CN114765935A - Electronic system - Google Patents
Electronic system Download PDFInfo
- Publication number
- CN114765935A CN114765935A CN202110053077.5A CN202110053077A CN114765935A CN 114765935 A CN114765935 A CN 114765935A CN 202110053077 A CN202110053077 A CN 202110053077A CN 114765935 A CN114765935 A CN 114765935A
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- China
- Prior art keywords
- heat
- electronic system
- space
- electronic device
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 42
- 230000008878 coupling Effects 0.000 claims description 12
- 238000010168 coupling process Methods 0.000 claims description 12
- 238000005859 coupling reaction Methods 0.000 claims description 12
- 230000005540 biological transmission Effects 0.000 claims description 7
- 239000012809 cooling fluid Substances 0.000 claims description 2
- 238000005381 potential energy Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000007769 metal material Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses an electronic system, which comprises an electronic device and a heat dissipation device. The electronic device comprises a shell, a heat source, a heat conducting seat and a heat conducting block. The shell is provided with a communicated space and at least one opening. The heat source is arranged in the space. The heat conduction seat is arranged in the space and is in contact with the heat source, and at least part of the heat conduction seat is opposite to the opening. The heat conduction block is positioned at the opening and elastically connected with the shell. The heat dissipation device comprises at least one pressing part and a heat dissipation part. The pressing part is configured to press the heat conducting block, so that the heat conducting block moves towards the space and is abutted against the heat conducting seat, and the heat energy of the heat source is transmitted to the pressing part through the heat conducting seat and the heat conducting block. The heat dissipation part is connected with the pressing part and is configured to dissipate heat energy transmitted to the pressing part. Therefore, the heat dissipation device of the electronic system can effectively dissipate the heat of the heat source of the electronic device.
Description
Technical Field
The present invention relates to an electronic system, and more particularly, to an electronic system with a heat dissipation device.
Background
With the progress of electronic technology, the function of the smart phone is improved for a thousand miles a day. Along with the change of life modes of people, the electric games on the smart phone are becoming more and more popular. To take advantage of this new business area, various developers have also pursued more diversified and more detailed games to attract the market owners.
However, in order to deal with these more and more complex games, the amount of information to be processed at each moment of time by the processor inside the smart phone becomes larger and larger, so that the load of the processor becomes higher and higher.
Disclosure of Invention
The invention provides an electronic system, and a heat dissipation device can effectively dissipate heat of a heat source of the electronic device.
The invention provides an electronic system, which comprises an electronic device and a heat dissipation device. The electronic device comprises a shell, a heat source, a heat conducting seat and a heat conducting block. The shell is provided with a communicated space and at least one opening. The heat source is arranged in the space. The heat conducting seat is arranged in the space and is contacted with the heat source, and at least part of the heat conducting seat is opposite to the opening. The heat conduction block is positioned in the opening and elastically connected with the shell. The heat dissipation device comprises at least one pressing part and a heat dissipation part. The pressing part is configured to press the heat conducting block, so that the heat conducting block moves towards the space and is abutted against the heat conducting seat, and the heat energy of the heat source is transmitted to the pressing part through the heat conducting seat and the heat conducting block. The heat dissipation part is connected with the pressing part and is configured to dissipate heat energy transmitted to the pressing part.
In summary, the heat dissipation device of the present invention is mounted to the electronic device, and the heat dissipation device can effectively dissipate heat from the heat source of the electronic device. Moreover, the protruding part of the heat radiating part is inserted into the through hole of the shell, and the second combining part of the heat radiating part is buckled on the fourth combining part of the shell, so that the assembly of the heat radiating device and the electronic device is completed, and the assembly process does not involve the use of other hand tools, thereby bringing convenience for users.
