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CN116442596A - All-organic polymer dielectric film with five-layer structure and preparation method thereof - Google Patents

All-organic polymer dielectric film with five-layer structure and preparation method thereof Download PDF

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Publication number
CN116442596A
CN116442596A CN202310622913.6A CN202310622913A CN116442596A CN 116442596 A CN116442596 A CN 116442596A CN 202310622913 A CN202310622913 A CN 202310622913A CN 116442596 A CN116442596 A CN 116442596A
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film
layer
organic polymer
films
polymer dielectric
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Inventor
赵月涛
蔡博
刘印政
孟祥硕
李垣江
朱琎
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Jiangsu University of Science and Technology
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Jiangsu University of Science and Technology
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D7/00—Producing flat articles, e.g. films or sheets
    • B29D7/01—Films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/304—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/14—Organic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/32—Wound capacitors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/24—All layers being polymeric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/16—Capacitors

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention discloses an all-organic polymer dielectric film with a five-layer structure and a preparation method thereof, wherein the dielectric film comprises five layers of films; the five-layer film comprises two low-loss high-breakdown-layer films positioned on the outermost layer, two middle transition-layer films are arranged between the two low-loss high-breakdown-layer films, and a high-dielectric-layer film is arranged between the two middle transition-layer films; the all-organic polymer dielectric film is prepared by bonding five layers of films which are sequentially stacked into a whole in a continuous hot pressing process. The invention combines organic polymers with different properties by using a multi-layer continuous hot pressing method, can fully exert the advantages of each component, can inhibit the growth of electric branches due to the interlayer difference of different components, plays a role in improving the breakdown strength, and has the advantages of higher dielectric constant, high breakdown field intensity, high discharge energy density and the like.

