CN221930559U - Air-cooled liquid-cooled combined heat radiator - Google Patents
Air-cooled liquid-cooled combined heat radiator Download PDFInfo
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- CN221930559U CN221930559U CN202420448885.0U CN202420448885U CN221930559U CN 221930559 U CN221930559 U CN 221930559U CN 202420448885 U CN202420448885 U CN 202420448885U CN 221930559 U CN221930559 U CN 221930559U
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- 238000001816 cooling Methods 0.000 claims abstract description 130
- 239000007788 liquid Substances 0.000 claims abstract description 85
- 239000000758 substrate Substances 0.000 claims abstract description 63
- 239000000110 cooling liquid Substances 0.000 claims abstract description 49
- 230000017525 heat dissipation Effects 0.000 claims abstract description 31
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims 1
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 239000002826 coolant Substances 0.000 description 12
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides an air-cooling and liquid-cooling combined type heat dissipating device, which comprises a shell and an air-cooling part, wherein the air-cooling part is arranged in the shell, and the shell comprises a high-temperature cooling liquid outlet current collecting plate, a low-temperature cooling liquid outlet current collecting plate, a left liquid cooling plate substrate, a right liquid cooling plate substrate, a liquid cooling plate cover plate and a connecting pipeline, and the air-cooling and liquid-cooling combined type heat dissipating device has the beneficial effects that: different heat dissipation modes can be adopted for electronic elements with different operation power consumption, and when the operation power consumption of the electronic equipment is lower, the electronic equipment can dissipate heat only by relying on an air cooling mode; when the electronic equipment operation consumption is higher, can adopt forced air cooling and liquid cooling to dispel the heat simultaneously, radiating efficiency is higher, simultaneously, carries out radiating liquid cooling board and the forced air cooling passageway of cooling liquid to electronic component and integrates as an organic whole, compact structure has reduced heat abstractor's space size and weight, satisfies heat abstractor's miniaturized and lightweight requirement.
Description
Technical Field
The utility model relates to the technical field of radiators, in particular to an air-cooling and liquid-cooling combined radiating device.
Background
With the rapid development of electronic components to a high integration direction, the heat flux density of electronic equipment is increased sharply due to the fact that the electronic components are larger in power and smaller in size, and therefore the working temperature of the electronic components is higher. Numerous studies have shown that the primary cause of failure of electronic devices is temperature induced, and that excessive temperatures can cause damage to the junction of the semiconductor and thus affect the life of the electronic components. Therefore, in order to ensure that the electronic component works within a reasonable temperature range, a higher requirement is put forward on a heat dissipation mode of the electronic component, and meanwhile, the space size of the heat dissipation system is more severely limited by the highly integrated and miniaturized electronic equipment, so that the heat dissipation system is miniaturized to meet the space requirement. At present, heat dissipation is mainly realized on high-power density electronic components by a single heat dissipation mode, and when the power consumption of the electronic components changes, the heat dissipation mode is uneconomical and can cause waste of heat dissipation resources; and the traditional cooling and radiating system is complex and has large volume, so that the application of the radiating device is limited by space size, and the purpose of miniaturization cannot be achieved.
Disclosure of Invention
The utility model aims to solve the technical problems and provide the novel air-cooling and liquid-cooling combined type heat radiating device which can integrate a liquid cooling plate for radiating electronic elements and an air-cooling channel for cooling liquid into a whole, has a compact structure, reduces the space size and weight of the heat radiating device, and meets the requirements of miniaturization and light weight of the heat radiating device.
The utility model is realized by the following technical scheme:
The utility model provides an forced air cooling liquid cooling combination formula heat abstractor, includes casing, forced air cooling part, the inside forced air cooling part that is equipped with of casing, the casing includes high temperature coolant liquid outlet current collector, low temperature coolant liquid outlet current collector, left side liquid cooling plate base plate, right side liquid cooling plate base plate, liquid cooling plate apron, connecting tube, forced air cooling part top is equipped with high temperature coolant liquid outlet current collector, forced air cooling part bottom is equipped with low temperature coolant liquid outlet current collector, forced air cooling part both sides are equipped with left side liquid cooling plate base plate, right side liquid cooling plate base plate, be equipped with the liquid cooling plate apron on left side liquid cooling plate base plate and the right side liquid cooling plate base plate, be equipped with a plurality of pipeline through-hole on high temperature coolant liquid outlet current collector and the low temperature coolant liquid outlet current collector, forced air cooling part includes forced air cooling heat dissipation pipeline, radiating fin, be equipped with a plurality of radiating fin on the heat dissipation pipeline equally spaced apart from each other to be equipped with the space between every two radiating fin, the top of air cooling pipeline with pipeline through-hole on the high temperature coolant liquid outlet current collector is linked together, the bottom of air cooling pipeline with the low temperature coolant liquid outlet current collector plate is linked together through-hole on the liquid cooling plate board through-hole on the low temperature cooling pipeline outlet current collector plate, the left side liquid outlet current collector plate.