In addition, when the first end of the bracket is not pushed by the convex part of the heat dissipation part, at least one part of the supporting part is propped against the heat conduction block. Therefore, the support part can continuously prevent the heat conduction block from contacting the heat conduction seat under the condition that the heat dissipation device is not abutted to the electronic device. Therefore, the heat conducting seat can not transfer the heat energy of the heat source to the heat conducting block, and a user can not touch the heat conducting block which generates heat by mistake. Therefore, the use safety of the electronic device is effectively improved.
Furthermore, in practical applications, when a user thinks that the heat generated by the heat source of the electronic device is not high, the user can choose not to mount the heat sink on the electronic device, so that the electronic system can provide a great flexibility in use.
Drawings
Fig. 1 is a schematic perspective view of an electronic system according to an embodiment of the invention, in which a heat dissipation device is not fixed to the electronic device.
Fig. 2 is a partial perspective top view of the electronic device of fig. 1.
Fig. 3 is a cross-sectional view taken along line a-a of fig. 2.
Fig. 4 is a bottom perspective view of the heat dissipation device of fig. 1.
Fig. 5 is a partial perspective top view of the electronic device of fig. 1, wherein the supporting portion is away from a path of the heat-conducting block moving toward the heat-conducting base.
Fig. 6 is a schematic perspective view of the electronic system in fig. 1, wherein the heat dissipation device is fixed to the electronic device.
Fig. 7 is a cross-sectional view taken along line B-B of fig. 6.
Fig. 8 is a side view of a heat dissipation device according to an embodiment of the invention.
Fig. 9 is a partial cross-sectional view of a heat dissipation device according to an embodiment of the invention.
Detailed Description
Referring to fig. 1 to 3, an electronic system 100 includes an electronic device 110 and a heat dissipation device 120. In an embodiment, the electronic device 110 may be a smart phone or a tablet computer, but is not limited thereto. Specifically, the electronic device 110 includes a housing 111, a heat source 112, a heat conductive base 113, and a heat conductive block 114. The housing 111 has a communicating space SP and at least one opening OP. The heat source 112 is provided in the space SP. In one embodiment, the heat source 112 may be a CPU or an image processor. When the electronic device 110 is operating, the heat source 112 generates a considerable amount of heat energy. The heat conducting seat 113 is disposed in the space SP and contacts the heat source 112, and at least a portion of the heat conducting seat 113 faces the opening OP. The heat conduction block 114 is located at the opening OP and elastically connected to the housing 111. In an embodiment, the heat-conducting block 114 is made of a metal material, and the contour of the heat-conducting block 114 matches the contour of the opening OP, so that the electronic device 110 has a good appearance.
Please refer to fig. 4. Fig. 4 is a perspective bottom view of the heat dissipation device 120 of fig. 1. In this embodiment, as shown in fig. 1 and 4, the heat dissipation device 120 includes at least one pressing portion 121 and a heat dissipation portion 122. The heat dissipation portion 122 is connected to the pressing portion 121, and the pressing portion 121 is configured to press the heat conduction block 114 of the electronic device 110, so that the heat conduction block 114 moves toward the heat conduction seat 113 and is joined with the heat conduction seat 113. In practical applications, the pressing portion 121 of the heat dissipation device 120 is made of metal material to improve the heat conduction efficiency.
As shown in fig. 4, the heat dissipating portion 122 of the heat dissipating device 120 includes a first connecting portion 1221 and a second connecting portion 1222 opposite to each other. As shown in fig. 1 to 2, the housing 111 of the electronic device 110 includes a third coupling portion 1111 and a fourth coupling portion 1112 facing each other. The first coupling portion 1221 of the heat sink 122 is configured to be coupled to the third coupling portion 1111 of the electronic device 110, and the second coupling portion 1222 of the heat sink 122 is configured to be coupled to the fourth coupling portion 1112 of the electronic device 110. In an embodiment, the third combining portion 1111 and the fourth combining portion 1112 are opposite sides of the electronic device 110, but not limited thereto. In an embodiment, the first combining portion 1221 and the second combining portion 1222 are a snap structure, but not limited thereto.
