CN115117093A - Display panel, manufacturing method thereof and display device - Google Patents
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- CN115117093A CN115117093A CN202210669327.2A CN202210669327A CN115117093A CN 115117093 A CN115117093 A CN 115117093A CN 202210669327 A CN202210669327 A CN 202210669327A CN 115117093 A CN115117093 A CN 115117093A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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Abstract
The invention discloses a display panel, a manufacturing method thereof and a display device, wherein the display panel comprises: the light-emitting diode comprises a substrate, an insulating layer, an electrode layer and a light-emitting unit, wherein the insulating layer comprises a channel, two ends of the channel are communicated with one side of the insulating layer far away from the substrate, and an elastic insulating part is arranged in the channel. The elastic insulating part is stressed to deform, so that the light emitting surface of the bound light emitting unit is parallel to the substrate, and the condition of poor binding is avoided.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display panel, a manufacturing method of the display panel and a display device.
Background
Micro light-emitting diodes (Micro-LEDs) and Mini light-emitting diodes (Mini-LEDs) become one of the hot spots of the display technology, are simple in structure, have the characteristics of self-luminescence, high resolution, high brightness, high light-emitting efficiency, long service life, high response speed, electricity saving and the like, and are widely applied to the display fields of televisions, mobile phones, computers and the like.
For the micro light emitting diode display panel and the mini light emitting diode display panel, after the micro light emitting diode or the mini light emitting diode is manufactured, a large amount of light is transferred to the display substrate and is bound with the driving circuit on the display substrate.
However, in the prior art, after the micro light emitting diode or the mini light emitting diode is bound with the driving circuit, an included angle may be formed between the light emitting surface of the micro light emitting diode or the mini light emitting diode and the display substrate.
Therefore, it is desirable to provide a design that can improve the bonding problem of micro-leds or mini-leds.
Disclosure of Invention
In view of the above, the present invention provides a display panel, a manufacturing method thereof and a display device, so as to improve the bonding problem of micro light emitting diodes or mini light emitting diodes.
In one aspect, the present invention provides a display panel, comprising:
a substrate;
the insulating layer is positioned on one side of the substrate and comprises a channel, two ends of the channel are communicated with one side of the insulating layer, which is far away from the substrate, and an elastic insulating part is arranged in the channel;
the electrode layer is positioned on one side, far away from the substrate, of the elastic insulating part and comprises a first connecting electrode and a second connecting electrode, the orthographic projection of the first connecting electrode on the substrate is at least partially overlapped with the orthographic projection of one end of the channel on the substrate, and the orthographic projection of the second connecting electrode on the substrate is at least partially overlapped with the orthographic projection of the other end of the channel on the substrate;
and the light-emitting unit is positioned on one side of the electrode layer, which is far away from the insulating layer, and comprises a first pin and a second pin, wherein the first pin is in contact with the first connecting electrode, and the second pin is in contact with the second connecting electrode.
In another aspect, the present invention provides a method for manufacturing a display panel, including:
providing a substrate;
forming a first insulating layer on one side of the substrate, and etching a first groove on one side, far away from the substrate, of the first insulating layer;
filling filler in the first groove;
forming a second insulating layer on one side, far away from the substrate, of the first insulating layer, and etching one side, far away from the first insulating layer, of the second insulating layer to form a second groove and a third groove, wherein a gap is formed between the second groove and the third groove;
removing the filler to enable the first groove, the second groove and the third groove to be communicated to form a channel;
filling an elastic insulating part into the channel;
forming an electrode layer on one side of the second insulating layer far away from the first insulating layer, wherein the electrode layer comprises a first connecting electrode and a second connecting electrode, the first connecting electrode at least partially covers the second groove, and the second connecting electrode at least partially covers the third groove;
installing a light emitting unit on one side of the electrode layer far away from the second insulating layer, wherein the light emitting unit comprises a first pin and a second pin, the first pin is in contact with the first connecting electrode, and the second pin is in contact with the second connecting electrode; if one side of the first connecting electrode, which is far away from the second insulating layer, and one side of the second connecting electrode, which is far away from the second insulating layer, are located in different planes, the elastic insulating part deforms, so that one side of the first connecting electrode, which is far away from the second insulating layer, and one side of the second connecting electrode, which is far away from the second insulating layer, are located in the same plane.
In another aspect, the present invention provides a display device, including the display panel described above.
Compared with the prior art, the display panel provided by the invention at least realizes the following beneficial effects:
the display panel provided by the invention comprises: a substrate; the insulating layer is positioned on one side of the substrate and comprises a channel, two ends of the channel are communicated with one side of the insulating layer, which is far away from the substrate, and an elastic insulating part is arranged in the channel; the electrode layer is positioned on one side of the elastic insulating part, which is far away from the substrate, and comprises a first connecting electrode and a second connecting electrode, wherein the orthographic projection of the first connecting electrode on the substrate at least partially overlaps with the orthographic projection of one end of the channel on the substrate, and the orthographic projection of the second connecting electrode on the substrate at least partially overlaps with the orthographic projection of the other end of the channel on the substrate; and the light-emitting unit is positioned on one side of the electrode layer, which is far away from the insulating layer, and comprises a first pin and a second pin, wherein the first pin is in contact with the first connecting electrode, and the second pin is in contact with the second connecting electrode. When the light-emitting unit is bound, the first pin of the light-emitting unit presses down the first connecting electrode, the first connecting electrode contacts one end of the elastic insulating component, the second pin of the light-emitting unit presses down the second connecting electrode, the second connecting electrode contacts the other end of the elastic insulating component, when the side of the first connection electrode remote from the insulating layer and the side of the second connection electrode remote from the insulating layer are located in different planes, the pressure applied by the first connecting electrode to the elastic insulating part is different from the pressure applied by the second connecting electrode to the elastic insulating part, and the pressures act on the elastic insulating part to deform the elastic insulating part, the contact surface of the first connecting electrode and one end of the elastic insulating part and the contact surface of the second connecting electrode and the other end of the elastic insulating part are not positioned in the same plane, when the light-emitting units are bound, the light-emitting surfaces of the light-emitting units are parallel to the substrate, so that the condition of poor binding is avoided; when the side, away from the insulating layer, of the first connecting electrode and the side, away from the insulating layer, of the second connecting electrode are located in the same plane, and the length of the first pin is unequal to that of the second pin, the pressure applied to the first connecting electrode by the first pin is different from the pressure applied to the second connecting electrode by the second pin, so that the pressure applied to one end of the elastic insulating part by the first connecting electrode is unequal to the pressure applied to the other end of the elastic insulating part by the second connecting electrode, the pressure and the pressure are both acted on the elastic insulating part to deform the elastic insulating part, the light emitting surface of the bound light emitting unit is parallel to the substrate, and the condition that the bound light emitting unit is poor due to the fact that the lengths of the first pin and the second pin are different is avoided.
