CN118201399A

CN118201399A - Display substrate, preparation method thereof and display device

Info

Publication number: CN118201399A
Application number: CN202410302774.3A
Authority: CN
Inventors: 马登; 姜真求
Original assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd
Current assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd
Priority date: 2024-03-15
Filing date: 2024-03-15
Publication date: 2024-06-14

Abstract

The application provides a display substrate, a preparation method thereof and a display device, wherein the display substrate comprises the following components: the substrate comprises a display area and a frame area surrounding the display area; the at least two retaining walls are arranged at one side of the substrate at intervals, are both positioned in the frame area, and are provided with openings between two adjacent retaining walls; the packaging layer covers the at least two retaining walls and the substrate; the organic layer is arranged in the packaging layer, so that the organic layer can alleviate the film stress of the packaging layer and avoid cracks of the packaging layer; meanwhile, the organic layer is positioned in the opening, so that the retaining wall can separate the organic layer from the edge of the substrate, external moisture and oxygen are prevented from entering the organic layer, and the reliability of the display substrate is further improved.

Description

Display substrate, preparation method thereof and display device

Technical Field

The application relates to the technical field of display, in particular to a display substrate, a preparation method thereof and a display device.

Background

An Organic LIGHT EMITTING Diode (OLED) is an active light emitting display device, and has advantages of self-luminescence, wide viewing angle, high contrast, low power consumption, extremely high reaction speed, light weight, flexibility, low cost, and the like. With the continuous development of Display technology, a Flexible Display device (Flexible Display) using an OLED as a light emitting device and a thin film transistor (Thin Film Transistor, TFT) for signal control has become a mainstream product in the current Display field.

Disclosure of Invention

In view of the above, the present application provides a display substrate, a method for manufacturing the same, and a display device.

In view of the above object, a first aspect of the present application provides a display substrate, comprising:

the substrate comprises a display area and a frame area surrounding the display area;

the at least two retaining walls are arranged at one side of the substrate at intervals, are both positioned in the frame area, and are provided with openings between two adjacent retaining walls;

The packaging layer covers the at least two retaining walls and the substrate;

And the organic layer is arranged in the packaging layer and is positioned in the opening.

Optionally, the encapsulation layer includes a first inorganic layer and a second inorganic layer, the first inorganic layer covers the at least two retaining walls and the substrate, the organic layer is disposed on a side of the first inorganic layer facing away from the substrate, and the second inorganic layer covers the organic layer and the first inorganic layer.

Optionally, the number of the retaining walls is greater than or equal to three, the openings are formed between every two adjacent retaining walls, the organic layer comprises a plurality of organic sub-patterns arranged at intervals, and each opening is internally provided with one organic sub-pattern.

Optionally, a ratio of the thickness of the organic sub-pattern to the depth of the corresponding opening is 1-4:5.

Optionally, the plurality of organic sub-patterns includes at least a first organic sub-pattern and a second organic sub-pattern, and the first organic sub-pattern and the second organic sub-pattern are different in thickness.

Optionally, the first organic sub-pattern is disposed near the display area, and a thickness of the first organic sub-pattern is smaller than a thickness of the second organic sub-pattern.

Optionally, the at least two retaining walls include at least a first retaining wall and a second retaining wall, and the thicknesses of the first retaining wall and the second retaining wall are different.

Optionally, the first retaining wall is disposed near the display area, and the thickness of the first retaining wall is smaller than that of the second retaining wall.

Optionally, the at least two retaining walls further include at least one third retaining wall, the at least one third retaining wall is located between the first retaining wall and the second retaining wall, and the thickness of the at least one third retaining wall is smaller than or equal to the thickness of the second retaining wall and is greater than the thickness of the first retaining wall.

Optionally, the width of the opening is 20-40 μm.

Based on the same inventive concept, a second aspect of the present application provides a method for preparing a display substrate, including:

Providing a substrate, wherein the substrate comprises a display area and a frame area surrounding the display area;

at least two retaining walls are arranged at one side of the substrate at intervals, the at least two retaining walls are positioned in the frame area, and an opening is arranged between every two adjacent retaining walls;

And a packaging layer is arranged on one side of the retaining wall, which is away from the substrate, so that the packaging layer covers the at least two retaining walls and the substrate, an organic layer is arranged in the packaging layer, and the organic layer is positioned in the opening.

Based on the same inventive concept, a third aspect of the present application provides a display device, including the display substrate according to any one of the first aspect or the display substrate prepared by the preparation method according to the second aspect.

As can be seen from the above, the organic layer is disposed in the packaging layer, so that the stress of the packaging layer can be relaxed, and the stress of the packaging layer can not be concentrated under the conditions of bending, stretching or extrusion, so that the packaging layer is prevented from cracking; meanwhile, the organic layer is positioned in the opening, so that the retaining wall can separate the organic layer from the edge of the substrate, external moisture and oxygen are prevented from entering the organic layer, the organic layer is prevented from entering the display area, the reliability of the display substrate can be further improved on the basis of improving edge cracks, and the service life of the display substrate is prolonged.

