CN115190739A - Composite cold plate structure and electronic equipment - Google Patents
Composite cold plate structure and electronic equipment Download PDFInfo
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- CN115190739A CN115190739A CN202210712153.3A CN202210712153A CN115190739A CN 115190739 A CN115190739 A CN 115190739A CN 202210712153 A CN202210712153 A CN 202210712153A CN 115190739 A CN115190739 A CN 115190739A
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- 239000002131 composite material Substances 0.000 title claims abstract description 80
- 239000007788 liquid Substances 0.000 claims abstract description 98
- 239000012530 fluid Substances 0.000 claims abstract description 82
- 230000017525 heat dissipation Effects 0.000 claims abstract description 62
- 238000005192 partition Methods 0.000 claims abstract description 39
- 230000000712 assembly Effects 0.000 claims description 6
- 238000000429 assembly Methods 0.000 claims description 6
- 230000003750 conditioning effect Effects 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 19
- 150000001875 compounds Chemical class 0.000 abstract description 7
- 238000001816 cooling Methods 0.000 description 27
- 239000002356 single layer Substances 0.000 description 16
- 238000005516 engineering process Methods 0.000 description 8
- 238000012546 transfer Methods 0.000 description 8
- 238000010622 cold drawing Methods 0.000 description 7
- 238000004891 communication Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000011161 development Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000033228 biological regulation Effects 0.000 description 3
- 239000002826 coolant Substances 0.000 description 3
- 239000000110 cooling liquid Substances 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 201000009240 nasopharyngitis Diseases 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 239000012809 cooling fluid Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application provides a composite cold plate structure and electronic equipment, wherein the composite cold plate structure comprises a liquid inlet, a liquid outlet and a cold plate assembly, the cold plate assembly comprises a cold plate body, a partition plate and a heat dissipation member, an accommodating cavity is formed in the cold plate body, the partition plate is positioned in the accommodating cavity so as to divide the accommodating cavity into a first cavity and a second cavity for fluid circulation, the extending direction of the partition plate is consistent with the extending direction of the cold plate body, and the heat dissipation member is arranged in the first cavity; the liquid inlet and the liquid outlet are both positioned on the cold plate body, the liquid inlet and the liquid outlet are respectively close to the two opposite ends of the extension direction of the cold plate body, the first cavity and the second cavity are both communicated with the liquid inlet, and the first cavity and the second cavity are both communicated with the liquid outlet. The application provides a compound cold plate structure's radiating effect is better.
Description
Technical Field
The application relates to the technical field of electronic equipment, in particular to a composite cold plate structure and electronic equipment.
Background
With the rapid development of 5G communication technology and edge calculation and the continuous evolution of the performance and service capability of data center equipment such as servers/switches, the power consumption of a single chip is also continuously and rapidly increased, and with the trend that the semiconductor manufacturing process tends to limit and the failure of moore's law, semiconductor chip manufacturers increasingly rely on the number of stacked chip cores to achieve the purpose of improving the performance of the chip, so that the increase of the power consumption of the chip is further promoted, and a heat dissipation technology with strong performance is needed to solve the heat dissipation of the chip with large power consumption.
At present, the large-power consumption chip is mainly radiated by a liquid cooling radiating technology, a cold plate type liquid cooling structure is the development direction of the current main liquid cooling technology, and the common cold plate type liquid cooling structure is a single-layer micro-channel cold plate type liquid cooling structure generally. Generally, the IT equipment comprises a plurality of chips and a heat dissipation unit, wherein the heat dissipation unit comprises a plurality of single-layer micro-channel cold plate type liquid cooling structures, the single-layer micro-channel cold plate type liquid cooling structures are arranged in a one-to-one correspondence mode with the chips, the single-layer micro-channel cold plate type liquid cooling structures are connected in series, and cooling liquid sequentially flows through the single-layer micro-channel cold plate type liquid cooling structures to finally flow out of the IT equipment after the heat dissipation of the chips corresponding to the single-layer micro-channel cold plate type liquid cooling structures is given.
However, the downstream end of the serial single-layer micro-channel cold plate type liquid cooling structure has poor heat dissipation effect.