Of course, it is not necessary for any product in which the present invention is practiced to achieve all of the above-described technical effects simultaneously.
Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
FIG. 1 is a schematic structural diagram of a display panel according to the present invention;
FIG. 2 is a cross-sectional view taken along line A-A' of FIG. 1;
FIG. 3 is another cross-sectional view taken along line A-A' of FIG. 1;
FIG. 4 is a further sectional view taken along line A-A' of FIG. 1;
FIG. 5 is a further sectional view taken along line A-A' of FIG. 1;
FIG. 6 is a further sectional view taken along line A-A' of FIG. 1;
FIG. 7 is a further sectional view taken along line A-A' of FIG. 1;
FIG. 8 is a further sectional view taken along line A-A' of FIG. 1;
FIG. 9 is a further sectional view taken along line A-A' of FIG. 1;
FIG. 10 is a further sectional view taken along line A-A' of FIG. 1;
FIG. 11 is a further sectional view taken along line A-A' of FIG. 1;
FIG. 12 is a further sectional view taken along line A-A' of FIG. 1;
FIG. 13 is a further sectional view taken along line A-A' of FIG. 1;
FIG. 14 is a further sectional view taken along line A-A' of FIG. 1;
FIG. 15 is a schematic view of one configuration of a substrate;
FIG. 16 is a schematic diagram of a structure for forming a first insulating layer;
FIG. 17 is a schematic view of a first recess filling feature;
FIG. 18 is a schematic view of a structure for forming a second insulating layer;
FIG. 19 is a schematic view of one configuration for forming a channel;
FIG. 20 is a schematic view of one configuration of filling the channels with elastomeric insulating members;
FIG. 21 is a schematic view of a structure for forming an electrode layer;
FIG. 22 is a schematic view showing a structure for mounting a light emitting unit;
fig. 23 is a schematic structural diagram of a display device according to the present invention.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
The present invention provides a display panel, a method for manufacturing the same, and a display device, and the following detailed description will be given with respect to specific embodiments of the display panel, the method for manufacturing the same, and the display device provided by the present invention.
Referring to fig. 1 to 7, fig. 1 is a schematic structural view of a display panel according to the present invention, fig. 2 is a cross-sectional view taken along a direction a-a 'in fig. 1, fig. 3 is another cross-sectional view taken along a direction a-a' in fig. 1, fig. 4 is still another cross-sectional view taken along a direction a-a 'in fig. 1, fig. 5 is still another cross-sectional view taken along a direction a-a' in fig. 1, fig. 6 is still another cross-sectional view taken along a direction a-a 'in fig. 1, and fig. 7 is still another cross-sectional view taken along a direction a-a' in fig. 1.
A display panel 100, comprising: a substrate 1; the insulating layer 2 is positioned on one side of the substrate 1, the insulating layer 2 comprises a channel 3, two ends of the channel 3 are communicated with one side of the insulating layer 2, which is far away from the substrate 1, and an elastic insulating part 4 is arranged in the channel 3; an electrode layer 5, located on the side of the elastic insulating part 4 away from the substrate 1, and including a first connecting electrode 6 and a second connecting electrode 7, wherein the orthographic projection of the first connecting electrode 6 on the substrate 1 at least partially overlaps with the orthographic projection of one end of the channel 3 on the substrate 1, and the orthographic projection of the second connecting electrode 7 on the substrate 1 at least partially overlaps with the orthographic projection of the other end of the channel 3 on the substrate 1; and the light emitting unit 8 is positioned on one side of the electrode layer 5 far away from the insulating layer 2 and comprises a first pin 9 and a second pin 10, wherein the first pin 9 is in contact with the first connecting electrode 6, and the second pin 10 is in contact with the second connecting electrode 7.
It should be noted that, in fig. 1 to 7, the substrate 1, the insulating layer 2 and the thin film transistor layer 16 are not filled with patterns, only the channel 3 is shown in fig. 2 without being completely filled with the elastic insulating member 4, both ends of the elastic insulating member 4 are located at the same horizontal plane, that is, one end of the elastic insulating member 4 and one side of the insulating layer 2 away from the substrate 1 have a first space, the other end of the elastic insulating member 4 and one side of the insulating layer 2 away from the substrate 1 have a second space, the first connecting electrode 6 is in contact with one end of the elastic insulating member 4 through the first space, the second connecting electrode 7 is in contact with the other end of the elastic insulating member 4 through the second space, of course, both ends of the elastic insulating member 4 may not be located at the same horizontal plane, or both the first connecting electrode 6 and the second connecting electrode 7 are not in contact with the elastic insulating member 4 before the light emitting unit 8 is bound, without being limited thereto, it is sufficient that the first connection electrode 6 can contact one end of the elastic insulating member 4 and the second connection electrode 7 can contact the other end of the elastic insulating member 4 when the light emitting unit 8 is bound. Fig. 4 only shows that the elastic insulating member 4 is completely filled in the channel 3, that is, two ends of the elastic insulating member 4 are also communicated with one side of the insulating layer 2 far from the substrate 1, a first connecting electrode 6 and a second connecting electrode 7 are arranged on one side of the insulating layer 2 far from the substrate 1, when the orthographic projection of the first connecting electrode 6 on the substrate 1 is at least partially overlapped with the orthographic projection of one end of the channel 3 on the substrate 1, the first connecting electrode 6 is at least partially contacted with one end of the elastic insulating member 4, the orthographic projection of the second connecting electrode 7 on the substrate 1 is at least partially overlapped with the orthographic projection of the other end of the channel 3 on the substrate 1, and the second connecting electrode 7 is at least partially contacted with the elastic insulating member 4.
