CN115338993A - TAIKO ring taking device and method - Google Patents
TAIKO ring taking device and method Download PDFInfo
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- CN115338993A CN115338993A CN202210966418.2A CN202210966418A CN115338993A CN 115338993 A CN115338993 A CN 115338993A CN 202210966418 A CN202210966418 A CN 202210966418A CN 115338993 A CN115338993 A CN 115338993A
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- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000005520 cutting process Methods 0.000 claims abstract description 24
- 239000002313 adhesive film Substances 0.000 claims abstract description 18
- 238000001179 sorption measurement Methods 0.000 claims abstract description 14
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 13
- 238000000605 extraction Methods 0.000 claims description 17
- 239000003433 contraceptive agent Substances 0.000 claims description 4
- 230000002254 contraceptive effect Effects 0.000 claims description 4
- 206010024796 Logorrhoea Diseases 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000013467 fragmentation Methods 0.000 description 2
- 238000006062 fragmentation reaction Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000005336 cracking Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
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Abstract
The invention provides a TAIKO ring taking device and a ring taking method, wherein the TAIKO ring taking device comprises: the device comprises a ring taking workbench, an iron ring for bearing a wafer attached with an adhesive film, an adsorption platform for adsorbing the wafer, a mechanical arm for placing the wafer and physically centering the wafer, an identification unit and a clamping jaw for taking the ring; the scanning area of the recognition unit at least comprises the edge area of the wafer; the recognition unit is driven by the rotation of the clamping jaw to recognize whether the edge of the wafer is placed in a specific area. Whether the edge of the wafer is placed in a specific area or not can be accurately identified through the identification unit, the mechanical arm is matched with the wafer to adjust the placing coordinate of the wafer to conduct physical centering on the wafer again, and the problem that the wafer is cracked due to the fact that the supporting ring body is broken in the physical centering process in the TAIKO ring cutting process is avoided under the condition that the thinning wafer main body of the wafer does not need to be in direct contact with the wafer.
Description
Technical Field
The application relates to the technical field of semiconductor manufacturing, in particular to a TAIKO ring taking device and a ring taking method.
Background
The 12-inch wafer is usually thinned by using a TAIKO type thinning process, and a TAIKO ring formed by the TAIKO type thinning process can provide a supporting force for the wafer, so that the warping of the wafer is reduced. Wherein, the ring cutting and the ring removing are important steps in the TAIKO thinning process, and mainly play a role in keeping the integrity of the edge of the wafer and facilitating the Dicing (cutting into die) and packaging.
Currently, there are generally two types of ring cutting methods: blade cutting and laser cutting. Wherein, the ring mode of getting of blade cutting generally adopts the blade to insert, gets and get the ring through upwards lifting up the mode that drops downwards, can carry out the physics centering to the TAIKO wafer before getting the ring again, often can press from both sides the peripheral TAIKO ring of the wafer body of garrulous attenuate at the centering in-process, especially carry out thin slice and ultra-thin slice and get the ring and more easily press from both sides the peripheral TAIKO ring of the wafer body of garrulous attenuate when centering.
Disclosure of Invention
The application provides a TAIKO ring taking device and a TAIKO ring taking method, which can solve the problem that wafer cracking is caused by easy breakage of a TAIKO ring in a centering process in the conventional TAIKO ring cutting process.
On one hand, the embodiment of the application provides a TAIKO ring taking device, which performs ring cutting and ring taking operation on a wafer; the wafer comprises: the wafer thinning device comprises a thinned wafer main body and a support ring body surrounding the thinned wafer main body; the back of the wafer is provided with an adhesive film; the TAIKO contraceptive ring removing device comprises:
a ring taking workbench;
the iron ring is arranged around the wafer and used for fixing the adhesive film to bear the wafer;
the adsorption platform is placed on the ring taking workbench and used for adsorbing the wafer;
the mechanical arm is used for placing the wafer on the adsorption platform and simultaneously physically centering the wafer;
the identification unit is used for identifying whether the edge of the wafer is placed in a specific area or not and feeding back the edge data information of the wafer to the rear-stage unit;
the clamping jaw is used for rotationally taking down the support ring body after the circular cutting of the wafer is completed; the identification unit is arranged on the clamping jaw, and the scanning area of the identification unit at least comprises the edge area of the wafer; the identification unit identifies whether the edge of the wafer is placed in a specific area or not under the driving of the rotation of the clamping jaw.