Drawings

In order to more clearly illustrate the technical solutions of the present application or related art, the drawings that are required to be used in the description of the embodiments or related art will be briefly described below, and it is apparent that the drawings in the following description are only embodiments of the present application, and other drawings may be obtained according to the drawings without inventive effort to those of ordinary skill in the art.

FIG. 1 is an exemplary schematic diagram of a conventional OLED display substrate;

FIG. 2 is a schematic cross-sectional view of a display substrate according to an embodiment of the application;

FIG. 3 is a schematic cross-sectional view of a display substrate according to an embodiment of the application;

FIG. 4 is a schematic cross-sectional view of a display substrate according to an embodiment of the application;

FIG. 5 is a schematic cross-sectional view of a display substrate according to an embodiment of the application;

FIG. 6 is a schematic cross-sectional view of a display substrate according to an embodiment of the application;

FIG. 7 is a schematic diagram illustrating a sixth cross-section of a display substrate according to an embodiment of the application;

FIG. 8 is a seventh cross-sectional view of a display substrate according to an embodiment of the application;

FIG. 9 is a schematic diagram illustrating an eighth cross-section of a display substrate according to an embodiment of the application;

FIG. 10 is a schematic diagram illustrating a ninth cross-section of a display substrate according to an embodiment of the present application;

FIG. 11 is a schematic illustration of a first cross-section of a process for preparing an embodiment of the present application;

FIG. 12 is a schematic illustration of a second cross-section of a process for preparing an embodiment of the present application;

FIG. 13 is a schematic cross-sectional view of a third embodiment of the present application during the preparation process;

FIG. 14 is a schematic cross-sectional view of a fourth embodiment of the present application during the manufacturing process;

FIG. 15 is a schematic view of a fifth cross-section during the preparation of an embodiment of the present application;

Fig. 16 is a top view of a display substrate according to an embodiment of the application.

In the figure, 01, the packaging structure layer; 011. a first inorganic encapsulation layer; 012. an organic encapsulation layer; 013. a second inorganic encapsulation layer; 02. an effective packaging area; 100. a display area; 200. a border region; 1. a substrate; 2. a retaining wall; 21. an opening; 22. a third retaining wall; 23. a first retaining wall; 24. a second retaining wall; 3. an encapsulation layer; 31. a first inorganic layer; 32. a second inorganic layer; 4. an organic layer; 41. an organic sub-pattern; 411. a first organic sub-pattern; 412. a second organic sub-pattern; 5. a buffer layer; 6. an active layer; 7. a gate insulating layer; 8. a gate electrode; 9. an interlayer insulating layer; 10. a source electrode; 11. a drain electrode; 12. a flat layer; 13. a first electrode layer; 14. a pixel definition layer; 15. a light emitting layer; 16. a second electrode layer; 17. an organic functional layer.

Detailed Description

The present application will be further described in detail below with reference to specific embodiments and with reference to the accompanying drawings, in order to make the objects, technical solutions and advantages of the present application more apparent.

It should be noted that unless otherwise defined, technical or scientific terms used in the embodiments of the present application should be given the ordinary meaning as understood by one of ordinary skill in the art to which the present application belongs. The terms "first," "second," and the like, as used in embodiments of the present application, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to indicate relative positional relationships, which may also be changed when the absolute position of the object to be described is changed.

Organic materials and electrodes that emit light in OLEDs are very sensitive to oxygen and moisture, which can cause them to lose their light-emitting properties. To prevent this, it is desirable to preserve or extend the useful life of the OLED panel by "encapsulation".

Fig. 1 shows an exemplary schematic diagram of a conventional OLED display substrate. As shown in fig. 1, the display substrate includes a display area 100 and a bezel area 200. The display substrate generally includes a substrate and a light emitting functional layer thereon. In order to prevent external oxygen and moisture from entering the light-emitting functional layer, the light-emitting functional layer is generally covered by a packaging structure layer 01.

The encapsulation structure layer 01 generally includes a first inorganic encapsulation layer 011, an organic encapsulation layer 012, and a second inorganic encapsulation layer 013 stacked in this order. The first inorganic encapsulation layer 011 is disposed on a side of the light-emitting functional layer facing away from the substrate 1, and covers the entire substrate. The organic encapsulation layer 012 covers only the light emitting function layer. The second inorganic encapsulation layer 013 covers the organic encapsulation layer 012 and the first inorganic encapsulation layer 011. Further, in order to block the flow of the organic encapsulation layer 012 to the frame region 200 at the time of fabrication, isolation posts are provided in the frame region 200, and the provision of the isolation posts can block the flow of the organic encapsulation layer 012 so that the organic encapsulation layer 012 is provided only in the display region 100.

