CN110071206A - A kind of COB aluminum-based packaging plate and its preparation process - Google Patents
A kind of COB aluminum-based packaging plate and its preparation process Download PDFInfo
- Publication number
- CN110071206A CN110071206A CN201910172988.2A CN201910172988A CN110071206A CN 110071206 A CN110071206 A CN 110071206A CN 201910172988 A CN201910172988 A CN 201910172988A CN 110071206 A CN110071206 A CN 110071206A
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- Prior art keywords
- layer
- aluminum
- cob
- copper
- insulating layer
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- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 40
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 40
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 27
- 238000002360 preparation method Methods 0.000 title claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 49
- 229910052751 metal Inorganic materials 0.000 claims abstract description 25
- 239000002184 metal Substances 0.000 claims abstract description 25
- 229910052802 copper Inorganic materials 0.000 claims abstract description 22
- 239000010949 copper Substances 0.000 claims abstract description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 21
- 239000003292 glue Substances 0.000 claims abstract description 21
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 17
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 17
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 13
- 230000003712 anti-aging effect Effects 0.000 claims abstract description 11
- 239000004568 cement Substances 0.000 claims abstract description 9
- 239000004033 plastic Substances 0.000 claims abstract description 9
- 229910052757 nitrogen Inorganic materials 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 13
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 12
- 238000011049 filling Methods 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 12
- 238000012360 testing method Methods 0.000 claims description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 238000003466 welding Methods 0.000 claims description 8
- 238000004026 adhesive bonding Methods 0.000 claims description 7
- 238000010586 diagram Methods 0.000 claims description 7
- 239000007789 gas Substances 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 7
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims description 6
- 238000007731 hot pressing Methods 0.000 claims description 6
- 229920002120 photoresistant polymer Polymers 0.000 claims description 6
- 239000004411 aluminium Substances 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 238000007650 screen-printing Methods 0.000 claims description 4
- GHKOFFNLGXMVNJ-UHFFFAOYSA-N Didodecyl thiobispropanoate Chemical group CCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCC GHKOFFNLGXMVNJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000012790 confirmation Methods 0.000 claims description 3
- 238000005553 drilling Methods 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims description 3
- 230000004907 flux Effects 0.000 claims description 3
- XZBIXDPGRMLSTC-UHFFFAOYSA-N formohydrazide Chemical compound NNC=O XZBIXDPGRMLSTC-UHFFFAOYSA-N 0.000 claims description 3
- 238000007689 inspection Methods 0.000 claims description 3
- 238000003475 lamination Methods 0.000 claims description 3
- 238000005259 measurement Methods 0.000 claims description 3
- 230000001590 oxidative effect Effects 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 238000005070 sampling Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 238000004381 surface treatment Methods 0.000 claims description 3
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical group CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 claims description 2
- 238000011161 development Methods 0.000 claims description 2
- AGAURCCLJKMAEJ-UHFFFAOYSA-N 1,2-bis(2-hydroxyphenyl)ethane-1,2-dione Chemical compound OC1=CC=CC=C1C(=O)C(=O)C1=CC=CC=C1O AGAURCCLJKMAEJ-UHFFFAOYSA-N 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 238000009413 insulation Methods 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 230000017525 heat dissipation Effects 0.000 abstract description 9
- 230000032683 aging Effects 0.000 abstract description 8
- 238000005516 engineering process Methods 0.000 abstract description 7
- 239000004743 Polypropylene Substances 0.000 description 11
- 238000005538 encapsulation Methods 0.000 description 8
- 239000000919 ceramic Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 241000218202 Coptis Species 0.000 description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910019752 Mg2Si Inorganic materials 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 241001465382 Physalis alkekengi Species 0.000 description 1
- 238000000862 absorption spectrum Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 229920006336 epoxy molding compound Polymers 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000001954 sterilising effect Effects 0.000 description 1
- 238000004659 sterilization and disinfection Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 230000005619 thermoelectricity Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The invention discloses a kind of COB aluminum-based packaging plate and its preparation processes, belong to technical field of circuit board, a kind of COB aluminum-based packaging plate and its preparation process, it may be implemented while reasonable control cost and technology difficulty by insulating layer and metal-based layer cooperation, significantly improve the heat dissipation performance and insulation performance of package substrate, reduce the thermal resistance that insulating layer radiates to package substrate, as the raising of thermal conductivity not only increases the service life of mould set product, the bulk temperature of mould group is reduced simultaneously, improve the product quality of LED module, suitable for great power LED field, long service life, lower production costs, in addition insulating layer is while meeting superior insulation performance, by adding copper resistant agent in the preparation process that high glue height leads PP plastic cement, antioxidant, auxiliary antioxidant and anti-aging ball insulate to significantly improve The ageing resistance of layer, it is possible to reduce directly contact bring copper evil with circuit layer, extend the service life of insulating layer.