Optionally, in the TAIKO ring extraction device, the TAIKO ring extraction device further includes: the processing unit is electrically connected with the identification unit and is used for receiving the edge data information output by the identification unit and adjusting the placement coordinates of the wafer according to the edge data information; and the processing unit is also used for feeding back the placing coordinates to the mechanical arm so as to enable the mechanical arm to physically center the wafer again.
Optionally, in the TAIKO ring extraction device, the TAIKO ring extraction device further includes: and the blade is used for circular cutting of the wafer so as to separate the thinned wafer main body from the support ring body.
Optionally, in the TAIKO ring taking apparatus, the edge data information includes: edge offset for each point on the wafer edge.
Optionally, in the TAIKO ring extraction device, the TAIKO ring extraction device is configured to:
if the edge offset is larger than 300 mu m, the processing unit adjusts the placing coordinate of the wafer; according to the placing coordinates fed back by the processing unit, the mechanical arm physically and again centers the wafer;
if the edge offset is less than or equal to 300 mu m, the blade separates the support ring body from the thinned wafer main body; the clamping jaw rotates to take down the support ring body.
Optionally, in the TAIKO ring removing apparatus, the clamping jaw includes: the clamping jaw comprises a plurality of clamping jaw bodies and connecting rods, the clamping jaw bodies are evenly distributed on a circular ring, the connecting rods are connected with all the clamping jaw bodies, and the identification unit is installed on the clamping jaw bodies.
Optionally, in the TAIKO ring extraction device, the TAIKO ring extraction device further includes: and the gasket is positioned at the bottom of the support ring body, and the gasket lifts the support ring body by lifting a certain height after the wafer is subjected to ring cutting and before the clamping jaws take the ring.
On the other hand, the embodiment of the application also provides a ring taking method, which is characterized in that the TAIKO ring taking device is used for carrying out ring cutting and ring taking operation on the wafer; the wafer comprises: the wafer thinning device comprises a thinned wafer main body and a support ring body surrounding the thinned wafer main body; the back of the wafer is provided with an adhesive film; the method for removing intrauterine device comprises the following steps:
the first step is as follows: fixing the adhesive film by using an iron ring to bear the wafer;
the second step is as follows: placing the wafer on the adsorption platform by using a mechanical arm, and simultaneously carrying out physical centering on the wafer;
the third step: under the drive of the rotation of the clamping jaw, an identification unit is used for identifying whether the edge of the wafer is placed in a specific area or not and feeding back the edge data information of the wafer to a rear-stage unit; if the edge of the wafer is placed in a specific area, the supporting ring body is taken down by utilizing the rotation of the clamping jaw; and if the edge of the wafer is placed outside the specific area, returning to execute the second step.
Optionally, in the loop extracting method, the TAIKO loop extracting apparatus includes a processing unit electrically connected to the identification unit, and in the third step, the processing unit receives the edge data information output by the identification unit; if the edge of the wafer is placed outside the specific area, the processing unit adjusts the placement coordinate of the wafer according to the edge data information; and feeding back the adjusted placing coordinate to the mechanical arm to return to execute the second step.
Optionally, in the loop extracting method, the edge data information includes: edge offset of each point on the edge of the wafer; wherein,
if the edge offset is larger than 300 mu m, the processing unit adjusts the placing coordinate of the wafer; feeding back the adjusted placing coordinate to the mechanical arm to return to execute the second step;
and if the edge offset is less than or equal to 300 mu m, after the support ring body is separated from the thinned wafer main body, the clamping jaw rotates to take down the support ring body.
The technical scheme at least comprises the following advantages:
this application passes through whether the edge that the recognition cell can accurately discern the wafer is placed in specific region, the position of placing of robotic arm cooperation adjustment wafer comes to carry out physics centering to the wafer again until the edge of wafer is located specific region, thereby this application has avoided the physics centering in-process among the TAIKO ring cutting technology to press from both sides the problem that garrulous support ring body and/or attenuate wafer main part and lead to the wafer fragmentation under the condition of the attenuate wafer main part that does not need the direct contact wafer.