Disclosure of Invention
Based on this, this application provides a compound cold drawing structure and electronic equipment, and the radiating effect of compound cold drawing structure is better.
In a first aspect, the application provides a composite cold plate structure, which comprises a liquid inlet, a liquid outlet and a cold plate assembly, wherein the cold plate assembly comprises a cold plate body, a partition plate and a heat dissipation member, an accommodating cavity is formed in the cold plate body, the partition plate is positioned in the accommodating cavity to divide the accommodating cavity into a first cavity and a second cavity for fluid circulation, the extending direction of the partition plate is consistent with the extending direction of the cold plate body, and the heat dissipation member is arranged in the first cavity;
the liquid inlet and the liquid outlet are both positioned on the cold plate body, the liquid inlet and the liquid outlet are respectively close to two opposite ends of the extension direction of the cold plate body, the first cavity and the second cavity are both communicated with the liquid inlet, and the first cavity and the second cavity are both communicated with the liquid outlet.
In one possible implementation manner, the composite cold plate structure provided by the present application includes a cold plate body having a first side surface and a second side surface opposite to each other, a partition plate located between the first side surface and the second side surface, a first chamber located between the first side surface and the partition plate, and a second chamber located between the second side surface and the partition plate;
the distance between the second side surface and the partition plate is less than or equal to the distance between the first side surface and the partition plate.
In a possible implementation manner, the composite cold plate structure provided by the application further includes an impedance adjusting member, the impedance adjusting member is disposed in the second chamber or in the liquid inlet, and the impedance adjusting member is used for adjusting the fluid impedance of the second chamber.
In a possible implementation manner, in the composite cold plate structure provided by the present application, the impedance adjusting element includes at least one first adjusting block, an extending direction of the first adjusting block is consistent with an extending direction of the second chamber, the at least one first adjusting block is located in the second chamber, and the first adjusting block is connected to an inner wall of the second chamber.
In a possible implementation manner, in the composite cold plate structure provided by the application, the number of the first adjusting blocks is two, the two first adjusting blocks are arranged oppositely, and a first channel for fluid circulation is formed between the two first adjusting blocks.
In a possible implementation manner, the composite cold plate structure provided by the application, the impedance adjusting part comprises at least one second adjusting block, the extending direction of the second adjusting block is consistent with the extending direction of the liquid inlet, the at least one second adjusting block is located on one side of the liquid inlet, which deviates from the first cavity, and the second adjusting block is connected with the inner wall of the liquid inlet.
In a possible implementation, the composite cold plate structure provided by the application, the impedance adjusting piece is an adjusting plate, the adjusting plate is located in the first cavity, an included angle is formed between the extending direction of the adjusting plate and the extending direction of the first cavity, the side edge of the impedance adjusting plate is connected with the inner wall of the second cavity, a plurality of impedance adjusting holes are formed in the adjusting plate, and each impedance adjusting hole forms a plurality of second channels for fluid circulation.
In one possible implementation, the composite cold plate structure provided by the present application, the heat sink is a microchannel fin.
In a second aspect, the present application provides an electronic device comprising a chip assembly and at least one composite cold plate structure provided in the first aspect above, the composite cold plate structure overlying the chip assembly.
In a possible implementation manner, the electronic device provided by the application has the advantages that the number of the chip assemblies is at least two, the chip assemblies comprise chips, the number of the composite cold plate structures is at least two, the composite cold plate structures cover the chips, the composite cold plate structures are arranged in one-to-one correspondence with the chips, and the composite cold plate structures are sequentially communicated.