Description
Technical field
The present invention relates to technical field of circuit board, more specifically to a kind of COB aluminum-based packaging plate and its preparation
Technique.
Background technique
Substrate type common at present has rigid printed circuit board, high thermal conductivity coefficient aluminum substrate, ceramic substrate, soft printing
Circuit board, metallic composite etc., general low-power LED encapsulation using ordinary electronic industry pcb board can meet demand,
But metal system and the high heat-radiating substrate of ceramics system are used instead mostly more than the LED of 0.5W or more encapsulation, main cause is dissipating for substrate
The hot service life to LED has a direct impact with performance, therefore package substrate becomes very heavy when designing the application of high luminance LED commodity
The element wanted, aluminum substrate series (COB aluminum substrate), COB aluminum substrate existing market demand is increasingly vigorous, and COB aluminum substrate encapsulates skill
Art is also slowly grown up, and traditional COB package board is generally using high reflective mirror surface aluminium base production, since specular aluminium cost is high
Expensive, the linking pressed in production process and pressed in the process is very difficult, is easy to appear layering, bubble.
Encapsulation plays decisive action to the industry performance of COB as the link formed a connecting link in COB industrial chain, crucial
Technology is the raising luminous efficiency as much as possible in limited cost-range, while reducing packaging thermal resistance, improves reliability, more
The development in year, there are mainly four types of present COB encapsulating structures: formal dress, upside-down mounting, vertical and three-dimensional perpendicular；Simultaneously encapsulation form from
Single-chip package assembles (COB), system to base plan again to multi-chip package, from pinned (Lamp) to patch type (SMD)
(SIP) and remote fluorescence (RP) encapsulation etc. are encapsulated, with the rapid raising of high-power LED chip performance, and EMC occurs
(Epoxymoldingcompound) encapsulation, the encapsulation of CSP (Chipscalepackage) wafer-level package, 3D array etc. are new
Efficient encapsulation technology.
For a COB lamps and lanterns, heat is generated by cob chip first, then passes through three kinds of heat transfer, convection current, radiation sides
Formula is transmitted, and Fig. 6 in Figure of description is please referred to, and shows high-power COB heat dissipation channel: for 1 channel, lens to
The mode of heat loss through radiation is limited in air, can ignore；2 channels are the main process of heat dissipation, and representative has chip to package substrate
Air is arrived again to be radiated；3 channels are radiated using gold thread, and the elongated geometry of metal wire itself is limited to；4 channels use
Eutectic bonding mode has electrode cable to system circuit board to radiate, and efficiency is higher than gold thread mode.