More specifically, in practical applications, as shown in fig. 4, the first bonding portion 1221 of the heat dissipating portion 122 includes at least one protruding portion 1221 a. As shown in fig. 1 to 2, the third coupling portion 1111 of the casing 111 includes at least one through hole HT, and the protruding portion 1221a of the heat dissipating portion 122 is configured to be inserted into the through hole HT of the casing 111. The fourth coupling portion 1112 of the housing 111 is actually a side of the housing 111, and the second coupling portion 1222 of the heat sink 122 is configured to be fastened to the fourth coupling portion 1112 of the housing 111.
Further, as shown in fig. 2 to 3, the electronic device 110 further includes a bracket 130, and the bracket 130 is movably located in the space SP. The bracket 130 includes a transmission portion 131, at least one supporting portion 132, and a connection portion 133. The transmission portion 131 includes a first end 1311 and a second end 1312 opposite to each other, and the first end 1311 is located between the second end 1312 and the through hole HT and configured to be pushed by the protruding portion 1221 a. When the heat sink 120 is not combined with the electronic device 110, at least a portion of the supporting portion 132 abuts against the heat conducting block 114, so that the heat conducting block 114 is not in contact with the heat conducting base 113. Therefore, the heat conducting base 113 does not transfer the heat energy of the heat source 112 to the heat conducting block 114, and the user does not feel that the heat conducting block 114 is hot. Therefore, the safety of the electronic system 100 can be effectively improved
In one embodiment, the housing 111 has an edge 1113, the edge 1113 surrounds and defines the opening OP, the edge 1113 is located between the connecting portion 133 and the first end 1311 in a vertical projection of the bracket 130, the connecting portion 133 connects the second end 1312, and the supporting portion 132 connects the connecting portion 133. In fact, the transmission portion 131, the supporting portion 132 and the connection portion 133 may be an integrally formed structure.
Please refer to fig. 5. Fig. 5 is a partial perspective top view of the electronic device 110 of fig. 1, wherein the supporting portion 132 is far from the heat conducting block 114 (fig. 5 illustrates the heat conducting block 114 and the internal structure of the electronic device 110). In detail, as shown in fig. 5, when the protruding portion 1221a of the heat dissipating portion 122 (only a portion of the protruding portion 1221a is shown in fig. 5) is inserted into the through hole HT of the housing 111, the protruding portion 1221a pushes the first end 1311 of the bracket 130, so that the transmission portion 131 of the bracket 130 is away from the through hole HT of the housing 111, and the supporting portion 132 moves along with the transmission portion 131 and away from the heat conducting block 114 due to the connecting portion 133. In this case, the supporting portion 132 no longer abuts against the heat conducting block 114, so the heat conducting block 114 moves toward the heat conducting base 113 due to gravity.
In other words, when the first end 1311 of the bracket 130 is not pushed by the protruding portion 1221a of the heat dissipating portion 122, at least a portion of the supporting portion 132 abuts against the heat conducting block 114, so that the heat conducting block 114 does not contact with the heat conducting base 113.
In one embodiment, as shown in fig. 2 and 5, the electronic system 100 further includes at least one first elastic element 140. The first elastic member 140 is located in the space SP and elastically connected between the bracket 130 and the housing 111. When the first elastic element 140 is in a natural state, at least a portion of the supporting portion 132 of the bracket 130 abuts against the heat conducting block 114, and when the protruding portion 1221a of the heat dissipating portion 122 is inserted into the through hole HT of the housing 111 and pushes the first end 1311 of the bracket 130, the supporting portion 132 of the bracket 130 is away from the heat conducting block 114, so that the first elastic element 140 is elongated to store a plurality of elastic potential energies. When the protruding portion 1221a of the heat dissipating portion 122 leaves the through hole HT of the housing 111 and no longer pushes the first end 1311 of the bracket 130, the first elastic component 140 releases the stored elastic potential energy to return to the natural state, so that at least a portion of the supporting portion 132 of the bracket 130 resets again and abuts against the heat conducting block 114, and the heat conducting block 114 no longer contacts with the heat conducting base 113.
