CN115117093B - Display panel, manufacturing method thereof and display device - Google Patents
Display panel, manufacturing method thereof and display device Download PDFInfo
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- CN115117093B CN115117093B CN202210669327.2A CN202210669327A CN115117093B CN 115117093 B CN115117093 B CN 115117093B CN 202210669327 A CN202210669327 A CN 202210669327A CN 115117093 B CN115117093 B CN 115117093B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention discloses a display panel, a manufacturing method thereof and a display device, wherein the display panel comprises: the LED light-emitting device comprises a substrate, an insulating layer, an electrode layer and a light-emitting unit, wherein the insulating layer comprises a channel, two ends of the channel are communicated with one side, far away from the substrate, of the insulating layer, and an elastic insulating part is arranged in the channel. The elastic insulating part is stressed to deform, so that the light emitting surface of the bonded light emitting unit is parallel to the substrate, and the situation of poor bonding is avoided.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display panel, a manufacturing method thereof and a display device.
Background
Micro light emitting diode (Micro-LED) and Mini light emitting diode (Mini-LED) become one of the hot spots of display technology, and the Micro light emitting diode and Mini light emitting diode have the characteristics of self light emission, high resolution, high brightness, high light emitting efficiency, long service life, high response speed, power saving and the like, and are widely applied to the display fields of televisions, mobile phones, computers and the like.
For the micro light emitting diode display panel and the mini light emitting diode display panel, after the micro light emitting diode or the mini light emitting diode is manufactured, a large amount of light is transferred to the display substrate and is bound with the driving circuit on the display substrate.
However, in the prior art, after the micro light emitting diode or the mini light emitting diode is bound to the driving circuit, a problem that an included angle is formed between the light emitting surface of the micro light emitting diode or the mini light emitting diode and the display substrate may occur.
Accordingly, there is a need to provide a design that can improve the bonding problem of micro leds or mini leds.
Disclosure of Invention
In view of the above, the present invention provides a display panel, a manufacturing method thereof, and a display device for improving the bonding problem of micro light emitting diodes or mini light emitting diodes.
In one aspect, the present invention provides a display panel including:
A substrate;
The insulating layer is positioned on one side of the substrate, the insulating layer comprises a channel, two ends of the channel are communicated with one side, far away from the substrate, of the insulating layer, and an elastic insulating part is arranged in the channel;
An electrode layer, which is positioned on one side of the elastic insulating component far away from the substrate, and comprises a first connecting electrode and a second connecting electrode, wherein the orthographic projection of the first connecting electrode on the substrate at least partially overlaps with the orthographic projection of one end of the channel on the substrate, and the orthographic projection of the second connecting electrode on the substrate at least partially overlaps with the orthographic projection of the other end of the channel on the substrate;
The light-emitting unit is positioned on one side of the electrode layer far away from the insulating layer and comprises a first pin and a second pin, wherein the first pin is in contact with the first connecting electrode, and the second pin is in contact with the second connecting electrode.
In another aspect, the present invention provides a method of manufacturing a display panel, including:
Providing a substrate;
Forming a first insulating layer on one side of the substrate, and etching a first groove on one side of the first insulating layer away from the substrate;
filling the first groove with a filler;
forming a second insulating layer on one side of the first insulating layer far away from the substrate, etching one side of the second insulating layer far away from the first insulating layer to form a second groove and a third groove, wherein a space is reserved between the second groove and the third groove;
removing the filler, so that the first groove, the second groove and the third groove are communicated to form a channel;
filling an elastic insulating part into the channel;
Forming an electrode layer on one side of the second insulating layer far away from the first insulating layer, wherein the electrode layer comprises a first connecting electrode and a second connecting electrode, the first connecting electrode at least partially covers the second groove, and the second connecting electrode at least partially covers the third groove;
A light emitting unit is arranged on one side, far away from the second insulating layer, of the electrode layer, the light emitting unit comprises a first pin and a second pin, the first pin is in contact with the first connecting electrode, and the second pin is in contact with the second connecting electrode; if one side of the first connecting electrode far away from the second insulating layer and one side of the second connecting electrode far away from the second insulating layer are located in different planes, the elastic insulating part deforms, so that one side of the first connecting electrode far away from the second insulating layer and one side of the second connecting electrode far away from the second insulating layer are located in the same plane.
In yet another aspect, the present invention provides a display device including the display panel described above.
Compared with the prior art, the display panel provided by the invention has the advantages that at least the following beneficial effects are realized:
The display panel provided by the invention comprises: a substrate; the insulating layer is positioned on one side of the substrate, the insulating layer comprises a channel, two ends of the channel are communicated with one side of the insulating layer away from the substrate, and an elastic insulating part is arranged in the channel; the electrode layer is positioned on one side of the elastic insulating part, which is far away from the substrate, and comprises a first connecting electrode and a second connecting electrode, wherein the orthographic projection of the first connecting electrode on the substrate at least partially overlaps with the orthographic projection of one end of the channel on the substrate, and the orthographic projection of the second connecting electrode on the substrate at least partially overlaps with the orthographic projection of the other end of the channel on the substrate; the light-emitting unit is positioned on one side of the electrode layer far away from the insulating layer and comprises a first pin and a second pin, wherein the first pin is contacted with the first connecting electrode, and the second pin is contacted with the second connecting electrode. When the light-emitting unit is bound, the first connecting electrode is pressed down by the first pin of the light-emitting unit, the first connecting electrode is contacted with one end of the elastic insulating part, the second connecting electrode is pressed down by the second pin of the light-emitting unit, the second connecting electrode is contacted with the other end of the elastic insulating part, when one side of the first connecting electrode far away from the insulating layer and one side of the second connecting electrode far away from the insulating layer are positioned in different planes, the pressure applied by the first connecting electrode to the elastic insulating part is unequal to the pressure applied by the second connecting electrode to the elastic insulating part, and the pressure applied by the first connecting electrode and the pressure applied by the second connecting electrode to the elastic insulating part are acted on the elastic insulating part to deform the elastic insulating part, and the contact surface of the first connecting electrode and one end of the elastic insulating part and the contact surface of the second connecting electrode and the other end of the elastic insulating part are not positioned in the same plane, so that when the light-emitting unit is bound, the light-emitting surface of the light-emitting unit is parallel to the substrate, and the situation of poor binding is avoided; when one side of the first connecting electrode far away from the insulating layer and one side of the second connecting electrode far away from the insulating layer are located in the same plane, the length of the first pin is different from that of the second pin, the pressure applied by the first pin to the first connecting electrode is different from that applied by the second pin to the second connecting electrode, so that the pressure applied by the first connecting electrode to one end of the elastic insulating component is different from that applied by the second connecting electrode to the other end of the elastic insulating component, the pressure is acted on the elastic insulating component to deform the elastic insulating component, the light emitting surface of the bonded light emitting unit is parallel to the substrate, and the situation that bonding is poor due to the fact that the lengths of the first pin and the second pin are different is avoided.