Drawings
In order to more clearly illustrate the detailed description of the present application or the technical solutions in the prior art, the drawings needed to be used in the detailed description of the present application or the prior art description will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic structural diagram of a TAIKO ring removing device according to an embodiment of the present invention;
FIG. 2 is a schematic top view of a TAIKO ring extractor in a physical centering process in accordance with an embodiment of the present invention;
FIG. 3 is a schematic top view of a TAIKO ring extractor during a rotational ring extraction process in accordance with an embodiment of the present invention;
FIG. 4 is a flow chart of a method of ring extraction according to an embodiment of the present invention;
wherein the reference numerals are as follows:
11-a ring taking workbench, 12-an adsorption platform, 13-an adhesive film, 14-a clamping jaw, 141-a clamping jaw body, 142-a connecting rod, 15-an iron ring, 16-an identification unit, 20-a wafer, 21-a thinned wafer main body and 22-a support ring body.
Detailed Description
The technical solutions in the present application will be described clearly and completely with reference to the accompanying drawings, and it is obvious that the described embodiments are some, but not all embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and operate, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; the connection can be mechanical connection or electrical connection; the two elements may be directly connected or indirectly connected through an intermediate medium, or may be communicated with each other inside the two elements, or may be wirelessly connected or wired connected. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
In addition, the technical features mentioned in the different embodiments of the present application described below may be combined with each other as long as they do not conflict with each other.
An embodiment of the present application provides a TAIKO ring removing device, and referring to fig. 1, fig. 1 is a schematic structural diagram of the TAIKO ring removing device according to the embodiment of the present invention, where the TAIKO ring removing device includes a working chamber, and performs ring cutting and ring removing operations on a wafer 20 in the working chamber; the wafer 20 includes: a thinned wafer main body 21 and a support ring body 22 surrounding the thinned wafer main body 21; the wafer 20 is provided with an adhesive film 13 on the back side. Wherein the adhesive film 13 includes, but is not limited to: ultraviolet irradiation tape and heat sensitive tape.
In this embodiment, before the ring cutting and removing operation, UV irradiation has been performed on the wafer 20 attached with the adhesive film 13 and fixed by the iron ring 15, which reduces the adhesiveness of the adhesive film 13 on the bottom of the support ring body 22.
As shown in fig. 1, the TAIKO ring extraction device includes: the ring removing device comprises a ring removing workbench 11, an iron ring 15 arranged around the wafer 20, an adsorption platform 12 placed on the ring removing workbench 11, a mechanical arm, an identification unit 16 and a clamping jaw 14. Wherein the iron ring 15 is used for fixing the adhesive film 13 to carry the wafer 20; the adsorption platform 12 is used for adsorbing the wafer 20, and is mainly used for adsorbing the thinned wafer main body 21; the robot arm is used for placing the wafer 20, which is attached with the adhesive film 13 and fixed by the iron ring 15, on the adsorption platform 12, and is also used for physically centering the wafer 20.
Referring to fig. 2 and 3, fig. 2 is a schematic top view of a TAIKO ring extractor during physical centering according to an embodiment of the present invention, and fig. 3 is a schematic top view of the TAIKO ring extractor during rotational ring extraction according to an embodiment of the present invention. In this embodiment, when not in operation at ordinary times, the robot arm is accommodated in the working chamber; in operation, the robot arm needs to extend out from the storage position to complete the placing work of the wafer 20, the physical centering work of the wafer 20, and the like, and the robot arm can contact with the iron ring 15 in operation; the identifying unit 16 is configured to identify whether the edge of the wafer 20 is placed in a specific area and feed back the edge data information of the wafer 20 to a subsequent unit; the clamping jaw 14 is used for rotationally taking off the support ring body 22 after the circular cutting of the wafer 20 is completed; wherein the identification unit 16 is mounted on the clamping jaw 14, and a scanning area of the identification unit 16 at least comprises an edge area of the wafer 20; the recognition unit 16 recognizes whether the edge of the wafer 20 is placed in a specific area or not, by the rotation of the chuck 14.