Heat dissipation has the rate of circuit system value atmospheric environment to depend on the design of entire light-emitting lamp system, while encapsulating base
Plate both carries chip as entire LED cooling system the key link, it is most important that says the heat transfer of chip generation to cooling
The carrier of device plays a part of forming a connecting link, so, the selection of heat-radiating substrate is critically important, and MCPCB generally has three layers, including
Circuit layer, insulating layer and metal substrate layer reach heat dissipation effect frequently as circuit system substrate for efficient high-speed, using mesh
The special plate of preceding industry middle and high end because its is at low cost, it can be achieved that large scale, large-scale production, and realizes thermoelectricity when packaged
Separation exists simultaneously some problems, because insulating layer is the epoxy resin containing inorganic filler, thermal conductivity is lower, limits entire
The capacity of heat transmission of substrate；Thermal expansion coefficient (CTE) all mismatches, and die bond interfacial stress is big, is easy to produce crack, delamination problems；
It is lower using temperature, it limits using temperature, the critical issue of COB substrate is to improve the thermal conductivity and heat resistance of middle layer,
Following describe current technology approach:
One: one type bores carbon material DLC (Diamond Like Carbon), thermal conductivity (475W/ (m.K)), heat resistance
Well, the features such as intensity is high, by substituted epoxy resin insulating barrier, is applied to MCPCB substrate manufacture, is greatly improved thermal conductivity
Rate, practical application effect will also pass through market test；
Two: insulating layer being replaced using ceramic layer, organic insulator is replaced using high heat-conducting ceramic, substantially increases Metal Substrate
The thermally conductive and heat resistance of plate, novel MCPCB thermal conductivity are increased to 200W/ (m.K), and thermal resistance is reduced to one third, and can hold
Temperature (200 DEG C) are used by higher；
For the pellumina that three, are formed by anodic oxidation in time as insulating layer, the key of this approach is growth one
The pellumina of layer 20-30um thickness, then film layer carries out sealing pores to improve insulating properties and corrosion resistance, finally by screen printing
Brush or sputtering production circuit layer, specific structure are illustrated in fig. 6 shown below, and maximum feature is that metallic aluminium and aluminium oxide binding force are strong
(peel strength reach at 5N/mm or more), thermal conductivity is high (10-20W/ (m.K)) and heat-resist, due to complex process, at high cost,
Market receives to have to be seen.
Four, mirror-surface aluminum base boards, by the insulating layer of removal part, the direct die bond of COB chip is on silver-plated aluminum substrate, a side
The face substrate capacity of heat transmission greatly improves, simultaneously because mirror-surface aluminum base board reflectivity is high, LED light extraction efficiency can be improved, but there are resistance to
The safety problems such as breakdown voltage is low.
Therefore one kind, which how is prepared, both can satisfy high heat dispersion and superior insulation performance, while can rationally control
This package substrate is made, be traditional circuit plate production industry urgently can not to problem.
Summary of the invention
1. technical problems to be solved
Aiming at the problems existing in the prior art, the purpose of the present invention is to provide a kind of COB aluminum-based packaging plate and its systems
Standby technique, it may be implemented while reasonable control cost and technology difficulty, significantly improve package substrate heat dissipation performance and
Insulation performance reduces the thermal resistance that insulating layer radiates to package substrate, as the raising of thermal conductivity not only increases mould set product
Service life, while the bulk temperature of mould group is reduced, the product quality of LED module is improved, is suitable for great power LED and leads
Domain, long service life, and lower production costs, meet the condition of large-scale industrial application, and target level of product quality meets European Union's mark
Quasi- and Unite States Standard.
2. technical solution
To solve the above problems, the present invention adopts the following technical scheme that.
A kind of COB aluminum-based packaging plate, including metal-based layer, the metal-based layer are led aluminium base plate using 6 system's height and are made, institute
It states and is provided with insulating layer on metal-based layer, the insulating layer is led PP plastic cement by high glue height and is made, and joined during the preparation process
The copper resistant agent of 0.4%-0.5%, the antioxidant of 0.05%-0.1%, the auxiliary antioxidant of 0.05%-0.1% and 1% it is anti-old
Change ball, the copper resistant agent is the N of equivalent, and N'- salicil hydrazine and N, N'- are bis- to formylhydrazine, and the antioxidant is antioxidant
1010, the auxiliary antioxidant is DLTP, and the anti-aging ball includes film shell and filling gas, and the filling gas is pressure
Contracting nitrogen is provided with circuit layer on the insulating layer, and the circuit layer is the base copper-clad plate of BT resin, and electro-coppering mode can adopt
With any one in acid copper-plating, pulse copper facing or rotation copper facing, the metal-based layer includes basic courses department, fin part and boss
Portion, and be integrally formed between basic courses department, fin part and boss portion, the insulating layer and circuit layer are respectively provided with and boss portion phase
The first through hole matched and the second through-hole, and boss portion extends through first through hole and the second through-hole, is provided in the boss portion
LED chip is provided with the conducting wire being electrically connected with LED chip on the circuit layer, and the metal-based layer and circuit layer surface are equal
It is covered with release film.