Of course, it is not necessary for any one product embodying the invention to achieve all of the technical effects described above at the same time.
Other features of the present invention and its advantages will become apparent from the following detailed description of exemplary embodiments of the invention, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a schematic structural diagram of a display panel according to the present invention;
FIG. 2 is a cross-sectional view taken along the direction A-A' in FIG. 1;
FIG. 3 is another cross-sectional view taken along line A-A' of FIG. 1;
FIG. 4 is a further cross-sectional view taken along line A-A' in FIG. 1;
FIG. 5 is a further cross-sectional view taken along line A-A' in FIG. 1;
FIG. 6 is a further cross-sectional view taken along line A-A' in FIG. 1;
FIG. 7 is a further cross-sectional view taken along line A-A' in FIG. 1;
FIG. 8 is a further cross-sectional view taken along line A-A' in FIG. 1;
FIG. 9 is a further cross-sectional view taken along line A-A' in FIG. 1;
FIG. 10 is a further cross-sectional view taken along line A-A' in FIG. 1;
FIG. 11 is a further cross-sectional view taken along line A-A' in FIG. 1;
FIG. 12 is a further cross-sectional view taken along line A-A' in FIG. 1;
FIG. 13 is a further cross-sectional view taken along line A-A' in FIG. 1;
FIG. 14 is a further cross-sectional view taken along line A-A' in FIG. 1;
FIG. 15 is a schematic view of a structure of a substrate;
fig. 16 is a schematic view of a structure for forming a first insulating layer;
FIG. 17 is a schematic illustration of a configuration of a first groove-filling filler;
Fig. 18 is a schematic view of a structure in which a second insulating layer is formed;
FIG. 19 is a schematic view of a structure for forming a channel;
FIG. 20 is a schematic view of a structure in which the channels are filled with an elastic insulating member;
FIG. 21 is a schematic view of a structure for forming an electrode layer;
fig. 22 is a schematic view of a structure in which the light emitting unit is mounted;
Fig. 23 is a schematic structural diagram of a display device according to the present invention.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless it is specifically stated otherwise.
The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of exemplary embodiments may have different values.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.
The invention provides a display panel, a manufacturing method thereof and a display device, and specific embodiments of the display panel, the manufacturing method thereof and the display device are described in detail below.
Referring to fig. 1 to 7, fig. 1 is a schematic structural view of a display panel according to the present invention, fig. 2 is a cross-sectional view of A-A 'direction in fig. 1, fig. 3 is another cross-sectional view of A-A' direction in fig. 1, fig. 4 is yet another cross-sectional view of A-A 'direction in fig. 1, fig. 5 is yet another cross-sectional view of A-A' direction in fig. 1, fig. 6 is yet another cross-sectional view of A-A 'direction in fig. 1, and fig. 7 is yet another cross-sectional view of A-A' direction in fig. 1.
The display panel 100 includes: a substrate 1; the insulating layer 2 is positioned on one side of the substrate 1, the insulating layer 2 comprises a channel 3, two ends of the channel 3 are communicated with one side, far away from the substrate 1, of the insulating layer 2, and an elastic insulating part 4 is arranged in the channel 3; an electrode layer 5 located on a side of the elastic insulating member 4 away from the substrate 1, and including a first connection electrode 6 and a second connection electrode 7, the front projection of the first connection electrode 6 on the substrate 1 at least partially overlapping with the front projection of one end of the channel 3 on the substrate 1, and the front projection of the second connection electrode 7 on the substrate 1 at least partially overlapping with the front projection of the other end of the channel 3 on the substrate 1; the light emitting unit 8 is located at a side of the electrode layer 5 away from the insulating layer 2, and includes a first lead 9 and a second lead 10, wherein the first lead 9 is in contact with the first connection electrode 6, and the second lead 10 is in contact with the second connection electrode 7.
In fig. 1 to 7, the substrate 1, the insulating layer 2 and the thin film transistor layer 16 are not filled with the pattern, only the channel 3 is shown in fig. 2, and the two ends of the elastic insulating member 4 are not completely filled with the elastic insulating member 4, that is, one end of the elastic insulating member 4 and one side of the insulating layer 2 away from the substrate 1 have a first space, the other end of the elastic insulating member 4 and one side of the insulating layer 2 away from the substrate 1 have a second space, the first connecting electrode 6 contacts one end of the elastic insulating member 4 via the first space, the second connecting electrode 7 contacts the other end of the elastic insulating member 4 via the second space, and of course, the two ends of the elastic insulating member 4 may not be located at the same level, or before the light emitting unit 8 is bound, the first connecting electrode 6 and the second connecting electrode 7 may not contact the elastic insulating member 4, and not limited to this, and it is sufficient to ensure that the first connecting electrode 6 contacts one end of the elastic insulating member 4 and the second connecting electrode 7 contacts the other end of the elastic insulating member 4 when the light emitting unit 8 is bound. In fig. 4, only the elastic insulating member 4 is completely filled in the channel 3, that is, two ends of the elastic insulating member 4 are also communicated with one side of the insulating layer 2 away from the substrate 1, a first connection electrode 6 and a second connection electrode 7 are disposed on one side of the insulating layer 2 away from the substrate 1, when the front projection of the substrate 1 and the front projection of one end of the channel 3 at least partially overlap, the first connection electrode 6 at least partially contacts one end of the elastic insulating member 4, the front projection of the second connection electrode 7 at the substrate 1 and the front projection of the other end of the channel 3 at least partially overlap, and the second connection electrode 7 at least partially contacts the elastic insulating member 4.