Although the existing packaging structure layer 01 can prevent the penetration of external oxygen and moisture to a certain extent, the service life of the display device is further prolonged. However, since the organic encapsulation layer 012 is disposed only in the display region 100 and the first inorganic encapsulation layer 011 and the second inorganic encapsulation layer 013 are disposed in the display region 100 and the bezel region 200 of the entire display substrate, this results in that the encapsulation structure layer 01 has only the first inorganic encapsulation layer 011 and the second inorganic encapsulation layer 013 stacked in a region from the barrier ribs to the edge of the display substrate (generally referred to as "effective encapsulation region 02", which is a distance of about 100 um).

The inventor finds that in the long-time reliability test, since only the first inorganic encapsulation layer 011 and the second inorganic encapsulation layer 013 are overlapped in the encapsulation structure layer 01 of the edge, cracks are easy to appear on the edge under the conditions of bending, stretching or extrusion, and finally external moisture and oxygen are immersed in the cracks, so that the service life of the display device is reduced.

This is because the first inorganic sealing material and the second inorganic sealing material are both made of an inorganic material, and the inorganic material can well prevent invasion of moisture and oxygen, but the inorganic material itself has a large stress and poor toughness, and cracks occur due to stress concentration because the stress cannot be released in a long-time reliability test.

Based on this, referring to fig. 2, the present application provides a display substrate. The display substrate includes: a substrate 1 including a display region 100 and a frame region 200 surrounding the display region 100; at least two retaining walls 2, which are arranged at intervals on one side of the substrate 1, wherein the at least two retaining walls 2 are both positioned in the frame area 200, and an opening 21 is arranged between two adjacent retaining walls 2; the packaging layer 3 covers the at least two retaining walls 2 and the substrate 1; an organic layer 4 disposed in the encapsulation layer 3, the organic layer 4 being located in the opening 21.

Specifically, the main structure of the display substrate includes a display area 100 and a bezel area 200 surrounding the display area 100 on a plane parallel to the display substrate.

The display area 100 may include a plurality of subpixels arranged in an array. The sub-pixels are minimum units for configuring the screen, and each of the plurality of sub-pixels may include a light emitting element and a driving circuit. Each of the plurality of sub-pixels may emit light of a different wavelength. For example, the plurality of subpixels may include a red subpixel, a green subpixel, and a blue subpixel. However, the plurality of sub-pixels is not limited thereto, and may include a white sub-pixel. The drive circuit of the sub-pixel is a circuit for controlling the drive of the light emitting element. For example, the driving circuit may be configured to include a thin film transistor and a capacitor, but is not limited thereto. The driving circuit may include a thin film transistor and a capacitor. The thin film transistor is disposed on the substrate base. The thin film transistor may be a driving element of the display substrate.

The bezel area 200 (which may also be referred to as the non-display area 100 area) is the following area: no image is displayed in this region, and various means for driving a plurality of sub-pixels provided in the display area 100 may be provided. For example, a driver IC, a flexible film, or the like, which provides signals for driving a plurality of sub-pixels, may be disposed in the bezel area 200. The bezel area 200 may be an area surrounding the display area 100, but is not limited thereto. For example, the bezel area 200 may be an area extending from the display area 100.

With continued reference to fig. 2, in a direction perpendicular to the display substrate, the display substrate includes a base 1, and the base 1 can support and protect various components of the display substrate. The substrate 1 may be formed of glass, quartz, ceramic, or a plastic material having flexibility. For example, when the substrate 1 is formed of a plastic material, it may be formed of Polyimide (PI). The base 1 may be flexible, stretchable, foldable, bendable and/or crimpable, so the display substrate may also be flexible, stretchable, foldable, bendable and/or crimpable.

At least two retaining walls 2 are disposed at intervals on one side of the substrate 1, and the at least two retaining walls 2 are located in the frame area 200, as shown in fig. 3, and an opening 21 is disposed between two adjacent retaining walls 2. . Specifically, the number of the retaining walls 2 may be two (as shown in fig. 2) or more (as shown in fig. 4 and 5).

The display substrate further comprises an encapsulation layer 3, and the encapsulation layer 3 covers the at least two retaining walls 2 and the substrate 1. The encapsulation layer 3 is used for blocking external moisture and oxygen, and preventing the external moisture and oxygen from entering the display area 100, so as to reduce the service life of the display substrate.

Specifically, the encapsulation layer 3 may include at least one film layer made of an inorganic material, where the inorganic material may block moisture and oxygen that invade from the outside, so as to avoid invasion of water and oxygen from the outside. Illustratively, the encapsulation layer 3 comprises a first inorganic layer 31 and a second inorganic layer 32 stacked, the first inorganic layer 31 covering the at least two retaining walls 2 and the substrate 1, the second inorganic layer 32 covering the first inorganic layer 31.

