based package board comprises: and in the step B, after the circuit pattern is etched, the redundant photoresist layer is removed by using 5% NaOH.
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| JP2021034659A (en) * | 2019-08-28 | 2021-03-01 | パナソニック株式会社 | Solar cell module |
| WO2021090630A1 (en) * | 2019-11-08 | 2021-05-14 | デンカ株式会社 | Insulating resin composition, insulating resin cured body, layered body, and circuit base board |
| CN112687781A (en) * | 2020-12-22 | 2021-04-20 | 珠海市沃德科技有限公司 | Processing method of LED mirror lamp panel for COB packaging |
| CN114068794A (en) * | 2021-11-11 | 2022-02-18 | 深圳市中美欧光电科技有限公司 | COB (chip on board) packaging mirror surface aluminum substrate and processing technology thereof |
Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201237098Y (en) * | 2008-06-16 | 2009-05-13 | 深圳市量子光电子有限公司 | High power light-emitting diode |
| CN101556034A (en) * | 2008-04-08 | 2009-10-14 | 展晶科技(深圳)有限公司 | Light source device |
| CN101888740A (en) * | 2010-06-02 | 2010-11-17 | 苏州科医世凯半导体技术有限责任公司 | Convex metal printed circuit board and manufacturing method thereof |
| CN202488866U (en) * | 2011-11-12 | 2012-10-10 | 葛豫卿 | Printed circuit board applying metal substrate to penetrate heat path |
| CN102802348A (en) * | 2012-07-17 | 2012-11-28 | 昆山生隆科技发展有限公司 | High-pressure-resistant aluminum-based printed circuit board for LED (Light Emitting Diode) and manufacturing method of high-pressure-resistant aluminum-based printed circuit board |
| CN203134857U (en) * | 2013-01-28 | 2013-08-14 | 深圳市安普光光电科技有限公司 | COB substrate structure |
| CN103571004A (en) * | 2012-07-23 | 2014-02-12 | 中国石油化工股份有限公司 | Insulation material for high-speed extruded communication cable and preparation method for same |
| CN105792505A (en) * | 2016-03-25 | 2016-07-20 | 龙南骏亚电子科技有限公司 | Aluminum-based circuit board of high thermal conductivity |
| CN105813391A (en) * | 2016-05-10 | 2016-07-27 | 浙江罗奇泰克电子有限公司 | Fabrication method of light emitting diode (LED) aluminum-based circuit board |
| CN106132098A (en) * | 2016-06-30 | 2016-11-16 | 浙江罗奇泰克电子有限公司 | A kind of manufacture method of LED metal base circuit board |
| CN107553985A (en) * | 2017-08-22 | 2018-01-09 | 江苏由迎管阀件有限公司 | A kind of anti-aging PP pipes |
| CN206976393U (en) * | 2017-06-29 | 2018-02-06 | 深圳可瑞高新材料股份有限公司 | Thermoelectric separated composite metal substrate |
| CN108322993A (en) * | 2017-12-31 | 2018-07-24 | 长沙牧泰莱电路技术有限公司 | A kind of the pcb board part and its processing method of thermoelectricity separation |
| CN208312327U (en) * | 2018-04-25 | 2019-01-01 | 四川省欧玛科技有限公司 | Convenient for the LED light source copper base of heat dissipation |
-
2019
- 2019-03-07 CN CN201910172988.2A patent/CN110071206B/en active Active
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101556034A (en) * | 2008-04-08 | 2009-10-14 | 展晶科技(深圳)有限公司 | Light source device |
| CN201237098Y (en) * | 2008-06-16 | 2009-05-13 | 深圳市量子光电子有限公司 | High power light-emitting diode |
| CN101888740A (en) * | 2010-06-02 | 2010-11-17 | 苏州科医世凯半导体技术有限责任公司 | Convex metal printed circuit board and manufacturing method thereof |
| CN202488866U (en) * | 2011-11-12 | 2012-10-10 | 葛豫卿 | Printed circuit board applying metal substrate to penetrate heat path |
| CN102802348A (en) * | 2012-07-17 | 2012-11-28 | 昆山生隆科技发展有限公司 | High-pressure-resistant aluminum-based printed circuit board for LED (Light Emitting Diode) and manufacturing method of high-pressure-resistant aluminum-based printed circuit board |
| CN103571004A (en) * | 2012-07-23 | 2014-02-12 | 中国石油化工股份有限公司 | Insulation material for high-speed extruded communication cable and preparation method for same |
| CN203134857U (en) * | 2013-01-28 | 2013-08-14 | 深圳市安普光光电科技有限公司 | COB substrate structure |
| CN105792505A (en) * | 2016-03-25 | 2016-07-20 | 龙南骏亚电子科技有限公司 | Aluminum-based circuit board of high thermal conductivity |
| CN105813391A (en) * | 2016-05-10 | 2016-07-27 | 浙江罗奇泰克电子有限公司 | Fabrication method of light emitting diode (LED) aluminum-based circuit board |
| CN106132098A (en) * | 2016-06-30 | 2016-11-16 | 浙江罗奇泰克电子有限公司 | A kind of manufacture method of LED metal base circuit board |
| CN206976393U (en) * | 2017-06-29 | 2018-02-06 | 深圳可瑞高新材料股份有限公司 | Thermoelectric separated composite metal substrate |
| CN107553985A (en) * | 2017-08-22 | 2018-01-09 | 江苏由迎管阀件有限公司 | A kind of anti-aging PP pipes |
| CN108322993A (en) * | 2017-12-31 | 2018-07-24 | 长沙牧泰莱电路技术有限公司 | A kind of the pcb board part and its processing method of thermoelectricity separation |
| CN208312327U (en) * | 2018-04-25 | 2019-01-01 | 四川省欧玛科技有限公司 | Convenient for the LED light source copper base of heat dissipation |
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|---|---|
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