It can be understood that, fig. 2 only illustrates the situation that the lengths of the first pin 9 and the second pin 10 of the light emitting unit 8 are equal, before the light emitting unit 8 is bound, one side of the first connecting electrode 6 away from the substrate 1 and one side of the second connecting electrode 7 away from the substrate 1 are not in the same plane, and the channel 3 is not completely filled with the elastic insulating member 4, fig. 3 is a structure after the light emitting unit 8 is bound, specifically, when the light emitting unit 8 is bound, the first pin 9 of the light emitting unit 8 presses the first connecting electrode 6, the first connecting electrode 6 presses one end of the elastic insulating member 4, the second pin 10 of the light emitting unit 8 presses the second connecting electrode 7, the second connecting electrode 7 presses the other end of the elastic insulating member 4, the maximum distance between the first connecting electrode 6 and the substrate 1 is greater than the maximum distance between the second connecting electrode 7 and the substrate 1, the degree of pressing one end of the first connecting electrode 6 against the elastic insulating member 4 is greater than the degree of pressing the other end of the second connecting electrode 7 against the elastic insulating member 4, and the two ends of the elastic insulating member 4 are bound, so that the two ends of the light emitting unit 8 are not parallel to the substrate 1 is avoided. Fig. 4 only illustrates the situation that the lengths of the first pin 9 and the second pin 10 of the light emitting unit 8 are equal, before the light emitting unit 8 is bound, one side of the first connecting electrode 6 away from the substrate 1 and one side of the second connecting electrode 7 away from the substrate 1 are not in the same plane, and the channel 3 is completely filled with the elastic insulating member 4, fig. 5 is a structure after the light emitting unit 8 is bound for the situation of fig. 4, and similarly, when the light emitting unit 8 is bound, the first pin 9 of the light emitting unit 8 presses the first connecting electrode 6, the first connecting electrode 6 presses one end of the elastic insulating member 4, the second pin 10 of the light emitting unit 8 presses the second connecting electrode 7, the second connecting electrode 7 presses the other end of the elastic insulating member 4, the maximum distance between the first connecting electrode 6 and the substrate 1 is greater than the maximum distance between the second connecting electrode 7 and the substrate 1, the degree of pressing one end of the elastic insulating member 4 by the first connecting electrode 6 is greater than the degree of pressing the other end of the second connecting electrode 7 by the elastic insulating member 4, and the compression of the two ends of the elastic insulating member 4 is different, so that the light emitting unit 8 and the light emitting unit 1 is bound to be prevented from being parallel to the substrate. Fig. 6 only illustrates the situation that the lengths of the first pin 9 and the second pin 10 of the light emitting unit 8 are unequal, before the light emitting unit 8 is bound, the side, away from the substrate 1, of the first connection electrode 6 and the side, away from the substrate 1, of the second connection electrode 7 are located in the same plane, and the channel 3 is completely filled with the elastic insulating member 4, fig. 7 is a structure after the light emitting unit 8 is bound, aiming at the situation of fig. 6, when the light emitting unit 8 is bound, the length of the first pin 9 is longer than the length of the second pin 10, and the pressure of the first pin 9 on the first connection electrode 6 is greater than the pressure of the second pin 10 on the second connection electrode 7, so that the pressure of the first connection electrode 6 on one end of the elastic insulating member 4 is greater than the pressure of the second connection electrode 7 on the other end of the elastic insulating member 4, and the compression amounts of the two ends of the elastic insulating member 4 are different, so that the light emitting surface of the light emitting unit 8 is parallel to the substrate 1, and binding failure is avoided.
Specifically, several structures in the present embodiment are only illustrative, but not limited thereto, the first pin 9 may be an anode of the light emitting unit 8, the second pin 10 may be a cathode of the light emitting unit 8, or the first pin 9 may be a cathode of the light emitting unit 8, the second pin 10 may be an anode of the light emitting unit 8, and accordingly, the first connection electrode 6 may be connected to the anode of the light emitting unit 8, the second connection electrode 7 may be connected to the cathode of the light emitting unit 8, or the first connection electrode 6 may be connected to the cathode of the light emitting unit 8, and the second connection electrode 7 may be connected to the anode of the light emitting unit 8. Because of the in-plane level difference caused by various film patterns on the array substrate, after the insulating layer 2 is manufactured, the level difference may be formed on the side, away from the substrate 1, of the insulating layer 2, in this embodiment, by adding the insulating layer 2, even if the level difference is formed by the insulating layer 2 due to the level difference of the array substrate, due to the arrangement of the channel 3 in the insulating layer 2, the elastic insulating member 4 is partially filled in the channel 3, two ends of the elastic insulating member 4 in the channel 3 can be respectively covered with the first connecting electrode 6 and the second connecting electrode 7 with equal thickness, that is, in the channel 3, the side, away from the substrate 1, of the first connecting electrode 6 and the side, away from the substrate 1, of the second connecting electrode 7 are located in the same plane, which is favorable for binding the light emitting unit 8, and the light emitting surface of the light emitting unit 8 is parallel to the substrate 1. In addition, other film layers may be disposed between the substrate 1 and the light emitting unit 8, which is not described herein in detail, and the light emitting unit 8 may be a micro light emitting diode or a mini light emitting diode, which is not limited in this embodiment.