It can be understood that fig. 2 only illustrates the case where the first pin 9 and the second pin 10 of the light emitting unit 8 are equal in length, the side of the first connection electrode 6 away from the substrate 1 and the side of the second connection electrode 7 away from the substrate 1 are not in the same plane before the light emitting unit 8 is bound, and the elastic insulating member 4 is not completely filled in the channel 3, fig. 3 is a structure after the light emitting unit 8 is bound for the case of fig. 2, specifically, when the light emitting unit 8 is bound, the first pin 9 of the light emitting unit 8 presses the first connection electrode 6, the first connection electrode 6 presses one end of the elastic insulating member 4, the second pin 10 of the light emitting unit 8 presses the second connection electrode 7, the second connection electrode 7 presses the other end of the elastic insulating member 4, the maximum distance between the first connection electrode 6 and the substrate 1 is greater than the maximum distance between the second connection electrode 7 and the substrate 1, the degree of pressing down of the first connecting electrode 6 to one end of the elastic insulating member 4 is greater than the degree of pressing down of the second connecting electrode 7 to the other end of the elastic insulating member 4, and the compression amounts of the two ends of the elastic insulating member 4 are different, so that the light emitting surface of the light emitting unit 8 is parallel to the substrate 1, and poor binding is avoided. Fig. 4 only shows that the lengths of the first pin 9 and the second pin 10 of the light emitting unit 8 are equal, before the light emitting unit 8 is bound, the side of the first connecting electrode 6 away from the substrate 1 and the side of the second connecting electrode 7 away from the substrate 1 are not in the same plane, and the channel 3 is completely filled with the elastic insulating member 4, fig. 5 is a structure after the light emitting unit 8 is bound for the case of fig. 4, and similarly, when the light emitting unit 8 is bound, the first pin 9 of the light emitting unit 8 presses the first connecting electrode 6, the first connecting electrode 6 presses one end of the elastic insulating member 4, the second pin 10 of the light emitting unit 8 presses the second connecting electrode 7, the second connecting electrode 7 presses the other end of the elastic insulating member 4, the maximum distance between the first connecting electrode 6 and the substrate 1 is greater than the maximum distance between the second connecting electrode 7 and the substrate 1, the pressing degree of the first connecting electrode 6 to one end of the elastic insulating member 4 is greater than the pressing degree of the second connecting electrode 7 to the elastic insulating member 4 The pressing degree of the other end of the elastic insulating component 4 and the compression amount of the two ends of the elastic insulating component 4 are different, so that the light-emitting surface of the light-emitting unit 8 is parallel to the substrate 1, and poor binding is avoided. Fig. 6 only shows that the lengths of the first pin 9 and the second pin 10 of the light emitting unit 8 are not equal, before the light emitting unit 8 is bound, the side of the first connecting electrode 6 away from the substrate 1 and the side of the second connecting electrode 7 away from the substrate 1 are located in the same plane, and the channel 3 is completely filled with the elastic insulating member 4, fig. 7 is a structure after the light emitting unit 8 is bound for the case of fig. 6, when the light emitting unit 8 is bound, the length of the first pin 9 is longer than that of the second pin 10, the pressure of the first pin 9 on the first connecting electrode 6 is greater than that of the second pin 10 on the second connecting electrode 7, so that the pressure of the first connecting electrode 6 on one end of the elastic insulating member 4 is greater than that of the second connecting electrode 7 on the other end of the elastic insulating member 4, and the compression amounts of the two ends of the elastic insulating member 4 are different, so that the light emitting surface of the light emitting unit 8 is parallel to the substrate 1, poor binding is avoided.
Specifically, several structures in the present embodiment are merely illustrative, but not limited thereto, the first pin 9 may be an anode of the light emitting unit 8, and the second pin 10 may be a cathode of the light emitting unit 8, or the first pin 9 may be a cathode of the light emitting unit 8, and the second pin 10 may be an anode of the light emitting unit 8, and accordingly, the first connection electrode 6 may be connected to the anode of the light emitting unit 8, and the second connection electrode 7 may be connected to the cathode of the light emitting unit 8, or the first connection electrode 6 may be connected to the cathode of the light emitting unit 8, and the second connection electrode 7 may be connected to the anode of the light emitting unit 8. Because the array substrate has the in-plane step caused by various film patterns, after the insulating layer 2 is manufactured, the insulating layer 2 may have a step on the side away from the substrate 1, in this embodiment, by adding the insulating layer 2, even if the insulating layer 2 has the step caused by the step of the array substrate, because the insulating layer 2 is provided with the channel 3, and the elastic insulating member 4 is partially filled in the channel 3, the two ends of the elastic insulating member 4 in the channel 3 can be respectively covered with the first connecting electrode 6 and the second connecting electrode 7 with the same thickness, that is, in the channel 3, the side of the first connecting electrode 6 away from the substrate 1 and the side of the second connecting electrode 7 away from the substrate 1 are located in the same plane, which is beneficial to binding the light emitting unit 8, so that the light emitting surface of the light emitting unit 8 is parallel to the substrate 1. In addition, other film layers may be further disposed between the substrate 1 and the light emitting unit 8, which are not described herein in detail, and the light emitting unit 8 may be a micro light emitting diode or a mini light emitting diode, which is not specifically limited in this embodiment.
