CN210516691U

CN210516691U - Bearing device

Info

Publication number: CN210516691U
Application number: CN201920800083.0U
Authority: CN
Inventors: 张朝前; 马砚忠; 李少雷; 陈鲁
Original assignee: Skyverse Ltd
Current assignee: Shenzhen Zhongke Feice Technology Co Ltd
Priority date: 2019-05-30
Filing date: 2019-05-30
Publication date: 2020-05-12
Anticipated expiration: 2029-05-30

Abstract

The utility model discloses a bear device belongs to semiconductor technology field. The bearing device comprises: a first chuck and a second chuck; the first chuck comprises a first bearing surface, and a plurality of vacuum grooves are formed in the first bearing surface; the second chuck includes the second loading face, the second loading face includes the adsorption zone, a plurality of pinholes have in the adsorption zone, the pinhole be used for with vacuum groove intercommunication. The utility model discloses wafer bearing device can adsorb wafer and ordinary wafer that fan-out type packaging technology's glued membrane frame bore.

Description

Bearing device

Technical Field

The utility model relates to the field of semiconductor technology, in particular to bear device.

Background

The thickness of the non-patterned wafer and the patterned wafer before thinning is larger, and the thicker wafer can be directly adsorbed by the sucking disc to fix the wafer in the detection or processing process.

However, with the continuous emergence of new packaging technologies, the thickness of chips required for three-dimensional packaging of some high-performance electronic product chips is thinner and thinner. When the circuit layer is manufactured, the back face of the silicon wafer needs to be thinned and polished, then the film is pasted, the ultrathin wafer is supported by the tension of the adhesive film pasted on the frame, the ultrathin wafer is kept flat, the problems of warping, drooping and the like are solved, and the transmission problem of the ultrathin wafer is solved. In addition, the dicing, scribing and grinding of the wafer all require a film frame to provide the necessary load bearing to complete the processing and inspection tasks.

In the prior art, a FANOUT (fan-out package) wafer is sucked by a sucker, but during the use process, the suction force generated by a vacuum groove of the sucker is found to cause the FANOUT (fan-out package) wafer to be damaged.

SUMMERY OF THE UTILITY MODEL

The utility model provides a bear device has solved or has partially solved and has adsorbed FANOUT (fan-out type encapsulation) wafer through the sucking disc among the prior art, and the adsorption affinity that the vacuum slot of sucking disc produced can lead to FANOUT (fan-out type encapsulation) wafer to damage's technical problem.

In order to solve the technical problem, the utility model provides a bear device includes: the bearing device comprises: a first chuck and a second chuck; the first chuck comprises a first bearing surface, and a plurality of vacuum grooves are formed in the first bearing surface; the second chuck includes the second loading face, the second loading face includes the adsorption zone, a plurality of pinholes have in the adsorption zone, the pinhole be used for with vacuum groove intercommunication.

Further, the first chuck further comprises a first back surface opposite the first bearing surface, and the second chuck further comprises a second back surface opposite the second bearing surface; the first chuck is detachably arranged on the second bearing surface, and the first back face faces the second bearing surface; or the second chuck is detachably arranged on the first bearing surface, and the second back face faces the first bearing surface.

Furthermore, a plurality of first threaded holes are formed in the first chuck, and a plurality of second threaded holes are formed in the second chuck; the first threaded holes correspond to the second threaded holes one by one, and the bolts penetrate through the first threaded holes to enter the second threaded holes corresponding to the first threaded holes.

Furthermore, a connecting cavity is defined between the first chuck and the second chuck, the vacuum groove is communicated with the connecting cavity, and the needle hole is communicated with the connecting cavity.

Further, a face of the first chuck facing the second chuck includes a first connection region surrounding the connection cavity; the end surface of the second chuck facing the first chuck comprises a second connection region surrounding the connection cavity; the first connection region has a boss and the second connection region has a spigot; alternatively, the first attachment area has a spigot and the second attachment area has a boss; the boss is embedded into the spigot, and the boss surrounds the side wall of the connecting cavity.

Further, the second chuck is arranged on the first bearing surface; the second bearing surface faces to the direction away from the first chuck; the pinhole runs through the second chuck, and with connect the chamber intercommunication.

Further, the first chuck is arranged on the second bearing surface; the first bearing surface faces to the direction away from the second chuck; one or more of vacuum holes are formed in the first chuck, and the vacuum holes are located in the first chuck and communicated with the connecting cavity.

Further, the first chuck is used for fixing a first object to be adsorbed, and the first object to be adsorbed comprises a wafer.

Further, the second carrying surface also comprises a supporting area surrounding the adsorption area; the adsorption region protrudes from the surface of the support region.

Further, the second chuck is used for fixing a second object to be adsorbed; the second substance to be adsorbed includes: the device comprises an adhesive film and a wafer stuck to the surface of the adhesive film; the bearing piece is used for bearing the edge of the adhesive film; the supporting area is used for bearing the bearing piece, and the adsorption area is used for adsorbing the wafer.