The utility model provides a compound cold drawing structure and electronic equipment, compound cold drawing structure is used for supplying the fluid circulation through holding the chamber in this internal setting of cold plate, sets up inlet and liquid outlet through near relative both ends at cold plate body extending direction to make the fluid get into through the inlet and hold the intracavity, and flow out from the liquid outlet. Set up the baffle through this internal cold drawing to will hold the chamber and divide for first cavity and second cavity, first cavity is used for holding radiating piece and supplies the fluid circulation, and radiating piece is used for the heat dissipation. The second chamber is used for supplying fluid to circulate so as to adjust the fluid flow of the first chamber, thereby improving the heat dissipation effect of the heat dissipation piece, and in the serial composite cold plate structure, the second chamber at the upstream end can provide low-temperature fluid for the first chamber at the downstream end so as to improve the heat dissipation effect of the heat dissipation piece at the downstream end, thereby enabling the heat dissipation effect of each heat dissipation piece in the serial composite cold plate structure to be more uniform. Therefore, the composite cold plate structure has a good heat dissipation effect.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure;
FIG. 2 is a schematic diagram of the composite cold plate structure and chip assembly of FIG. 1;
fig. 3 is a first schematic structural diagram illustrating a composite cold plate structure and a chip assembly in an electronic device according to an embodiment of the present disclosure;
FIG. 4 is a front view of FIG. 3;
fig. 5 is a second schematic structural diagram of a composite cold plate structure and a chip assembly in an electronic device according to an embodiment of the present disclosure;
FIG. 6 is a front view of FIG. 5;
fig. 7 is a third schematic structural diagram of a composite cold plate structure and a chip assembly in an electronic device according to an embodiment of the present disclosure;
FIG. 8 is a front view of FIG. 7;
fig. 9 is a fourth schematic structural view illustrating a composite cold plate structure and a chip assembly in an electronic device according to an embodiment of the present disclosure;
fig. 10 is a fifth schematic structural view of a composite cold plate structure and a chip assembly in an electronic device according to an embodiment of the present disclosure;
fig. 11 is a front view of fig. 10.
Description of the reference numerals:
100-composite cold plate configuration;
110-a liquid inlet;
120-a liquid outlet;
130-a cold plate assembly; 131-a cold plate body; 1311-a first chamber; 1312-a second chamber; 132-a separator; 133-a heat sink;
140-an impedance adjusting member; 141-a first conditioning block; 142-a second conditioning block; 143-adjusting plate;
150-a first channel;
160-a second channel;
200-a chip assembly;
210-a chip; 220-a circuit board; 230-heat transfer plates;
300-a tubing assembly;
310-a liquid inlet pipe; 320-a liquid outlet pipe; 330-connecting pipe.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application clearer, the technical solutions in the embodiments of the present application will be described in more detail below with reference to the accompanying drawings in the preferred embodiments of the present application. In the drawings, the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. The described embodiments are a subset of the embodiments in the present application and not all embodiments in the present application. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present application and should not be construed as limiting the present application. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application. Embodiments of the present application will be described in detail below with reference to the accompanying drawings.
In the description of the present application, it should be noted that unless otherwise specifically stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may for example be fixed or indirectly connected through intervening media, or may be interconnected between two elements or may be in the interactive relationship between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations and positional relationships based on the drawings, are only for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application.
The terms "first," "second," and "third" (if any) in the description and claims of this application and the above-described drawings are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein.
Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or display that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or display.
With the rapid development of 5G communication technology and edge calculation and the continuous evolution of the performance and service capability of data center equipment such as servers/switches, the power consumption of a single chip is also continuously and rapidly increased, and with the trend that the semiconductor manufacturing process tends to limit and the failure of moore's law, semiconductor chip manufacturers increasingly rely on the number of stacked chip cores to achieve the purpose of improving the performance of the chip, so that the increase of the power consumption of the chip is further promoted, and a heat dissipation technology with strong performance is needed to solve the heat dissipation of the chip with large power consumption.
At present, the large-power consumption chip is mainly radiated by a liquid cooling radiating technology, a cold plate type liquid cooling structure is the development direction of the current main liquid cooling technology, and the common cold plate type liquid cooling structure is a single-layer micro-channel cold plate type liquid cooling structure generally. Generally, the IT equipment comprises a plurality of chips and a heat dissipation unit, wherein the heat dissipation unit comprises a plurality of single-layer micro-channel cold plate type liquid cooling structures, the single-layer micro-channel cold plate type liquid cooling structures are arranged in a one-to-one correspondence mode with the chips, the single-layer micro-channel cold plate type liquid cooling structures are connected in series, and cooling liquid sequentially flows through the single-layer micro-channel cold plate type liquid cooling structures to finally flow out of the IT equipment after the heat dissipation of the chips corresponding to the single-layer micro-channel cold plate type liquid cooling structures is given.