Compared with the prior art, the display panel 100 provided by the invention at least has the following beneficial effects:
the display panel 100 provided by the present invention includes: a substrate 1; the insulating layer 2 is positioned on one side of the substrate 1, the insulating layer 2 comprises a channel 3, two ends of the channel 3 are communicated with one side of the insulating layer 2, which is far away from the substrate 1, and an elastic insulating part 4 is arranged in the channel 3; an electrode layer 5, located on the side of the elastic insulating part 4 away from the substrate 1, and including a first connecting electrode 6 and a second connecting electrode 7, wherein the orthographic projection of the first connecting electrode 6 on the substrate 1 at least partially overlaps with the orthographic projection of one end of the channel 3 on the substrate 1, and the orthographic projection of the second connecting electrode 7 on the substrate 1 at least partially overlaps with the orthographic projection of the other end of the channel 3 on the substrate 1; and the light emitting unit 8 is positioned on one side of the electrode layer 5, which is far away from the insulating layer 2, and comprises a first pin 9 and a second pin 10, wherein the first pin 9 is in contact with the first connecting electrode 6, and the second pin 10 is in contact with the second connecting electrode 7. When the light emitting unit 8 is bound, the first pin 9 of the light emitting unit 8 presses the first connecting electrode 6 downwards, the first connecting electrode 6 contacts one end of the elastic insulating part 4, the second pin 10 of the light emitting unit 8 presses the second connecting electrode 7 downwards, the second connecting electrode 7 contacts the other end of the elastic insulating part 4, when one side of the first connecting electrode 6, which is far away from the insulating layer 2, and one side of the second connecting electrode 7, which is far away from the insulating layer 2, are located in different planes, the pressure applied to the elastic insulating part 4 by the first connecting electrode 6 is different from the pressure applied to the elastic insulating part 4 by the second connecting electrode 7, and the elastic insulating part 4 is acted on to deform, the contact surfaces of the first connecting electrode 6 and one end of the elastic insulating part 4, and the contact surfaces of the second connecting electrode 7 and the other end of the elastic insulating part 4 are not located in the same plane, so that when the light emitting unit 8 is bound, the light-emitting surface of the light-emitting unit 8 is parallel to the substrate 1, so that the condition of poor binding is avoided; when the side of the first connecting electrode 6, which is far away from the insulating layer 2, and the side of the second connecting electrode 7, which is far away from the insulating layer 2, are located in the same plane, and the length of the first pin 9 is not equal to the length of the second pin 10, the pressure applied by the first pin 9 to the first connecting electrode 6 is different from the pressure applied by the second pin 10 to the second connecting electrode 7, so that the pressure applied by the first connecting electrode 6 to one end of the elastic insulating part 4 is not equal to the pressure applied by the second connecting electrode 7 to the other end of the elastic insulating part 4, and the pressures are both applied to the elastic insulating part 4 to deform the elastic insulating part 4, so that the light-emitting surface of the bound light-emitting unit 8 is parallel to the substrate 1, and the condition of poor binding caused by the different lengths of the first pin 9 and the second pin 10 is avoided.
In some alternative embodiments, referring to fig. 1, 2, 8 and 9, fig. 8 is a further cross-sectional view taken along a-a 'of fig. 1, and fig. 9 is a further cross-sectional view taken along a-a' of fig. 1, the elastic insulating member 4 has fluidity.
It will be appreciated that in fig. 8 and 9, substrate 1, insulating layer 2, and thin-film-transistor layer 16 are not filled with a pattern. The elastic insulating member 4 may be an elastic member compressed by a force, or an elastic member deformed without being compressed by a force, that is, the elastic insulating member 4 has fluidity, referring to fig. 2 and 8, fig. 2 only illustrates a case where lengths of the first pin 9 and the second pin 10 of the light emitting unit 8 are equal, before the light emitting unit 8 is bound, a side of the first connecting electrode 6 away from the substrate 1 and a side of the second connecting electrode 7 away from the substrate 1 are not in the same plane, and the channel 3 is not completely filled with the elastic insulating member 4, fig. 8 is a structure in which the light emitting unit 8 is bound, in a case of fig. 2, the first pin 9 presses the first connecting electrode 6, the second pin 10 presses the second connecting electrode 7, because a maximum distance from the first connecting electrode 6 to the substrate 1 is greater than a maximum distance from the second connecting electrode 7 to the substrate 1, the first connecting electrode 6 is compared with the second connecting electrode 7, the pressure applied to the elastic insulating member 4 is larger, according to the principle of a communicating vessel, the elastic insulating member 4 is forced to deform and move towards the direction close to the second connecting electrode 7 until the contact surfaces of the first connecting electrode 6 and the first pin 9 and the contact surfaces of the second connecting electrode 7 and the second pin 10 are located on the same plane, the dotted line position in fig. 8 is the original position of the two end surfaces of the elastic insulating member 4, at this time, the contact surfaces of the first connecting electrode 6 and the elastic insulating member 4 are located on one side of the original position close to the substrate 1, the contact surfaces of the second connecting electrode 7 and the elastic insulating member 4 are located on one side of the original position close to the light emitting unit 8, so that the light emitting surface of the light emitting unit 8 is parallel to the substrate 1, thereby avoiding the poor binding of the light emitting unit 8, of course, the lengths of the first pin 9 and the second pin 10 of the light emitting unit 8 are equal, and before the light emitting unit 8 is bound, under the condition that the side of the first connecting electrode 6, which is far away from the substrate 1, and the side of the second connecting electrode 7, which is far away from the substrate 1, are not in the same plane, the elastic insulating part 4 can be arranged to be completely filled in the channel 3, the action mode of the elastic insulating part 4 is the same as that of the above, and the elastic insulating part 4 is deformed and moved, so that the contact surfaces of the first connecting electrode 6 and the first pin 9, and the contact surfaces of the second connecting electrode 7 and the second pin 10 are in the same plane, further, when the light-emitting unit 8 is bound, the light-emitting surface of the light-emitting unit 8 can be ensured to be parallel to the substrate 1, and the condition of poor binding can be avoided. Referring to fig. 6 and 9, fig. 6 only shows that the lengths of the first pin 9 and the second pin 10 of the light emitting unit 8 are different, before the light emitting unit 8 is bonded, the side of the first connection electrode 6 away from the substrate 1 and the side of the second connection electrode 7 away from the substrate 1 are located in the same plane, and the channel 3 is completely filled with the elastic insulating member 4, fig. 9 is a structure after the light emitting unit 8 is bonded for the case of fig. 6, because the length of the first pin 9 is greater than the length of the second pin 10, the pressure applied by the first pin 9 to the first connection electrode 6 is greater than the pressure applied by the second pin 10 to the second connection electrode 7, so that the pressure applied by the first connection electrode 6 to the elastic insulating member 4 is greater than the pressure applied by the second connection electrode 7 to the elastic insulating member 4, the elastic insulating member 4 is forced to deform according to the principle of a connector, and moves toward the direction of the second connection electrode 7, until the requirement that the distance between the contact surfaces of the first connection electrode 6 and the first pin 9 and the distance between the contact surfaces of the second connection electrode 7 and the second pin 10 are equal to the distance between the first pin 9 and the second pin 10 along the direction perpendicular to the substrate 1 is satisfied, the light emitting surface of the light emitting unit 8 is parallel to the substrate 1, and poor binding is avoided.