The organic layer 4 is disposed in the encapsulation layer 3. Specifically, the organic layer 4 is disposed on a side of the first inorganic layer 31 facing away from the substrate 1, and the second inorganic layer 32 covers the organic layer 4, the retaining wall 2 and the first inorganic layer 31.

The organic layer 4 is located in the packaging layer 3, so that the packaging layer 3 can cover the organic layer 4 on one hand and prevent external moisture and oxygen from entering the organic layer 4; on the other hand, the organic layer 4 can alleviate the film stress of the encapsulation layer 3, so that the stress of the encapsulation layer 3 can not be concentrated under the conditions of bending, stretching or extrusion, and further, the occurrence of cracks of the encapsulation layer 3 is avoided.

The organic layer 4 is located in the opening 21, specifically, as shown in fig. 2, 4 and 5, the organic layer 4 may be located in the opening 21, and the organic layer 4 is located in the opening 21, so that the retaining wall 2 may separate the organic layer 4 from the edge of the substrate 1, and separate the organic layer 4 from the display area 100, so as to prevent external moisture and oxygen from entering the organic layer 4, and prevent external moisture from continuing to enter the display area 100 from the organic layer 4, further improve reliability of the display substrate on the basis of improving edge cracks, and prolong service life of the display substrate.

As shown in fig. 6, the organic layer 4 may also be partially located in the opening 21, and partially located on the side of the retaining wall 2 facing away from the substrate 1. However, it should be noted that in this case, the organic layer 4 cannot cover at least a portion of the effective encapsulation area 02 near the edge of the substrate 1, so as to ensure that the encapsulation layer 3 can cover the organic layer 4, and that external water and oxygen cannot enter from the organic layer 4, thereby further improving the reliability of the display substrate on the basis of improving edge cracks. The effective packaging area 02 refers to an area between the barrier wall 2 and the edge of the substrate 1, which is far from the display area 100.

In the application, at least two retaining walls 2 are arranged on the frame area 200, and an organic layer 4 is arranged in an opening 21 formed between adjacent retaining walls 2, wherein the organic layer 4 is positioned in the packaging layer 3, and the arrangement of the organic layer 4 can buffer the stress concentration of the packaging layer 3, avoid edge cracks, block the invasion of water and oxygen, and improve the reliability of the display substrate. Meanwhile, at least two retaining walls 2 are disposed in the frame region 200, and the organic layer 4 may be disposed on the basis of not enlarging the frame region 200.

In some embodiments, with continued reference to fig. 4, the number of the retaining walls 2 is greater than or equal to three, the openings 21 are disposed between every two adjacent retaining walls 2, the organic layer 4 includes a plurality of organic sub-patterns 41 disposed at intervals, and one organic sub-pattern 41 is disposed in each opening 21.

Specifically, the organic layer 4 includes a plurality of organic sub-patterns 41 disposed at intervals, and each of the organic sub-patterns 41 is located in the corresponding opening 21. Therefore, the organic layer 4 is divided into the plurality of organic sub-patterns 41 by the plurality of retaining walls 2, so that the organic layer 4 is formed into discontinuous and broken film layers, the broken film layers can better isolate invasion of moisture and oxygen, and the reliability of the display substrate is further improved.

In some embodiments, the ratio of the thickness of the organic sub-pattern 41 to the depth of the corresponding opening 21 is 1-4:5.

Specifically, when the ratio of the thickness of the organic sub-pattern 41 to the depth of the corresponding opening 21 is 1-4:5, it is ensured that the organic sub-pattern 41 can provide a sufficient stress buffering effect, and the fabrication of the organic sub-pattern 41 is facilitated.

When the ratio of the thickness of the organic sub-pattern 41 to the depth of the corresponding opening 21 is less than 1:5, the thickness of the organic sub-pattern 41 is too thin to provide a sufficient stress buffering effect, and the thickness is too thin to facilitate the actual preparation of the organic sub-pattern 41, and filling defects are easy to occur during the preparation, and also to facilitate the blocking of water and oxygen.

When the ratio of the thickness of the organic sub-pattern 41 to the depth of the corresponding opening 21 is greater than 4:5, since the material actually preparing the organic sub-pattern 41 is an organic material having fluidity, if the filling thickness of the organic sub-pattern 41 is too thick, the adjacent organic sub-patterns 41 may be connected to each other due to the leveling property of the organic material, and finally the adjacent organic sub-patterns 41 cannot be disconnected, so that the blocking effect of the organic layer 4 on water and oxygen is affected.

Illustratively, the ratio of the thickness of the organic sub-pattern 41 to the depth of the corresponding opening 21 may be 1:5, 1.5:5, 2:5, 2.5:5, 3:5, 3.5:5, 4:5, etc.

Alternatively, the thickness of the retaining wall 2 is 3-5 um, and the thickness of the organic sub-pattern 41 is 1.5-3 um. Illustratively, the thickness of the retaining wall 2 may be 3um, 3.5um, 4um, 4.5um, 5um, etc., and the thickness of the organic sub-pattern 41 may be 1.5um, 2um, 2.5um, 3um, etc.

