CN101174168A - Cooling structure of electronic device - Google Patents
Cooling structure of electronic device Download PDFInfo
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- CN101174168A CN101174168A CNA2006101231494A CN200610123149A CN101174168A CN 101174168 A CN101174168 A CN 101174168A CN A2006101231494 A CNA2006101231494 A CN A2006101231494A CN 200610123149 A CN200610123149 A CN 200610123149A CN 101174168 A CN101174168 A CN 101174168A
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Abstract
The invention discloses a heat elimination structure of an electronic device, being used for the heat elimination of a heat source of the electronic device, which comprises a casing, in which a holding space is formed and the heat source is positioned; a heat elimination module embedded on the casing and provided with a contact part and a heat elimination part, wherein the contact part is contacted with the heat source in the holding space, absorbs the heat generated by the heat source and conducts to the heat elimination part, the heat elimination part is positioned outside the casing, and is used for dissipating the heat generated by the heat source. The invention can also comprises a casing, in which a holding space is formed, the heat source is positioned, and contacted with the inner side of the holding space; a heat elimination module provided with an embedding part and a heat elimination part, wherein the embedding part is used for embedding the heat elimination module on the casing and corresponding to the heat source, and the heat elimination part is positioned outside the casing.
Description
[technical field]
The relevant a kind of radiator structure of the present invention is particularly about a kind of radiator structure of electronic installation.
[background technology]
Recently in order to make the electronic installation can be more compact, function can be more powerful, the volume of chip need be done littler and littler, and arithmetic speed needs more and more faster, but the more and more faster result of arithmetic speed is relative, the heat that chip produced also can get more and more, and when the heat of electronic installation inside can't dissipate because of accumulation, can have influence on wherein the fiduciary level of electronic package and the degree of stability of performance, even shorten its life-span.Therefore, the design of radiator structure in the electronic installation, when just becoming design electronics can not be indiscreet and negligent important topic.
For portable electronic devices, for example notebook computer, palm PC etc. carry for convenience, and its volume is towards compact direction improvement design.And this thanks to the heat dissipation problem of the electronic installation inside of miniaturization, especially problem demanding prompt solution.Therefore there is different radiator structure designs to be suggested to solve its heat dissipation problem.With the notebook computer is example, notebook computer can be divided into military and industrial notebook computer and general notebook computer, in military and industrial notebook computer of design and general notebook computer, the demand difference of its grade, and when design, just must do different designs to radiator structure respectively according to different operational requirements characteristics.For instance, military and industrial notebook computer often needs to use under rugged surroundings, the moisture of for example being everlasting heavily or under the rugged surroundings of rocky dirt uses, so military and industrial notebook computer for waterproof, shockproof and dustproof demand much larger than general notebook computer, and general notebook computer is lain in the factor such as compact just is not the main emphasis of considering for military and industrial notebook computer.That is to say that military and industrial notebook computer is when designing or do the radiator structure design, can at first consider and to take into account its waterproof or dust reduction capability, and general notebook computer is in design or when doing the radiator structure design, at first can take into account to take into account its factor such as compact.
As shown in Figure 1, be the radiator structure in the existing general notebook computer, its radiator structure includes the radiating module 5 of thermals source 3 such as contact central processing unit or high-speed computation chip and drives the radiator fan 7 that cooling draught flows.It mainly is directly to contact with thermal source 3 with radiating module 5, absorb the heat that thermal source 3 produces by heat conduction, suck cooling draught by radiator fan 7 by housing 1 outside again, radiating module 5 and thermal source 3 are cooled off, at last cooling draught is sent outside the housing 1 again.In order to make radiator fan 7 can suck cooling draught, must offer ventilating opening 1a on the housing 1, pass through for cooling draught.Yet the existence of ventilating opening 1a can make housing 1 forfeiture watertightness, and can't reach waterproof effect, and therefore this radiator structure design just can't be applied to must can waterproof and the military and industrial notebook computer of dustproof.
As shown in Figure 2, be existing military and industrial notebook computer and radiator structure thereof.Military and industrial notebook computer is because of considering its waterproof, shockproof and dustproof demand, mostly with the integrally formed housing 11 of metal as main frame, and this housing 11 must be airtight fully to avoid internal electrical components to be subjected to the influence of external environment, for example aqueous vapor, dust etc.Therefore just can't offer but airflow of ventilating opening cooling at housing 11, but must utilize housing 11 directly and cool exterior air carry out heat interchange to reach the purpose of system radiating.Therefore in military and industrial notebook computer, adopt the high metal material of heat-conduction coefficient to make housing 11, and make thermals source 13 such as central processing unit, high-speed computation chip directly or indirectly by a heat-conducting piece 15 contact housings 11.By heat conduction, the heat that thermal source 13 is produced conducts to housing 11, again by directly externally heat radiation of housing 11.