Description

All-organic polymer dielectric film with five-layer structure and preparation method thereof
Technical Field
The invention relates to a dielectric polymer material film and a preparation method thereof, in particular to an all-organic polymer dielectric film with a five-layer structure and a preparation method thereof.
Background
Organic thin film capacitors have important applications in various fields, such as electric vehicles, which use thin film capacitor-structured inverters to convert direct current into alternating current, laser instruments, which require the use of thin film capacitors to generate strong voltages, and electromagnetic catapulting, which require the thin film capacitors as energy storage devices to provide strong power, due to their excellent discharge power density, extremely high operating voltages, and unique self-healing characteristics.
Currently, the commercial organic film capacitor uses mainly biaxially oriented polypropylene (BOPP) material with a dielectric constant of about 2.2, and the energy storage density of the capacitor is generally 3J/cm 3 In the following, the lower energy storage density can seriously affect the volume of the power module in actual production, for example, the inverter and the thin film capacitor in the electromagnetic ejection system occupy a great space, which severely restricts the use of the device. Therefore, finding a new polymer film that can possess higher energy storage density is critical for miniaturization of the relevant modules.
Polyvinylidene fluoride (PVDF) -based fluorine-containing polymer has stronger polarity and higher dielectric constant (8-12), has the potential of becoming a novel high energy storage polymer film, but the ferroelectricity of PVDF causes larger energy loss in a charge-discharge cycle. PVDF-based binary copolymers (such as P (VDF-HFP), P (VDF-CTFE) and the like) introduce larger groups on the main chain, so that PVDF generates larger defects in crystallization, thus reducing ferroelectricity, becoming relaxation ferroelectrics and greatly reducing energy loss in the charge-discharge process.
The multilayer composite polymer film can effectively improve dielectric energy storage characteristics for two main reasons: firstly, the interfaces among different kinds of polymer dielectrics can effectively inhibit the growth of electric branches, so that the breakdown performance of the composite film is improved; secondly, the polymer film of each layer becomes thinner, and the thin layer strengthening effect makes the electrical performance of the polymer film of each layer better. The preparation methods of the multi-layer composite polymer film commonly used in the prior art are two types: firstly, when the capacitor is rolled, a plurality of layers of dielectric materials are used, when the number of layers of the composite film is large, a plurality of layers of the composite film (twice the number of layers of the composite film) are used for one capacitor at the same time, the process is complex, the operation is almost impossible, and a large amount of air is introduced between the film layers in the rolling process, so that the performance of the device is reduced; secondly, the multilayer composite dielectric film is directly prepared by a multilayer coextrusion biaxial stretching technology, but when the processing temperature difference of each layer of material is large, the simultaneous melt extrusion processing is not possible.
Disclosure of Invention
The invention aims to: the invention aims to provide an all-organic polymer dielectric film with five-layer structure, which can effectively inhibit the growth of electric branches and improve breakdown performance and dielectric constant;
the second object of the invention is to provide a method for preparing the all-organic polymer dielectric film with a five-layer structure.
The technical scheme is as follows: the all-organic polymer dielectric film with the five-layer structure comprises five layers of films; the five-layer film comprises two low-loss high-breakdown-layer films positioned on the outermost layer, two middle transition-layer films are arranged between the two low-loss high-breakdown-layer films, and a high-dielectric-layer film is arranged between the two middle transition-layer films; the all-organic polymer dielectric film is prepared by bonding five layers of films which are sequentially stacked into a whole in a continuous hot pressing process.
The dielectric constants and the dielectric losses of the low-loss high-breakdown layer, the intermediate transition layer and the high-dielectric layer are all increased in sequence.
The high dielectric layer film material comprises a polymer matrix and an organic blending phase, wherein the polymer matrix is at least one of polyvinylidene fluoride, poly (vinylidene fluoride-co-hexafluoropropylene), poly (vinylidene fluoride-co-chlorotrifluoroethylene), poly (vinylidene fluoride-co-trifluoroethylene-co-chlorotrifluoroethylene) or poly (vinylidene fluoride-co-trifluoroethylene-co-chlorotrifluoroethylene), and the organic blending phase is at least one of poly (methyl methacrylate-co-styrene), polymethyl methacrylate, polyurea or polythiourea. The mass ratio of the polymer matrix to the organic blending phase is (99-70): 1-30. The polymer matrix and the organic blending phase are fully mixed preferentially, and the high dielectric layer film is prepared by using a melt extrusion biaxial stretching process. Specifically, poly (vinylidene fluoride-co-hexafluoropropylene) resin and polymethyl methacrylate resin are mixed together according to the mass ratio of (99-70) to (1-30), and are subjected to twin-screw melt extrusion, sheet casting and film forming by a biaxial stretching process. Wherein the temperature from the extruder to the die is set to be 170-240 ℃ and gradually increased, and the rotating speed of the screw is set to be 40-200 r/min.
