CN118553673B - Silicon chip clamping device - Google Patents
Silicon chip clamping device Download PDFInfo
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- CN118553673B CN118553673B CN202411000597.XA CN202411000597A CN118553673B CN 118553673 B CN118553673 B CN 118553673B CN 202411000597 A CN202411000597 A CN 202411000597A CN 118553673 B CN118553673 B CN 118553673B
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- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 94
- 239000010703 silicon Substances 0.000 title claims abstract description 94
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 93
- 238000001179 sorption measurement Methods 0.000 claims abstract description 59
- 230000000694 effects Effects 0.000 claims abstract description 10
- 238000007789 sealing Methods 0.000 claims description 19
- 238000009423 ventilation Methods 0.000 claims description 10
- 230000003014 reinforcing effect Effects 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 230000009977 dual effect Effects 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 68
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to the technical field of semiconductor processing, in particular to a silicon wafer clamping device, which comprises a mechanical arm, wherein a fixed disc is fixedly arranged at the end part of the mechanical arm, mounting rods which are distributed in an annular mode at equal intervals are fixedly arranged on the lower surface of the fixed disc, a mounting plate is fixedly arranged at the end part of the mounting rods, a mounting opening is formed in the position, close to the middle, of the outer wall of the mounting plate, an air cylinder is fixedly arranged in the mounting opening, a movable opening which is distributed in an annular mode at equal intervals is further formed in the outer wall of the mounting plate, a movable block is movably arranged in the movable opening, and a rubber clamping strip is fixedly arranged on the lower surface of the movable block. According to the invention, through the dual clamping actions of the adsorption clamping and the rubber clamping strip of the adsorption mechanism, the silicon wafer can be more stable after being clamped, so that the processing precision and consistency are ensured, the silicon wafer is prevented from being damaged, meanwhile, the clamping mode can enable the silicon wafer to be subjected to multi-angle adjustment, various processing operations are conveniently carried out on the silicon wafer, and the use effect is better.
Description
Technical Field
The invention relates to the technical field of semiconductor processing, in particular to a silicon wafer clamping device.
Background
With the rapid development of the semiconductor industry, silicon wafers are used as basic materials for manufacturing integrated circuits, the size of the silicon wafers is continuously increased, the requirements on manufacturing precision are also increasingly increased, and in the processing process of the silicon wafers, the silicon wafers are required to be accurately clamped and positioned so as to ensure the processing precision and consistency, and the traditional silicon wafer clamping device usually adopts a mechanical clamp or a pneumatic chuck to realize the positioning and fixing of the silicon wafers.
However, the conventional wafer clamping device has the following problems: the mechanical clamp may damage the surface of the silicon wafer when clamping the silicon wafer, so as to influence the quality of the silicon wafer, and the pneumatic sucker can reduce the direct contact with the surface of the silicon wafer, but after long-time working, the suction force may be insufficient due to the problems of unstable air pressure or air passage blockage and the like, so that the processing process of the silicon wafer is influenced, therefore, the design of the silicon wafer clamping device is needed to solve the problems.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides a silicon wafer clamping device.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
The utility model provides a silicon chip clamping device, includes the arm, the fixed mounting plate that is provided with of tip of arm, the fixed mounting rod that is annular distribution of equidistance is provided with to the lower fixed surface of mounting plate, and the fixed mounting plate that is provided with of tip of mounting rod, the mounting hole that the mounting plate outer wall is close to middle position department has been seted up, and fixedly in the mounting hole be provided with the inflator, the equidistance has still been seted up to the outer wall of mounting plate and is annular distribution's movable mouth, and the activity is provided with the movable block in the movable mouth, the fixed rubber clamping strip that is provided with of lower fixed surface of movable block, the fixed gasbag that is provided with the equidistance of lateral wall of rubber clamping strip, adjacent be linked together through communicating pipe between the gasbag, the outer wall of movable block runs through fixedly and is provided with the ventilation pipe, and the one end of ventilation pipe with the gasbag is linked together, the equidistance is annular distribution's mounting hole, and fixedly provided with fixed pipe in the mounting hole, the sleeve has been cup jointed in the outside of fixed pipe, the one end and the sleeve pipe that the gasbag was kept away from to the ventilation pipe are linked together still includes:
The air supply and exhaust mechanism is arranged between the air cylinder and the fixed disc and is used for introducing air into the air cylinder and extracting the air in the air cylinder;
The adsorption mechanism is arranged below the air cylinder and is used for adsorbing the silicon wafer before the rubber clamping strip clamps the silicon wafer;
the moving mechanism is arranged in the mounting plate and used for adjusting the position of the moving block in the movable opening;
the sealing mechanism is arranged on the outer side of the sleeve and used for sealing a gap between the sleeve and the fixed pipe.