One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

because first chuck includes first loading face, has seted up many vacuum grooves in the first loading face, and the second chuck includes the second loading face, and the second loading face includes the adsorption zone, has a plurality of pinholes in the adsorption zone, and the pinhole is used for communicating with vacuum groove. Therefore, when a thicker wafer is to be loaded, the second chuck is detached from the first chuck, the thicker wafer is placed on the sealing ring of the first loading surface, external vacuum equipment adsorbs the thicker wafer through the vacuum groove or the pinhole and the vacuum groove, when a FANOUT (fan-out type package) wafer is to be loaded, the second chuck is installed on the first chuck, the FANOUT (fan-out type package) wafer is placed on the adsorption area of the first loading surface, the external vacuum equipment adsorbs the FANOUT (fan-out type package) wafer through the vacuum groove and the pinhole or directly through the pinhole, damage of the FANOUT (fan-out type package) wafer caused by adsorption force generated by the vacuum groove is avoided, and integrity of the FANOUT (fan-out type package) wafer is ensured.

Drawings

Fig. 1 is a schematic structural diagram of a wafer carrier according to an embodiment of the present invention;

FIG. 2 is a schematic view of a first chuck of the wafer carrier of FIG. 1;

FIG. 3 is a cross-sectional view of a first chuck of the wafer carrier of FIG. 1;

FIG. 4 is a schematic view of a vacuum line of the first chuck of the wafer carrier of FIG. 1;

FIG. 5 is an enlarged schematic view at A in FIG. 3;

FIG. 6 is an exploded view of a first chuck of the wafer carrier of FIG. 1;

FIG. 7 is a schematic view illustrating a natural state of a seal ring of the first chuck of the wafer carrier of FIG. 1;

fig. 8 is a schematic view illustrating a sealing ring of the first chuck of the wafer carrier of fig. 1 in a pressed state.

Detailed Description

Referring to fig. 1, an embodiment of the present invention provides a wafer fixing device including: a first chuck 10 and a second chuck 20.

The first chuck 10 includes a first carrying surface 11, and a plurality of vacuum grooves 15 are formed in the first carrying surface 11.

The second chuck 20 comprises a second carrying surface 21, the second carrying surface 21 comprises an absorption area 22, and a plurality of pin holes 23 are formed in the absorption area 22, and the pin holes 23 are used for being communicated with the vacuum grooves 15.

In the embodiment of the present invention, the first chuck 10 includes a first bearing surface 11, a plurality of vacuum grooves 15 are formed in the first bearing surface 11, the second chuck 20 includes a second bearing surface 21, the second bearing surface 21 includes an absorption area 22, a plurality of pinholes 23 are formed in the absorption area 22, and the pinholes 23 are used for communicating with the vacuum grooves 15. Therefore, when a thicker wafer is to be loaded, the second chuck 20 is detached from the first chuck 10, the thicker wafer is placed on the sealing ring 70 of the first loading surface 11, the external vacuum device adsorbs the thicker wafer through the vacuum grooves 15 or the pinholes 23 and the vacuum grooves 15, when a FANOUT (fan-out package) wafer is to be loaded, the second chuck 20 is mounted on the first chuck 10, the FANOUT (fan-out package) wafer is placed on the adsorption region 22 of the first loading surface 21, the external vacuum device adsorbs the FANOUT (fan-out package) wafer through the pinholes 23 or the vacuum grooves 15 and the pinholes 23, damage of the FANOUT (fan-out package) wafer caused by adsorption force generated by the vacuum grooves is avoided, and integrity of the FANOUT (fan-out package) wafer is ensured.

Specifically, the first chuck 10 further includes a first back surface opposite the first bearing surface 11, and the second chuck 20 further includes a second back surface opposite the second bearing surface 21.

The first chuck 10 is detachably disposed on the second carrying surface 21, and the first back surface faces the second carrying surface 21. Communicating the pinhole 23 with external vacuum equipment, when a thicker wafer is to be adsorbed, communicating the pinhole 23 with the vacuum groove 15 through a pipeline and the like, placing the thicker wafer on the vacuum groove 15, and starting the external vacuum equipment for adsorption; when a FANOUT (fan-out package) wafer is to be attached, the first chuck 10 is detached from the second carrying surface 21, and the FANOUT (fan-out package) wafer is directly placed on the second carrying surface 21 and attached through the pin holes.

Or the second chuck 20 is detachably disposed on the first carrying surface 11, and the second back surface faces the first carrying surface 11. Communicating the vacuum groove 15 with external vacuum equipment, when a thicker wafer is to be adsorbed, detaching the second chuck 20 from the first bearing surface 11, placing the thicker wafer on the vacuum groove 15, and starting the external vacuum equipment for adsorption; when a FANOUT (fan-out package) wafer is to be sucked, the pin holes 23 may be communicated with the vacuum grooves 15 through pipes or the like, and the FANOUT (fan-out package) wafer is placed on the second carrying surface 21 and sucked through the pin holes.