Compared with the prior art, the display panel 100 provided by the invention has at least the following beneficial effects:
the display panel 100 provided by the present invention includes: a substrate 1; the insulating layer 2 is positioned on one side of the substrate 1, the insulating layer 2 comprises a channel 3, two ends of the channel 3 are communicated with one side, far away from the substrate 1, of the insulating layer 2, and an elastic insulating part 4 is arranged in the channel 3; an electrode layer 5 located on a side of the elastic insulating member 4 away from the substrate 1, and including a first connection electrode 6 and a second connection electrode 7, the front projection of the first connection electrode 6 on the substrate 1 at least partially overlapping with the front projection of one end of the channel 3 on the substrate 1, and the front projection of the second connection electrode 7 on the substrate 1 at least partially overlapping with the front projection of the other end of the channel 3 on the substrate 1; the light emitting unit 8 is located at a side of the electrode layer 5 away from the insulating layer 2, and includes a first lead 9 and a second lead 10, wherein the first lead 9 is in contact with the first connection electrode 6, and the second lead 10 is in contact with the second connection electrode 7. When the light-emitting unit 8 is bound, the first pin 9 of the light-emitting unit 8 presses down the first connecting electrode 6, the first connecting electrode 6 contacts one end of the elastic insulating member 4, the second pin 10 of the light-emitting unit 8 presses down the second connecting electrode 7, the second connecting electrode 7 contacts the other end of the elastic insulating member 4, when one side of the first connecting electrode 6 far away from the insulating layer 2 and one side of the second connecting electrode 7 far away from the insulating layer 2 are located in different planes, the pressure applied by the first connecting electrode 6 to the elastic insulating member 4 is different from the pressure applied by the second connecting electrode 7 to the elastic insulating member 4, and the contact surface of the first connecting electrode 6 and one end of the elastic insulating member 4 and the contact surface of the second connecting electrode 7 and the other end of the elastic insulating member 4 are not located in the same plane, so that when the light-emitting unit 8 is bound, the light-emitting surface of the light-emitting unit 8 is parallel to the substrate 1, and binding failure is avoided; when the side of the first connection electrode 6 far away from the insulating layer 2 and the side of the second connection electrode 7 far away from the insulating layer 2 are located in the same plane, and the length of the first pin 9 is different from the length of the second pin 10, the pressure applied by the first pin 9 to the first connection electrode 6 is different from the pressure applied by the second pin 10 to the second connection electrode 7, so that the pressure applied by the first connection electrode 6 to one end of the elastic insulating member 4 is different from the pressure applied by the second connection electrode 7 to the other end of the elastic insulating member 4, both the pressures act on the elastic insulating member 4 to deform the elastic insulating member, so that the light-emitting surface of the light-emitting unit 8 after binding is parallel to the substrate 1, and the situation of poor binding caused by the difference in length of the first pin 9 and the second pin 10 is avoided.
In some alternative embodiments, referring to fig. 1,2, 8 and 9, fig. 8 is a further cross-sectional view taken along A-A 'in fig. 1, and fig. 9 is a further cross-sectional view taken along A-A' in fig. 1, the elastic insulating member 4 having fluidity.
It will be appreciated that in fig. 8 and 9, the substrate 1, the insulating layer 2 and the thin film transistor layer 16 are not filled with patterns. the elastic insulating member 4 may be an elastic member that is compressed by force, or may be an elastic member that is deformed without being compressed by force, that is, the elastic insulating member 4 has fluidity, referring to fig. 2 and 8, fig. 2 only illustrates that the lengths of the first pin 9 and the second pin 10 of the light emitting unit 8 are equal, before the light emitting unit 8 is bound, the side of the first connection electrode 6 away from the substrate 1 and the side of the second connection electrode 7 away from the substrate 1 are not in the same plane, and the channel 3 is not completely filled with the elastic insulating member 4, fig. 8 is a structure after the light emitting unit 8 is bound, the first pin 9 presses the first connection electrode 6, The second pin 10 presses down the second connection electrode 7, because the maximum distance from the first connection electrode 6 to the substrate 1 is larger than the maximum distance from the second connection electrode 7 to the substrate 1, the first connection electrode 6 applies larger pressure to the elastic insulation part 4 than the second connection electrode 7, the elastic insulation part 4 is forced to deform according to the principle of a communicating vessel, and moves towards the direction close to the second connection electrode 7 until the contact surface of the first connection electrode 6 and the first pin 9 and the contact surface of the second connection electrode 7 and the second pin 10 are met, the dotted line position in fig. 8 is the original position of the two end surfaces of the elastic insulation part 4, at this time, the contact surface of the first connection electrode 6 and the elastic insulation part 4 is positioned at one side of the original position close to the substrate 1, The contact surface of the second connection electrode 7 and the elastic insulating member 4 is positioned at one side of the original position close to the light emitting unit 8, so that the light emitting surface of the light emitting unit 8 is parallel to the substrate 1, and poor binding of the light emitting unit 8 is avoided, of course, when the lengths of the first pin 9 and the second pin 10 of the light emitting unit 8 are equal, before binding of the light emitting unit 8, the side of the first connection electrode 6 away from the substrate 1 and the side of the second connection electrode 7 away from the substrate 1 are not in the same plane, the elastic insulating member 4 can be fully filled in the channel 3, the elastic insulating member 4 has the same action mode as the above, and the elastic insulating member 4 deforms to move, the contact surface of the first connecting electrode 6 and the first pin 9 and the contact surface of the second connecting electrode 7 and the second pin 10 are positioned on the same plane, and furthermore, when the light emitting unit 8 is bound, the light emitting surface of the light emitting unit 8 can be ensured to be parallel to the substrate 1, so that the situation of poor binding is avoided. Referring to fig. 6 and 9, fig. 6 illustrates only a case where the first and second leads 9 and 10 of the light emitting unit 8 are different in length, before the light emitting unit 8 is bound, a side of the first connection electrode 6 away from the substrate 1 is located in the same plane as a side of the second connection electrode 7 away from the substrate 1, and the channel 3 is completely filled with the elastic insulating member 4, fig. 9 is a structure after the light emitting unit 8 is bound, since the length of the first lead 9 is greater than the length of the second lead 10, the pressure applied to the first connection electrode 6 by the first lead 9 is greater than the pressure applied to the second connection electrode 7 by the second lead 10, so that the pressure applied to the elastic insulating member 4 by the first connection electrode 6 is greater than the pressure applied to the elastic insulating member 4 by the second connection electrode 7, The elastic insulating member 4 is forced to deform according to the principle of the communicating vessel, and moves in a direction approaching to the second connection electrode 7 until the contact surface between the first connection electrode 6 and the first pin 9 and the contact surface between the second connection electrode 7 and the second pin 10 are equal to the distance between the first pin 9 and the second pin 10 in a direction perpendicular to the substrate 1, so that the light emitting surface of the light emitting unit 8 is parallel to the substrate 1, and poor binding is avoided.
In some alternative embodiments, referring to fig. 1 and 10, fig. 10 is a further cross-sectional view taken along line A-A' in fig. 1, the insulating layer 2 comprises: a first insulating layer 11 and a second insulating layer 12 stacked, the second insulating layer 12 being located on a side of the first insulating layer 11 away from the substrate 1; the channel 3 comprises a first channel 13, a second channel 14 and a third channel 15 which are communicated in sequence, wherein the first channel 13 and the third channel 15 are positioned on the second insulating layer 12, and the second channel 14 is positioned on the first insulating layer 11.