In some embodiments, referring to fig. 5, the plurality of organic sub-patterns 41 includes at least a first organic sub-pattern 411 and a second organic sub-pattern 412, and the first organic sub-pattern 411 and the second organic sub-pattern 412 have different thicknesses.

Specifically, the first organic sub-patterns 411 and the second organic sub-patterns 412 with different thicknesses and arranged at intervals can better block the invasion of external water and oxygen, improve the reliability of products, and better play the role of relieving the stress of the packaging layer 3, so that the occurrence of cracks at the edge of the packaging layer 3 due to stress concentration is avoided.

Further, the first organic sub-pattern 411 is disposed near the display area 100, and the thickness of the first organic sub-pattern 411 is smaller than the thickness of the second organic sub-pattern 412.

In particular, in the display substrate, since the closer to the edge of the base 1, the encapsulation layer 3 is more likely to develop cracks due to stress concentration in the case of bending, pressing, or stretching, the closer to the edge of the base 1, stress buffering is required to avoid the occurrence of cracks. Based on this, in the present application, the thickness of the second organic sub-pattern 412 disposed near the edge of the substrate 1 is relatively thicker, and the thicker second organic sub-pattern 412 can perform a better stress buffering function, so as to avoid cracking of the encapsulation layer 3 near the edge of the substrate 1.

In some embodiments, as shown in fig. 7, the at least two retaining walls 2 comprise at least a first retaining wall 23 and a second retaining wall 24, wherein the first retaining wall 23 and the second retaining wall 24 have different thicknesses.

Specifically, the thicknesses of the first retaining wall 23 and the second retaining wall 24 are different, on one hand, during the preparation process, the first retaining wall 23 and the second retaining wall 24 with different thicknesses can be used to form the organic sub-patterns 41 with different thicknesses, so as to facilitate the preparation and formation of the organic sub-patterns 41; on the other hand, the thickness of the first retaining wall 23 is different from that of the second retaining wall 24, so that the first retaining wall 23 and the second retaining wall 24 with different thicknesses can be flexibly arranged at different positions in actual preparation, and the retaining wall 2 can play a role in better blocking water and oxygen.

In some embodiments, with continued reference to fig. 7, the first wall 23 is disposed adjacent to the display area 100, and the thickness of the first wall 23 is less than the thickness of the second wall 24.

Specifically, in the display substrate, the more easily the water oxygen is immersed due to the position closer to the edge of the base 1. The closer to the edge of the substrate 1 the more water-oxygen barrier is required. Based on this, in the present application, the thickness of the second barrier wall 24 disposed near the edge of the substrate 1 is relatively thick, and the thicker second organic sub-pattern 41 can play a better role in blocking water oxygen, so as to prevent water oxygen from entering the organic sub-pattern 41.

In some embodiments, referring to fig. 8 and 9, the at least two retaining walls 2 further comprise at least one third retaining wall 22, the at least one third retaining wall 22 is located between the first retaining wall 23 and the second retaining wall 24, and the thickness of the at least one third retaining wall 22 is less than or equal to the thickness of the second retaining wall 24 and greater than the thickness of the first retaining wall 23.

Specifically, the third retaining wall 22 may be provided in one or two or more. The specific number of the third retaining walls 22 is not limited herein, and is set according to practical situations.

The thickness of the third retaining wall 22 is less than or equal to the thickness of the first retaining wall 24, i.e. the thickness of the third retaining wall 22 may be the same as the thickness of the first retaining wall 24 or less than the thickness of the first retaining wall 24, but the thickness of the third retaining wall 22 is always greater than the thickness of the first retaining wall 23.

This is because the direction from the second wall 24 to the third wall 22 to the first wall 23 is the direction from the edge of the substrate 1 to the display area 100, and the thicker wall 2 is required to block the water and oxygen as the position is closer to the edge of the substrate 1, so that the second wall 24 and the third wall 22 with thicker thickness are arranged at the position is closer to the edge, thereby avoiding the invasion of the water and oxygen and improving the reliability of the display substrate.

Meanwhile, the position closer to the edge of the substrate 1 is more required to be buffered, so that the second retaining wall 24 and the third retaining wall 22 with thicker thickness are arranged at the position closer to the edge, the opening 21 with deeper depth can be formed between the second retaining wall 24 and the third retaining wall 22 and between the adjacent third retaining walls 22, the opening 21 can be filled with the organic layer 4 with thicker thickness, and the organic layer 4 with thicker thickness can play a better role in buffering stress, so that the crack at the edge position is avoided.

When the third retaining wall 22 is provided with a plurality of third retaining walls 22, the thicknesses of the plurality of third retaining walls 22 may be different (as shown in fig. 8) or the same (as shown in fig. 9). When the thicknesses of the third retaining walls 22 are different, the thicknesses of the third retaining walls 22 may gradually decrease in the direction toward the display area 100, so as to better achieve the effect of blocking water oxygen and buffering stress.