In some alternative embodiments, referring to fig. 1 and 10, fig. 10 is a further cross-sectional view a-a' of fig. 1, the insulating layer 2 comprising: a first insulating layer 11 and a second insulating layer 12 which are laminated, wherein the second insulating layer 12 is positioned on one side of the first insulating layer 11 far away from the substrate 1; the channel 3 comprises a first channel 13, a second channel 14 and a third channel 15 which are sequentially communicated, the first channel 13 and the third channel 15 are positioned on the second insulating layer 12, and the second channel 14 is positioned on the first insulating layer 11.
It can be understood that, in fig. 10, the substrate 1, the insulating layer 2, and the thin-film transistor layer 16 are not filled with patterns, fig. 10 only illustrates one position of the first channel 13, the second channel 14, and the third channel 15, the second channel 14 is located at the first insulating layer 11, the first channel 13, and the third channel 15 is located at the second insulating layer 12, and the second insulating layer 12 is located at a side of the first insulating layer 11 away from the substrate 1, and it is further determined that the structure of the channel 3 is the channel 3 with two ends facing away from the substrate 1, and it is complicated to fabricate the channel 3 in one film, and it is beneficial to form the channel 3 by disposing the first channel 13, the third channel 15 at the second insulating layer 12 and disposing the second channel 14 at the first insulating layer 11, which simplifies the steps and saves the cost.
In some alternative embodiments, with continued reference to fig. 1 and 10, the first connecting electrode 6 is in contact with the resilient insulating member 4 at the end of the first channel 13 remote from the second channel 14, and the second connecting electrode 7 is in contact with the resilient insulating member 4 at the end of the third channel 15 remote from the second channel 14.
It can be understood that the first connecting electrode 6 is in contact with the elastic insulating member 4 at the end of the first passage 13 remote from the second passage 14, which can ensure the reliability between the first connecting electrode 6 and the elastic insulating member 4; the second connecting electrode 7 is in contact with the elastic insulating part 4 at one end of the third channel 15 far away from the second channel 14, so that the reliability between the second connecting electrode 7 and the elastic insulating part 4 can be ensured; it is also possible to provide a space between the first connection electrode 6 and the second connection electrode 7 to prevent the first connection electrode 6 from contacting the second connection electrode 7, causing a short circuit of the light emitting cells 8.
In some optional implementations, with continued reference to fig. 2 to 10, the display panel 100 in this embodiment further includes: the orthographic projection of the first pin 9 on the substrate 1 at least partially overlaps the orthographic projection of one end of the channel 3 on the substrate 1, and the orthographic projection of the second pin 10 on the substrate 1 at least partially overlaps the orthographic projection of the other end of the channel 3 on the substrate 1.
It can be understood that the first connection electrode 6 is a single body, the position where the first pin 9 is in contact with the first connection electrode 6 is most stressed, while the orthographic projection of the first pin 9 on the substrate 1 does not overlap the orthographic projection of one end of the channel 3 on the substrate 1, that is, the position where the first connection electrode 6 is less stressed is in contact with the elastic insulating member 4, and similarly, the second connection electrode 7 is a whole, the position where the second pin 10 is in contact with the first connection electrode is most stressed, while the orthographic projection of the second pin 10 on the substrate 1 does not overlap the orthographic projection of the other end of the channel 3 on the substrate 1, that is, the position where the stress on the second connection electrode 7 is small is in contact with the elastic insulating member 4, so that the amount of deformation of the first connection electrode 6 and the second connection electrode 7 at the position of the channel 3 is small, and the effect of improving the poor binding of the light emitting unit 8 is weak. When the orthographic projection of the first pin 9 on the substrate 1 is at least partially overlapped with the orthographic projection of one end of the channel 3 on the substrate 1, the orthographic projection of the second pin 10 on the substrate 1 is at least partially overlapped with the orthographic projection of the other end of the channel 3 on the substrate 1, namely, the position of the first connecting electrode 6 with larger stress is contacted with the elastic insulating part 4, the position of the second connecting electrode 7 with larger stress is contacted with the elastic insulating part 4, the deformation amount of the first connecting electrode 6 and the second connecting electrode 7 at the position of the channel 3 is larger, the poor binding of the light-emitting unit 8 can be effectively improved, and after the light-emitting unit 8 is bound, the light-emitting surface of the light-emitting unit 8 is parallel to the substrate 1.
In some alternative embodiments, with continued reference to fig. 2, the display panel 100 in this embodiment further includes: and the thin film transistor layer 16 is positioned between the substrate 1 and the insulating layer 2 and comprises a thin film transistor 17 and a signal line 18, the first connecting electrode 6 is electrically connected with the thin film transistor 17 through a first through hole 19, and the second connecting electrode 7 is electrically connected with the signal line 18 through a second through hole 20.
It should be noted that the thin-film transistor layer 16 includes a thin-film transistor 17, and the thin-film transistor 17 includes a gate 25, a source 26, a drain 27, and an active layer 28 connecting the source 26 and the drain 27, and fig. 2 only illustrates that the thin-film transistor 17 is a top-gate structure, and may also be a bottom-gate structure, which may be adjusted according to specific requirements, and this embodiment is not limited in this embodiment. The thin-film transistor layer 16 may further include a gate insulating layer and an interlayer dielectric layer, and other film layers may also be disposed between the substrate 1 and the thin-film transistor layer 16, which is not limited in this embodiment.
It is understood that the first connection electrode 6 is electrically connected to the drain electrode 27 of the thin film transistor 17, the second electrode is electrically connected to the signal line 18, the drain electrode 27 provides a first voltage to the first connection electrode 6, the signal line 18 provides a second voltage to the second electrode, when the light emitting unit 8 is bound, the first connection electrode 6 is electrically connected to the first pin 9, the second connection electrode 7 is electrically connected to the second pin 10, a potential difference is formed between the first voltage and the second voltage, and the light emitting unit 8 emits light under the action of the potential difference.
In some alternative embodiments, referring to fig. 1, 2, 6, 11 and 12, fig. 11 is a further cross-sectional view taken along a-a 'in fig. 1, and fig. 12 is a further cross-sectional view taken along a-a' in fig. 1, the first and second connection electrodes 6 and 7 have elasticity.