However, the downstream end of the serial single-layer micro-channel cold plate type liquid cooling structure has poor heat dissipation effect. This is because the coolant absorbs the heat that the chip produced from the inlet end gradually, and the temperature of coolant is constantly rising, and the chip that is located the low reaches end, the chip that is far away from the inlet end more promptly, and the coolant temperature in the individual layer microchannel cold plate formula liquid cooling structure that corresponds with it is higher, and is more unfavorable to the heat dissipation of chip itself, can even take place the risk of chip overtemperature. And because the power of each chip is not uniform in size, the heat dispersion performance of the single-layer micro-channel cold plate type liquid cooling structure cannot be adjusted according to the power of the chip, and therefore the heat dispersion effect of the single-layer micro-channel cold plate type liquid cooling structure is poor.
Based on this, this application provides a compound cold drawing structure and electronic equipment, and the radiating effect of compound cold drawing structure is better.
The technical solutions of the composite cold plate structure and the electronic device provided in the embodiments of the present application are described in detail below with reference to the accompanying drawings.
Referring to fig. 1, an electronic device according to an embodiment of the present disclosure includes at least one composite cold plate structure 100 and a chip assembly 200, wherein the composite cold plate structure 100 covers the chip assembly 200.
It is understood that the electronic device may be a computer, a server, a data center, etc., but the embodiment is not limited thereto, and the composite cold plate structure 100 covers the chip assembly 200, and the composite cold plate structure 100 may absorb heat generated by the operation of the chip assembly 200, thereby dissipating heat from the chip assembly 200.
Referring to fig. 1 and 2, in some embodiments, the number of the chip assemblies 200 is at least two, the chip assemblies 200 include at least two chips 210, the composite cold plate structures 100 cover the chips 210, the composite cold plate structures 100 are disposed in one-to-one correspondence with the chips 210, and the composite cold plate structures 100 are sequentially communicated with each other.
It is understood that the chip assembly 200 may further include a circuit board 220 and a heat transfer plate 230, the chip 210 is located between the circuit board 220 and the heat transfer plate 230, the composite cold plate structure 100 covers the heat transfer plate 230, the heat transfer plate 230 is used for transferring heat of the chip 210 to the composite cold plate structure 100, and the composite cold plate structure 100 absorbs heat of the chip 210, thereby dissipating heat and cooling the chip 210.
The heat transfer plate 230 may be made of TIM (Thermal Interface Material) Material such as high Thermal conductivity gasket or Thermal conductive gel.
The electronic device may further include a tube assembly 300, the tube assembly 300 including an inlet tube 310, an outlet tube 320, and at least one connecting tube 330, the connecting tube 330 being disposed corresponding to the composite cold plate structure 100, the inlet tube 310 being in communication with the first composite cold plate structure 100, the outlet tube 320 being in communication with the last composite cold plate structure 100, the connecting tube 330 being in communication with the first composite cold plate structure 100 and the last composite cold plate structure 100.
Therefore, each composite cold plate structure 100 is sequentially communicated to form the composite cold plate structures 100 in series, fluid enters from the first composite cold plate structure 100 and flows out from the last composite cold plate structure 100, the composite cold plate structure 100 of the embodiment of the application can reduce the temperature of the fluid in the composite cold plate structure 100 far away from the liquid inlet pipe 310, so that the temperature of the fluid in each composite cold plate structure 100 is more uniform, and the heat dissipation performance of the composite cold plate structure 100 far away from the liquid inlet pipe 310 is improved.
It should be understood that the composite cold plate structure 100 may also be used to cool and dissipate heat for other devices requiring heat dissipation. For convenience of illustration, the composite cold plate structure 100 is used to dissipate heat from the chip 210 in the embodiments of the present application. The chip 210 may be a CPU, a GPU, an LED, or a high-energy high-frequency electronic chip, which is not limited in this embodiment.