In some embodiments, the width of the opening 21 is 20-40 μm. When the width of the opening 21 is 20 to 40 μm, the width of the organic sub-pattern 41 formed in the opening 21 can be made moderate, which not only can play a role in well isolating water and oxygen and buffering stress, but also is convenient for practical preparation.

When the width of the opening 21 is less than 20 μm, the width of the opening 21 is too narrow, which is disadvantageous for the actual manufacturing process and also disadvantageous for the filling of the organic sub-pattern 41. When the width of the opening 21 is greater than 40 μm, the width of the opening 21 is too large, so that the number of the retaining walls 2 which can be provided in the limited rim area 200 is limited, resulting in poor moisture blocking effect.

Illustratively, the width of the opening 21 may be 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, etc.

In some embodiments, as shown in fig. 10, a buffer layer 5 is further disposed on one side of the substrate 1 along the direction perpendicular to the display substrate, where the buffer layer 5 serves to block water vapor and impurity ions in the substrate 1 (especially organic material), and to add hydrogen ions to the active layer 6 formed later, and the buffer layer 5 is made of an insulating material, so that the substrate 1 can be insulated from the active layer 6.

The active layer 6 is disposed on the buffer layer 5, and the active layer 6 may be made of an amorphous, polycrystalline semiconductor material, an oxide semiconductor, or an organic semiconductor material. In addition, the active layer 6 includes a channel region in which impurities are not doped, and source and drain regions disposed at opposite sides of the communication region and doped with impurities.

A gate insulating layer 7 is disposed on the active layer 6. The gate insulating layer 7 is a layer for electrically insulating the gate electrode 8 from the active layer 6, and may be formed of an insulating material. For example, the gate insulating layer 7 may be formed as a single layer of silicon nitride (SiN _x) or silicon oxide (SiO _x) as an inorganic material, or as a plurality of layers of silicon nitride (SiN _x) or silicon oxide (SiO _x), but the embodiment is not limited thereto.

A gate electrode 8 is provided on the gate insulating layer 7. The gate electrode 8 may overlap at least some of the active layer 6 and may overlap the channel region. The gate electrode 8 may be any one of a variety of metal materials, for example, any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy of two or more thereof, or a plurality of layers thereof, but the embodiment is not limited thereto.

An interlayer insulating layer 9 is provided on the gate electrode 8 and the gate insulating layer 7. The interlayer insulating layer 9 may be made of an inorganic insulating material or an organic insulating material.

A contact hole overlapping at least a portion of the active layer 6 is formed in the gate insulating layer 7 and the interlayer insulating layer 9.

A source electrode 10 and a drain electrode 11 are provided on the interlayer insulating layer 9. The source electrode 10 and the drain electrode 11 are disposed on the same layer and spaced apart from each other. In addition, the source electrode 10 and the drain electrode 11 are connected to the source region and the drain region of the active layer 6, respectively, through contact holes. The source electrode 10 and the drain electrode 11 may be formed of any one or more of a variety of metal materials, for example, any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy of two or more thereof, or a plurality of layers thereof, but the embodiment is not limited thereto.

As described above, the active layer 6, the gate electrode 8, the source electrode 10, and the drain electrode 11 constitute one thin film transistor.

The structure of the thin film transistor is not limited to the foregoing example, and may be modified into various alternative structures. The light emitting diode display may include a switching transistor and a driving transistor, and the foregoing thin film transistor may be the driving transistor. Although not shown, a switching thin film transistor may be provided.

At least two retaining walls 2 are arranged on the interlayer insulating layer 9 at intervals, and the at least two retaining walls 2 are located in the frame area 200.

A planarization layer 12 is provided in the display region of the thin film transistor and the interlayer insulating layer 9, the planarization layer 12 serving to remove and/or planarize the steps of the foregoing structure, thereby increasing the light emitting efficiency of the light emitting element to be formed thereon. Contact holes overlapping at least some of the drain electrodes 11 are formed in the passivation layer.

The planarization layer 12 may be formed of polyacrylate resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, unsaturated polyester resin, polyphenylene sulfide resin, and/or benzocyclobutene (BCB).

The first electrode layer 13 is disposed on the planarization layer 12, and the first electrode layer 13 may be formed of a transparent conductive material such as Indium Tin Oxide (ITO), indium Zinc Oxide (IZO), zinc oxide (ZnO), indium oxide (In 2O 3), or a metal such as lithium (Li), calcium (Ca), lithium fluoride/calcium (LiF/Ca), lithium fluoride/aluminum (LiF/Al), aluminum (Al), silver (Ag), magnesium (Mg), gold (Au), or the like. The first electrode layer 13 is electrically connected to the drain electrode 11 of the thin film transistor via a contact hole formed in the flat layer 12 to serve as an anode of the light emitting element.