Wherein the intermediate transition layer film material is at least one of polyethylene terephthalate, polyphenylene sulfide, polyethylene naphthalate, polycarbonate, polyimide or polyetherimide.
Wherein, the low-loss high-breakdown-layer film material is preferably polypropylene.
Wherein the thickness of the five-layer all-organic polymer dielectric film is 10-18 mu m.
The preparation method of the all-organic polymer dielectric film with the five-layer structure comprises the following steps:
(A1) Stacking a low-loss high-breakdown-layer film (1), an intermediate transition layer film (2), a high-dielectric-layer film (3), an intermediate transition layer film (2) and a low-loss high-breakdown-layer film (1) in sequence from top to bottom;
(B1) And (3) bonding the five layers of films sequentially stacked in the step (A1) into a whole by using a continuous hot pressing method to form the all-organic polymer dielectric film with the five-layer structure.
The method specifically comprises the following steps of:
(A2) The method comprises the steps of respectively mounting each layer of coiled film on different rollers, sequentially stacking each layer of film through the rollers, and clamping the pre-stacked film between the pair of rollers and wrapping the pre-stacked film forwards continuously by the rollers;
(B2) Preheating the pre-stacked films by a hot roller with constant temperature;
(C2) And hot-pressing the preheated film by a continuous hot-pressing roller, leaving the hot-pressed film, cooling by a shaping roller, and rolling the obtained film to obtain the full-organic polymer dielectric film with a five-layer structure.
The preheating process is preferably finished by a roller heated by high-temperature oil, and the preheating temperature is 80-160 ℃; preferably, the temperature is raised step by step, and the preheating temperature is determined by factors such as a low-loss high-breakdown-layer film material, a high-dielectric-layer film material, a preheating path length, a hot-pressing linear speed and the like. Under the preheating condition, the low-loss high-breakdown-layer film material and the high-dielectric-layer film material are thoroughly heated and begin to soften, so that preparation is made for heating and hot pressing.
Wherein the temperature of the hot pressing is 170-200 ℃. The temperature of the hot pressing is lower than the melting point of the intermediate transition layer and higher than the melting points of the low-loss high-breakdown layer and the high-dielectric layer. Under the hot-pressing temperature condition, the low-loss high-breakdown layer film material and the high-dielectric layer film material reach a viscous state, the intermediate transition layer is still in a high-elastic state, and five layers of films are bonded together after cooling to become a single-layer film with a five-layer structure.
Wherein the pressure applied in the hot pressing process is 5-100 MPa. Under the pressure conditions, the viscous state of the film material of the low-loss high-breakdown layer and the high-dielectric layer is tightly pressed on the intermediate transition layer in a high-elastic state.
The film is subjected to short hot pressing by the pair of rollers, and enters a cooling and shaping stage to obtain the finished film. In order to avoid the introduction of dust and other pollutants between layers and in the film roll, the whole process from unreeling, laminating, preheating, hot pressing, shaping and reeling is carried out in a clean environment.
The beneficial effects are that: compared with the prior art, the invention has the following remarkable effects:
(1) The dielectric film is a single-layer film with five independent films bonded into a whole, and has the advantages of high breakdown strength, lower dielectric loss, good machining performance, higher dielectric constant, higher energy storage density and the like; the relative dielectric constant of the five-layer film can reach 5.5, and the dielectric loss is only 0.024; (2) The invention is close to a gradient material, from a low-loss high-breakdown layer film to an intermediate transition layer film and then to a high-dielectric layer film, the dielectric constant is increased in sequence, and the dielectric loss is reduced in sequence; (3) According to the invention, five independent films stacked in a certain order are adhered into a whole under continuous hot pressing to form a single-layer film, and the method avoids the problem that the processing temperature of each layer of material in the prior art is large in difference and cannot be processed by simultaneous melt extrusion; (4) The invention combines organic polymers with different properties by using a multi-layer compounding method, can fully exert the advantages of each component, can inhibit the growth of electric branches due to the difference between different component layers, and plays a role in improving the breakdown strength; (5) The invention can greatly improve the energy storage density of the polymer film, effectively improve the breakdown strength of the polymer film and reduce dielectric loss.
Drawings
FIG. 1 is a schematic structural view of an all-organic polymer dielectric film having a five-layer structure according to the present invention;
FIG. 2 is a flow chart of a method of preparing an all-organic composite film having a five-layer structure according to the present invention;
FIG. 3 is a schematic illustration of continuous hot pressing in a process for preparing an all-organic composite film having a five-layer structure;
FIG. 4 is a five-layer thin film dielectric spectrum test result of example 1;
FIG. 5 shows the results of Weber distribution test for pressure resistance of the polymer dielectric film of example 1.
Detailed Description
The present invention is described in further detail below.
Example 1