Referring to fig. 2 to 4, in particular, the composite cold plate structure 100 provided in the embodiment of the present disclosure includes a liquid inlet 110, a liquid outlet 120, and a cold plate assembly 130, where the cold plate assembly 130 includes a cold plate body 131, a partition plate 132, and a heat dissipation member 133, a receiving cavity is disposed in the cold plate body 131, the partition plate 132 is located in the receiving cavity to divide the receiving cavity into a first cavity 1311 and a second cavity 1312 for fluid flowing through, an extending direction of the partition plate 132 is identical to an extending direction of the cold plate body 131, and the heat dissipation member 133 is disposed in the first cavity 1311.
The liquid inlet 110 and the liquid outlet 120 are both located on the cold plate body 131, the liquid inlet 110 and the liquid outlet 120 are respectively close to two opposite ends of the extension direction of the cold plate body 131, the first cavity 1311 and the second cavity 1312 are both communicated with the liquid inlet 110, and the first cavity 1311 and the second cavity 1312 are both communicated with the liquid outlet 120.
In the present application, the liquid inlet 110 and the liquid outlet 120 are used to communicate with the pipeline assembly 300, the liquid inlet 110 and the liquid outlet 120 are respectively close to two opposite ends of the extension direction of the cold plate body 131, so that the fluid enters the cold plate body 131 through the liquid inlet 110, and flows out of the cold plate body 131 through the liquid outlet 120, a receiving cavity is provided in the cold plate body 131, the receiving cavity is used for flowing the fluid, so that the fluid sequentially flows through the liquid inlet 110, the receiving cavity and the liquid outlet 120, and the receiving cavity is divided into a first cavity 1311 and a second cavity 1312 by a partition 132, the second cavity 1312 is located on a side of the first cavity 1311 away from the chip 210, that is, the first cavity 1311 is close to the chip 210, and the heat sink 133 is located in the first cavity 1311, so that when the fluid flows through the heat sink 133, the heat sink 133 absorbs heat from the chip 210, thereby dissipating heat and cooling the chip 210. The second chamber 1312 is used for regulating the fluid flow in the first chamber 1311, and when the power of the chip 210 is higher, the heat dissipation effect of the composite cold plate structure 100 may be improved by making the fluid flow in the second chamber 1312 corresponding to the chip 210 smaller than the fluid flow in the first chamber 1311 corresponding to the chip 210, that is, the fluid circulates more through the first chamber 1311, so that the heat dissipation member 133 absorbs and takes away more heat.
It can be understood that when a plurality of composite cold plate structures 100 are connected in series, a fluid sequentially flows through the first chamber 1311 and the second chamber 1312 of each composite cold plate structure 100, and each fluid flows through one composite cold plate structure 100, since the fluid in the first chamber 1311 absorbs heat of the chip 210, the temperature of the fluid in the first chamber 1311 will rise, and the fluid in the second chamber 1312 does not absorb heat of the chip 210, and the temperature of the fluid in the second chamber 1312 is lower, the second chamber 1312 near the liquid outlet pipe 320 may provide a low-temperature fluid for the first chamber 1311 far from the liquid inlet pipe 310, so as to lower the temperature of the fluid in the first chamber 1311 far from the liquid inlet pipe 310, so that the heat sink 133 in the first chamber 1311 far from the liquid inlet pipe 310 absorbs more heat, and thus improve the heat dissipation effect of the composite cold plate structure 100 far from the liquid inlet pipe 310.
Wherein the fluid is a cooling fluid, the fluid flowing in the direction indicated by the arrows in fig. 2 and 3.
The composite cold plate structure 100 of the present embodiment is used for fluid circulation by providing a receiving cavity in the cold plate body 131, and providing a liquid inlet 110 and a liquid outlet 120 near opposite ends of the extending direction of the cold plate body 131, so that fluid enters the receiving cavity through the liquid inlet 110 and flows out from the liquid outlet 120. The first chamber 1311 is used to house the heat sink 133 and to circulate the fluid, and the heat sink 133 is used to dissipate heat, by providing a partition 132 within the cold plate body 131 to divide the housing chamber into a first chamber 1311 and a second chamber 1312. The second chamber 1312 is used for fluid circulation to adjust the fluid flow rate of the first chamber 1311, so as to improve the heat dissipation effect of the heat dissipation member 133, and in the serial composite cold plate structures 100, the second chamber 1312 at the upstream end may provide the first chamber 1311 at the downstream end with a low-temperature fluid, so as to improve the heat dissipation effect of the heat dissipation member 133 at the downstream end, so as to make the heat dissipation effect of each heat dissipation member 133 in the serial composite cold plate structures 100 more uniform. Therefore, the composite cold plate structure 100 has a good heat dissipation effect.