As still further aspects of the invention: the air supply and exhaust mechanism comprises an air pump fixedly arranged on the lower surface of the fixed disc, an air pipe is arranged at the air supply end of the air pump in a communicated mode, the air pipe is communicated with the air cylinder, and an air pressure gauge is arranged at the outer side of the air pipe in a communicated mode.
As still further aspects of the invention: the adsorption mechanism comprises an adsorption cylinder arranged below the air cylinder, the lower surface of the mounting plate is connected with the side wall of the adsorption cylinder through a reinforcing rib, the lower surface of the air cylinder is communicated with an air pipe, a control valve is arranged on the air pipe, the end part of the air pipe is communicated with the adsorption cylinder, a sucker is arranged at the bottom end of the adsorption cylinder in a communicated mode, a fixing rod is fixedly connected with the inner wall of the adsorption cylinder, a pressure sensor is arranged at the end part of the fixing rod, and the pressure sensor is located in the sucker.
As still further aspects of the invention: the end fixing of sucking disc is provided with the adsorption plate, and the outer wall of adsorption plate has seted up a plurality of wind holes, the fixed adsorption pad that is provided with of outer wall of adsorption plate, and the outer wall of adsorption pad has seted up the adsorption hole corresponding with the wind hole, the fixed curb plate that is annular distribution that is provided with of outer wall of adsorption cylinder, and the outer wall of curb plate runs through the activity and is provided with the movable rod, the one end and the adsorption plate of movable rod are connected, and the fixed separation blade that is provided with of the other end of movable rod, the spring has been cup jointed in the outside of movable rod, the one end and the separation blade of spring are connected, and the other end and the curb plate of spring are connected.
As still further aspects of the invention: the side wall of the rubber clamping strip is also provided with clamping grooves which are distributed at equal intervals, rubber sheets which are distributed symmetrically up and down are fixedly arranged in the clamping grooves, and the end parts of the rubber sheets are semicircular.
As still further aspects of the invention: the shifting mechanism comprises a limiting rod fixedly arranged in the movable opening, the limiting rod penetrates through the movable block, a fixing hole communicated with the movable opening is formed in the outer wall of the mounting plate, a first telescopic cylinder is fixedly arranged in the fixing hole, and the telescopic end of the first telescopic cylinder is connected with the outer wall of the movable block.
As still further aspects of the invention: the sealing mechanism comprises a telescopic cylinder II fixedly arranged at the end part of the sleeve, a movable plate is fixedly arranged at the telescopic end of the telescopic cylinder II, connecting rods which are distributed annularly and equidistantly are fixedly arranged on the outer wall of the movable plate, a retaining plate is fixedly arranged at the end part of the connecting rod and sleeved outside the fixed pipe, a sealing plug is fixedly arranged on the outer wall of one side, close to the sleeve, of the retaining plate, a ring groove is formed in one end, close to the retaining plate, of the sleeve, and the sealing plug is positioned in the ring groove.
Compared with the prior art, the invention has the beneficial effects that:
According to the silicon wafer clamping device provided by the invention, the mounting plate can be moved to the upper part of the silicon wafer to be clamped through the mechanical arm, then the air in the air cylinder can be pumped out through the air supply and exhaust mechanism, at the moment, the air in the air cylinder can enter the air cylinder along the ventilation pipe, the sleeve pipe and the fixing pipe, so that the air cylinder is contracted, at the moment, the rubber clamping strips can be outwards opened, then the mounting plate can be controlled to further move through the mechanical arm, the adsorption mechanism is promoted to adsorb the silicon wafer, the mechanical arm is moved to enable the silicon wafer to leave the placing surface of the silicon wafer, and simultaneously, the air can be introduced into the air cylinder again through the air supply and exhaust mechanism, so that the air cylinder expands, the end part of the rubber clamping strips is promoted to move towards the direction of the silicon wafer, and therefore, compared with mechanical clamping, damage to the surface of the silicon wafer can be avoided, meanwhile, the initial position of the rubber clamping strips can be regulated through the shifting mechanism, clamping operation is convenient for clamping silicon wafers with different sizes, the silicon wafer after being clamped can be more stable through the double clamping actions of the adsorption clamping mechanism and the rubber clamping strips, the silicon wafer can be processed, the silicon wafer can be more accurately and consistently processed, and the silicon wafer can be better processed in a plurality of angles by adjusting modes.