Please refer to fig. 6 to 7. Fig. 6 is a perspective view of the electronic system 100 of fig. 1, wherein the heat sink 120 is fixed to the electronic device 110. Fig. 7 is a cross-sectional view taken along line B-B of fig. 6. In the present embodiment, as shown in fig. 6 to 7, the heat radiating portion 122 of the heat radiating device 120 abuts the housing 111 of the electronic device 110. In this case, the protrusion 1221a of the heat sink 122 is inserted into the through hole HT of the housing 111, and the second combining portion 1222 of the heat sink 122 is fastened to the fourth combining portion 1112 of the housing 111 to fix the relative position of the heat sink 120 and the electronic device 110. Specifically, in the present embodiment, when the second combining portion 1222 of the heat dissipating portion 122 is snapped to the fourth combining portion 1112 of the housing 111, the second combining portion 1222 is wrapped and snapped to the side of the portion of the housing 111, as shown in fig. 6.
As described above, when the protrusion 1221a of the heat sink 122 is inserted into the through hole HT of the housing 111 and pushes the first end 1311 of the bracket 130, the supporting portion 132 of the bracket 130 is away from the heat conducting block 114, and therefore, when the second combining portion 1222 of the heat sink 122 is also fastened to the fourth combining portion 1112 of the housing 111, the pressing portion 121 of the heat sink 120 presses the heat conducting block 114 of the electronic device 110, and the heat conducting block 114 moves toward the space SP and is then engaged with the heat conducting base 113, so that the heat energy of the heat source 112 is transmitted to the pressing portion 121 of the heat sink 120 through the heat conducting base 113 and the heat conducting block 114. The heat dissipation portion 122 of the heat dissipation device 120 is configured to dissipate heat energy transmitted to the bonding portion 121.
In other words, by mounting the heat sink 120 to the electronic device 110, the heat sink 120 can effectively dissipate the heat of the heat source 112 of the electronic device 110. Moreover, as described above, the protruding portion 1221a of the heat dissipating unit 122 is inserted into the through hole HT of the housing 111, and the second combining portion 1222 of the heat dissipating unit 122 is fastened to the fourth combining portion 1112 of the housing 111, so that the assembly of the heat dissipating device 120 and the electronic device 110 is completed, and the assembly process does not involve the use of other hand tools, thereby providing convenience to the user.
In practical applications, when the user thinks that the heat generated by the heat source 112 of the electronic device 110 is not high during operation, the user can also choose not to mount the heat sink 120 on the electronic device 110, so that the electronic system 100 can provide a great flexibility in use.
In this embodiment, as shown in fig. 3 and 7, the electronic system 100 further includes a heat pad 160. Specifically, the heat dissipation pad 160 is disposed on a side of the heat conductive base 113 facing the heat conductive block 114, so that the heat conductive block 114 and the heat conductive base 113 can be in better thermal contact.
In addition, in this embodiment, as shown in fig. 3 and 7, the electronic system 100 further includes at least one second elastic element 150. The second elastic member 150 is located in the space SP and elastically connected between the heat conduction block 114 and the housing 111. When the second elastic component 150 is in a natural state, at least a portion of the heat conducting block 114 is located at the opening OP, and when the pressing portion 121 of the heat dissipation device 120 presses against the heat conducting block 114 of the electronic device 110 and the heat conducting block 114 moves toward the space SP and abuts against the heat conducting base 113, the second elastic component 150 is compressed to store a plurality of elastic potential energy. When the heat dissipation device 120 leaves the electronic device 110 and the pressing portion 121 of the heat dissipation device 120 leaves the heat conduction block 114 of the electronic device 110, the second elastic component 150 releases the stored elastic potential energy to return to the natural state, and the heat conduction block 114 is at least partially located in the opening OP again to maintain the appearance of the electronic device 110.