It will be appreciated that in fig. 10, none of the substrate 1, the insulating layer 2 and the thin film transistor layer 16 is filled with a pattern, fig. 10 only illustrates one position of the first channel 13, the second channel 14 and the third channel 15, the second channel 14 is located on the first insulating layer 11, the first channel 13 and the third channel 15 are located on the second insulating layer 12, the second insulating layer 12 is located on one side of the first insulating layer 11 away from the substrate 1, the structure of the channel 3 is further determined to be that two ends face the channel 3 on one side away from the substrate 1, it is relatively complicated to manufacture the channel 3 in one film layer, and the first channel 13 and the third channel 15 are arranged on the second insulating layer 12 and the second channel 14 are arranged on the first insulating layer 11, so that the formation of the channel 3 is facilitated, the steps are simplified, and the cost is saved.
In some alternative embodiments, with continued reference to fig. 1 and 10, the first connection electrode 6 is in contact with the resilient insulating member 4 at an end of the first channel 13 remote from the second channel 14, and the second connection electrode 7 is in contact with the resilient insulating member 4 at an end of the third channel 15 remote from the second channel 14.
It will be appreciated that the first connection electrode 6 is in contact with the elastic insulating member 4 at the end of the first passage 13 remote from the second passage 14, so that reliability between the first connection electrode 6 and the elastic insulating member 4 can be ensured; the second connection electrode 7 contacts the elastic insulating member 4 at the end of the third channel 15 away from the second channel 14, so that the reliability between the second connection electrode 7 and the elastic insulating member 4 can be ensured; a space can be provided between the first connection electrode 6 and the second connection electrode 7 to prevent the first connection electrode 6 from contacting the second connection electrode 7, thereby shorting the light emitting unit 8.
In some alternative implementations, with continued reference to fig. 2-10, the display panel 100 in this embodiment further includes: the front projection of the first pins 9 at the substrate 1 at least partially overlaps with the front projection of the one end of the channels 3 at the substrate 1, and the front projection of the second pins 10 at the substrate 1 at least partially overlaps with the front projection of the other end of the channels 3 at the substrate 1.
It will be appreciated that the first connection electrode 6 is integral, the first lead 9 is most stressed at the contact position with the first connection electrode 6, the front projection of the first lead 9 on the substrate 1 does not overlap with the front projection of the end of the channel 3 on the substrate 1, i.e. the first connection electrode 6 is less stressed and contacts the elastic insulating member 4, and similarly, the second connection electrode 7 is integral, the second pin 10 is in contact with the first connection electrode, the stress received by the position is the largest, and the orthographic projection of the second pin 10 on the substrate 1 and the orthographic projection of the other end of the channel 3 on the substrate 1 are not overlapped, namely, the position where the second connection electrode 7 receives smaller stress is in contact with the elastic insulating part 4, so that the deformation amount of the first connection electrode 6 and the second connection electrode 7 at the position of the channel 3 is smaller, and the effect of improving the bad binding of the light emitting unit 8 is weaker. When the front projection of the first lead 9 on the substrate 1 and the front projection of one end of the channel 3 on the substrate 1 are at least partially overlapped, the front projection of the second lead 10 on the substrate 1 and the front projection of the other end of the channel 3 on the substrate 1 are at least partially overlapped, that is, the position where the stress of the first connection electrode 6 is larger is contacted with the elastic insulating member 4, the position where the stress of the second connection electrode 7 is larger is contacted with the elastic insulating member 4, the deformation of the first connection electrode 6 and the second connection electrode 7 at the position of the channel 3 is larger, so that bad binding of the light-emitting unit 8 can be effectively improved, and after the light-emitting unit 8 is bound, the light-emitting surface of the light-emitting unit 8 is parallel to the substrate 1.
In some alternative embodiments, with continued reference to fig. 2, the display panel 100 in this embodiment further includes: the thin film transistor layer 16 is located between the substrate 1 and the insulating layer 2, and includes a thin film transistor 17 and a signal line 18, the first connection electrode 6 is electrically connected to the thin film transistor 17 through a first via 19, and the second connection electrode 7 is electrically connected to the signal line 18 through a second via 20.
Note that, the thin film transistor layer 16 includes the thin film transistor 17, the thin film transistor 17 includes the gate electrode 25, the source electrode 26, the drain electrode 27, and the active layer 28 connecting the source electrode 26 and the drain electrode 27, and in fig. 2, only the thin film transistor 17 is illustrated as a top gate structure, or may be configured as a bottom gate structure, and may be adjusted according to specific requirements, which is not limited in this embodiment. The thin film transistor layer 16 may further include a gate insulating layer and an interlayer dielectric layer, and other film layers may be disposed between the substrate 1 and the thin film transistor layer 16, which is not limited in this embodiment.
It will be appreciated that the first connection electrode 6 is electrically connected to the drain electrode 27 of the thin film transistor 17, the second electrode is electrically connected to the signal line 18, the drain electrode 27 provides a first voltage to the first connection electrode 6, the signal line 18 provides a second voltage to the second electrode, when the light emitting unit 8 is bound, the first connection electrode 6 is electrically connected to the first pin 9, the second connection electrode 7 is electrically connected to the second pin 10, a potential difference is formed between the first voltage and the second voltage, and the light emitting unit 8 emits light under the action of the potential difference.
In some alternative embodiments, referring to fig. 1, 2,6, 11 and 12, fig. 11 is a further cross-sectional view taken along A-A 'in fig. 1, and fig. 12 is a further cross-sectional view taken along A-A' in fig. 1, the first connection electrode 6 and the second connection electrode 7 have elasticity.
In fig. 11 and 12, the substrate 1, the insulating layer 2, and the thin film transistor layer 16 are not filled with the pattern, and the materials of the first connection electrode 6 and the second connection electrode 7 are usually metal or indium tin oxide, so that the deformation amounts of the first connection electrode 6 and the second connection electrode 7 are limited, and the materials of the first connection electrode 6 and the second connection electrode 7 are elastic, so that the deformation amounts of the first connection electrode 6 and the second connection electrode 7 can be increased, and the first pin 9 and the second pin 10 are prevented from being excessively pressed down, thereby damaging the first connection electrode 6 and the second connection electrode 7.