Drawings
FIG. 1 is a schematic view of a first view angle structure of a wafer clamping apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of the structure of the inflator and the adsorption cylinder in the silicon wafer clamping device according to the embodiment of the invention;
FIG. 3 is a schematic diagram of a semi-sectional structure of a mounting plate of a silicon wafer clamping device according to an embodiment of the present invention;
FIG. 4 is an enlarged schematic view of the structure of FIG. 3 at A;
FIG. 5 is an enlarged schematic view of the structure at B in FIG. 3;
FIG. 6 is a schematic view of a gas cylinder in a wafer clamping apparatus according to an embodiment of the present invention;
FIG. 7 is a schematic view of a rubber clamping strip in a silicon wafer clamping device according to an embodiment of the present invention;
fig. 8 is a schematic view of a second view structure of a silicon wafer clamping device according to an embodiment of the present invention.
In the figure: 101-mechanical arm, 102-fixed disk, 103-mounting rod, 104-mounting plate, 105-movable port, 106-movable block, 107-inflator, 108-fixed pipe, 109-sleeve, 110-vent pipe, 111-rubber clamping strip, 112-airbag, 113-communicating pipe, 201-air pump, 202-air pipe, 203-barometer, 301-vent pipe, 302-control valve, 303-adsorption cylinder, 304-sucking disk, 305-fixed rod, 306-pressure sensor, 307-side plate, 308-movable rod, 309-baffle, 310-spring, 311-adsorption plate, 312-wind hole, 313-adsorption pad, 314-adsorption hole, 401-limit rod, 402-telescopic cylinder one, 501-telescopic cylinder two, 502-movable plate, 503-connecting rod, 504-offset plate, 505-sealing plug, 601-clamping groove, 602-rubber sheet.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent.
As shown in fig. 1 to 8, a silicon wafer clamping device provided by an embodiment of the invention comprises a mechanical arm 101, a fixed disc 102 is fixedly arranged at the end part of the mechanical arm 101, a mounting rod 103 which is distributed in an annular shape and is equidistantly arranged on the lower surface of the fixed disc 102, a mounting plate 104 is fixedly arranged at the end part of the mounting rod 103, a mounting hole is formed in the position, close to the middle, of the outer wall of the mounting plate 104, an air cylinder 107 is fixedly arranged in the mounting hole, a movable opening 105 which is distributed in an annular shape and is equidistantly arranged is further formed in the outer wall of the mounting plate 104, a movable block 106 is movably arranged in the movable opening 105, a rubber clamping strip 111 is fixedly arranged on the lower surface of the movable block 106, air bags 112 which are distributed in an equidistant manner are fixedly arranged on the side walls of the rubber clamping strip 111, adjacent air bags 112 are communicated through a communicating pipe 113, a vent pipe 110 is fixedly arranged on the outer wall of the movable block 106, one end of the vent pipe 110 is communicated with the air bags 112, a mounting hole which is distributed in an annular shape and is fixedly arranged in the middle of the outer wall of the mounting plate 104, a sleeve 109 is sleeved on the outer side of the fixed pipe 108, one end, which is far from the air bags 112 is communicated with the sleeve 109, and the sleeve 109 is further communicated with the sleeve 109. An air supply and exhaust mechanism provided between air cylinder 107 and fixed disk 102 for introducing air into air cylinder 107 and extracting air from air cylinder 107; the adsorption mechanism is arranged below the inflator 107 and is used for adsorbing the silicon wafer before the silicon wafer is clamped by the rubber clamping strip 111; a moving mechanism provided in mounting plate 104 for adjusting the position of moving block 106 in movable port 105; and the sealing mechanism is arranged outside the sleeve and is used for sealing a gap between the sleeve 109 and the fixed pipe 108.