Specifically, the first chuck 10 has a plurality of first threaded holes 12, and the second chuck 20 has a plurality of second threaded holes 24.

The first threaded holes 12 correspond to the second threaded holes 24 one by one, and bolts penetrate through the first threaded holes 12 to enter the second threaded holes 24 corresponding to the first threaded holes 12, so that the second chuck 20 is convenient to mount or dismount.

The first chuck 10 and the second chuck 20 define a connecting cavity 40 therebetween, the vacuum grooves 15 are communicated with the connecting cavity 40, and the needle holes 23 are communicated with the connecting cavity 40.

The face of the first chuck 10 facing the second chuck 20 comprises a first connection zone surrounding the connection cavity 40; the end face of the second chuck 20 facing the first chuck 10 comprises a second connection region surrounding the connection cavity 40.

The first connection region has a boss 41 and the second connection region has a spigot 42; alternatively, the first attachment area has a spigot 42 and the second attachment area has a boss 41. The boss 41 is embedded into the spigot 42, and the boss 41 encloses the side wall of the connecting cavity 40, so that the sealing performance of the connecting cavity 40 is ensured. The boss 41 is annular, and the spigot 42 is annular, so that the first chuck 10 and the second chuck 20 are completely engaged, and air leakage is avoided.

Specifically, the second chuck 20 is disposed on the first carrying surface 11; the second bearing surface 21 faces away from the first chuck 10; the needle hole 23 penetrates the second chuck 20 and communicates with the connection chamber 30.

The first chuck 10 is arranged on the second bearing surface 21; the first bearing surface 11 faces away from the second chuck 20; one or more of the vacuum holes 17 are provided on the first chuck 10, and the vacuum holes 17 are located inside the first chuck 10 and communicate with the connection chamber 30.

Specifically, the first chuck 10 is used for fixing a first object to be adsorbed, which includes a wafer.

In particular, the second bearing surface 21 also comprises a support zone 25 surrounding the suction zone 22.

The adsorption region 22 protrudes from the surface of the support region 25 to ensure matching with the shape of the second object to be adsorbed.

The second chuck 20 is used for fixing the second object to be adsorbed.

The second substance to be adsorbed includes: the device comprises an adhesive film and a wafer stuck to the surface of the adhesive film; and the bearing piece is used for bearing the edge of the adhesive film.

The supporting region 25 is used for carrying the carrier, and the absorption region 22 is used for absorbing the wafer.

Specifically, one or more of the vacuum pipeline 30, the vacuum hole 17 and the sealing ring 70 are arranged on the first chuck 10, at least one vacuum hole 17 is arranged in a region surrounded by the sealing ring 70, the vacuum hole 17 is located in the first chuck 10 and communicated with at least one vacuum pipeline 30, and a plurality of vacuum grooves 15 communicated with the vacuum hole 17 are formed on the first bearing surface 11. The vacuum line 30 may be in communication with an external vacuum device.

Referring to fig. 1, in the present application, the first carrying surface 11 of the first chuck 10 is a curved surface that is concave downward, and since the wafer (not shown) with large warpage (not shown) itself also has a certain warpage, such as potato-shaped, saddle-shaped, and other irregular distributions, when the wafer is placed on the first carrying surface 11, the wafer is adapted to contact with the first carrying surface, and then the wafer is vacuumized through the vacuum hole 17 via the vacuum pipeline inside the first chuck 10, so that the wafer is better attached to the first chuck 10, and then the wafer is detected or processed.

This application technical scheme is through adopting to increase on the first loading face 11 with first chuck 10 and set up sealing washer 70 and the surperficial adaptation contact of big angularity wafer irregular distribution, perhaps directly places the product on the first loading face 11 that is equipped with the vacuum adsorption subassembly, has solved being difficult to by vacuum adsorption's problem of big angularity wafer, further improves the firm reliability of absorption to big angularity wafer.

In addition, the design of the vacuum structure provided in the first chuck 10 of the present application may have a plurality of embodiments, wherein the first embodiment may be that the chuck 10 is only provided with a vacuum pipeline and a vacuum hole, so as to directly contact the wafer with the first carrying surface 11, and perform vacuum suction on a vacuum sealed inner cavity enclosed by the wafer and the first carrying surface 11; the second embodiment may be that a sealing ring 70 is additionally disposed on the surface of the first carrying surface 11 on the basis of providing a vacuum pipeline and a vacuum hole, so that the wafer contacts the sealing ring 70 first, and then the vacuum-sealed inner cavity surrounded by the wafer, the first carrying surface 11 and the sealing ring 70 is vacuumized and adsorbed.

Referring to fig. 2 and 6, the sealing ring 70 is disposed in the annular groove 13 recessed in the surface of the first bearing surface 11 and protrudes from the bearing surface 11, and the sealing ring 70 includes a deformation portion 701 protruding from the first bearing surface 11 and a mounting portion 703 mounted on the bearing surface 11.