It can be understood that referring to fig. 2 and 11, fig. 2 only illustrates that the lengths of the first pin 9 and the second pin 10 of the light emitting unit 8 are equal, before the light emitting unit 8 is bound, one side of the first connecting electrode 6 away from the substrate 1 and one side of the second connecting electrode 7 away from the substrate 1 are not in the same plane, and the elastic insulating member 4 is not completely filled in the channel 3, the elastic insulating member 4 has fluidity, fig. 8 is a structure for binding the light emitting unit 8 according to the situation of fig. 2, specifically, the maximum distance between the first connecting electrode 6 and the substrate 1 is greater than the maximum distance between the second connecting electrode 7 and the substrate 1, the pressure applied by the first connecting electrode 6 to the elastic insulating member 4 is greater than the pressure applied by the second connecting electrode 7 to the elastic insulating member 4, the first connecting electrode 9 presses down the first connecting electrode 6, the first connecting electrode 6 has elasticity, the first connecting electrode 6 deforms only at the contact position with the elastic insulating member 4, the elastic insulating member 4 is forced to deform in a direction close to the second connecting electrode 7 according to the principle of a communicating vessel, the second connecting electrode 7 also has the maximum distance between the second connecting electrode 7 and the substrate 1 is not bound at the contact position of the first pin 7 and the first pin 4, and the first pin 10 is prevented from contacting the first pin 1, and the good contact surface is prevented from contacting the first pin 1 and the second pin 1 is prevented from contacting the first pin 1.
Similarly, referring to fig. 6 and 12, fig. 6 only illustrates that the lengths of the first pin 9 and the second pin 10 of the light emitting unit 8 are unequal, before the light emitting unit 8 is bound, one side of the first connecting electrode 6, which is far away from the substrate 1, is located in the same plane with one side of the second connecting electrode 7, which is far away from the substrate 1, and the channel 3 is completely filled with the elastic insulating member 4, the elastic insulating member 4 has fluidity, fig. 12 is a structure for binding the light emitting unit 8 in the case of fig. 6, specifically, the pressure applied by the first pin 9 to the first connecting electrode 6 is greater than the pressure applied by the second pin 10 to the second connecting electrode 7, so that the pressure applied by the first connecting electrode 6 to the elastic insulating member 4 is greater than the pressure applied by the second connecting electrode 7 to the elastic insulating member 4, the first connecting electrode 6 has elasticity, the first connecting electrode 6 is only deformed at the contact position with the elastic insulating member 4, the elastic insulating member 4 is forced to move towards the direction close to the second connecting electrode 7 according to the principle of a communicating vessel, the second connecting electrode 7 also has elasticity, the second connecting electrode 7 is only deformed at the contact position with the elastic connecting electrode 4, the second connecting electrode 7 is deformed at the contact position with the first connecting electrode 7, the first pin 10 is not parallel to the first pin 10, and the first pin is prevented from contacting the first pin 10 and the first pin 1 is not parallel to the second pin 7, and the first pin is prevented from contacting the first pin 1 and the second pin is not parallel to the first pin 1, and the first pin is prevented from contacting the second pin 1.
In some alternative embodiments, with continued reference to fig. 1 and 2, the material of the first connection electrode 6 and the second connection electrode 7 is a copper alloy.
It is understood that the copper alloy may be copper-nickel alloy, beryllium-copper alloy, or of course manganese steel alloy and carbon steel, and any material that can achieve conductivity and has soft texture and good ductility is within the protection scope of the present embodiment. Because the first connecting electrode 6 and the second connecting electrode 7 adopt copper alloy, the first connecting electrode 6 and the second connecting electrode 7 have elasticity, the deformation range of the first connecting electrode 6 and the second connecting electrode 7 is increased, namely the maximum strength limit of the first connecting electrode 6 and the second connecting electrode 7 is increased, and the first connecting electrode 6 and the second connecting electrode 7 are prevented from being damaged due to overlarge pressure when the first pin 9 and the second pin 10 are pressed down.
In some alternative embodiments, with continued reference to fig. 1 and 2, the material of the resilient insulating member 4 is a hot melt adhesive or a heat sensitive plastic ester.
It is understood that the hot melt adhesive is made of basic resin, tackifier, viscosity regulator and antioxidant, and the basic resin is formed by copolymerizing ethylene and vinyl acetate at high temperature and high pressure. The heat sensitive plastic ester (TPEE) is also called polyester rubber, and is a linear block copolymer containing a hard segment of PBT (polybutylene terephthalate) polyester and a soft segment of aliphatic polyester or polyether, and the materials can be deformed after being stressed, and can be other materials, and the materials are not particularly limited herein.
In some alternative embodiments, referring to fig. 1,2, 13 and 14, fig. 13 is a further cross-sectional view taken along a direction A-A' in fig. 1, and fig. 14 is a further cross-sectional view taken along a direction perpendicular to the substrate 1, the cross-section passing through both ends of the channel 3, and the channel 3 being U-shaped, V-shaped or semicircular in cross-section.
It will be understood that, in fig. 13 and 14, the substrate 1, the insulating layer 2 and the thin film transistor layer 16 are not filled with patterns, only the channel 3 is illustrated as U-shaped in cross section in fig. 2, only the channel 3 is illustrated as semi-circular in cross section in fig. 13, only the channel 3 is illustrated as V-shaped in cross section in fig. 14, and, without being limited thereto, the channel 3 capable of being used as a communicating vessel to avoid bad binding of the light emitting unit 8 is within the scope of the present embodiment.
In some alternative embodiments, referring to fig. 15 to 22, fig. 15 is a schematic structural view of a substrate, fig. 16 is a schematic structural view of forming a first insulating layer, fig. 17 is a schematic structural view of a first groove filling filler, fig. 18 is a schematic structural view of forming a second insulating layer, fig. 19 is a schematic structural view of forming a channel, fig. 20 is a schematic structural view of filling an elastic insulating member in the channel, fig. 21 is a schematic structural view of forming an electrode layer, fig. 22 is a schematic structural view of mounting a light emitting unit, a manufacturing method of a display panel provided in this embodiment includes:
s101: providing a substrate 1;
In S101, referring to fig. 15, fig. 15 illustrates only one structure of the substrate 1, the substrate 1 may be a flexible substrate 1 or a rigid substrate 1, and when the substrate 1 is a rigid substrate 1, glass, transparent resin, or the like may be used as the material of the substrate 1; when the substrate 1 is a flexible substrate 1, the material of the substrate 1 may be polycarbonate, polyimide, or the like, and is not particularly limited in this embodiment, and in fig. 15 to 22, the substrate 1, the insulating layer 2, and the thin film transistor layer 16 are not filled with a pattern.