The mounting plate 104 can be moved to the upper side of the silicon wafer to be clamped through the mechanical arm 101, then air in the air cylinder 107 can be pumped out through the air supply and exhaust mechanism, at the moment, the air in the air cylinder 112 can enter the air cylinder 107 along the ventilation pipe 110, the sleeve 109 and the fixing pipe 108, so that the air cylinder 112 is contracted, the rubber clamping strips 111 can be outwards opened, then the mounting plate 104 can be controlled to further move through the mechanical arm 101, the adsorption mechanism is promoted to adsorb the silicon wafer firstly, the mechanical arm 101 is moved to enable the silicon wafer to leave the placing surface of the silicon wafer, and meanwhile, the air can be supplied to the air cylinder 107 through the air supply and exhaust mechanism, so that the air can be led into the air cylinder 107 again along the fixing pipe 108, the sleeve 109 and the ventilation pipe 110, the air cylinder 112 is expanded, the end part of the rubber clamping strips 111 is promoted to move towards the direction of the silicon wafer, soft clamping of the silicon wafer is realized, compared with mechanical clamping, damage to the surface of the silicon wafer can be avoided, simultaneously, the initial position of the rubber clamping strips 111 can be adjusted through the shifting mechanism, clamping operation is convenient to clamp the silicon wafer of different sizes, the silicon wafer can be clamped through the adsorption of the adsorption mechanism and the clamping device, the clamping effect of the clamping strips 111 can be ensured, the silicon wafer can be processed more stably, and consistently, the silicon wafer can be processed, and more accurately, and more damage can be avoided, simultaneously, the multiple silicon wafer can be processed, and conveniently.
As an embodiment of the present invention, referring to fig. 2, the air supply and exhaust mechanism includes an air pump 201 fixedly disposed on the lower surface of the fixed disc 102, an air pipe 202 is disposed at an air supply end of the air pump 201 and is communicated with the air pipe 202 and the air cylinder 107, an air pressure meter 203 is disposed at an outer side of the air pipe 202 and is communicated with the air pipe, air in the air cylinder 107 is extracted by the air pump 201, and external air is introduced into the air cylinder 107, and during the air extraction and introduction process, air pressure in the air cylinder 107 can be detected by the air pressure meter 203, so that the air pressure is maintained at a suitable pressure value, and the use is safer.
As an embodiment of the present invention, referring to fig. 2, 5 and 6, the adsorption mechanism includes an adsorption cylinder 303 disposed below an air cylinder 107, a lower surface of a mounting plate 104 is connected to a side wall of the adsorption cylinder 303 through a reinforcing rib, an air pipe 301 is disposed on the lower surface of the air cylinder 107, a control valve 302 is disposed on the air pipe 301, an end portion of the air pipe 301 is connected to the adsorption cylinder 303, a suction cup 304 is disposed on a bottom end of the adsorption cylinder 303, a fixing rod 305 is fixedly connected to an inner wall of the adsorption cylinder 303, a pressure sensor 306 is disposed on an end portion of the fixing rod 305, the pressure sensor 306 is disposed in the suction cup 304, when air in the air cylinder 107 is pumped by an air pump 201 to expand the rubber clamping strip 111 around, the suction cup 304 is contacted with a silicon wafer as the mounting plate 104 moves toward the silicon wafer, and when the suction cup 304 is pressed until the pressure sensor 306 detects a pressure signal in contact with the silicon wafer, the suction cup 304 and the surface is completely attached to the control valve 302 at this time, so that the air cylinder 107 and the air pipe 303 are communicated with the suction cylinder 303, the suction cup 304 is opened, and the air in the suction cup 304 is made to flow toward the air cylinder 107, so that the suction cup 304 can have better adsorption effect.