At least one annular groove 13 is formed in the first bearing surface 11 of the first chuck 10 to be matched with a sealing ring 70 which is embedded in the annular groove 13 and is higher than the first bearing surface 11, when a wafer with large warping degree is placed on the first bearing surface 11, the wafer is firstly contacted with the sealing ring 70, the sealing ring 70 directly supports the wafer, a vacuum closed cavity is defined by the curved surface of the wafer, the sealing ring 70 and the first bearing surface 11, downward acting force is applied to the sealing ring 70 and the wafer on the sealing ring 70 by air pressure, meanwhile, because the sealing ring 70 is a hollow silicone tube, the acting force easily sucks the sealing ring 70 to be lower than the first bearing surface 11, and meanwhile, the wafer with large warping degree is pulled straight until the whole wafer surface is firmly adsorbed on the first bearing surface 11; meanwhile, referring to fig. 2, on the basis of the annular groove 13 and the sealing ring 70, the first supporting surface 11 is further configured as a curved surface recessed from the outer periphery to the center, so that the edge of the wafer with large warpage contacts the outer periphery of the supporting surface 11, and the curved center of the wafer is closer to the recessed center of the supporting surface 11, which is more convenient for the wafer to be placed and positioned.

On the basis that the first bearing surface 11 is arranged to be a curved surface, the first bearing surface 11 is in adaptive contact with the wafer with the large warping degree, and the first bearing surface 11 is provided with at least one annular groove 13 which is matched with a sealing ring 70 embedded in the annular groove 13, so that the problem of vacuum adsorption of the wafer with the large warping degree is solved, and the firm and reliable adsorption of the wafer is further improved.

Referring to fig. 3, 4 and 5, at least one vacuum hole 17 is formed in the region surrounded by the sealing ring 70.

In one embodiment, on the basis of the sealing ring 70, at least one vacuum hole 17 is additionally formed on the first carrying surface 11, the vacuum hole 17 is located within a range surrounded by the sealing ring 70, and the vacuum pipeline 30 is opened to suck vacuum to a vacuum-sealed cavity surrounded by the wafer, the sealing ring 70 and the carrying surface 11.

In this embodiment, a vacuum hole 17 is additionally provided to facilitate the vacuum pumping of the vacuum-tight chamber.

Further, referring to fig. 2, 3 and 4, the vacuum hole 17 includes a first vacuum hole 171 and a second vacuum hole 173, the first vacuum hole 171 is located in a region surrounded by the first sealing ring 131, and the second vacuum hole 173 is located in a region between the first sealing ring 131 and the second sealing ring 133.

Because different wafers have different sizes in practical use, the wafer fixing device 100 may also be used to place smaller wafers than the carrying surface 11, for example, a 300mm radius of the carrying surface 11 may require a 200mm radius of the wafer. Therefore, in order to design the structure of the independent vacuum line, two vacuum holes 171 corresponding to the two sealing rings 70 are provided, the first vacuum hole 171 is located in the region surrounded by the first sealing ring 131, and the second vacuum hole 173 is located in the region between the first sealing ring 131 and the second sealing ring 133, so that when the wafer size is small, the vacuum is drawn only through the first vacuum hole 171, and when the wafer size is large, the vacuum is drawn through both the first vacuum hole 171 and the second vacuum hole 173.

This application corresponds two sealing washer 70 and sets up two vacuum hole 17, and a thing is multi-purpose, can the multiple size wafer of adaptation vacuum adsorption, and the operation of being convenient for has improved the efficiency of evacuation in addition to the setting of independent vacuum line and the mode of evacuation.

In addition, referring to fig. 2, 3 and 4, a mounting portion 703 of a sealing ring 70 is disposed in an annular groove 13 recessed on the surface of the bearing surface 11.

The annular groove 13 in an embodiment of the present application includes a first annular groove 131 and a second annular groove 133, the first annular groove 131 and the second annular groove 133 are concentrically disposed, the second annular groove 133 surrounds an outer side of the first annular groove 131, a seal ring 70 is embedded in an annular groove 13, and the vacuum hole 17 includes a first vacuum hole 171 disposed in an area surrounded by the first annular groove 131, and a second vacuum hole 173 disposed between the first annular groove 131 and the second annular groove 133. In the embodiment of the present invention, two rings of annular grooves 13 are simultaneously formed on the first bearing surface 11, and similarly, a plurality of rings of annular grooves 13 may be formed according to the use requirement, and a sealing ring 70 is disposed in each annular groove 13, so that the two annular grooves 13 and the two sealing rings 70 are matched together to be compatible with wafers of two sizes.