In view of the speed of current chip more and more faster, the heat of its generation is also more and more, a large amount of heats that existing housing 11 military and industrial notebook computer has been not enough to efficiently and effectively thermals source such as central processing unit or high-speed computation chip 13 be produced are fast derived, and when degree that the generation of heat energy can be loaded greater than natural convection, its high temperature just can cause the overheated of system, even make System Operation bad.
In view of this, be necessary to provide a kind of radiator structure of electronic installation in fact, when reaching its waterproof and dustproof characteristic demand, its radiating effect simultaneously gains.
[summary of the invention]
Therefore, the object of the present invention is to provide a kind of radiator structure of electronic installation, when reaching its waterproof and dustproof characteristic demand, its radiating effect simultaneously gains.
In order to reach above-mentioned purpose, the invention provides a kind of radiator structure of electronic installation, include a housing and a radiating module in order to this heat abstractor that dispels the heat of the thermal source to electronic installation inside.Wherein enclosure interior forms an accommodation space, and in order to the electronic package of ccontaining formation electronic installation operational function, and thermal source such as central processing unit, high-speed computation chip is positioned at accommodation space.Radiating module has a contact site and a radiating part, and wherein heat abstractor is embedded at housing, makes contact site contact thermal source in accommodation space, absorbs the heat that thermal source produces and conducts to radiating part.And radiating part is positioned at outside, in order to the heat loss with thermal source produced.
Compared to prior art, form a heat conduction path by radiating module, connect inside and outside the housing, the heat that the enclosure interior thermal source is produced, directly be passed to outside, and the structural design by radiating module with heat exchange pattern, apace with the loss of thermal convection mode in outside.Be with, do not need the but air turnover of air hole cooling on the housing, make that the sealing of housing is kept.Simultaneously, owing to need not consider enclosure interior cooling draught circulation problem, so more compacting of can being arranged of the electronic package of enclosure interior, make easier reducedization of volume of electronic installation.
For purpose of the present invention, structural attitude and function thereof are had further understanding, conjunction with figs. is described in detail as follows now:
[description of drawings]
Fig. 1 is the diagrammatic cross-section of the radiator structure of existing general notebook computer;
Fig. 2 is the diagrammatic cross-section of the radiator structure of existing military and industrial notebook computer;
Fig. 3 is the diagrammatic cross-section of radiator structure of the portable electronic structure of first embodiment of the invention;
Fig. 4 is the partial enlarged drawing of Fig. 3;
Fig. 5 is the decomposing schematic representation of Fig. 3;
Fig. 6 is the diagrammatic cross-section of radiator structure of the portable electronic structure of second embodiment of the invention;
Fig. 7 is the partial enlarged drawing of Fig. 6;
Fig. 8 is the decomposing schematic representation of Fig. 6;
[embodiment]
See also Fig. 3, Fig. 4 and shown in Figure 5, radiator structure for a kind of electronic installation that first embodiment of the invention provided, in the embodiment of the invention, be that example describes as electronic installation 20 with the notebook computer, yet this electronic installation 20 can be but is not limited to desktop PC, portable multimedia player, general notebook computer, military and industrial notebook computer, palm PC or personal digital assistant (PersonalDigital Assistant) etc. need possess waterproof and dustproof characteristic, and the heat loss that thermals source such as the central processing unit of working at high speed or chip can be produced again is to outside.
The housing 21 inner airtight accommodation spaces 211 that form are in order to circuit board 22 electronic packages such as grade of sub-device 20 functional operations of ccontaining power supply.One or more than one thermal source 23 be arranged at a side of circuit board 22, be arranged at jointly in the accommodation space 211 of housing 21 with circuit board 22.Generally speaking, the end face of housing 21 can be provided with input medias such as keyboard, Trackpad (figure does not show), therefore interfere with each other for fear of thermal source 23 and input media, so each thermal source 23 can be arranged at circuit board 22 on a side of housing 21 bottom surfaces, corresponding to the bottom of electronic installation 20.
One radiating module 30 is embedded at the bottom surface of housing 21.Radiating module 30 has a contact site 31 and a radiating part 32, and wherein contact site 31 is arranged in the accommodation space 211 of housing 21, and radiating part 32 is positioned at housing 21 outsides, and radiating module 30 closely is embedded in housing 21, makes accommodation space 211 keep sealing state.At least one contact block 311 is formed at contact site 31, and each contact block 311 is in order to contact one or several thermals source 23, to receive the heat that thermal source 23 is produced.Wherein a contact block 311 can contact with several thermals source 23 simultaneously, or as the revealer of present embodiment institute, forms several contact blocks 311 in contact site 31, and the pairing thermal source 23 of each contact block 311 and its is contacted.In addition, between contact block 311 and the thermal source 23, heat-conducting mediums 231 such as a heat-conducting glue or heat conductive pad can be set, use the thermal contact resistance that reduces between thermal source 23 and the contact block 311 to connect thermal source 23 and contact block 311.Radiating part 32 is positioned at the outside of housing 21, in order to the cold air of contact housing 21 outsides, carrying out thermal convection, with heat loss that thermal source 23 is produced in air.More be formed with several radiating fins that are set up in parallel 321 on the radiating part 32, use the heat transfer surface area that increases radiating part 32, to promote the thermal convection effect of radiating part 32 and cool exterior air.