A pixel defining layer 14 is provided on a side of the first electrode layer 13 remote from the substrate 1, a via hole is provided on the pixel defining layer 14, and a light emitting layer 15 is provided in the via hole. A second electrode layer 16 is provided on a side of the light emitting layer 15 remote from the substrate 11, the second electrode layer 16 may be a cathode, and the second electrode layer 16 is connected to the ground line VSS. The light-emitting layer 15 in one via emits light to form one sub-pixel, and thus, the light-emitting layer 15 in one via is one sub-pixel, so that the front projection of the sub-pixel on the display substrate is the front projection of the light-emitting layer 15 on the display substrate, and the display substrate may include a plurality of sub-pixels.

The light emitting layer 15 may include a hole injecting layer, a hole transporting layer, a light emitting material layer, an electron transporting layer, and an electron injecting layer, which are sequentially stacked, the hole injecting layer being in contact with the first electrode layer 13, and the electron injecting layer being in contact with the second electrode layer 16. Of course, in other exemplary embodiments of the present application, the light emitting layer 15 may include only a hole transporting layer, the light emitting layer 15, and an electron transporting layer, and the light emitting layer 15 may also have other structures, and the specific structure thereof may be set as needed.

A first inorganic layer 31 is disposed on the second electrode layer 16, and the first inorganic layer 31 covers the barrier wall 2, the second electrode layer 16, and the interlayer insulating layer 9.

In the display area 100, an organic functional layer 17 is further disposed on a side of the first inorganic layer 31 facing away from the substrate 1, and the barrier wall 2 adjacent to the display area 100 is used for blocking the organic functional layer 17.

In the border area 200, the first inorganic layer 31 is arranged on the side facing away from the substrate 1, and the organic layer 4 is also arranged. The organic layer 4 is located in the opening 21 between two adjacent retaining walls 2. An opening 21 is formed between adjacent two of the retaining walls 2 for accommodating the organic layer 4.

The thicknesses of the organic layer 4 and the organic functional layer 17 may be the same or different, and the preparation materials of the two may be the same or different. The organic layer 4 is separated from the organic functional layer 17 by the barrier wall 2, so as to better block water and oxygen from entering the organic functional layer 17 from the organic layer 4, and further avoid water and oxygen from entering the display area 100.

The second inorganic layer 32 is used to cover the organic functional layer 17, the organic layer 4, the retaining wall 2 and the first inorganic layer 31.

It should be noted that the retaining wall 2 may be disposed on the interlayer insulating layer 9, or may be disposed on the planarization layer 12, or may be disposed on the buffer layer 5 or the gate insulating layer 7, and the specific disposition position of the retaining wall 2 is made according to the actual requirement, which is not limited herein.

step S1, providing a substrate 1, wherein the substrate 1 comprises a display area 100 and a frame area 200 surrounding the display area 100;

Step S2, at least two retaining walls 2 are arranged at intervals on one side of the substrate 1, the at least two retaining walls 2 are both located in the frame area 200, and an opening 21 is arranged between two adjacent retaining walls 2;

Step S3, a packaging layer 3 is disposed on a side of the retaining wall 2 away from the substrate 1, so that the packaging layer 3 covers the at least two retaining walls 2 and the substrate 1, an organic layer 4 is disposed in the packaging layer 3, and the organic layer 4 is located in the opening 21.

Specifically, the buffer layer 5 is formed on the substrate 1, the active layer 6 is formed on the buffer layer 5, the gate insulating layer 7 is formed on the active layer 6, and the gate electrode 8 is formed on the gate insulating layer 7. An interlayer insulating layer 9 is formed on the gate electrode 8 and the gate insulating layer 7. A contact hole overlapping at least a portion of the active layer 6 is formed in the gate insulating layer 7 and the interlayer insulating layer 9.

A source electrode 10 and a drain electrode 11 are provided on the interlayer insulating layer 9. The source electrode 10 and the drain electrode 11 are disposed on the same layer and spaced apart from each other. In addition, the source electrode 10 and the drain electrode 11 are connected to the source region and the drain region of the active layer 6, respectively, through contact holes. The active layer 6, the gate electrode 8, the source electrode 10, and the drain electrode 11 constitute one thin film transistor.

Then, at least two of the retaining walls 2 are disposed at intervals on the region where the interlayer insulating layer 9 is located in the frame region 200, and an opening 21 is provided between the adjacent two retaining walls 2, as shown in fig. 11.

A planarization layer 12 is provided on the thin film transistor and the interlayer insulating layer 9 located in the display area 100, and a first electrode layer 13 and a pixel defining layer 14 are sequentially provided on the planarization layer 12. The pixel defining layer 14 is provided with a via hole, and the light emitting layer 15 is provided in the via hole. A second electrode layer 16 is provided on the side of the light-emitting layer 15 remote from the substrate 1, as shown in fig. 12.