Specifically, according to the wafer fixing device 100, two or more annular grooves 13 are formed in the first bearing surface 11 of the first chuck 10, and the corresponding sealing rings 70 are placed in the annular grooves 13, so that the stability and reliability of the sealing rings 70 can be improved, the safety of wafers is ensured, meanwhile, the plurality of annular grooves 13 are formed, the wafer fixing device 100 is suitable for wafers of different sizes, the wafer fixing device is multifunctional, and the economic cost of repeated die sinking production is reduced.

Referring to fig. 3, 4 and 5, the bottom surface of the annular groove 13 is further concavely provided with a fixing groove 135, and the mounting portion 703 of the sealing ring 70 is clamped by the fixing groove 135.

In order to ensure that the sealing ring 70 is accommodated and fixed in the annular groove 13, a fixing groove 135 is further formed in the bottom surface of the annular groove 13 in a recessed manner, the caliber of the fixing groove 135 is smaller, the sealing ring 70 in this embodiment is a silica gel ring with a hollow structure, the silica gel ring is arranged in an elliptical structure with two thin ends and a thick middle part, the upper part of the sealing ring 70 protrudes out of the first bearing surface 11 of the first chuck 10, the bottom of the sealing ring 70 is thinner, the outer surface of the sealing ring 70 abuts against the inner wall of the fixing groove 135, and the bottom of the sealing ring 70 is tightly fitted and clamped in the.

In the embodiment of the present application, on the basis of the annular groove 13, the bottom surface of the annular groove 13 is further provided with the fixing groove 135, the upper portion of the sealing ring 70 protrudes out of the height of the first bearing surface 11, the lower portion of the sealing ring is accommodated in the annular groove 13, and the bottom of the sealing ring 70 is clamped in the fixing groove 135, so that the firmness and reliability of the sealing ring 70 are ensured, the taking and placing of the wafer are facilitated, and the artificial damage to the wafer in the wafer processing process is reduced.

Referring to fig. 7 and 8, a fixing bead 71 is received in the mounting portion 703, and the fixing bead 71 presses the mounting portion 703 to tightly clamp the gasket 70 to the fixing groove 135.

In the process of detecting or processing the wafer, the wafer is placed on a rotating moving platform through the first chuck 10 to be detected or processed point by point or piece by piece, so that in order to prevent the sealing ring 70 from separating from the fixed groove 135 or the whole sealing ring 70 from completely separating from the annular groove 13 in the moving process, and further ensure that the mounting part 703 does not separate from the fixed groove 135, a fixed pressing strip 71 is placed in the bottom of the sealing ring 70, the sealing ring 70 is a hollow silica gel ring and is fixed in the annular groove 13 in an ellipse-like shape, the deformation part 701 protrudes out of the first bearing surface 11, the mounting part 703 is adapted to be clamped in the fixed groove 135, and then the sealing ring 70 is extruded through the fixed pressing strip 71, so that the outer surface of the mounting part 703 abuts against the inner wall of the fixed groove 135, and the sealing ring 70 is further fixed in the.

The application further ensures the adaptation consistency of the sealing ring 70 and the fixing groove 135 and the annular groove 13 and the stability and reliability of the sealing ring 70, reduces the damage of the wafer in the process of taking and placing, and reduces the production cost.

Referring to fig. 2, the first bearing surface 11 is further formed with a plurality of vacuum grooves 15 communicated with the vacuum holes 17, and the heights of the plurality of vacuum grooves 15 gradually increase from the center of the chuck 10 to the outside so that the first bearing surface 11 is a concave curved surface.

The vacuum groove 15 is used for being matched with the surface of the wafer with large warping degree just in time as an adsorption structure, the edge height of the wafer with large warping degree is higher than the center of the wafer, the center of the wafer is sunk in the middle of the conical first bearing surface 11, the edge of the wafer is contacted with the outer side of the conical first bearing surface 11, the whole surface of the wafer is closely contacted with the first bearing surface 11, and the wafer is subjected to vacuum hole 17 to be clamped on the wafer, The vacuum closed cavity enclosed by the sealing ring 70 and the first bearing surface 11 is vacuumized, so that the wafer with the large warping degree can be completely attached to and adsorbed on the first bearing surface 11, and the adsorption problem of the wafer with the large warping degree is solved.

This application is through setting up many the structure of highly being by the vacuum recess that the 11 centre of a circle of first loading surface increases gradually to the outside for loading surface 11 of first chuck 10 is sunken conical surface, further increases the adsorption area of the first loading surface 11 of big angularity wafer and first chuck 10, improves the fastness of laying of big angularity wafer.

Referring to fig. 2 and 3, the vacuum grooves 15 include a first vacuum groove 151 and a second vacuum groove 153, the first vacuum groove 151 is disposed in a region surrounded by the first annular groove 131, the second vacuum groove 153 is disposed in a region between the first annular groove 131 and the second annular groove 133, the first vacuum hole 171 is communicated with the first annular groove 131, and the second vacuum hole 173 is communicated with the second annular groove 133.