As an embodiment of the present invention, referring to fig. 5, an end portion of a suction cup 304 is fixedly provided with a suction plate 311, an outer wall of the suction plate 311 is provided with a plurality of air holes 312, an outer wall of the suction plate 311 is fixedly provided with a suction pad 313, an outer wall of the suction pad 313 is provided with suction holes 314 corresponding to the air holes 312, an outer wall of a suction cylinder 303 is fixedly provided with side plates 307 distributed in an equidistant annular shape, the outer wall of the side plates 307 is movably provided with a movable rod 308 in a penetrating manner, one end of the movable rod 308 is connected with the suction plate 311, the other end of the movable rod 308 is fixedly provided with a baffle 309, a spring 310 is sleeved outside the movable rod 308, one end of the spring 310 is connected with the baffle 309, the other end of the spring 310 is connected with the side plates 307, when a mounting plate 104 is close to a silicon wafer, the suction pad 313 of the outer wall of the suction plate 311 can replace the suction cup 304 to be contacted with the silicon wafer, when a pressure sensor 306 is contacted with the suction plate 311, the control valve 302 is caused to open the breather pipe 301 so that the air cylinder 107 and the adsorption cylinder 303 are communicated, at this time, the silicon wafer is adsorbed through the adsorption hole 314 in the adsorption pad 313, the spring 310 at the outer side of the movable rod 308 is also in a stretched state at this time, after the adsorption pad 313 adsorbs the silicon wafer, the control valve 302 can be caused to close the breather pipe 301, so when the mounting plate 104 is far away from the placing surface of the silicon wafer, the spring 310 also resets to play a role of pulling the sucker 304, the negative pressure state in the adsorption cylinder 303 can be caused to be maintained, the silicon wafer can be adsorbed without continuous suction, and after the silicon wafer is adsorbed and lifted, the air pump 201 can supply air to the air cylinder 107 to expand the air bag 112, the rubber clamping strip 111 is caused to bend, the end part of the rubber clamping strip 111 realizes soft clamping operation on the silicon wafer, at this time, because the control valve 302 is in a closed state, the adsorption force of the adsorption pad 313 to the silicon wafer can not disappear, so that the silicon wafer is more stable after being clamped, and the use effect is better.
As an embodiment of the present invention, referring to fig. 7, the side wall of the rubber clamping strip 111 is further provided with equidistant clamping grooves 601, and the clamping grooves 601 are fixedly provided with vertically symmetrically distributed rubber sheets 602, and the ends of the rubber sheets 602 are semicircular, so that silicon wafers can more easily enter between the rubber sheets 602, and during the process of clamping the silicon wafers by the rubber clamping strip 111, the silicon wafers can be clamped into the clamping grooves 601 on the side wall of the rubber clamping strip 111, and the rubber sheets 602 can be pushed to move towards the inside of the clamping grooves 601, so that the silicon wafers are more difficult to separate from the clamping grooves 601, and the clamping stability is further improved.
As an embodiment of the present invention, referring to fig. 1 and 3, the displacement mechanism includes a limiting rod 401 fixedly disposed in the movable opening 105, the limiting rod 401 penetrates through the movable block 106, a fixing hole communicated with the movable opening 105 is formed in an outer wall of the mounting plate 104, a first telescopic cylinder 402 is fixedly disposed in the fixing hole, a telescopic end of the first telescopic cylinder 402 is connected with an outer wall of the movable block 106, and when the position of the movable block 106 needs to be changed, the first telescopic cylinder 402 can drive the movable block 106 to slide outside the limiting rod 401, so that the initial position of the rubber clamping strip 111 can be conveniently adjusted, and clamping operations can be conveniently performed on silicon wafers with different sizes, so that the use effect is better.
As an embodiment of the present invention, please refer to fig. 3 and 4, the sealing mechanism includes a telescopic cylinder two 501 fixedly disposed at the end of the sleeve 109, the telescopic end of the telescopic cylinder two 501 is fixedly provided with a moving plate 502, the outer wall of the moving plate 502 is fixedly provided with a connecting rod 503 distributed in an annular shape, the end of the connecting rod 503 is fixedly provided with a retaining plate 504, the retaining plate 504 is sleeved outside the fixed pipe 108, a sealing plug 505 is fixedly disposed on the outer wall of one side of the retaining plate 504, the sleeve 109 is provided with a ring groove at one end of the retaining plate 504, and the sealing plug 505 is located in the ring groove, before the position of the moving block 106 is adjusted, the moving plate 502 can be driven by the telescopic cylinder two 501 to move by the connecting rod 503, so that the sealing plug 505 on the outer wall of the retaining plate 504 can be moved out of the ring groove through the connecting rod 503, and the sleeve 109 can be flexibly stretched out of the outer side of the fixed pipe 108, after the position of the moving block 106 is adjusted, the sealing plug 505 on the outer wall of the retaining plate 504 can be driven by the telescopic cylinder two 501 again, so as to ensure that the sealing plug 505 between the sleeve 109 and the fixed pipe 108 is not enough to be clamped by the rubber strip, and the original clamping effect can be effectively avoided.