Preferably, the TAIKO ring extraction device further comprises: a processing unit (not shown) electrically connected to the recognition unit 16, where the aforementioned subsequent unit may be the processing unit 16 in this embodiment, and the processing unit is configured to receive the edge data information output by the recognition unit 16 and adjust the placement coordinates of the wafer 20 according to the edge data information; the processing unit is further configured to feed back the placement coordinates to the robot arm so that the robot arm physically re-centers the wafer 20.
In this embodiment, the edge data information output by the identifying unit 16 includes, but is not limited to: the edge offset for each point on the edge of the wafer 20. Specifically, the distance between the wafer center point (the center of the adsorption platform 12) at the ideal centering position and each point on the edge of the wafer 20 at the ideal centering position may be calculated, the distance between the wafer center point at the ideal centering position and each point on the edge of the wafer 20 at the current actual centering position may be calculated, and then the difference between the distances is calculated to obtain the edge offset of each point on the edge of the wafer 20; or calculating the distance between the coordinates of each point on the edge of the wafer 20 at the ideal centering position and the coordinates of each point on the edge of the wafer 20 at the current actual centering position, thereby obtaining the edge offset of each point on the edge of the wafer 20.
Further, the TAIKO ring removing device may further include: a blade for ring-cutting the wafer 20 to separate the thinned wafer main body 21 and the support ring body 22. In this embodiment, when not in operation at ordinary times, the blade is received in the working chamber; in operation, the blade needs to be extended from the stowed position to complete the ring cutting of the wafer 20.
Preferably, the TAIKO ring extraction device further includes: and the gasket is positioned at the bottom of the support ring body 22, wherein after the wafer 20 is subjected to ring cutting and before the clamping jaws 14 take a ring, the gasket lifts the support ring body 22 by a certain height.
In this embodiment, the TAIKO ring extractor is configured to:
if the edge offset is larger than 300 mu m, the processing unit adjusts the placing coordinate of the wafer; according to the placing coordinates fed back by the processing unit, the mechanical arm physically and again centers the wafer 20; if the edge offset is less than or equal to 300 μm, the blade separates the support ring body from the thinned wafer main body, then the support ring body 22 is lifted by the gasket, and finally the support ring body 22 is taken down by the clamping jaw 14 in a rotating manner.
Preferably, as shown in fig. 3, said jaw 14 comprises: a plurality of jaw bodies 141 evenly distributed on a virtual circle and connecting rods 142 connecting all of said jaw bodies 141, on which jaw bodies 141 said identification unit 16 can be mounted in this embodiment. The specific location of the identification unit 16 mounted on the clamping jaw 14 is not limited in any way, as long as it is ensured that the scanning area of the identification unit 16 at least includes all the edge areas of the wafer 20, including: the whole area where the support ring body 22 is located and the edge area of the thinned wafer main body 21.
Based on the same inventive concept, an embodiment of the present application further provides a ring taking method, and referring to fig. 4, fig. 4 is a flowchart of the ring taking method according to the embodiment of the present invention, where the TAIKO ring taking method includes:
first step S10: fixing the adhesive film 13 with an iron ring 15 to carry the wafer 20;
second step S20: placing the wafer 20 on the adsorption platform 12 by using a mechanical arm, and simultaneously physically centering the wafer 20 by using the mechanical arm;
the third step S30: under the driving of the rotation of the clamping jaw 14, an identification unit 16 is used for identifying whether the edge of the wafer 20 is placed in a specific area or not and feeding back the edge data information of the wafer 20 to a back-stage unit; if the edge of the wafer is placed in a specific area, the clamping jaw 14 is used for rotating and taking down the support ring body 22; if the edge of the wafer 20 is located outside the specific region, the second step S20 is executed again.
Further, the TAIKO ring taking device includes a processing unit electrically connected to the identification unit 16, and in the third step S30, the processing unit receives the edge data information output by the identification unit 16; if the edge of the wafer 20 is placed outside the specific area, the processing unit adjusts the placement coordinate of the wafer 20 according to the edge data information; and feeding back the adjusted placing coordinates to the mechanical arm to return to execute the second step S20.