A kind of step of preparation process of COB aluminum-based packaging plate includes a stage and two-stage, and the stage includes:
A:BT sawing sheet: according to the technological requirements and specification, BT resin base copper-clad plate is cut into required breadth；
B: route: making double-sided circuit figure with liquid photosensitive glue, then etched figure, and liquid photosensitive glue uses curtain-type
Coating, liquid anti-plate photoresists resolution ratio is very high, develops without bottom, it is easy to obtain fine circuitous pattern, etch
Extra photosensitive layer is removed after circuitous pattern with 5%NaOH；
C: welding resistance: curtain-type coating fluid body-sensing photoresist solder flux produces welding resistance figure, then is coated with plate face with liquid photosensitive glue,
It is exposed, is developed again with welding resistance egative film；
D: surface treatment: cleaning surface debris and oxidative phenomena；
E: assembly/attached glue: high glue height is led by PP plastic cement using screen printing mode and is printed on metal-based layer as carrier
Upper formation insulating layer, obtains gluing substrate；The print thickness of the insulating layer is 40-210 μm；
F: fluting: target goes out the second through-hole on circuit layer；
G: assembly/mirror surface vacation patch: circuit layer and gluing substrate is die-filling in order；
The two-stage includes:
H: pressure transmission: being pushed into vacuum hotpressing machine after the completion of die-filling, aluminum-based copper-clad plate is made in the hot pressing of vacuum condition lower layer, applies matrix
Glue-line on plate completes primary solidification in lamination process, and obtained aluminum-based copper-clad plate is dried in vacuo at 180-220 DEG C again
Solidify 3-5h in case, obtains package substrate ontology；
I: aperture drilling: is carried out using bicker on package substrate ontology in steph；
J:V-cut: cut-off rule is cut using turntable cutter on package substrate ontology；
K: shape shape: is carved out on package substrate ontology；
L: line test, proof voltage test and OSP test successively electrical measurement: are carried out；
M: survey eventually: FQC carries out full inspection confirmation to product, and FQA sampling observation is verified；
N: packaging shipment packaging: is carried out to qualified products.
3. beneficial effect
Compared with the prior art, the present invention has the advantages that
(1) this programme may be implemented while reasonable control cost and technology difficulty, significantly improve dissipating for package substrate
Hot property and insulation performance reduce the thermal resistance that insulating layer radiates to package substrate, as the raising of thermal conductivity not only increases mould
The service life of set product, while the bulk temperature of mould group is reduced, the product quality of LED module is improved, big function is suitable for
Rate LED field, long service life, and lower production costs, meet the condition of large-scale industrial application, and target level of product quality meets
EU criteria and Unite States Standard.
(2) insulating layer reduces thermal resistance when heat dissipation, while corrosion-and high-temp-resistant while meeting superior insulation performance,
With excellent mechanical strength, and it is anti-by adding copper resistant agent, antioxidant, auxiliary in the preparation process that high glue height leads PP plastic cement
Oxygen agent and anti-aging ball significantly improve the ageing resistance of insulating layer, it is possible to reduce bring copper evil is directly contacted with circuit layer,
Extend the service life of insulating layer.
Detailed description of the invention
Fig. 1 is the structural diagram of the present invention；
Fig. 2 is the structural schematic diagram of metal-based layer part of the present invention；
Fig. 3 is the structural schematic diagram of anti-aging ball portion of the present invention；
Fig. 4 is the flow diagram of a stage part of the invention；
Fig. 5 is the flow diagram of two-stage of the invention part；
Fig. 6 is the structural schematic diagram of LED light mould group heat dissipation channel part in the prior art.
Figure label explanation:
1 metal-based layer, 101 basic courses departments, 102 fin parts, 103 boss portions, 2 insulating layers, 3 circuit layers, 4 LED chips, 5 are prevented
Aging ball, 6 compressed nitrogens.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description；Obviously, described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments, is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the instruction such as term " on ", "lower", "inner", "outside", " top/bottom end "
Orientation or positional relationship be based on the orientation or positional relationship shown in the drawings, be merely for convenience of description the present invention and simplification retouch
It states, rather than the device or element of indication or suggestion meaning must have a particular orientation, be constructed and operated in a specific orientation,
Therefore it is not considered as limiting the invention.In addition, term " first ", " second " are used for description purposes only, and cannot understand
For indication or suggestion relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation " " is set
Be equipped with ", " be arranged/connect ", " connection " etc., shall be understood in a broad sense, such as " connection ", may be a fixed connection, be also possible to removable
Connection is unloaded, or is integrally connected, can be mechanical connection, is also possible to be electrically connected, can be directly connected, it can also be in
Between medium be indirectly connected, can be the connection inside two elements, for the ordinary skill in the art, can be specific
Situation understands the concrete meaning of above-mentioned term in the present invention.