It should be noted that, in fig. 11 and 12, the substrate 1, the insulating layer 2, and the thin film transistor layer 16 are not filled with patterns, and the materials of the first connection electrode 6 and the second connection electrode 7 are usually metal or indium tin oxide, so that the deformation amount of the first connection electrode 6 and the second connection electrode 7 is limited, and the deformation amount of the first connection electrode 6 and the second connection electrode 7 can be increased by using elastic materials for the first connection electrode 6 and the second connection electrode 7, so as to avoid the damage of the first connection electrode 6 and the second connection electrode 7 caused by excessive pressure when the first pin 9 and the second pin 10 are pressed down.
It can be understood that, referring to fig. 2 and 11, fig. 2 only illustrates a case where the first pin 9 and the second pin 10 of the light emitting unit 8 are equal in length, a side of the first connection electrode 6 away from the substrate 1 and a side of the second connection electrode 7 away from the substrate 1 are not in the same plane before the light emitting unit 8 is bound, and the elastic insulating member 4 is not completely filled in the channel 3, the elastic insulating member 4 has fluidity, fig. 8 is a structure for binding the light emitting unit 8 with respect to the case of fig. 2, specifically, a maximum distance between the first connection electrode 6 and the substrate 1 is greater than a maximum distance between the second connection electrode 7 and the substrate 1, a pressure applied by the first connection electrode 6 to the elastic insulating member 4 is greater than a pressure applied by the second connection electrode 7 to the elastic insulating member 4, the first pin 9 presses the first connection electrode 6, the first connection electrode 6 has elasticity, the first connecting electrode 6 is only deformed at the contact position with the elastic insulating part 4, the elastic insulating part 4 is forced to be deformed according to the principle of a communicating vessel and moves towards the direction close to the second connecting electrode 7, the second connecting electrode 7 is also elastic, the second connecting electrode 7 is only deformed towards the direction far away from the substrate 1 at the contact position with the elastic insulating part 4, the contact surface of the first pin 9 and the first connecting electrode 6 is realized, the contact surface of the second pin 10 and the second connecting electrode 7 is positioned in the same horizontal plane, the light-emitting surface of the bound light-emitting unit 8 is ensured to be parallel to the substrate 1, and poor binding is avoided.
Similarly, referring to fig. 6 and 12, fig. 6 only shows that the lengths of the first pin 9 and the second pin 10 of the light emitting unit 8 are different, before the light emitting unit 8 is bound, the side of the first connecting electrode 6 away from the substrate 1 and the side of the second connecting electrode 7 away from the substrate 1 are located in the same plane, and the channel 3 is completely filled with the elastic insulating member 4, the elastic insulating member 4 has fluidity, fig. 12 is a structure for binding the light emitting unit 8 with respect to the situation of fig. 6, specifically, the pressure applied by the first pin 9 to the first connecting electrode 6 is greater than the pressure applied by the second pin 10 to the second connecting electrode 7, so that the pressure applied by the first connecting electrode 6 to the elastic insulating member 4 is greater than the pressure applied by the second connecting electrode 7 to the elastic insulating member 4, the first connecting electrode 6 has elasticity, and the contact position of the first connecting electrode 6 only deforms with the elastic insulating member 4, the elastic insulating part 4 is forced to deform according to the principle of a communicating vessel and moves towards the direction close to the second connecting electrode 7, the second connecting electrode 7 is elastic, the second connecting electrode 7 only deforms with the contact position of the elastic insulating part 4 and extends towards the direction far away from the substrate 1, the distance between the contact surface of the first pin 9 and the first connecting electrode 6 and the distance between the contact surface of the second pin 10 and the contact surface of the second connecting electrode 7 are equal to the length difference value of the first pin 9 and the second pin 10, the light-emitting surface of the bound light-emitting unit 8 is ensured to be parallel to the substrate 1, and poor binding is avoided.
In some alternative embodiments, with continued reference to fig. 1 and 2, the material of the first and second connection electrodes 6, 7 is a copper alloy.
It is understood that the copper alloy can be a copper-nickel alloy, a beryllium copper alloy, or a manganese-steel alloy and a carbon steel, and any material that can achieve electrical conductivity, and is soft and has good ductility is within the protection scope of the present embodiment. Because first connecting electrode 6 and second connecting electrode 7 adopt the copper alloy for first connecting electrode 6 and second connecting electrode 7 have elasticity, the scope that can take place the deformation of first connecting electrode 6 and second connecting electrode 7 increases, and the maximum strength limit of first connecting electrode 6 and second connecting electrode 7 increases promptly, and the pressure is too big when avoiding first pin 9, second pin 10 to push down, leads to first connecting electrode 6, second connecting electrode 7 to damage.
In some alternative embodiments, with continued reference to fig. 1 and 2, the material of the resilient insulating member 4 is a hot melt adhesive or a heat sensitive plastic.
It can be understood that the materials of the hot melt adhesive are basic resin, tackifier, viscosity regulator and antioxidant, and the basic resin is formed by copolymerizing ethylene and vinyl acetate at high temperature and high pressure. Thermo-sensitive plastic ester (TPEE), also called polyester rubber, is a linear block copolymer containing PBT (polybutylene terephthalate) polyester hard segments and aliphatic polyester or polyether soft segments, which can deform after being stressed, and can be of course other materials, which are not specifically limited herein.
In some alternative embodiments, referring to fig. 1, 2, 13 and 14, fig. 13 is a further sectional view taken along a-a 'in fig. 1, and fig. 14 is a further sectional view taken along a-a' in fig. 1, the section taken along a direction perpendicular to the substrate 1, the section taken through both ends of the channel 3, the channel 3 being U-shaped, V-shaped or semi-circular in cross-section.
It is understood that, in fig. 13 and 14, the substrate 1, the insulating layer 2 and the thin-film transistor layer 16 are not filled with patterns, only the channel 3 is illustrated as U-shaped in cross section in fig. 2, only the channel 3 is illustrated as semi-circular in cross section in fig. 13, only the channel 3 is illustrated as V-shaped in cross section in fig. 14, and the channel 3 capable of serving as a communication device to avoid the poor binding of the light emitting unit 8 is within the protection scope of the present embodiment, without being limited thereto.