In order to promote the radiating effect of radiating module 30, radiator structure more includes a radiator fan 41 and a fan fixer 42, wherein fan fixer 42 is fixed in the bottom surface of housing 21, and radiator fan 41 is fixed on the fan fixer 42, corresponding to the radiating part 32 of radiating module 30, to produce cooling draught by radiating part 32.
Radiating module 30 is made by the good material of thermal conductivity, as copper, aluminium or its alloy, with the performance thermal conduction effect.After radiating module 30 can be made shaping earlier, when being shaped, housing 21 is embedded in the lump in the housing 21 again.With military and industrial notebook computer is example, its housing more than 21 is with aluminium alloy, magnesium alloy or almag casting forming, therefore can be in die cast 21 processes, in advance radiating module 30 is positioned over the mould inside precalculated position, again by die casting program shaping housing 21, and radiating module 30 is embedded on the housing 21.If with general notebook computer, therefore its housing 21 also can be positioned over the mould inside precalculated position with radiating module 30 in advance with the plastics injection molding in plastics injection molding process, and make radiating module 30 when housing 21 is shaped, be embedded at housing 21 in the lump.Certainly also can make housing 21 and radiating module 30 individually, and on housing 21, reserve the opening 24 that is embedded radiating module 30 usefulness, again radiating module 30 be placed opening 24, make it be embedded at housing 21.Radiating module 30 can be strengthened and the combining of housing 21 by several fixation kits 33, and this fixation kit 33 can be and is integrally formed in radiating module 30, when radiating module 30 is embedded at housing 21, embeds in the lump in the housing 21.Fixation kit 33 also can be screw, bolt or the latch that adds, and after radiating module 30 is embedded at housing 21, passes radiating module 30 and embeds in the housing 21.
First embodiment of the invention constitutes a heat conducting path by radiating module 30, contact is arranged in the thermal source 23 of the accommodation space 211 of housing 21, the heat that thermal source 23 is produced is directly delivered to accommodation space 211 outsides by radiating module 30, does not need to come thermal source 23 is dispelled the heat by the thermal convection of cooling draught again.Therefore just do not need to offer on the housing 21 the air hole cooling but air-flow enter and leave accommodation space 211, can keep the sealing of housing 21, and keep excellent waterproof and dustproof effect.Simultaneously, owing to need not consider the problem that cooling draught flows in the accommodation space of housing 21, therefore make more compacting that the electronic package of housing 21 inside can be arranged, make easier reducedization of volume of electronic installation 20.The material of radiating module 30, how much kenels can change at the demand that adds the heat-flash biography, make it absorb the heat of thermal source 23 by heat conduction, and with heat by the heat interchange loss to extraneous effect, be better than in the prior art directly with the effect of housing 21 as hot biography approach.
See also Fig. 6, Fig. 7 and shown in Figure 8,, in present embodiment, combine the common radiator structure that constitutes with radiating module 60 by housing 51 for the radiator structure of a kind of electronic installation 50 that second embodiment of the invention provided.
The disclosed a kind of radiator structure of present embodiment, include a housing 51 and a radiating module 60, the housing 51 inner airtight accommodation spaces 511 that form, in order to ccontaining circuit board 52 electronic packages such as grade, one or more than one thermal source 53 be arranged on the side of circuit board 52, be arranged at jointly in the accommodation space 511 of housing 51 with circuit board 52.
In the position of accommodation space 511 medial surfaces corresponding to thermal source 53, be formed with several outstanding heat-conducting parts 512, in order to contact with one or several thermals source 53, the heat that is produced with reception thermal source 53, with heat transferred to housing 51.Thermal source 53 also can be directly and the medial surface of accommodation space 511, makes housing 51 directly absorb the heats that thermals source 53 produce.