S102: forming a first insulating layer 11 on one side of the substrate 1, and etching a first groove 21 on the side of the first insulating layer 11 away from the substrate 1;
In S102, referring to fig. 16, fig. 16 only shows the substrate 1 and the first insulating layer 11, and specifically, other film layers such as the thin film transistor layer 16 are further included between the substrate 1 and the first insulating layer 11.
S103: filling the first recess 21 with a filler 22;
In S103, referring to fig. 17, fig. 17 only shows that the first groove 21 is completely filled with the filler 22, but of course, the filler 22 may be filled in the first groove 21, and the embodiment is not particularly limited thereto, and the filler 22 may be filled by an inkjet printing method, and the material of the filler 22 may be a metal or an inorganic material, which is not particularly limited herein.
S104: forming a second insulating layer 12 on the side of the first insulating layer 11 far from the substrate 1, etching the side of the second insulating layer 12 far from the first insulating layer 11 to form a second groove 23 and a third groove 24, wherein a space is reserved between the second groove 23 and the third groove 24;
in S104, referring to fig. 18, fig. 18 only shows that the cross sections of the second groove 23 and the third groove 24 are rectangular, and specifically, may be trapezoidal.
S105: removing the filler 22 so that the first groove 21, the second groove 23 and the third groove 24 communicate to form the passage 3;
In S105, referring to fig. 19, removing the filler 22 may connect the first groove 21, the second groove 23 and the third groove 24, specifically, if the filler 22 is metal, the filler 22 may be removed by wet etching; if the filler 22 is an inorganic material, the filler 22 may be removed by a solvent that reacts with the inorganic material to form the channel 3.
S106: filling the channel 3 with an elastic insulating member 4;
in S106, referring to fig. 20, fig. 20 only shows that the elastic insulating member 4 is at least partially positioned in the second insulating layer 12, so that the reliability of the connection between the first connection electrode 6 and the second connection electrode 7 and the elastic insulating member 4 can be effectively improved.
S107: forming an electrode layer 5 on a side of the second insulating layer 12 remote from the first insulating layer 11, the electrode layer 5 including a first connection electrode 6 and a second connection electrode 7, the first connection electrode 6 at least partially covering the second recess 23, the second connection electrode 7 at least partially covering the third recess 24;
In S107, referring to fig. 21, fig. 21 only shows that the first connection electrode 6 and the second connection electrode 7 are at least partially located in the channel 3, and of course, if the channel 3 is completely filled with the elastic insulating member 4, the first connection electrode 6 and the second connection electrode 7 may be covered with the elastic insulating member 4 on the side of the second insulating layer 12 away from the first insulating layer 11.
S108: a light emitting unit 8 is arranged on one side of the electrode layer 5 far from the second insulating layer 12, the light emitting unit 8 comprises a first pin 9 and a second pin 10, the first pin 9 is contacted with the first connecting electrode 6, and the second pin 10 is contacted with the second connecting electrode 7; if the side of the first connection electrode 6 away from the second insulating layer 12 is located in a different plane from the side of the second connection electrode 7 away from the second insulating layer 12, the elastic insulating member 4 deforms so that the side of the first connection electrode 6 away from the second insulating layer 12 is located in the same plane as the side of the second connection electrode 7 away from the second insulating layer 12.
In S108, referring to fig. 22, in fig. 22, it is only shown that the lengths of the first pin 9 and the second pin 10 of the light emitting unit 8 are equal, the elastic insulating member 4 has fluidity, the first connecting electrode 6 presses down one end of the elastic insulating member 4, the second connecting electrode 7 presses down the other end of the elastic insulating member 4, the pressure of the first connecting electrode 6 to the elastic insulating member 4 is greater than the pressure of the second connecting electrode 7 to the elastic insulating member 4, the elastic insulating member 4 is forced to move to the second connecting electrode 7 to deform, and at this time, the channel 3 and the elastic insulating member 4 are equivalent to a communicating vessel, so that the stresses at the first pin 9 and the second pin 10 can be equal, at this time, the contact surface of the first pin 9 and the first connecting electrode 6 and the contact surface of the second pin 10 and the second connecting electrode 7 are in the same plane, after the light emitting unit 8 is bound, the light emitting surface of the light emitting unit 8 is parallel to the substrate 1, and the problem of binding failure is avoided. Of course, this embodiment is merely illustrative of one specific embodiment, and is not limited thereto.
Based on the same inventive concept, the present application also provides a display device 200, please refer to fig. 23, fig. 23 is a schematic structural diagram of a display device provided in the embodiment of the present application, the display device 200 includes a display panel 100, and the display panel 100 is any one of the display panels 100 provided in the above embodiments of the present application. The embodiments of the display device 200 provided in the embodiments of the present application can refer to the embodiments of the display panel 100 described above, and the repetition is not repeated. The display device 200 provided by the present application may be: any product or component with display function such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like.