During the use, can remove mounting panel 104 to the top of waiting to centre gripping silicon chip through arm 101, then can take out the air in the gas cylinder 107 through air feed exhaust mechanism, air in the gas cylinder 112 can get into in the gas cylinder 107 along ventilation pipe 110 this moment, sleeve pipe 109 and fixed pipe 108, make the gas cylinder 112 shrink, this moment rubber clamping strip 111 just can outwards open, then can further remove through arm 101 control mounting panel 104, promote adsorption mechanism to adsorb the silicon chip earlier, and remove arm 101 and make the silicon chip leave the plane of placing of silicon chip, simultaneously can be through air feed exhaust mechanism to gas cylinder 107, make the air follow fixed pipe 108, sleeve pipe 109 and ventilation pipe 110 again guide into in the gas cylinder 107, make the gas cylinder 112 take place to expand, make the tip of rubber clamping strip 111 move towards the silicon chip direction, thereby realize the soft centre gripping to the silicon chip, compared mechanical centre gripping can avoid causing the damage to the silicon chip surface, simultaneously, still can adjust the initial position of rubber clamping strip 111, the convenience carries out the centre gripping operation to the silicon chip of different sizes, this clamping device can make through adsorption mechanism's absorption and rubber clamping strip 111 double clamping effect, can make the silicon chip be guaranteed more consistently and the silicon chip is processed with the multiple angle is cut off, and the silicon chip can be carried out simultaneously, the processing is more stable, and is guaranteed, the silicon chip is more stable.
It should be noted that, although the present disclosure describes embodiments, not every embodiment includes only a single embodiment, and the description is for clarity only, and those skilled in the art should understand that the embodiments of the disclosure may be combined appropriately to form other embodiments that can be understood by those skilled in the art.
Claims (7)
1. The utility model provides a silicon chip clamping device, includes the arm, its characterized in that, the tip fixed of arm is provided with the fixed disk, the fixed mounting bar that is annular distribution is provided with to the lower fixed surface of fixed disk, and the fixed mounting panel that is provided with of tip of mounting bar, the mounting hole has been seted up to the position department that the mounting panel outer wall is close to the centre, and fixedly in the mounting hole be provided with the inflator, the movable mouth that the equidistance is annular distribution has still been seted up to the outer wall of mounting panel, and the activity is provided with the movable block in the movable mouth, the fixed rubber clamping strip that is provided with of lower surface of movable block, the fixed gasbag that is provided with the equidistance distribution of lateral wall of rubber clamping strip, adjacent be linked together through communicating pipe between the gasbag, the fixed ventilation pipe that is provided with is run through to the outer wall of movable block, and the one end of ventilation pipe with the gasbag is linked together, the mounting hole that the equidistance is annular distribution is seted up to the outer wall of inflator, and fixedly be provided with the fixed pipe in the mounting hole, the sleeve has been cup jointed in the outside of fixed pipe, the one end and the sleeve pipe that the gasbag is kept away from the gasbag are linked together, still includes:
The air supply and exhaust mechanism is arranged between the air cylinder and the fixed disc and is used for introducing air into the air cylinder and extracting the air in the air cylinder;
The adsorption mechanism is arranged below the air cylinder and is used for adsorbing the silicon wafer before the rubber clamping strip clamps the silicon wafer;
the moving mechanism is arranged in the mounting plate and used for adjusting the position of the moving block in the movable opening;
the sealing mechanism is arranged on the outer side of the sleeve and used for sealing a gap between the sleeve and the fixed pipe.
2. The silicon wafer clamping device according to claim 1, wherein the air supply and exhaust mechanism comprises an air pump fixedly arranged on the lower surface of the fixed disk, an air pipe is communicated with an air supply end of the air pump, the air pipe is communicated with the air cylinder, and an air pressure gauge is further communicated with the outer side of the air pipe.