Further, collector plate inlet connectors are arranged at the two ends of the left side of the high-temperature cooling liquid outlet collector plate, and the collector plate inlet connectors are communicated with one end of the connecting pipeline.
Further, substrate outlet connectors are arranged above the left sides of the left liquid cooling plate substrate and the right liquid cooling plate substrate, substrate inlet connectors are arranged below the right sides of the left liquid cooling plate substrate and the right liquid cooling plate substrate, and substrate outlet connectors above the left sides of the left liquid cooling plate substrate and the right liquid cooling plate substrate are respectively communicated with the other ends of the connecting pipelines.
Further, flow channels are formed in the left liquid cooling plate substrate and the right liquid cooling plate substrate, one end of each flow channel is communicated with the substrate outlet connector, and the other end of each flow channel is communicated with the substrate inlet connector.
Further, a collector plate outlet joint is arranged in the middle of the low-temperature cooling liquid outlet collector plate, and the collector plate outlet joint is communicated with a pipeline through hole on the low-temperature cooling liquid outlet collector plate.
Further, the flow channel is serpentine in shape.
Further, the heat dissipation fin is in a wave shape, a flat plate shape or an L-shaped fin.
Further, the left liquid cooling plate substrate and the right liquid cooling plate substrate are integrally formed with the liquid cooling plate cover plate.
Further, the air-cooled heat dissipation pipeline and the heat dissipation fins are integrally formed.
The utility model has the beneficial effects that: different heat dissipation modes can be adopted for electronic elements with different operation power consumption, and when the operation power consumption of the electronic equipment is lower, the electronic equipment can dissipate heat only by relying on an air cooling mode; when the electronic equipment operation consumption is higher, can adopt forced air cooling and liquid cooling to dispel the heat simultaneously, radiating efficiency is higher, simultaneously, carries out radiating liquid cooling board and the forced air cooling passageway of cooling liquid to electronic component and integrates as an organic whole, compact structure has reduced heat abstractor's space size and weight, satisfies heat abstractor's miniaturized and lightweight requirement.
Drawings
FIG. 1 is a schematic diagram of an air-cooled liquid-cooled combined heat sink according to the present utility model;
FIG. 2 is a schematic diagram of an explosion structure of an air-cooled liquid-cooled combined heat sink according to the present utility model;
FIG. 3 is a schematic view showing the bottom view of the high temperature coolant outlet header plate of the present utility model;
FIG. 4 is a schematic view of a structure of a low temperature coolant outlet header plate according to the present utility model;
Reference numerals: 1. a housing; 11. a high-temperature cooling liquid outlet collector plate; 110. a collector plate inlet fitting; 12. a low-temperature cooling liquid outlet collector plate; 120. a collector plate outlet fitting; 121. a conduit through hole; 13. a left liquid cooling plate substrate; 130. a substrate outlet connector; 131. a substrate inlet fitting; 132. a flow channel; 14. a right liquid cooling plate substrate; 15. a liquid cooling plate cover plate; 16. a connecting pipeline; 2. an air cooling component; 21. an air-cooled heat dissipation pipeline; 22. and a heat radiating fin.
Detailed Description
The invention is further described with reference to the accompanying drawings and detailed description below:
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used in the description of the applications herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having" and any variations thereof in the description of the application and the claims and the description of the drawings above are intended to cover a non-exclusive inclusion. The terms first, second and the like in the description and in the claims or in the above-described figures, are used for distinguishing between different objects and not necessarily for describing a sequential or chronological order.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.
Referring to fig. 1-4, an air-cooled liquid-cooled combined heat dissipating device comprises a shell 1 and an air-cooled component 2, wherein the air-cooled component 2 is arranged in the shell 1, the shell 1 comprises a high-temperature cooling liquid outlet current collecting plate 11, a low-temperature cooling liquid outlet current collecting plate 12, a left liquid cooling plate substrate 13, a right liquid cooling plate substrate 14, a liquid cooling plate cover plate 15 and a connecting pipeline 16, the top of the air-cooled component 2 is provided with the high-temperature cooling liquid outlet current collecting plate 11, the bottom of the air-cooled component 2 is provided with the low-temperature cooling liquid outlet current collecting plate 12, both sides of the air-cooled component 2 are provided with the left liquid cooling plate substrate 13 and the right liquid cooling plate substrate 14, the left liquid cooling plate substrate 13 and the right liquid cooling plate substrate 14 are provided with the liquid cooling plate cover plate 15, the high-temperature cooling liquid outlet current collecting plate 11 and the low-temperature cooling liquid outlet current collecting plate 12 are provided with a plurality of pipeline through holes 121, the air cooling component 2 comprises an air cooling heat radiating pipeline 21 and heat radiating fins 22, the air cooling heat radiating pipeline 21 is provided with a plurality of heat radiating fins 22, the heat radiating fins 22 are distributed at equal intervals, gaps are arranged between every two heat radiating fins 22, the top of the air cooling heat radiating pipeline 21 is communicated with the pipeline through holes 121 on the high-temperature cooling liquid outlet current collecting plate 11, the bottom of the air cooling heat radiating pipeline 21 is communicated with the pipeline through holes 121 on the low-temperature cooling liquid outlet current collecting plate 12, and the high-temperature cooling liquid outlet current collecting plate 11 is respectively communicated with the left liquid cooling plate substrate 13 and the right liquid cooling plate substrate 14 through connecting pipelines 16.