Embodiment 1:
Referring to Fig. 1, a kind of COB aluminum-based packaging plate, including metal-based layer 1, metal-based layer 1 lead aluminum substrate using 6 system's height
Material is made, and the essential element of 6 line aluminium alloys is magnesium and silicon, and main hardening constituent is Mg2Si, can be strengthened by heat treatment,
It is provided simultaneously with excellent heating conduction.
Referring to Fig. 1, being provided with insulating layer 2 on metal-based layer 1, insulating layer 2 is led PP plastic cement by high glue height and is made, and PP is i.e. poly-
Propylene, polyacrylic crystallinity is high, compound with regular structure, thus has excellent mechanical property, and polypropylene has good heat resistance,
Product can carry out disinfection sterilizing, under conditions of not by external force, 150 DEG C of also indeformable, polyacrylicization in 100 DEG C of temperatures above
It is fine to learn stability, in addition to it can be corroded by the concentrated sulfuric acid, concentrated nitric acid, all more stable to various other chemical reagent, it has higher
Dielectric coefficient can be used to make heated electrical apparatus insulation product and with the rising of temperature, its breakdown voltage is also very high,
It is suitable as electrical accessorie etc., reactance voltage, arc resistance are good, but electrostatic degree is high, contact with copper easy to aging, are mainly reflected in PP's
There is tertiary carbon atom on main chain, chemical change easily occurs under the effect of the extraneous factors such as heat, oxygen, ultraviolet light, shows as infrared
Occur carbonyl peak in absorption spectrum, subsequently generates peroxide, form free radical after fracture, these free radicals further cause whole
A macromolecular chain cracking, branching and crosslinking, make PP lose the feature of high molecular material, lose its service performance, including high temperature resistant
The performances such as property, insulation performance, mechanical strength be big, and joined 0.4% copper resistant agent, 0.05% antioxygen during the preparation process
Agent, 0.05% auxiliary antioxidant and 1% anti-aging ball 5, the N that copper resistant agent is 0.2%, N'- salicil hydrazine and 0.2%
N, N'- are bis- to formylhydrazine, and there is very strong inhibitions heavy metal ion to be catalyzed aging ability, anti-copper evil significant effect and with
Resin intermiscibility is good, and good dispersion does not migrate, and does not pollute, water-fast, and oily extractable is good, do not influence resin electrical insulation capability and
The advantages that other performance, significantly more inhibitory effect can be played in the case where being used cooperatively with antioxidant, antioxidant is anti-
Oxygen agent 1010, auxiliary antioxidant DLTP, cooperation antioxidant use performance synergistic effect.
Referring to Fig. 3, anti-aging ball 5 includes film shell and filling gas, anti-aging ball 5 is fragile under the conditions of external force
It splits, filling gas is compressed nitrogen 6, and nitrogen can serve as protection gas as inert gas under normal circumstances, even if insulating
The generation of the case where 2 aging of layer, upon there is old bad when, the anti-aging ball 5 in insulating layer 2 releases nitrogen after rupturing, compresses
The air " squeezing away " of surrounding is built the environment of an approximate anaerobic by the expansion escape rapidly of nitrogen 6, is played antioxygen with this and is made
With preventing the further aging of insulating layer 2, be provided with circuit layer 3 on insulating layer 2, circuit layer 3 is the base copper-clad plate of BT resin, and electricity
Copper facing mode can use any one in acid copper-plating, pulse copper facing or rotation copper facing,.
Referring to Fig. 2, metal-based layer 1 includes basic courses department 101, fin part 102 and boss portion 103, and basic courses department 101, wing
It being integrally formed between piece portion 102 and boss portion 103, fin part 102 is used to increase and the contact area of air, thermal conductivity is improved,
Insulating layer 2 and circuit layer 3 are respectively provided with the first through hole to match with boss portion 103 and the second through-hole, and boss portion 103 is distinguished
Through first through hole and the second through-hole, it is provided with LED chip 4 in boss portion 103, is provided on circuit layer 3 and 4 electricity of LED chip
Property connection conducting wire, metal-based layer 1 and 3 surface of circuit layer are all covered with release film.