In this embodiment, the edge data information includes, but is not limited to: edge offset of each point on the edge of the wafer; wherein,
if the edge offset is greater than 300 μm, the processing unit adjusts the placing coordinate of the wafer 20; feeding back the adjusted placing coordinates to the mechanical arm to return to execute the second step S20;
if the edge offset is less than or equal to 300 μm, after the support ring body 22 is separated from the thinned wafer main body 21, the clamping jaw 14 rotates to take off the support ring body 22.
In summary, the present invention provides a TAIKO ring removing apparatus and a ring removing method, wherein the TAIKO ring removing apparatus includes: the ring removing device comprises a ring removing workbench 11, an iron ring 15 for bearing a wafer 20 attached with an adhesive film 13, an adsorption platform 12 for adsorbing the wafer 20, a mechanical arm for placing the wafer 20 and physically centering the wafer 20, an identification unit 16 and a clamping jaw 14 for removing a ring; wherein the identification unit 16 is mounted on the clamping jaw 14, and a scanning area of the identification unit 16 at least comprises an edge area of the wafer; the recognition unit 16 recognizes whether the edge of the wafer 20 is placed in a specific area or not, by the rotation of the chuck 14. This application passes through whether the edge that discernment unit 16 can accurately discern wafer 20 places in specific region, then passes through robotic arm cooperation adjustment wafer 20 places the position and carries out physical centering to wafer 20 again until the edge of wafer 20 is located specific region, and this application has avoided the problem that the physics in-process that TAIKO ring cuts the physical centering in-process crushed support ring body 22 and/or attenuate wafer main part 21 and thereby lead to the wafer fragmentation under the condition of the attenuate wafer main part 21 that does not need direct contact wafer.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. This need not be, nor should it be exhaustive of all embodiments. And obvious variations or modifications of the invention are intended to be covered by the present invention.
Claims (10)
1. A TAIKO ring taking device is characterized in that the TAIKO ring taking device performs ring cutting and ring taking operation on a wafer; the wafer comprises: the wafer thinning device comprises a thinned wafer main body and a support ring body surrounding the thinned wafer main body; the back of the wafer is provided with an adhesive film; the TAIKO contraceptive ring removing device comprises:
a ring taking workbench;
the iron ring is arranged around the wafer and used for fixing the adhesive film to bear the wafer;
the adsorption platform is placed on the ring taking workbench and used for adsorbing the wafer;
the mechanical arm is used for placing the wafer on the adsorption platform and is also used for physically centering the wafer;
the identification unit is used for identifying whether the edge of the wafer is placed in a specific area or not and feeding back the edge data information of the wafer to the rear-stage unit;
the clamping jaw is used for rotationally taking down the support ring body after the circular cutting of the wafer is completed; wherein the identification unit is mounted on the clamping jaw, and the scanning area of the identification unit at least comprises the edge area of the wafer; the identification unit identifies whether the edge of the wafer is placed in a specific area or not under the driving of the rotation of the clamping jaw.
2. The TAIKO annuloplasty device of claim 1, further comprising: the processing unit is electrically connected with the identification unit and is used for receiving the edge data information output by the identification unit and adjusting the placement coordinates of the wafer according to the edge data information; the processing unit is further used for feeding back the placing coordinates to the mechanical arm so that the mechanical arm can be used for physically centering the wafer again.
3. The TAIKO contraceptive ring removal device of claim 2, further comprising: and the blade is used for circular cutting of the wafer so as to separate the thinned wafer main body from the support ring body.
4. The TAIKO ring extractor of claim 3, wherein the edge data information comprises: edge offset for each point on the wafer edge.
5. The TAIKO annuloplasty device of claim 4, wherein the TAIKO annuloplasty device is configured to:
if the edge offset is larger than 300 mu m, the processing unit adjusts the placing coordinate of the wafer; according to the placing coordinates fed back by the processing unit, the mechanical arm physically and again centers the wafer;
if the edge offset is less than or equal to 300 mu m, the blade separates the support ring body from the thinned wafer main body; the clamping jaw rotates to take down the supporting ring body.
6. The TAIKO ring extraction device of claim 1, wherein the jaw comprises: the clamping jaw comprises a plurality of clamping jaw bodies and connecting rods, the clamping jaw bodies are uniformly distributed on a circular ring, the connecting rods are used for connecting all the clamping jaw bodies, and the identification unit is installed on the clamping jaw bodies.