In some embodiments, as shown in fig. 1, fig. 4, and fig. 7, the heat dissipation device 120 further includes a plurality of heat dissipation fins 123 to improve the heat dissipation effect of the heat dissipation device 120, but the invention is not limited thereto.
Please refer to fig. 8. Fig. 8 is a side view of a heat dissipation device 120 according to an embodiment of the invention. In the present embodiment, as shown in fig. 8, the heat dissipating portion 122 of the heat dissipating device 120 includes at least one fan 124 to improve the heat dissipating effect of the heat dissipating device 120, but the invention is not limited thereto.
Please refer to fig. 9. Fig. 9 is a partial cross-sectional view of a heat dissipation device 120 according to an embodiment of the invention. In the present embodiment, as shown in fig. 9, the heat dissipating portion 122 of the heat dissipating device 120 includes at least one flow channel CH, and the flow channel CH is configured to allow the cooling fluid CF to flow therethrough to improve the heat dissipating effect of the heat dissipating device 120, but the invention is not limited thereto.
In summary, in the electronic system of the present invention, the heat dissipation device is mounted to the electronic device, and the heat dissipation device can effectively dissipate heat from the heat source of the electronic device. Moreover, the protruding part of the heat radiating part is inserted into the through hole of the shell, and the second combining part of the heat radiating part is buckled on the fourth combining part of the shell, so that the assembly of the heat radiating device and the electronic device is completed, and the assembly process does not involve the use of other hand tools, thereby bringing convenience for users.
In addition, when the first end of the bracket of the electronic system is not pushed by the convex part of the heat dissipation part, at least one part of the bearing part is propped against the heat conduction block. Therefore, the support portion can keep the heat conduction block from contacting the heat conduction seat when the heat sink does not contact the electronic device. Therefore, the heat conducting seat can not transfer the heat energy of the heat source to the heat conducting block, and a user can not touch the heat conducting block which generates heat by mistake. Therefore, the use safety of the electronic device is effectively improved.
Moreover, when the user thinks that the heat energy generated by the heat source of the electronic device is not high during the operation, the user can also choose not to install the heat sink on the electronic device, therefore, the electronic system can provide considerable flexibility in use.
Although the present invention has been described with reference to the above embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention.
Claims (11)
1. An electronic system, comprising:
an electronic device, comprising:
a housing having a space and at least one opening communicating with each other;
a heat source disposed in the space;
the heat conducting seat is arranged in the space and is in contact with the heat source, and at least part of the heat conducting seat is opposite to the opening; and
the heat conduction block is positioned at the opening and is elastically connected with the shell; and
a heat sink, comprising:
at least one pressing part configured to press the heat conduction block, so that the heat conduction block moves towards the space and abuts against the heat conduction seat, and the heat energy of the heat source is transmitted to the pressing part through the heat conduction seat and the heat conduction block; and
a heat dissipation portion connected to the nip portion and configured to dissipate the thermal energy transmitted to the nip portion.
2. The electronic system of claim 1, wherein the heat sink includes a first joint and a second joint opposite to each other, the housing includes a third joint and a fourth joint opposite to each other, when the heat sink abuts against the housing, the first joint is joined to the third joint, and the second joint is fastened to the fourth joint to fix a relative position between the heat sink and the electronic device.
3. The electronic system of claim 2, wherein the first coupling portion comprises at least one protrusion and the third coupling portion comprises at least one perforation, the protrusion configured to be inserted into the perforation.
4. The electronic system of claim 3, wherein the electronic device further comprises a support movably located in the space, and the support comprises:
a transmission part including a first end and a second end opposite to each other, the first end being located between the second end and the through hole and configured to push the protrusion;
at least one supporting part, wherein at least one part of the supporting part is propped against the heat conducting block so as to ensure that the heat conducting block is not contacted with the heat conducting seat; and
a connecting portion, the housing having an edge surrounding and defining the opening, the edge being located between the connecting portion and the first end in a vertical projection of the bracket, the connecting portion connecting the second end and the support portion,
when the protruding part pushes the first end, the bearing part moves along with the transmission part and is far away from the heat conducting block.