Dividing the bearing surface 11 of the first chuck 10 into two partial areas, namely an area surrounded by the first annular groove 131 and two large adsorption areas between the first annular groove 131 and the second annular groove 133, wherein a plurality of first vacuum grooves 151 and second vacuum grooves 153 which are uniformly distributed are correspondingly formed in the two large adsorption areas respectively; when a smaller wafer needs to be placed on the bearing surface 11, the edge of the smaller wafer is placed along the sealing ring 70 in the first annular groove 131, the smaller wafer, the sealing ring 70 in the first annular groove 131 and the bearing surface 11 in the area of the first vacuum groove 151 form a first vacuum-sealed cavity, correspondingly, when a larger wafer needs to be placed on the first bearing surface 11, the edge of the larger wafer is placed along the sealing ring 70 in the second annular groove 133, and the larger wafer, the sealing ring 70 in the second annular groove 133 and the bearing surface 11 in the area of the second vacuum groove 153 form a second vacuum-sealed cavity.

The sub-area adsorption in the application is suitable for wafers of different sizes, one object is multifunctional, the manufacturing cost of repeated die sinking is saved, meanwhile, an operator can conveniently use the sub-area adsorption device without frequently replacing the first chuck 10 of the adaptive chuck, and the work efficiency of detecting and processing the wafers is improved.

Specifically, the groove body width of the second vacuum groove 153 is greater than the groove body width of the first vacuum groove 151. The widths of the vacuum grooves 15 in different adsorption areas of the first bearing surface 11 are different, when a smaller-sized wafer is adsorbed, the edge of the smaller wafer is placed along the first annular groove 131, the amount of vacuumized gas is smaller in the smaller wafer, the first annular groove 131 and the first vacuum groove 151 area of the first bearing surface 11, and the width of the first vacuum groove 151 is correspondingly smaller; correspondingly, when a wafer with a larger size is adsorbed, the edge of the larger wafer is placed along the second annular groove 133, the amount of gas to be vacuumized is larger in the areas of the larger wafer, the second annular groove 133 and the second vacuum groove 153 of the first bearing surface 11, the width of the second vacuum groove 153 is correspondingly larger, and different widths of the vacuum grooves 15 are set corresponding to different vacuum gas flow rates.

The application improves the consistency of the structure, improves the vacuumizing efficiency to a certain extent, and saves the vacuumizing preparation time.

Referring to fig. 3, 4 and 5, the vacuum holes 17 are located in the first chuck 10 and are in communication with at least one vacuum line 30.

The vacuum holes 17 of the present application are communicated with the vacuum pipeline 30, so that the vacuum-sealed inner cavity surrounded by the sealing ring 70, the wafer and the first bearing surface 11 can be evacuated.

Specifically, in one embodiment of the present invention, the vacuum lines 30 in the first chuck 10 include a first vacuum line and a second vacuum line, the first vacuum line is correspondingly communicated with the first vacuum holes 171, and the second vacuum line is correspondingly communicated with the second vacuum holes 173.

On the basis of additionally arranging a plurality of vacuum grooves 15, the first bearing surface 11 is divided into regions and independent control of vacuum conduits in different regions is realized, a first vacuum gas path is communicated with a first vacuum hole 171 arranged in a region enclosed by a first annular groove 131, a second vacuum gas path is communicated with a second vacuum hole 173 arranged between the first annular groove 131 and a second annular groove 133, when a smaller wafer is placed, the edge of the smaller wafer is placed along the first annular groove 131, only the first vacuum gas path is opened to vacuumize the first vacuum closed cavity, when a larger wafer is placed, the edge of the larger wafer is placed along the second annular groove 133, the first vacuum gas path and the second vacuum gas path are simultaneously opened to vacuumize the second vacuum closed cavity, and similarly, when three annular grooves 13 and more are arranged, the vacuum grooves 15 and the vacuum holes 17 in two regions are correspondingly arranged, the design of the vacuum line 30 that is compatible with independent control of three or more wafers, and so on.

Referring to fig. 3, in the vacuum pipeline 30 structure of the present application, the first vacuum pipeline 30 is at least one first air path conduit 331 penetrating through the first chuck 10, one end of the first air path conduit 331 is directly connected to the first vacuum hole 171, and the other end is connected to the first pumping hole 311 on one outer side of the wafer fixing device 100; the second vacuum pipeline 30 is a second air channel conduit 333, the second air channel conduit 333 is formed by three longitudinal communicating grooves 335 in the chuck 10, the three longitudinal communicating grooves 335 are folded and communicated with each other, one end of the second air channel conduit 333 is communicated with the second vacuum hole 173, and the other end extends to the outer side of the wafer fixing device 100 to be communicated with the second pumping hole 313, so as to pump vacuum to the vacuum closed chamber through the vacuum pipeline 30.

In this application at the inside independent vacuum line 30 structure that sets up of first chuck 10, can be applicable to the subregion of multiple size wafer and adsorb, increase vacuum adsorption's commonality, it is fixed to the independent absorption of equidimension wafer not, practiced thrift the cost to a certain extent.