7. The TAIKO contraceptive ring removal device of claim 1, further comprising: and the gasket is positioned at the bottom of the support ring body, and the gasket lifts the support ring body by lifting a certain height after the wafer is subjected to ring cutting and before the clamping jaws take the ring.
8. A ring removing method, characterized in that a wafer is subjected to a ring cutting and ring removing operation by using the TAIKO ring removing apparatus as claimed in any one of claims 1 to 7; the wafer comprises: the wafer thinning device comprises a thinned wafer main body and a support ring body surrounding the thinned wafer main body; the back of the wafer is provided with an adhesive film; the method for removing the intrauterine device comprises the following steps:
the first step is as follows: fixing the adhesive film by using an iron ring to bear the wafer;
the second step: placing the wafer on the adsorption platform by using a mechanical arm, and simultaneously carrying out physical centering on the wafer;
the third step: under the driving of the rotation of the clamping jaw, an identification unit is used for identifying whether the edge of the wafer is placed in a specific area or not and feeding back the edge data information of the wafer to a rear-stage unit; if the edge of the wafer is placed in a specific area, the supporting ring body is taken down by utilizing the rotation of the clamping jaw; and if the edge of the wafer is placed outside the specific area, returning to execute the second step.
9. The method according to claim 8, wherein the TAIKO ring extraction device comprises a processing unit electrically connected to the identification unit, and in the third step, the processing unit receives the edge data information output by the identification unit; if the edge of the wafer is placed outside the specific area, the processing unit adjusts the placement coordinate of the wafer according to the edge data information; and feeding back the adjusted placing coordinate to the mechanical arm to return to execute the second step.
10. The loop extraction method according to claim 9, wherein the edge data information comprises: edge offset of each point on the edge of the wafer; wherein,
if the edge offset is larger than 300 mu m, the processing unit adjusts the placing coordinate of the wafer; feeding back the adjusted placing coordinate to the mechanical arm to return to execute the second step;
and if the edge offset is less than or equal to 300 mu m, after the support ring body is separated from the thinned wafer main body, the clamping jaw rotates to take down the support ring body.
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| CN202210966418.2A CN115338993A (en) | 2022-08-12 | 2022-08-12 | TAIKO ring taking device and method |
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| CN202210966418.2A CN115338993A (en) | 2022-08-12 | 2022-08-12 | TAIKO ring taking device and method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116013819A (en) * | 2023-02-24 | 2023-04-25 | 长春光华微电子设备工程中心有限公司 | Information calibration method for TAIKO wafer transmission |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105514011A (en) * | 2015-12-31 | 2016-04-20 | 北京七星华创电子股份有限公司 | Mechanical arm and method for safely transferring silicon chips |
| CN113211664A (en) * | 2021-04-28 | 2021-08-06 | 华虹半导体(无锡)有限公司 | TAIKO ring taking device and method |
| CN114121770A (en) * | 2021-11-15 | 2022-03-01 | 华虹半导体(无锡)有限公司 | TAIKO ring taking fixing device and fixing method |
| CN114843178A (en) * | 2022-04-28 | 2022-08-02 | 华虹半导体(无锡)有限公司 | Ring taking method for Taiko thinned wafer |
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| CN105514011A (en) * | 2015-12-31 | 2016-04-20 | 北京七星华创电子股份有限公司 | Mechanical arm and method for safely transferring silicon chips |
| CN113211664A (en) * | 2021-04-28 | 2021-08-06 | 华虹半导体(无锡)有限公司 | TAIKO ring taking device and method |
| CN114121770A (en) * | 2021-11-15 | 2022-03-01 | 华虹半导体(无锡)有限公司 | TAIKO ring taking fixing device and fixing method |
| CN114843178A (en) * | 2022-04-28 | 2022-08-02 | 华虹半导体(无锡)有限公司 | Ring taking method for Taiko thinned wafer |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116013819A (en) * | 2023-02-24 | 2023-04-25 | 长春光华微电子设备工程中心有限公司 | Information calibration method for TAIKO wafer transmission |
| CN116013819B (en) * | 2023-02-24 | 2023-07-04 | 长春光华微电子设备工程中心有限公司 | Information calibration method for TAIKO wafer transmission |
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