In some alternative embodiments, referring to fig. 15 to 22, fig. 15 is a schematic structural diagram of a substrate, fig. 16 is a schematic structural diagram of forming a first insulating layer, fig. 17 is a schematic structural diagram of filling a first groove with a filler, fig. 18 is a schematic structural diagram of forming a second insulating layer, fig. 19 is a schematic structural diagram of forming a channel, fig. 20 is a schematic structural diagram of filling a channel with an elastic insulating member, fig. 21 is a schematic structural diagram of forming an electrode layer, fig. 22 is a schematic structural diagram of mounting a light emitting unit, and the manufacturing method of the display panel provided in this embodiment includes:
s101: providing a substrate 1;
in S101, referring to fig. 15, fig. 15 illustrates only one structure of the substrate 1, where the substrate 1 may be a flexible substrate 1 or a rigid substrate 1, and when the substrate 1 is the rigid substrate 1, the substrate 1 may be made of glass, transparent resin, or the like; when the substrate 1 is a flexible substrate 1, the material of the substrate 1 may be polycarbonate, polyimide, etc., and this embodiment is not particularly limited, and in fig. 15 to fig. 22, the substrate 1, the insulating layer 2, and the thin-film transistor layer 16 are not filled with patterns.
S102: forming a first insulating layer 11 on one side of the substrate 1, and etching a first groove 21 on one side of the first insulating layer 11 away from the substrate 1;
in S102, referring to fig. 16, fig. 16 only illustrates the substrate 1 and the first insulating layer 11, and specifically, another film layer such as a thin film transistor layer 16 is further included between the substrate 1 and the first insulating layer 11.
S103: filling the first groove 21 with a filler 22;
in S103, referring to fig. 17, fig. 17 only shows that the first groove 21 is completely filled with the filler 22, but it is needless to say that the first groove 21 may be partially filled with the filler 22, which is not specifically limited in this embodiment, the filler 22 may be filled by an inkjet printing method, and the material of the filler 22 may be a metal or an inorganic material, which is not specifically limited here.
S104: forming a second insulating layer 12 on one side of the first insulating layer 11 far away from the substrate 1, and etching to form a second groove 23 and a third groove 24 on one side of the second insulating layer 12 far away from the first insulating layer 11, wherein a gap is formed between the second groove 23 and the third groove 24;
in S104, referring to fig. 18, fig. 18 only illustrates that the cross sections of the second groove 23 and the third groove 24 are rectangular, specifically, may be trapezoidal.
S105: removing the filler 22 so that the first groove 21, the second groove 23 and the third groove 24 are communicated to form a channel 3;
in S105, referring to fig. 19, removing the filler 22 may connect the first groove 21, the second groove 23, and the third groove 24, specifically, if the filler 22 is a metal, the filler 22 may be removed by wet etching; if the filler 22 is an inorganic material, the filler 22 may be removed by a solvent that reacts with the inorganic material to form the channel 3.
S106: filling the channel 3 with an elastic insulating part 4;
in S106, referring to fig. 20, fig. 20 only illustrates that the elastic insulating member 4 is at least partially located in the second insulating layer 12, which can effectively improve the reliability of the connection between the first and second connection electrodes 6 and 7 and the elastic insulating member 4.
S107: forming an electrode layer 5 on a side of the second insulating layer 12 away from the first insulating layer 11, the electrode layer 5 including a first connection electrode 6 and a second connection electrode 7, the first connection electrode 6 at least partially covering the second groove 23, the second connection electrode 7 at least partially covering the third groove 24;
in S107, referring to fig. 21, fig. 21 only shows that the first and second connection electrodes 6 and 7 are at least partially located in the channel 3, but if the channel 3 is completely filled with the elastic insulating member 4, the first and second connection electrodes 6 and 7 may cover the elastic insulating member 4 on the side of the second insulating layer 12 away from the first insulating layer 11.
S108: mounting a light emitting unit 8 on a side of the electrode layer 5 away from the second insulating layer 12, the light emitting unit 8 including a first pin 9 and a second pin 10, the first pin 9 being in contact with the first connection electrode 6, the second pin 10 being in contact with the second connection electrode 7; if the side of the first connecting electrode 6 away from the second insulating layer 12 and the side of the second connecting electrode 7 away from the second insulating layer 12 are located in different planes, the elastic insulating member 4 deforms, so that the side of the first connecting electrode 6 away from the second insulating layer 12 and the side of the second connecting electrode 7 away from the second insulating layer 12 are located in the same plane.
In S108, referring to fig. 22, fig. 22 only shows that the lengths of the first pin 9 and the second pin 10 of the light emitting unit 8 are equal, the elastic insulating member 4 has fluidity, the first connecting electrode 6 presses down one end of the elastic insulating member 4, the second connecting electrode 7 presses down the other end of the elastic insulating member 4, the elastic insulating member 4 is forced to move to the second connecting electrode 7 to deform because the pressure of the first connecting electrode 6 on the elastic insulating member 4 is greater than the pressure of the second connecting electrode 7 on the elastic insulating member 4, the stress on the first pin 9 and the second pin 10 can be equal because the channel 3 and the elastic insulating member 4 are equivalent to a connector, the contact surface of the first pin 9 and the first connecting electrode 6 and the contact surface of the second pin 10 and the second connecting electrode 7 are in the same plane, and after the light emitting unit 8 is bound, the light-emitting surface of the light-emitting unit 8 is parallel to the substrate 1, so that the problem of poor binding is avoided. Of course, the present embodiment is only illustrative of a specific embodiment, and is not limited thereto.
Based on the same inventive concept, the present application further provides a display device 200, please refer to fig. 23, fig. 23 is a schematic structural diagram of the display device provided in the embodiment of the present application, the display device 200 includes a display panel 100, and the display panel 100 is any one of the display panels 100 provided in the embodiments of the present application. For an embodiment of the display device 200 provided in the embodiment of the present application, reference may be made to the above-mentioned embodiment of the display panel 100, and repeated descriptions are omitted. The display device 200 provided by the present application may be: any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like.