Referring to fig. 2 and 6, the wafer supporting apparatus further includes at least one supporting rod 51 and a lifting driving assembly, the first chuck 10 further has at least one positioning hole 55 penetrating through the supporting surface 11, the supporting rod 51 can slidably penetrate through the positioning hole 55, and the lifting driving assembly drives the supporting rod 51 to protrude from the supporting surface 11 to abut against the surface of the sample.

Meanwhile, in order to facilitate the wafer carrying device to conveniently take and place the wafer, and the wafer carrying device has the characteristics of no additional pollution, at least one positioning hole 55 and a supporting rod 51 are formed on the first chuck 10, the lifting driving assembly drives the supporting rod 51 to vertically slide in the positioning hole 55, the lifting rod assembly is lifted and lowered, when a wafer needs to be placed, the supporting rod 51 is in a lifted state, a plane formed at the top end of the supporting rod 51 is about 20 mm higher than the surface of the first chuck 10, the manipulator drives the wafer to move to the position right above the first chuck 10 from the side and descend, when the height of the wafer on the manipulator and the surface of the first chuck 10 is less than 20 mm, the manipulator continues to descend, the wafer is supported by the top end of the supporting rod 51, the manipulator continues to descend to a certain height and moves out of the area above the first chuck 10, at this time, the supporting rod 51 will carry the wafer together to descend, and when the height of the top end, and realizing wafer placement. Wafer removal is similar to the reverse process: the support rod 51 is lifted to drive the wafer to rise, the manipulator moves from the side to the lower part of the wafer and rises to drive the wafer to be separated from the support rod 51 and then move out of the chuck 10 area laterally.

This application is passed through the elevation structure cooperation wafer of bracing piece 51 about the straight line dot realize getting put, the operator of being convenient for is held the wafer through the manipulator card in the use, comparatively easy accurate counterpoint, has improved work efficiency, avoids the wafer counterpoint to be inaccurate to break away from chuck 10 easily and leads to polluting or damaging.

Referring to fig. 2, the number of the supporting rods 51 is three, the number of the positioning holes 55 is matched with the number of the supporting rods 51, and the three supporting rods 51 are disposed inside the first annular groove 131. Considering that the wafer is circular, three support rods 51 are uniformly arranged in a first vacuum adsorption area of a first annular groove 131 of the first bearing surface 11, included angles between the support rods 51 are 120 degrees, and the lifting driving assembly 50 drives the three support rods 51 to lift or descend together with the wafer; in addition, three compression springs 53 for assisting the support rod 51 to descend are further provided, one compression spring 53 is correspondingly sleeved on one support rod 51, the three compression springs 53 continuously provide a downward elastic force, when the lifting driving assembly 50 drives the support rod 51 to ascend, the compression springs 53 are stretched, when the external force of the lifting driving assembly 50 is removed, the elastic deformation of the compression springs 53 is recovered due to the inherent property of the compression springs 53, and the compression springs 53 spontaneously recover and shorten to a state that the three support rods 51 descend below the bearing surface 11. Similarly, in order to more stably pick and place the wafer, a plurality of support rods 51 may be uniformly disposed in the second vacuum absorption region between the first annular groove 131 and the second annular groove 133 to further match the wafer.

This application cooperates getting of wafer through the vertical oscilaltion of three lifter jointly to put, further improves the security that the wafer was got and is put, and the operator's of being convenient for counterpoint improves the work efficiency who detects and process.

In order to more clearly describe the embodiment of the present invention, the following description is provided on the using method of the embodiment of the present invention.

When a thicker wafer is to be loaded, the bolts are loosened, the bolts are removed from the first and second bolt holes 12, 24, and the second chuck 20 is removed from the first chuck 10. The wafer is placed on the first carrying surface 11, so that the wafer can directly contact with the plane of the first carrying surface 11. Two annular grooves 13 may be formed in the first bearing surface 11, the two annular grooves 13 include a first annular groove 131 and a second annular groove 133 which are concentrically arranged, the second annular groove 133 surrounds the outer side of the first annular groove 131, a sealing ring 70 is embedded in one annular groove 13, the sealing ring 70 protrudes out of the first bearing surface 11, the first vacuum hole 171 is formed in the region surrounded by the first annular groove 131, and similarly, the second vacuum hole 173 is formed between the second annular groove 133 and the first annular groove 131. When the size of the wafer is small, the edge of the wafer is firstly contacted with the sealing ring 70 along the first annular groove 131 and placed on the bearing surface 11, when the size of the wafer is large, the edge of the wafer is firstly contacted with the sealing ring 70 along the second annular groove 133 and placed on the first bearing surface 11, the wafer, the sealing ring 70 and the first bearing surface 11 form a vacuumizing closed inner cavity, and then the wafer fixing device is vacuumized through the vacuum hole 17 and the vacuum pipeline 30. The wafer is vacuum sucked to the chuck 10 through the vacuum line 30 and the vacuum holes 17.