The first inorganic layer 31 is further disposed, and the first inorganic layer 31 covers the barrier wall 2, the second electrode layer 16 and the substrate 1, as shown in fig. 13.

Then, in the area where the first inorganic layer 31 is located in the display area 100, an organic functional layer 17 is formed, and the barrier wall 2 near the display area 100 is used for blocking the organic functional layer 17, as shown in fig. 14.

The openings 21 of the adjacent two retaining walls 2 are filled with an organic material so as to form an organic layer 4, as shown in fig. 15.

Then, a second inorganic layer 32 is formed, and the second inorganic layer 32 covers the organic functional layer 17, the organic layer 4, the barrier wall 2, and the first inorganic layer 31, and at this time, the formation of the encapsulation layer 3 is completed, as shown in fig. 10 and 16.

According to the application, on the premise of not increasing the size of the frame area 200, the stress of the packaging layer 3 can be buffered by only adding one process for manufacturing the organic layer 4, so that the cracking of the packaging layer 3 is avoided, meanwhile, the reliability of the display substrate can be further improved on the basis of improving the edge cracking, and the service life of the display substrate is prolonged.

The application also provides a display device which comprises the display substrate in any embodiment.

The display device may be a product having an image display function, for example, may be: a display, a television, a billboard, a digital photo frame, a laser printer with a display function, a telephone, a mobile phone, a Personal digital assistant (Personal DIGITAL ASSISTANT, PDA), a digital camera, a portable video camera, a viewfinder, a navigator, a vehicle, a large-area wall, a household appliance, an information inquiry device (such as a business inquiry device of e-government, a bank, a hospital, an electric power department, etc., a monitor, etc.).

The display device has the technical effects described in any of the above embodiments, and will not be described herein.

It should be noted that the foregoing describes some embodiments of the present disclosure. Other embodiments are within the scope of the following claims. In some cases, the actions or steps recited in the claims may be performed in a different order than in the embodiments described above and still achieve desirable results. In addition, the processes depicted in the accompanying figures do not necessarily require the particular order shown, or sequential order, to achieve desirable results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

Those of ordinary skill in the art will appreciate that: the discussion of any of the embodiments above is merely exemplary and is not intended to suggest that the scope of the disclosure, including the claims, is limited to these examples; the technical features of the above embodiments or in the different embodiments may also be combined under the idea of the present disclosure, the steps may be implemented in any order, and there are many other variations of the different aspects of the embodiments of the present disclosure as described above, which are not provided in details for the sake of brevity.

The disclosed embodiments are intended to embrace all such alternatives, modifications and variances which fall within the broad scope of the appended claims. Accordingly, any omissions, modifications, equivalents, improvements, and the like, which are within the spirit and principles of the embodiments of the disclosure, are intended to be included within the scope of the disclosure.

Claims

1. A display substrate, comprising:

The packaging layer covers the at least two retaining walls and the substrate;

2. The display substrate according to claim 1, wherein the encapsulation layer comprises a first inorganic layer and a second inorganic layer, the first inorganic layer covers the at least two barriers and the base, the organic layer is disposed on a side of the first inorganic layer facing away from the base, and the second inorganic layer covers the organic layer and the first inorganic layer.

3. The display substrate according to claim 2, wherein the number of the retaining walls is greater than or equal to three, the openings are arranged between every two adjacent retaining walls, the organic layer comprises a plurality of organic sub-patterns arranged at intervals, and one organic sub-pattern is arranged in each opening.

4. A display substrate according to claim 3, wherein the ratio of the thickness of the organic sub-pattern to the depth of the corresponding opening is 1-4:5.

5. The display substrate according to claim 4, wherein the plurality of organic sub-patterns includes at least a first organic sub-pattern and a second organic sub-pattern, and wherein thicknesses of the first organic sub-pattern and the second organic sub-pattern are different.

6. The display substrate of claim 5, wherein the first organic sub-pattern is disposed adjacent to the display area, and wherein a thickness of the first organic sub-pattern is less than a thickness of the second organic sub-pattern.

7. The display substrate of claim 1, wherein the at least two retaining walls comprise at least a first retaining wall and a second retaining wall, the first retaining wall and the second retaining wall having different thicknesses.

8. The display substrate of claim 7, wherein the first wall is disposed adjacent to the display area, and wherein a thickness of the first wall is less than a thickness of the second wall.

9. The display substrate of claim 8, wherein the at least two walls further comprise at least one third wall, the at least one third wall being located between the first wall and the second wall, the at least one third wall having a thickness less than or equal to a thickness of the second wall and greater than a thickness of the first wall.

10. The display substrate according to claim 1, wherein the width of the opening is 20 to 40 μm.

11. A method for manufacturing a display substrate, comprising:

12. A display device comprising the display substrate according to any one of claims 1 to 10 or the display substrate produced by the production method according to claim 11.