5. The electronic system of claim 4, further comprising at least one first resilient element disposed in the space and resiliently coupled between the frame and the housing, wherein at least a portion of the support portion abuts against the heat-conducting block when the first resilient element is in a natural state.
6. The electronic system of claim 1, further comprising at least one second resilient member positioned in the space and resiliently coupled between the heat slug and the housing, wherein the heat slug is at least partially positioned in the opening when the second resilient member is in a natural state.
7. The electronic system of claim 1, further comprising a heat spreader pad disposed on a side of the thermal socket facing the thermal slug.
8. The electronic system of claim 1, wherein a contour of the heat conducting block conforms to a contour of the opening.
9. The electronic system of claim 1, wherein the heat sink portion comprises a plurality of heat fins.
10. The electronic system of claim 1, wherein the heat sink comprises a fan.
11. The electronic system of claim 1, wherein the heat sink portion comprises a flow channel configured to flow a cooling fluid therethrough.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110053077.5A CN114765935A (en) | 2021-01-15 | 2021-01-15 | Electronic system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110053077.5A CN114765935A (en) | 2021-01-15 | 2021-01-15 | Electronic system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114765935A true CN114765935A (en) | 2022-07-19 |
Family
ID=82364364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110053077.5A Pending CN114765935A (en) | 2021-01-15 | 2021-01-15 | Electronic system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114765935A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6353536B1 (en) * | 1998-06-25 | 2002-03-05 | Kabushiki Kaisha Toshiba | Electronic equipment system and extension device for expanding the functions of electronic equipment |
| US6542360B2 (en) * | 2000-06-30 | 2003-04-01 | Kabushiki Kaisha Toshiba | Electronic apparatus containing heat generating component, and extension apparatus for extending the function of the electronic apparatus |
| CN101174168A (en) * | 2006-10-31 | 2008-05-07 | 佛山市顺德区顺达电脑厂有限公司 | Cooling structure of electronic device |
| WO2018089243A1 (en) * | 2016-11-14 | 2018-05-17 | Synventive Molding Solutions, Inc. | Actuator cooling apparatus and method |
| CN211296319U (en) * | 2020-03-16 | 2020-08-18 | 江西立讯智造有限公司 | Low-energy-consumption wireless charger with high heat dissipation efficiency |
| TWM604542U (en) * | 2020-08-31 | 2020-11-21 | 新漢智能系統股份有限公司 | Electronic device and heat-dissipation shell structure thereof |
-
2021
- 2021-01-15 CN CN202110053077.5A patent/CN114765935A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6353536B1 (en) * | 1998-06-25 | 2002-03-05 | Kabushiki Kaisha Toshiba | Electronic equipment system and extension device for expanding the functions of electronic equipment |
| US6542360B2 (en) * | 2000-06-30 | 2003-04-01 | Kabushiki Kaisha Toshiba | Electronic apparatus containing heat generating component, and extension apparatus for extending the function of the electronic apparatus |
| CN101174168A (en) * | 2006-10-31 | 2008-05-07 | 佛山市顺德区顺达电脑厂有限公司 | Cooling structure of electronic device |
| WO2018089243A1 (en) * | 2016-11-14 | 2018-05-17 | Synventive Molding Solutions, Inc. | Actuator cooling apparatus and method |
| CN211296319U (en) * | 2020-03-16 | 2020-08-18 | 江西立讯智造有限公司 | Low-energy-consumption wireless charger with high heat dissipation efficiency |
| TWM604542U (en) * | 2020-08-31 | 2020-11-21 | 新漢智能系統股份有限公司 | Electronic device and heat-dissipation shell structure thereof |
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