According to the embodiment, the display panel provided by the invention has at least the following beneficial effects:
The display panel provided by the invention comprises: a substrate; the insulating layer is positioned on one side of the substrate, the insulating layer comprises a channel, two ends of the channel are communicated with one side of the insulating layer away from the substrate, and an elastic insulating part is arranged in the channel; the electrode layer is positioned on one side of the elastic insulating part, which is far away from the substrate, and comprises a first connecting electrode and a second connecting electrode, wherein the orthographic projection of the first connecting electrode on the substrate at least partially overlaps with the orthographic projection of one end of the channel on the substrate, and the orthographic projection of the second connecting electrode on the substrate at least partially overlaps with the orthographic projection of the other end of the channel on the substrate; the light-emitting unit is positioned on one side of the electrode layer far away from the insulating layer and comprises a first pin and a second pin, wherein the first pin is contacted with the first connecting electrode, and the second pin is contacted with the second connecting electrode. When the light-emitting unit is bound, the first connecting electrode is pressed down by the first pin of the light-emitting unit, the first connecting electrode is contacted with one end of the elastic insulating part, the second connecting electrode is pressed down by the second pin of the light-emitting unit, the second connecting electrode is contacted with the other end of the elastic insulating part, when one side of the first connecting electrode far away from the insulating layer and one side of the second connecting electrode far away from the insulating layer are positioned in different planes, the pressure applied by the first connecting electrode to the elastic insulating part is unequal to the pressure applied by the second connecting electrode to the elastic insulating part, and the pressure applied by the first connecting electrode and the pressure applied by the second connecting electrode to the elastic insulating part are acted on the elastic insulating part to deform the elastic insulating part, and the contact surface of the first connecting electrode and one end of the elastic insulating part and the contact surface of the second connecting electrode and the other end of the elastic insulating part are not positioned in the same plane, so that when the light-emitting unit is bound, the light-emitting surface of the light-emitting unit is parallel to the substrate, and the situation of poor binding is avoided; when one side of the first connecting electrode far away from the insulating layer and one side of the second connecting electrode far away from the insulating layer are located in the same plane, the length of the first pin is different from that of the second pin, the pressure applied by the first pin to the first connecting electrode is different from that applied by the second pin to the second connecting electrode, so that the pressure applied by the first connecting electrode to one end of the elastic insulating component is different from that applied by the second connecting electrode to the other end of the elastic insulating component, the pressure is acted on the elastic insulating component to deform the elastic insulating component, the light emitting surface of the bonded light emitting unit is parallel to the substrate, and the situation that bonding is poor due to the fact that the lengths of the first pin and the second pin are different is avoided.
While certain specific embodiments of the invention have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims (11)
1. A display panel, comprising:
A substrate;
an insulating layer located at one side of the substrate, the insulating layer comprising: a first insulating layer and a second insulating layer stacked, the second insulating layer being located on a side of the first insulating layer away from the substrate;
the insulating layer comprises a channel, two ends of the channel are communicated with one side, far away from the substrate, of the second insulating layer, and an elastic insulating part is arranged in the channel; the channels comprise a first channel, a second channel and a third channel which are sequentially communicated, wherein the first channel and the third channel are positioned on the second insulating layer, and the second channel is positioned on the first insulating layer;
An electrode layer, which is positioned on one side of the elastic insulating component far away from the substrate, and comprises a first connecting electrode and a second connecting electrode, wherein the orthographic projection of the first connecting electrode on the substrate at least partially overlaps with the orthographic projection of one end of the channel on the substrate, and the orthographic projection of the second connecting electrode on the substrate at least partially overlaps with the orthographic projection of the other end of the channel on the substrate;
The light-emitting unit is positioned on one side of the electrode layer far away from the insulating layer and comprises a first pin and a second pin, wherein the first pin is in contact with the first connecting electrode, and the second pin is in contact with the second connecting electrode.
2. The display panel according to claim 1, wherein the elastic insulating member has fluidity.
3. The display panel according to claim 1, wherein the first connection electrode is in contact with the elastic insulating member at an end of the first channel away from the second channel, and the second connection electrode is in contact with the elastic insulating member at an end of the third channel away from the second channel.
4. The display panel of claim 1, further comprising:
the orthographic projection of the first pin on the substrate at least partially overlaps with the orthographic projection of one end of the channel on the substrate, and the orthographic projection of the second pin on the substrate at least partially overlaps with the orthographic projection of the other end of the channel on the substrate.
5. The display panel of claim 4, further comprising:
The thin film transistor layer is positioned between the substrate and the insulating layer and comprises a thin film transistor and a signal wire, wherein the first connecting electrode is electrically connected with the thin film transistor through a first through hole, and the second connecting electrode is electrically connected with the signal wire through a second through hole.
6. The display panel according to claim 5, wherein the first connection electrode and the second connection electrode have elasticity.
7. The display panel according to claim 6, wherein the material of the first connection electrode and the second connection electrode is a copper alloy.
8. The display panel according to claim 1, wherein the material of the elastic insulating member is a hot melt adhesive or a heat-sensitive plastic ester.
9. The display panel according to claim 1, wherein a cross section is taken in a direction perpendicular to the substrate, the cross section passing through both ends of the channel, the channel being U-shaped, V-shaped or semicircular in shape on the cross section.
10. A method of manufacturing a display panel, comprising:
Providing a substrate;
Forming a first insulating layer on one side of the substrate, and etching a first groove on one side of the first insulating layer away from the substrate;
filling the first groove with a filler;
forming a second insulating layer on one side of the first insulating layer far away from the substrate, etching one side of the second insulating layer far away from the first insulating layer to form a second groove and a third groove, wherein a space is reserved between the second groove and the third groove;
removing the filler, so that the first groove, the second groove and the third groove are communicated to form a channel;
filling an elastic insulating part into the channel;
Forming an electrode layer on one side of the second insulating layer far away from the first insulating layer, wherein the electrode layer comprises a first connecting electrode and a second connecting electrode, the first connecting electrode at least partially covers the second groove, and the second connecting electrode at least partially covers the third groove;
A light emitting unit is arranged on one side, far away from the second insulating layer, of the electrode layer, the light emitting unit comprises a first pin and a second pin, the first pin is in contact with the first connecting electrode, and the second pin is in contact with the second connecting electrode; if one side of the first connecting electrode far away from the second insulating layer and one side of the second connecting electrode far away from the second insulating layer are located in different planes, the elastic insulating part deforms, so that one side of the first connecting electrode far away from the second insulating layer and one side of the second connecting electrode far away from the second insulating layer are located in the same plane.
11. A display device comprising the display panel of any one of claims 1-9.
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| CN111430382A (en) * | 2020-04-23 | 2020-07-17 | 上海天马微电子有限公司 | Display panel, manufacturing method thereof and display device |
| CN111580695A (en) * | 2020-04-29 | 2020-08-25 | 上海天马微电子有限公司 | Display panel, manufacturing method thereof and display device |
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| KR101916670B1 (en) * | 2012-08-29 | 2018-11-08 | 엘지디스플레이 주식회사 | Organic light emitting diode display device and method of fabricating the same |
| CN110112204B (en) * | 2019-06-05 | 2022-07-29 | 京东方科技集团股份有限公司 | Array substrate, display panel and display device |
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