Referring to Fig. 4, a kind of step of preparation process of COB aluminum-based packaging plate includes a stage and two-stage, stage packet
It includes:
A:BT sawing sheet: according to the technological requirements and specification, BT resin base copper-clad plate is cut into required breadth；
B: route: double-sided circuit figure is made with liquid photosensitive glue Photo-Resist, then etched figure, liquid photosensitive glue
It is coated with using curtain-type, curtain method high production efficiency, and coating uniform, without sand holes, wire mark method is also easy to produce airhole, liquid
Anti-plate photoresists resolution ratio is very high, develops without bottom, it is easy to fine circuitous pattern is obtained, price is cheaper than dry film,
Extra photosensitive layer is removed with 5%NaOH after etched circuit figure, there are following points for attention in etching process: 1,
Notice that etching is not clean, etching is excessive；2, notice that line width and line are thin；3, copper face is not allow for aoxidizing, and scratches phenomenon；4, dry film is moved back to want
It moves back clean；
C: welding resistance: curtain-type coating fluid body-sensing photoresist solder flux produces welding resistance figure, then is coated with plate face with liquid photosensitive glue,
It is exposed, is developed again with welding resistance egative film, protection does not need to do the route of scolding tin, prevents tin from entering and causes short circuit；
D: surface treatment: cleaning surface debris and oxidative phenomena；
E: assembly/attached glue: high glue height is led by PP plastic cement using screen printing mode and is printed on metal-based layer 1 as carrier
Upper formation insulating layer 2, obtains gluing substrate；The print thickness of insulating layer 2 is 200 μm；
F: fluting: target goes out the second through-hole on circuit layer 3；
G: assembly/mirror surface vacation patch: circuit layer 3 and gluing substrate is die-filling in order；
Referring to Fig. 5, the two-stage includes:
H: pressure transmission: being pushed into vacuum hotpressing machine after the completion of die-filling, aluminum-based copper-clad plate is made in the hot pressing of vacuum condition lower layer, applies matrix
Glue-line on plate completes primary solidification in lamination process, by obtained aluminum-based copper-clad plate again in 200 DEG C of vacuum ovens
Solidify 4h, obtains package substrate ontology；
I: aperture drilling: is carried out using bicker on package substrate ontology in steph；
J:V-cut: cut-off rule is cut using turntable cutter on package substrate ontology；
K: shape shape: is carved out on package substrate ontology；
L: line test, proof voltage test and OSP test successively electrical measurement: are carried out；
M: survey eventually: FQC carries out full inspection confirmation to product, and FQA sampling observation is verified；
N: packaging shipment packaging: is carried out to qualified products.
The present invention may be implemented while reasonable control cost and technology difficulty, significantly improve the thermal diffusivity of package substrate
Energy and insulation performance reduce the thermal resistance that insulating layer 2 radiates to package substrate, produce as the raising of thermal conductivity not only increases mould group
The service life of product, while the bulk temperature of mould group is reduced, the product quality of LED module is improved, great power LED is suitable for
Field, long service life, and lower production costs, meet the condition of large-scale industrial application, and target level of product quality meets European Union
Standard and Unite States Standard, in addition insulating layer 2 reduces thermal resistance when heat dissipation, while resistance to height while meeting superior insulation performance
Temperature is corrosion-resistant, has excellent mechanical strength, and by adding copper resistant agent, antioxygen in the preparation process that high glue height leads PP plastic cement
Agent, auxiliary antioxidant and anti-aging ball 5 significantly improve the ageing resistance of insulating layer, it is possible to reduce directly contact with circuit layer 3
Bring copper evil, extends the service life of insulating layer 2.
The foregoing is intended to be a preferred embodiment of the present invention；But scope of protection of the present invention is not limited thereto.
Anyone skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its
It improves design and is subject to equivalent substitution or change, should be covered by the scope of protection of the present invention.