In some embodiments, the cold plate body 131 has first and second opposing sides, the partition 132 is positioned between the first and second sides, the first chamber 1311 is positioned between the first side and the partition 132, and the second chamber 1312 is positioned between the second side and the partition 132. The distance between the second side and the partition 132 is less than or equal to the distance between the first side and the partition 132.
Thus, the receiving chamber may be divided into a first chamber 1311 and a second chamber 1312 by the partition 132, thereby regulating the flow rate of the fluid in the first chamber 1311 through the second chamber 1312.
Specifically, the distance between the second side surface and the partition 132 may be smaller than or equal to the distance between the first side surface and the partition 132. Thus, the fluid impedance of the second chamber 1312 is larger than that of the first chamber 1311, and under the condition that the total flow rate of the fluid is constant, the fluid entering from the liquid inlet 110 flows more through the first chamber 1311 to the liquid outlet 120, so that the fluid absorbs more heat, thereby improving the heat dissipation effect of the heat dissipation member 133.
In this manner, the distance between the second side surface and the partition plate 132 and the distance between the first side surface and the partition plate 132 may be determined according to the heat dissipation power of the heat dissipation member 133. That is, when the heat dissipation power required by the heat dissipation member 133 is large, the distance between the second side surface and the partition plate 132 may be made much smaller than the distance between the first side surface and the partition plate 132 to increase the fluid impedance of the second chamber 1312, thereby increasing the flow rate of the fluid in the first chamber 1311 to improve the heat dissipation effect of the heat dissipation member 133. When heat dissipation power required by heat sink 133 is small, the distance between second side and partition 132 may be made equal to the distance between first side and partition 132 to approximate the magnitude of the fluid impedance of first chamber 1311 and the magnitude of the fluid impedance of second chamber 1312, thereby approximating the fluid flow rates within first chamber 1311 and within second chamber 1312 to reduce the heat dissipation power of heat sink 133.
Referring to fig. 2 and 5 to 11, in one possible implementation, the composite cold plate structure 100 provided in the embodiment of the present application further includes an impedance adjusting unit 140, the impedance adjusting unit 140 is disposed in the second chamber 1312 or the liquid inlet 110, and the impedance adjusting unit 140 is configured to adjust a fluid impedance of the second chamber 1312.
In this manner, the fluid impedance of the second chamber 1312 may be adjusted by the impedance adjusting member 140, or the impedance of the fluid entering the second chamber 1312 through the inlet port 110 may be adjusted by the impedance adjusting member 140, and thus, the impedance of the fluid of the second chamber 1312 may be adjusted by the impedance adjusting member 140, and thus the flow rate of the fluid of the first chamber 1311 may be adjusted according to the heat dissipation power of the heat dissipation member 133. That is, when the heat dissipation performance required by heat dissipation member 133 is large, the fluid impedance of second chamber 1312 is adjusted by impedance adjusting element 140 so that the fluid impedance of second chamber 1312 is large, so that the flow rate of the fluid in first chamber 1311 is increased, thereby improving the heat dissipation performance of heat dissipation member 133. When the heat dissipation power required by heat sink 133 is small, the fluid impedance of second chamber 1312 may be adjusted by impedance adjusting element 140 so that the fluid impedance of second chamber 1312 is small, so that the flow rate of the fluid in first chamber 1311 is appropriately reduced, thereby reducing the heat dissipation power of heat sink 133.
Referring to fig. 5 to 8, in one possible implementation manner, the impedance adjusting part 140 includes at least one first adjusting block 141, an extending direction of the first adjusting block 141 is the same as an extending direction of the second chamber 1312, the at least one first adjusting block 141 is located in the second chamber 1312, and the first adjusting block 141 is connected to an inner wall of the second chamber 1312.