According to the embodiment, the display panel provided by the invention at least realizes the following beneficial effects:
the display panel provided by the invention comprises: a substrate; the insulating layer is positioned on one side of the substrate and comprises a channel, two ends of the channel are communicated with one side of the insulating layer, which is far away from the substrate, and an elastic insulating part is arranged in the channel; the electrode layer is positioned on one side of the elastic insulating part, which is far away from the substrate, and comprises a first connecting electrode and a second connecting electrode, wherein the orthographic projection of the first connecting electrode on the substrate at least partially overlaps with the orthographic projection of one end of the channel on the substrate, and the orthographic projection of the second connecting electrode on the substrate at least partially overlaps with the orthographic projection of the other end of the channel on the substrate; and the light-emitting unit is positioned on one side of the electrode layer, which is far away from the insulating layer, and comprises a first pin and a second pin, wherein the first pin is in contact with the first connecting electrode, and the second pin is in contact with the second connecting electrode. When the light-emitting unit is bound, the first pin of the light-emitting unit presses down the first connecting electrode, the first connecting electrode contacts one end of the elastic insulating component, the second pin of the light-emitting unit presses down the second connecting electrode, the second connecting electrode contacts the other end of the elastic insulating component, when the side of the first connection electrode remote from the insulating layer and the side of the second connection electrode remote from the insulating layer are located in different planes, the pressure applied by the first connecting electrode to the elastic insulating part is different from the pressure applied by the second connecting electrode to the elastic insulating part, and the pressures act on the elastic insulating part to deform the elastic insulating part, the contact surface of the first connecting electrode and one end of the elastic insulating part and the contact surface of the second connecting electrode and the other end of the elastic insulating part are not positioned in the same plane, when the light-emitting units are bound, the light-emitting surfaces of the light-emitting units are parallel to the substrate, so that the condition of poor binding is avoided; when the side, away from the insulating layer, of the first connecting electrode and the side, away from the insulating layer, of the second connecting electrode are located in the same plane, and the length of the first pin is unequal to that of the second pin, the pressure applied to the first connecting electrode by the first pin is different from the pressure applied to the second connecting electrode by the second pin, so that the pressure applied to one end of the elastic insulating part by the first connecting electrode is unequal to the pressure applied to the other end of the elastic insulating part by the second connecting electrode, the pressure and the pressure are both acted on the elastic insulating part to deform the elastic insulating part, the light emitting surface of the bound light emitting unit is parallel to the substrate, and the condition that the bound light emitting unit is poor due to the fact that the lengths of the first pin and the second pin are different is avoided.
Although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims (12)
1. A display panel, comprising:
a substrate;
the insulating layer is positioned on one side of the substrate and comprises a channel, two ends of the channel are communicated with one side of the insulating layer, which is far away from the substrate, and an elastic insulating part is arranged in the channel;
the electrode layer is positioned on one side, far away from the substrate, of the elastic insulating part and comprises a first connecting electrode and a second connecting electrode, the orthographic projection of the first connecting electrode on the substrate is at least partially overlapped with the orthographic projection of one end of the channel on the substrate, and the orthographic projection of the second connecting electrode on the substrate is at least partially overlapped with the orthographic projection of the other end of the channel on the substrate;
and the light-emitting unit is positioned on one side of the electrode layer, which is far away from the insulating layer, and comprises a first pin and a second pin, wherein the first pin is in contact with the first connecting electrode, and the second pin is in contact with the second connecting electrode.
2. The display panel according to claim 1, wherein the elastic insulating member has fluidity.
3. The display panel according to claim 1, wherein the insulating layer comprises: the first insulating layer and the second insulating layer are stacked, and the second insulating layer is positioned on one side, away from the substrate, of the first insulating layer;
the channel comprises a first channel, a second channel and a third channel which are sequentially communicated, the first channel and the third channel are located on the second insulating layer, and the second channel is located on the first insulating layer.
4. The display panel according to claim 3, wherein the first connection electrode is in contact with the elastic insulating member at an end of the first channel away from the second channel, and wherein the second connection electrode is in contact with the elastic insulating member at an end of the third channel away from the second channel.
5. The display panel according to claim 1, further comprising:
the orthographic projection of the first pin on the substrate at least partially overlaps with the orthographic projection of one end of the channel on the substrate, and the orthographic projection of the second pin on the substrate at least partially overlaps with the orthographic projection of the other end of the channel on the substrate.
6. The display panel according to claim 5, further comprising:
and the thin film transistor layer is positioned between the substrate and the insulating layer and comprises a thin film transistor and a signal wire, the first connecting electrode is electrically connected with the thin film transistor through a first through hole, and the second connecting electrode is electrically connected with the signal wire through a second through hole.
7. The display panel according to claim 6, wherein the first connection electrode and the second connection electrode have elasticity.
8. The display panel according to claim 7, wherein a material of the first connection electrode and the second connection electrode is a copper alloy.
9. The display panel according to claim 1, wherein the material of the elastic insulating member is a hot melt adhesive or a heat-sensitive plastic.
10. The display panel according to claim 1, wherein a cross section taken in a direction perpendicular to the substrate passes through both ends of the channel, and the channel is U-shaped, V-shaped, or semicircular in the cross section.
11. A method of manufacturing a display panel, comprising:
providing a substrate;
forming a first insulating layer on one side of the substrate, and etching a first groove on one side, far away from the substrate, of the first insulating layer;
filling filler in the first groove;
forming a second insulating layer on one side, far away from the substrate, of the first insulating layer, and etching one side, far away from the first insulating layer, of the second insulating layer to form a second groove and a third groove, wherein a gap is formed between the second groove and the third groove;
removing the filler, so that the first groove, the second groove and the third groove are communicated to form a channel;
filling an elastic insulating part into the channel;
forming an electrode layer on one side of the second insulating layer far away from the first insulating layer, wherein the electrode layer comprises a first connecting electrode and a second connecting electrode, the first connecting electrode at least partially covers the second groove, and the second connecting electrode at least partially covers the third groove;
installing a light emitting unit on one side of the electrode layer far away from the second insulating layer, wherein the light emitting unit comprises a first pin and a second pin, the first pin is in contact with the first connecting electrode, and the second pin is in contact with the second connecting electrode; if one side of the first connecting electrode, which is far away from the second insulating layer, and one side of the second connecting electrode, which is far away from the second insulating layer, are located in different planes, the elastic insulating part deforms, so that one side of the first connecting electrode, which is far away from the second insulating layer, and one side of the second connecting electrode, which is far away from the second insulating layer, are located in the same plane.
12. A display device comprising the display panel of any one of claims 1-10.
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