Preferably, the left two ends of the high temperature cooling liquid outlet collecting plate 11 are provided with collecting plate inlet connectors 110, and the collecting plate inlet connectors 110 are communicated with one end of the connecting pipeline 16.
Preferably, the substrate outlet connectors 130 are disposed above the left sides of the left and right liquid-cooled substrates 13 and 14, the substrate inlet connectors 131 are disposed below the right sides of the left and right liquid-cooled substrates 13 and 14, and the substrate outlet connectors 130 above the left sides of the left and right liquid-cooled substrates 13 and 14 are respectively communicated with the other ends of the connecting pipes 16.
Preferably, the left liquid-cooled plate substrate 13 and the right liquid-cooled plate substrate 14 are internally provided with a flow channel 132, one end of the flow channel 132 is communicated with the substrate outlet joint 130, and the other end of the flow channel 132 is communicated with the substrate inlet joint 131.
Preferably, a collector plate outlet joint 120 is arranged in the middle of the low-temperature cooling liquid outlet collector plate 12, and the collector plate outlet joint 120 is communicated with a pipeline through hole 121 on the low-temperature cooling liquid outlet collector plate 12.
Preferably, the flow channel 132 is serpentine in shape.
Preferably, the heat dissipation fins 22 are wavy, flat or L-shaped fins.
Preferably, the left side liquid-cooling plate substrate 13 and the right side liquid-cooling plate substrate 14 are integrally formed with the liquid-cooling plate cover 15.
Preferably, the air-cooled heat dissipation duct 21 and the heat dissipation fins 22 are integrally formed.
The working principle is as follows: the electronic component is installed and is installed respectively in left side liquid cooling board base plate 13 and right side liquid cooling board base plate 14 upper surface, when electronic component operation consumption is less, only rely on the forced air cooling mode to dispel the heat, the heat that electronic component produced can carry out the heat conduction through left side liquid cooling board base plate 13 and right side liquid cooling board base plate 14 respectively, on transferring the radiating fin 22 that is connected with liquid cooling board apron 15 with heat, the cold air of certain flow and temperature gets into the forced air cooling passageway, takes away the heat that will transfer to in the radiating fin 22 through convection heat transfer, realize radiating purpose to electronic component.
When the operation power consumption of the electronic element is large, the electronic element radiates heat together by virtue of air cooling and liquid cooling, and part of heat generated by the electronic element conducts heat through the left liquid cooling plate substrate 13 and the right liquid cooling plate substrate 14 and is transferred to the radiating fins 22 connected with the liquid cooling plate cover plate 15; the other part of heat generated by the electronic component is absorbed by the cooling liquid, namely the cooling liquid flows into the liquid cooling plate cover plate 15, the heat generated by the electronic component is taken away by the low-temperature cooling liquid which enters the liquid cooling plate cover plate 15, the temperature of the low-temperature cooling liquid rises to become high-temperature cooling liquid after the heat absorption, and the high-temperature cooling liquid flows out from the substrate outlet connectors 130 arranged above the left side of the left liquid cooling plate substrate 13 and the right liquid cooling plate substrate 14 and is communicated with the high-temperature cooling liquid outlet collecting plate 11; under the action of pressure, the high-temperature coolant in the high-temperature coolant outlet header plate 11 flows into the pipe through-holes 121; the cold air with certain flow and temperature flows into the pipeline through holes 121 to dissipate heat of the high-temperature cooling liquid and the radiating fins 22 entering the air-cooled radiating pipeline, so that heat in the high-temperature cooling liquid and the radiating fins 22 is taken away, the temperature of the high-temperature cooling liquid is reduced to be low-temperature cooling liquid, the low-temperature cooling liquid flows into the low-temperature cooling liquid outlet current collecting plate 12, finally flows out of the current collecting plate outlet joint 120 and enters other devices of the radiating system, and the circulation of the whole cooling system is realized. The device can adopt different heat dissipation modes and high heat dissipation efficiency for electronic elements with different operation power consumption, and the liquid cooling plate for directly dissipating heat of the electronic elements and the air cooling channel for cooling the cooling liquid are integrated into a whole, so that the device has a compact structure, reduces the space size and weight of the heat dissipation device, and meets the requirements of miniaturization and light weight of the heat dissipation device.