As shown in fig. 1, the present invention provides an all-organic polymer dielectric film having a five-layer structure, comprising five layers of films; the five-layer film comprises two low-loss high-breakdown-layer films 1 positioned on the outermost layer, two intermediate transition layer films 2 are arranged between the two low-loss high-breakdown-layer films 1, and a high dielectric layer film 3 is arranged between the two intermediate transition layer films 2; the all-organic polymer dielectric film is prepared by bonding five layers of films which are sequentially stacked into a whole in a continuous hot pressing process. Wherein, the dielectric constants and dielectric losses of the low-loss high-breakdown-layer film 1, the intermediate transition layer film 2 and the high-dielectric-layer film 3 are all increased in sequence.
The low-loss high-breakdown-layer film 1 is a biaxially oriented polypropylene film, the intermediate transition layer film 2 is a biaxially oriented polyethylene terephthalate film, and the high-dielectric-layer film 3 is a poly (vinylidene fluoride-co-hexafluoropropylene)/polymethyl methacrylate composite film.
As shown in fig. 2 and 3, the preparation method of the all-organic polymer dielectric film with a five-layer structure comprises the following steps:
(1) Preparing each layer of film:
a. preparing a high dielectric layer film: preparing a film by using a melt extrusion biaxial stretching process, mixing together poly (vinylidene fluoride-co-hexafluoropropylene) resin and polymethyl methacrylate resin according to a mass ratio of 80:20, adding the mixture into a double-screw extruder, and forming a film by using the melt extrusion biaxial stretching process, wherein the temperature of the extruder is set to be 170-220 ℃ and gradually increased, the rotating speed of the screw is set to be 80r/min, the parameters of the double-screw extruder are set to be 3.5 times of longitudinal stretching and 4.5 times of transverse stretching;
b. intermediate transition layer-by-layer film: preparing a polyethylene terephthalate film by using a commercially available 2 mu m melt extrusion biaxial stretching process with good uniformity;
c. low loss high breakdown layer film: preparing a polypropylene film by using a commercially available 2 mu m melt extrusion biaxial stretching process with good uniformity;
(2) Cutting the coiled low-loss high-breakdown-layer film, the middle transition-layer film and the high-dielectric-layer film into films with the same width of 62cm respectively, stacking different polymer layers together according to the sequence of the low-loss high-breakdown-layer film, the middle transition-layer film, the high-dielectric-layer film, the middle transition-layer film and the low-loss high-breakdown-layer film, adjusting the linear speeds of all rollers to 20m/min, continuously rotating at a constant speed, and clamping the pre-stacked films between the paired rollers and wrapping the films forwards continuously by the rollers; wherein (1) in fig. 3 is a roller around which a biaxially oriented polypropylene film is wound, (2) is a roller around which a biaxially oriented polyethylene terephthalate film is wound, (3) is a roller around which a high dielectric layer film is wound, (4) is a preheating, hot-pressing and cooling shaping roller, and (5) is a roller around which a film is wound;
(3) Preheating the pre-stacked films by a hot roller with constant temperature, wherein the preheating temperature is 150 ℃;
(4) The preheated film passes through a plurality of continuous hot-pressing rollers, the temperature of the continuous hot-pressing rollers is set to 160 ℃, the pressure of the rollers is 10MPa, the film after hot-pressing leaves, the film is cooled at room temperature for a period of time, and then the film is collected by a rolling machine through a roller with the temperature of 60 ℃ and the pressure of 1MPa, so that the all-organic polymer medium film with a five-layer structure can be obtained.
Because the PET layer is high in temperature resistance, the PET layer is arranged in the middle, and the PP layer and the P (VDF-HFP)/PMMA layer are low in temperature resistance and are arranged on two sides of the PET layer. The hot pressing temperature is lower than the melting point of PET and slightly higher than the melting points of PP and P (VDF-HFP)/PMMA. When hot pressed, PP and P (VDF-HFP)/PMMA are adhered to the surface of the PET layer, and after curing, five separate films are adhered to form a single film.
Fig. 4 is a graph showing dielectric spectrum testing of dielectric films in this example, five layers of films having a relative dielectric constant of 5.5 and a dielectric loss of 0.024 at a frequency of 1kHz, lower than that of the single high dielectric layer, and higher than that of the single PP and PET films.
FIG. 5 is a five-layer film voltage withstand test, calculated from Weber distribution, with an intrinsic breakdown strength of 574kV/mm, and voltage withstand capability meeting the requirements of dielectric materials.
Example 2
On the basis of example 1, unlike example 1, in step (1), the polymer matrix is poly (vinylidene fluoride-co-chlorotrifluoroethylene), the organic blending phase is poly (methyl methacrylate-co-styrene), and the mass ratio of the two is 99:1; in the step (3), the preheating temperature is 160 ℃. In the step (4), the temperature of the continuous hot-pressing roller is set to 170 ℃, and the pressure of the roller is 10MPa.
Example 3
On the basis of example 1, unlike example 1, in step (1), the polymer matrix is poly (vinylidene fluoride-co-trifluoroethylene-co-chlorotrifluoroethylene), the organic blending phase is polyurea, and the mass ratio of the two is 70:30; in step (3), the preheating temperature is 80 ℃. In the step (4), the temperature of the continuous hot-pressing roller is set to be 200 ℃, and the roller pressure is 5MPa.