Because wafers with different sizes are required to be adsorbed on the first bearing surface 11, the first annular groove 131 and the second annular groove 133 arranged on the first bearing surface 11 can also be provided with more than two annular grooves 13, and the vacuum pipeline 30 is subjected to independent gas path structure design for the convenience of independent partition control, when the size of the wafer is smaller, the edge of the wafer is firstly contacted with the sealing ring 70 along the first annular groove 131 and is placed on the bearing surface 11, and at the moment, the wafer is only required to be vacuumized through the first vacuum hole 171, the first gas path conduit 331 and the first pumping hole 311; when the wafer size is larger, the edge of the wafer is placed on the carrying surface 11 along the second annular groove 133 in contact with the sealing ring 70, and at this time, the second vacuum hole 173, the second air path conduit 333 and the second pumping hole 313 are not only vacuumized, but also vacuumized through the first vacuum hole 171, the first air path conduit 331 and the first pumping hole 311.

The utility model provides an in order to facilitate getting the accuracy of counterpointing when putting ordinary wafer, still include three locating hole 55 and three bracing piece 51 that run through in first loading end 11, a bracing piece 51 slides and wears to locate a locating hole, adjust bracing piece 51 and be higher than or be less than loading end 11 through controlling lift drive assembly 50, when needing to place the wafer at first loading end, control lift drive assembly 50 and adjust bracing piece 51 and rise to about 20 millimeters higher than loading end 11, put down the wafer to the position of three bracing piece 51 slowly until bracing piece 51 accepts the wafer, control lift drive assembly 50 simultaneously adjusts three bracing pieces 51 and carries the wafer together and descends, when three bracing piece 51 top height is less than loading end 11, realize placing of wafer. Wafer removal is similar to the reverse process: the three support rods 51 are raised to drive the wafer to rise, and the wafer is taken back to be separated from the support rods 51 and then is moved out of the chuck area.

Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to the examples, those skilled in the art should understand that the technical solutions of the present invention can be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should be covered by the scope of the claims of the present invention.

Claims

1. A load bearing device, comprising: a first chuck and a second chuck;

the first chuck comprises a first bearing surface, and a plurality of vacuum grooves are formed in the first bearing surface;

the second chuck includes the second loading face, the second loading face includes the adsorption zone, a plurality of pinholes have in the adsorption zone, the pinhole be used for with vacuum groove intercommunication.

2. The carrier of claim 1, wherein:

the first chuck further comprises a first back surface opposite the first bearing surface, and the second chuck further comprises a second back surface opposite the second bearing surface;

the first chuck is detachably arranged on the second bearing surface, and the first back face faces the second bearing surface;

or the second chuck is detachably arranged on the first bearing surface, and the second back face faces the first bearing surface.

3. The carrier of claim 2, wherein:

the first chuck is provided with a plurality of first threaded holes, and the second chuck is provided with a plurality of second threaded holes;

the first threaded holes correspond to the second threaded holes one by one, and the bolts penetrate through the first threaded holes to enter the second threaded holes corresponding to the first threaded holes.

4. The carrier of claim 2, wherein:

a connecting cavity is defined between the first chuck and the second chuck, the vacuum groove is communicated with the connecting cavity, and the needle hole is communicated with the connecting cavity.

5. The carrier of claim 4, wherein:

the face of the first chuck facing the second chuck comprises a first connection region surrounding the connection cavity; the end surface of the second chuck facing the first chuck comprises a second connection region surrounding the connection cavity;

the first connection region has a boss and the second connection region has a spigot; alternatively, the first attachment area has a spigot and the second attachment area has a boss;

the boss is embedded into the spigot, and the boss surrounds the side wall of the connecting cavity.

6. The carrier of claim 4, wherein: the second chuck is arranged on the first bearing surface; the second bearing surface faces to the direction away from the first chuck;

the pinhole runs through the second chuck, and with connect the chamber intercommunication.

7. The carrier of claim 4, wherein: the first chuck is arranged on the second bearing surface; the first bearing surface faces to the direction away from the second chuck;

one or more of vacuum holes are formed in the first chuck, and the vacuum holes are located in the first chuck and communicated with the connecting cavity.

8. The carrier of claim 1, wherein: the first chuck is used for fixing a first object to be adsorbed, and the first object to be adsorbed comprises a wafer.

9. The carrier of claim 1, wherein: the second carrying surface further comprises a support zone surrounding the adsorption zone;

the adsorption region protrudes from the surface of the support region.

10. The carrier of claim 9, wherein: the second chuck is used for fixing a second object to be adsorbed;

the second substance to be adsorbed includes: the device comprises an adhesive film and a wafer stuck to the surface of the adhesive film; the bearing piece is used for bearing the edge of the adhesive film;

the supporting area is used for bearing the bearing piece, and the adsorption area is used for adsorbing the wafer.