Thus, the flow rate of the fluid in the first chamber 1311 is adjusted by providing an adjustment block in the second chamber 1312 to adjust the cross-sectional area of the flow path of the fluid in the second chamber 1312, thereby adjusting the impedance of the fluid in the second chamber 1312.
In some embodiments, the number of the first adjusting blocks 141 is two, two first adjusting blocks 141 are oppositely disposed, and a first channel 150 for fluid communication is formed between the two first adjusting blocks 141.
Referring to fig. 2, 5 and 6, it can be understood that one of the two first regulation blocks 141 may be disposed on the partition 132 and the other may be disposed on the second side such that the two first regulation blocks 141 are disposed opposite to each other, and the cross-sectional area of the first passage 150 is adjusted by the two first regulation blocks 141 to adjust the fluid resistance of the second chamber 1312, thereby adjusting the fluid flow rate in the first chamber 1311.
Referring to fig. 2, 7 and 8, alternatively, two first adjusting blocks 141 are respectively disposed at opposite sides of the second chamber 1312 in the fluid flow direction such that the two first adjusting blocks 141 are disposed opposite to each other, and the cross-sectional area of the first passage 150 is adjusted by the two first adjusting blocks 141 to adjust the fluid resistance of the second chamber 1312, thereby adjusting the fluid flow rate in the first chamber 1311.
Referring to fig. 9, in one possible implementation manner of the composite cold plate structure 100 provided by the present application, the impedance adjusting member 140 includes at least one second adjusting block 142, the extending direction of the second adjusting block 142 is the same as the extending direction of the inlet 110, the at least one second adjusting block 142 is located at a side of the inlet 110 away from the first chamber 1311, and the second adjusting block 142 is connected to the inner wall of the inlet 110.
Therefore, the second adjusting block 142 is arranged on the side, away from the first chamber 1311, of the liquid inlet 110, so that the resistance of the fluid in the liquid inlet 110 entering the second chamber 1312 is increased, the fluid resistance of the second chamber 1312 is further increased, the fluid flow rate of the first chamber 1311 is increased, and the heat dissipation effect of the heat dissipation member 133 is improved.
Referring to fig. 2, 10 and 11, in one possible implementation, the impedance adjusting member 140 is an adjusting plate 143, the adjusting plate 143 is located in the first chamber 1311, an extending direction of the adjusting plate 143 forms an included angle with an extending direction of the first chamber 1311, a side of the impedance adjusting plate 143 is connected to an inner wall of the second chamber 1312, and the adjusting plate 143 has a plurality of impedance adjusting holes, each of which forms a plurality of second channels 160 for fluid to flow through.
It is understood that the adjusting plate 143 may be disposed at any position in the second chamber 1312, that is, the adjusting plate 143 may be disposed at one end of the second chamber 1312 close to the liquid inlet 110, the adjusting plate 143 may be disposed at one end of the second chamber 1312 close to the liquid outlet 120, or the adjusting plate 143 may be disposed between two ends of the second chamber 1312 in the extending direction, as long as the fluid flows through the liquid inlet 110, the second channels 160 and the liquid outlet 120 in sequence, which is not limited in this embodiment.
In this way, the fluid impedance of the second chamber 1312 can be adjusted by arranging the adjusting plate 143 in the second chamber 1312, and in particular, the fluid impedance of the second chamber 1312 can be adjusted by adjusting the number of the impedance adjusting holes, so that the adjustment is simple and convenient. That is, the fluid resistance of the second chamber 1312 is greater as the number of resistance adjustment holes of the adjustment plate 143 is greater, and the fluid resistance of the second chamber 1312 is smaller as the number of resistance adjustment holes of the adjustment plate 143 is smaller.
In some embodiments, heat sink 133 is a microchannel fin.
The microchannel fins have the advantages of small volume, compact structure and high heat transfer coefficient, and the microchannel fins are selected as the heat dissipation members 133 to effectively absorb the heat of the chip 210 and transfer the heat to the cooling liquid, so that the chip 210 is effectively dissipated.
Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.