Modifications and variations of the above embodiments will be apparent to those skilled in the art in light of the above teachings. Therefore, the utility model is not limited to the specific embodiments disclosed and described above, but some modifications and changes of the utility model should be also included in the scope of the claims of the utility model. In addition, although specific terms are used in the present specification, these terms are for convenience of description only and do not limit the present utility model in any way.
Claims (9)
1. An air-cooled liquid-cooled combined heat dissipating device is characterized in that: comprises a shell and an air cooling part, wherein the air cooling part is arranged in the shell, the shell comprises a high-temperature cooling liquid outlet current collecting plate, a low-temperature cooling liquid outlet current collecting plate, a left liquid cooling plate substrate, a right liquid cooling plate substrate, a liquid cooling plate cover plate and connecting pipelines, the top of the air cooling part is provided with the high-temperature cooling liquid outlet current collecting plate, the bottom of the air cooling part is provided with the low-temperature cooling liquid outlet current collecting plate, the two sides of the air cooling part are provided with the left liquid cooling plate substrate and the right liquid cooling plate substrate, the left liquid cooling plate substrate and the right liquid cooling plate substrate are provided with the liquid cooling plate cover plate, the high-temperature cooling liquid outlet current collecting plate and the low-temperature cooling liquid outlet current collecting plate are provided with a plurality of pipeline through holes, the air cooling component comprises an air cooling heat dissipation pipeline and heat dissipation fins, a plurality of heat dissipation fins are arranged on the air cooling heat dissipation pipeline and are distributed at equal intervals, gaps are formed between every two heat dissipation fins, the top of the air cooling heat dissipation pipeline is communicated with pipeline through holes on the high-temperature cooling liquid outlet current collecting plate, the bottom of the air cooling heat dissipation pipeline is communicated with pipeline through holes on the low-temperature cooling liquid outlet current collecting plate, and the high-temperature cooling liquid outlet current collecting plate is respectively communicated with the left-side liquid cooling plate substrate and the right-side liquid cooling plate substrate through connecting pipelines.
2. The air-cooled liquid-cooled combined heat sink of claim 1, wherein: and the two ends of the left side of the high-temperature cooling liquid outlet current collecting plate are provided with current collecting plate inlet connectors which are communicated with one end of the connecting pipeline.
3. The air-cooled liquid-cooled combined heat sink of claim 1, wherein: the substrate outlet connectors are arranged above the left sides of the left liquid cooling plate substrate and the right liquid cooling plate substrate, the substrate inlet connectors are arranged below the right sides of the left liquid cooling plate substrate and the right liquid cooling plate substrate, and the substrate outlet connectors above the left sides of the left liquid cooling plate substrate and the right liquid cooling plate substrate are respectively communicated with the other ends of the connecting pipelines.
4. The air-cooled liquid-cooled composite heat sink of claim 3, wherein: the left side liquid cooling board base plate and the right side liquid cooling board base plate are internally provided with flow channels, one ends of the flow channels are communicated with the base plate outlet connector, and the other ends of the flow channels are communicated with the base plate inlet connector.
5. The air-cooled liquid-cooled combined heat sink of claim 1, wherein: the middle part of the low-temperature cooling liquid outlet current collecting plate is provided with a current collecting plate outlet joint which is communicated with a pipeline through hole on the low-temperature cooling liquid outlet current collecting plate.
6. The air-cooled liquid-cooled combined heat sink of claim 4, wherein: the flow channel is serpentine in shape.
7. The air-cooled liquid-cooled combined heat sink of claim 1, wherein: the radiating fins are in the shape of wavy, flat-plate-shaped fins or L-shaped fins.
8. The air-cooled liquid-cooled combined heat sink of claim 1, wherein: the left side liquid cooling board base plate and the right side liquid cooling board base plate are integrally formed with the liquid cooling board cover plate.
9. The air-cooled liquid-cooled combined heat sink of claim 1, wherein: the air-cooled heat dissipation pipeline and the heat dissipation fins are integrally formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420448885.0U CN221930559U (en) | 2024-03-08 | 2024-03-08 | Air-cooled liquid-cooled combined heat radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420448885.0U CN221930559U (en) | 2024-03-08 | 2024-03-08 | Air-cooled liquid-cooled combined heat radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221930559U true CN221930559U (en) | 2024-10-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202420448885.0U Active CN221930559U (en) | 2024-03-08 | 2024-03-08 | Air-cooled liquid-cooled combined heat radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221930559U (en) |
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- 2024-03-08 CN CN202420448885.0U patent/CN221930559U/en active Active
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