Claims (10)
1. a kind of COB aluminum-based packaging plate, including metal-based layer (1), it is characterised in that: be provided on the metal-based layer (1) absolutely
Edge layer (2) is provided with circuit layer (3) on the insulating layer (2), and the metal-based layer (1) includes basic courses department (101), fin part
(102) and boss portion (103) be integrally formed, and between basic courses department (101), fin part (102) and boss portion (103), it is described absolutely
Edge layer (2) and circuit layer (3) are respectively provided with the first through hole to match with boss portion (103) and the second through-hole, and boss portion
(103) first through hole and the second through-hole are extended through, is provided with LED chip (4), the circuit layer on the boss portion (103)
(3) conducting wire being electrically connected with LED chip (4) is provided on.
2. a kind of COB aluminum-based packaging plate according to claim 1, it is characterised in that: the metal-based layer (1) utilizes 6 systems
Height is led aluminium base plate and is made.
3. a kind of COB aluminum-based packaging plate according to claim 1, it is characterised in that: the insulating layer (2) is led by high glue height
PP plastic cement is made, and joined during the preparation process the copper resistant agent of 0.4%-0.5%, 0.05%-0.1% antioxidant,
The auxiliary antioxidant of 0.05%-0.1% and 1% anti-aging ball (5).
4. a kind of COB aluminum-based packaging plate according to claim 3, it is characterised in that: the copper resistant agent is the N, N'- of equivalent
Salicil hydrazine and N, N'- is bis- to formylhydrazine, and the antioxidant is antioxidant 1010, and the auxiliary antioxidant is DLTP.
5. a kind of COB aluminum-based packaging plate according to claim 3, it is characterised in that: the anti-aging ball (5) includes film
Shell and filling gas, the filling gas are compressed nitrogen (6).
6. a kind of COB aluminum-based packaging plate according to claim 1, it is characterised in that: the circuit layer (3) is BT resin base
Copper-clad plate, and electro-coppering mode can be using any one in acid copper-plating, pulse copper facing or rotation copper facing.
7. a kind of COB aluminum-based packaging plate according to claim 1, it is characterised in that: the metal-based layer (1) and circuit layer
(3) surface is all covered with release film.
8. a kind of COB aluminum-based packaging plate according to claim 1, it is characterised in that: its preparation process include: a stage and
Two-stage, a stage include:
A:BT sawing sheet: according to the technological requirements and specification, BT resin base copper-clad plate is cut into required breadth；
B: route: double-sided circuit figure is made with liquid photosensitive glue (Photo-Resist), then etched figure, liquid photosensitive glue are adopted
It is coated with curtain-type, liquid anti-plate photoresists resolution ratio is very high, develops without bottom, it is easy to obtain fine circuit diagram
Shape；
C: welding resistance: curtain-type coating fluid body-sensing photoresist solder flux produces welding resistance figure, then is coated with plate face with liquid photosensitive glue, with resistance
Soldering bottom piece exposes again, development；
D: surface treatment: cleaning surface debris and oxidative phenomena；
E: assembly/attached glue: high glue height is led by PP plastic cement using screen printing mode and is printed on the metal-based layer (1) as carrier
It is formed insulating layer (2), obtains gluing substrate；The print thickness of the insulating layer (2) is 40-210 μm；
F: fluting: target goes out the second through-hole on circuit layer (3)；
G: assembly/mirror surface vacation patch: circuit layer (3) and gluing substrate is die-filling in order.
9. a kind of preparation process of COB aluminum-based packaging plate according to claim 8, it is characterised in that: the two-stage packet
It includes:
H: pressure transmission: being pushed into vacuum hotpressing machine after the completion of die-filling, the hot pressing of vacuum condition lower layer is made aluminum-based copper-clad plate, on gluing substrate
Glue-line primary solidification is completed in lamination process, by obtained aluminum-based copper-clad plate again in 180-220 DEG C of vacuum oven
Solidify 3-5h, obtains package substrate ontology；
I: aperture drilling: is carried out using bicker on package substrate ontology in steph；
J:V-cut: cut-off rule is cut using turntable cutter on package substrate ontology；
K: shape shape: is carved out on package substrate ontology；
L: line test, proof voltage test and OSP test successively electrical measurement: are carried out；
M: survey eventually: FQC carries out full inspection confirmation to product, and FQA sampling observation is verified；
N: packaging shipment packaging: is carried out to qualified products.
10. a kind of preparation process of COB aluminum-based packaging plate according to claim 8, it is characterised in that: in the step B
Extra photosensitive layer is removed with 5%NaOH after etched circuit figure.
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| CN2018116344604 | 2018-12-29 |
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