Claims (10)
1. A composite cold plate structure is characterized by comprising a liquid inlet, a liquid outlet and a cold plate assembly, wherein the cold plate assembly comprises a cold plate body, a partition plate and a heat dissipation member, an accommodating cavity is formed in the cold plate body, the partition plate is positioned in the accommodating cavity so as to divide the accommodating cavity into a first cavity and a second cavity for fluid circulation, the extending direction of the partition plate is consistent with the extending direction of the cold plate body, and the heat dissipation member is arranged in the first cavity;
the liquid inlet and the liquid outlet are both located on the cold plate body, the liquid inlet and the liquid outlet are respectively close to two opposite ends of the extension direction of the cold plate body, the first cavity and the second cavity are both communicated with the liquid inlet, and the first cavity and the second cavity are both communicated with the liquid outlet.
2. The composite cold plate structure according to claim 1, wherein the cold plate body has first and second opposing sides, the partition is located between the first and second sides, the first chamber is located between the first side and the partition, and the second chamber is located between the second side and the partition;
the distance between the second side surface and the partition plate is smaller than or equal to the distance between the first side surface and the partition plate.
3. The composite cold plate structure of claim 2, further comprising an impedance adjustment disposed within said second chamber or within said inlet port, said impedance adjustment for adjusting a fluid impedance of said second chamber.
4. The composite cold plate structure of claim 3, wherein the impedance adjustment member includes at least one first adjustment block, the first adjustment block extends in a direction that is consistent with the direction of extension of the second chamber, the at least one first adjustment block is located within the second chamber, and the first adjustment block is connected to an inner wall of the second chamber.
5. The composite cold plate structure of claim 4, wherein the number of the first conditioning blocks is two, the two first conditioning blocks are disposed opposite each other, and a first passage is formed between the two first conditioning blocks for the fluid to flow through.
6. The composite cold plate structure of claim 3, wherein the impedance adjusting member comprises at least one second adjusting block, an extending direction of the second adjusting block is consistent with an extending direction of the liquid inlet, the at least one second adjusting block is located on a side of the liquid inlet facing away from the first chamber, and the second adjusting block is connected with an inner wall of the liquid inlet.
7. The composite cold plate structure of claim 3, wherein the impedance adjustment member is an adjustment plate positioned within the first chamber, an angle is formed between a direction of extension of the adjustment plate and a direction of extension of the first chamber, and a side of the impedance adjustment plate is connected to an inner wall of the second chamber, the adjustment plate having a plurality of impedance adjustment holes thereon, each of the impedance adjustment holes forming a plurality of second channels for the fluid to flow through.
8. The composite cold plate structure according to any one of claims 1 to 7, wherein the heat sink is a micro-channel fin.
9. An electronic device comprising a chip assembly and at least one composite cold plate structure according to any one of claims 1 to 8 overlying the chip assembly.
10. The electronic device of claim 9, wherein the number of the chip assemblies is at least two, the chip assemblies comprise chips, the number of the composite cold plate structures is at least two, the composite cold plate structures cover the chips, the composite cold plate structures are arranged in one-to-one correspondence with the chips, and each composite cold plate structure is sequentially communicated.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210712153.3A CN115190739A (en) | 2022-06-22 | 2022-06-22 | Composite cold plate structure and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210712153.3A CN115190739A (en) | 2022-06-22 | 2022-06-22 | Composite cold plate structure and electronic equipment |
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| CN115190739A true CN115190739A (en) | 2022-10-14 |
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| CN202210712153.3A Pending CN115190739A (en) | 2022-06-22 | 2022-06-22 | Composite cold plate structure and electronic equipment |
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| TW201310872A (en) * | 2011-08-19 | 2013-03-01 | Inventec Corp | Coolant pipe of sever rack |
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| CN113597202A (en) * | 2021-06-30 | 2021-11-02 | 联想(北京)有限公司 | Cold drawing and electronic equipment |
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2022
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| TW201310872A (en) * | 2011-08-19 | 2013-03-01 | Inventec Corp | Coolant pipe of sever rack |
| CN111726970A (en) * | 2020-07-06 | 2020-09-29 | 深圳比特微电子科技有限公司 | Liquid cooling heat abstractor, liquid cooling electronic equipment and liquid cooling virtual currency digger |
| CN113597202A (en) * | 2021-06-30 | 2021-11-02 | 联想(北京)有限公司 | Cold drawing and electronic equipment |
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