Claims (10)

1. An all-organic polymer dielectric film with a five-layer structure, which is characterized by comprising five layers of films; the five-layer film comprises two low-loss high-breakdown-layer films (1) positioned on the outermost layer, two middle transition-layer films (2) are arranged between the two low-loss high-breakdown-layer films (1), and a high-dielectric-layer film (3) is arranged between the two middle transition-layer films (2); the all-organic polymer dielectric film is prepared by bonding five layers of films which are sequentially stacked into a whole in a continuous hot pressing process.
2. The film of claim 1, wherein the high dielectric layer film material comprises a polymer matrix and an organic blend phase, the polymer matrix being at least one of polyvinylidene fluoride, poly (vinylidene fluoride-co-hexafluoropropylene), poly (vinylidene fluoride-co-chlorotrifluoroethylene), poly (vinylidene fluoride-co-trifluoroethylene-co-chlorotrifluoroethylene), or poly (vinylidene fluoride-co-trifluoroethylene-co-chlorotrifluoroethylene), the organic blend phase being at least one of poly (methyl methacrylate-co-styrene), polymethyl methacrylate, polyurea, or polythiourea.
3. The all-organic polymer dielectric film having a five-layer structure according to claim 1, wherein the intermediate transition layer film material is at least one of polyethylene terephthalate, polyphenylene sulfide, polyethylene naphthalate, polycarbonate, polyimide, or polyetherimide.
4. The all-organic polymer dielectric film having a five-layer structure according to claim 1, wherein the low-loss high-breakdown-layer film material is polypropylene.
5. The all-organic polymer dielectric film having a five-layer structure according to claim 1, wherein the thickness of the all-organic polymer dielectric film is 10 to 18 μm.
6. A method of preparing an all-organic polymer dielectric film having a five-layer structure as claimed in claim 1, comprising the steps of:
(A1) Stacking a low-loss high-breakdown-layer film (1), an intermediate transition layer film (2), a high-dielectric-layer film (3), an intermediate transition layer film (2) and a low-loss high-breakdown-layer film (1) in sequence from top to bottom;
(B1) And (3) bonding the five layers of films sequentially stacked in the step (A1) into a whole by using a continuous hot pressing method to form the all-organic polymer dielectric film with the five-layer structure.
7. The method for producing an all-organic polymer dielectric film having a five-layer structure according to claim 6, wherein in the step (B1), a preheating process is performed before the continuous hot pressing.
8. The method for producing an all-organic polymer dielectric film having a five-layer structure according to claim 7, wherein the preheating temperature is 80 to 160 ℃.
9. The method for producing an all-organic polymer dielectric film having a five-layer structure according to claim 6, wherein in the step (B1), the temperature of the hot pressing is 170 to 200 ℃; the pressure is 5-100 MPa.
10. The method for preparing an all-organic polymer dielectric film having a five-layer structure according to claim 6, comprising the steps of:
(A2) The method comprises the steps of respectively mounting each layer of coiled film on different rollers, sequentially stacking each layer of film through the rollers, and clamping the pre-stacked film between the pair of rollers and wrapping the pre-stacked film forwards continuously by the rollers;
(B2) Preheating the pre-stacked films by a hot roller with constant temperature;
(C2) And hot-pressing the preheated film by a continuous hot-pressing roller, leaving the hot-pressed film, cooling by a shaping roller, and rolling the obtained film to obtain the full-organic polymer dielectric film with a five-layer structure.
CN202310622913.6A 2023-05-30 2023-05-30 All-organic polymer dielectric film with five-layer structure and preparation method thereof Pending CN116442596A (en)

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CN116442596A true CN116442596A (en) 2023-07-18

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