3. The silicon wafer clamping device according to claim 2, wherein the adsorption mechanism comprises an adsorption cylinder arranged below the air cylinder, the lower surface of the mounting plate is connected with the side wall of the adsorption cylinder through a reinforcing rib, the lower surface of the air cylinder is communicated with an air pipe, a control valve is arranged on the air pipe, the end part of the air pipe is communicated with the adsorption cylinder, a sucker is arranged at the bottom end of the adsorption cylinder, a fixing rod is fixedly connected with the inner wall of the adsorption cylinder, a pressure sensor is arranged at the end part of the fixing rod, and the pressure sensor is arranged in the sucker.
4. A silicon wafer clamping device according to claim 3, wherein the end portion of the suction cup is fixedly provided with an adsorption plate, the outer wall of the adsorption plate is provided with a plurality of air holes, the outer wall of the adsorption plate is fixedly provided with an adsorption gasket, the outer wall of the adsorption gasket is provided with adsorption holes corresponding to the air holes, the outer wall of the adsorption cylinder is fixedly provided with side plates distributed in an annular shape at equal intervals, the outer wall of the side plates penetrates through a movable rod, one end of the movable rod is connected with the adsorption plate, the other end of the movable rod is fixedly provided with a baffle, the outer side of the movable rod is sleeved with a spring, one end of the spring is connected with the baffle, and the other end of the spring is connected with the side plates.
5. The silicon wafer clamping device according to claim 4, wherein the side walls of the rubber clamping strips are further provided with clamping grooves distributed at equal intervals, rubber sheets distributed symmetrically up and down are fixedly arranged in the clamping grooves, and the ends of the rubber sheets are semicircular.
6. The silicon wafer clamping device according to claim 1, wherein the moving mechanism comprises a limiting rod fixedly arranged in the movable opening, the limiting rod penetrates through the moving block, a fixing hole communicated with the movable opening is formed in the outer wall of the mounting plate, a first telescopic cylinder is fixedly arranged in the fixing hole, and the telescopic end of the first telescopic cylinder is connected with the outer wall of the moving block.
7. The silicon wafer clamping device according to claim 6, wherein the sealing mechanism comprises a second telescopic cylinder fixedly arranged at the end part of the sleeve, a movable plate is fixedly arranged at the telescopic end of the second telescopic cylinder, connecting rods distributed in an annular mode at equal distances are fixedly arranged on the outer wall of the movable plate, a retaining plate is fixedly arranged at the end part of the connecting rods and sleeved on the outer side of the fixed pipe, a sealing plug is fixedly arranged on the outer wall of one side, close to the sleeve, of the retaining plate, an annular groove is formed in one end, close to the retaining plate, of the sleeve, and the sealing plug is located in the annular groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101587851A (en) * | 2009-06-23 | 2009-11-25 | 北京七星华创电子股份有限公司 | A kind of device that is used for holding plate-like article |
| CN112919094A (en) * | 2021-01-19 | 2021-06-08 | 巩铁凡 | Clamping device based on rotatory automatic fixed chip of gear |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6467827B1 (en) * | 1999-10-30 | 2002-10-22 | Frank J. Ardezzone | IC wafer handling apparatus incorporating edge-gripping and pressure or vacuum driven end-effectors |
| JP4870425B2 (en) * | 2004-12-30 | 2012-02-08 | エーエスエムエル ネザーランズ ビー．ブイ． | PCB handler |
| KR101187684B1 (en) * | 2010-10-25 | 2012-10-04 | 서울과학기술대학교 산학협력단 | Non-contact air pads for chucking a substrate by using the radial flow |
| KR20120134368A (en) * | 2011-06-02 | 2012-12-12 | 엘아이지에이디피 주식회사 | Substrate chucking and de-chucking apparatus |
| CN110911340A (en) * | 2019-12-06 | 2020-03-24 | 覃冬梅 | Wafer taking and placing manipulator with compact and attached side edges |
| CN218215219U (en) * | 2022-08-20 | 2023-01-03 | 深圳市凤翔光电电子有限公司 | LED chip picking mechanism |
| CN115196339A (en) * | 2022-09-16 | 2022-10-18 | 江苏通光电子科技有限公司 | Grabbing device is used in chip processing |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101587851A (en) * | 2009-06-23 | 2009-11-25 | 北京七星华创电子股份有限公司 | A kind of device that is used for holding plate-like article |
| CN112919094A (en) * | 2021-01-19 | 2021-06-08 | 巩铁凡 | Clamping device based on rotatory automatic fixed chip of gear |
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