Present embodiment is applied to therefore can be contacted with thermal source 53 by housing 51 earlier on the housing 51 that metal material makes, takes away heat by radiating module 60 by housing 51 again.Because housing 51 has the restriction of weight and weight-strenth ratio; the material that therefore can adopt high specific strength usually is aluminium alloy, magnesium alloy or almag for example; yet these metal materials are the heat-conduction medium of non-the best still; make still too high to the thermal resistance of housing 51 lateral surfaces by accommodation space 511 medial surfaces; be unable to cope with high-power thermal source, for example the radiating requirements of central processing unit, high-speed computation chip etc.Be subject to the program of die cast in addition, surface of shell also is difficult for forming good radiator structure, makes the housing 51 external coefficients of heat convection also be difficult to promote.Be to embed radiating module 60 with present embodiment in the lateral surface of housing 51, radiating module 60 can select for use heat to pass the material that coefficient is higher than housing 51, and for example copper is shaped to squeeze casting or cut in advance.By follow-up housing 51 die casting program or package programs, radiating module 60 is embedded in the housing 51 again.Use the reduction thermal resistance, promote thermal convection effect with outside air by being provided with of radiating part 62 simultaneously.
In order to promote the radiating effect of radiating module 60, radiator structure more includes a radiator fan 41 and a fan fixer 42, wherein fan fixer 42 is fixed in the bottom surface of housing 51, and radiator fan 41 is fixed on the fan fixer 42, radiating part 62 corresponding to radiating module 60, to produce cooling draught, produce forced convertion and promote the thermal convection effect of radiating part 62 by radiating part 62.
Claims (17)
1. the radiator structure of an electronic installation dispels the heat in order to the thermal source to this electronic installation, it is characterized in that it comprises:
One housing, inner formation one accommodation space, and this thermal source is arranged in this accommodation space;
One radiating module, be embedded at this housing, this radiating module has a contact site and a radiating part, wherein this contact site contacts this thermal source in this accommodation space, absorb the heat of this thermal source generation and conduct to this radiating part, and this radiating part is positioned at this outside, in order to the heat loss with this thermal source produced.
2. the radiator structure of electronic installation as claimed in claim 1 is characterized in that, also includes at least one contact block, is formed at this contact site, in order to contact this thermal source.
3. the radiator structure of electronic installation as claimed in claim 1 is characterized in that, also includes a heat-conducting medium, and heat places between this contact block and this thermal source, in order to reduce this thermal source and to connect thermal contact resistance between this contact block.
4. the radiator structure of electronic installation as claimed in claim 1 is characterized in that, also includes several radiating fins, is formed at this radiating part, in order to increase the heat transfer surface area of this radiating part.
5. the radiator structure of electronic installation as claimed in claim 1 is characterized in that, also includes a radiator fan, corresponding to this radiating part, in order to pass through this radiating part to produce a cooling draught.
6. the radiator structure of electronic installation as claimed in claim 5 is characterized in that, also includes a fan fixer, is fixed in this housing, and this radiator fan is fixed in this fan fixer and corresponding to this radiating part.
7. the radiator structure of electronic installation as claimed in claim 5 is characterized in that, this fan fixer is a lid, covers this radiating part, and this fan fixer has several ventilating openings, in order to but air communication mistake of cooling.
8. the radiator structure of electronic installation as claimed in claim 5, it is characterized in that this fan fixer forms a convection current chamber, make this radiator fan be arranged in this convection current chamber, and this fan fixer has several ventilating openings, in order to cooling but air-flow enter or leave this convection current chamber.
9. the radiator structure of electronic installation as claimed in claim 1 is characterized in that, also comprises a fixation kit, forms in this radiating module, in order to embed this housing to strengthen combining of this radiating module and this housing.
10. the radiator structure of electronic installation as claimed in claim 1 is characterized in that, also comprises a fixation kit, embeds this housing in order to pass this radiating module, to strengthen combining of this radiating module and this housing.
11. the radiator structure of an electronic installation dispels the heat in order to the thermal source to this electronic installation, it is characterized in that it comprises:
One housing inner forms an accommodation space, and this thermal source is positioned at this accommodation space, and contact with the medial surface of this accommodation space, makes this housing directly absorb the heat of this thermal source generation;
One radiating module, have one and be embedded a portion and a radiating part, this is embedded portion in order to this radiating module being embedded at this housing and corresponding to this thermal source, and this radiating part is positioned at this outside, in order to the heat that this thermal source produced, be passed to this radiating part loss by this housing and this portion of being embedded.
12. the radiator structure of electronic installation as claimed in claim 11 is characterized in that, the medial surface of this accommodation space is formed with at least one outstanding heat-conducting part, in order to contact this thermal source.
13. the radiator structure of electronic installation as claimed in claim 11 is characterized in that, also includes several radiating fins, is formed at this radiating part, in order to increase the heat transfer surface area of this radiating part.
14. the radiator structure of electronic installation as claimed in claim 11 is characterized in that, also includes a radiator fan, corresponding to this radiating part, in order to pass through this radiating part to produce a cooling draught.
15. the radiator structure of electronic installation as claimed in claim 11 is characterized in that, also includes a fan fixer, is fixed in this housing, and this radiator fan is fixed in this fan fixer and corresponding to this radiating part.
16. the radiator structure of electronic installation as claimed in claim 15 is characterized in that, this fan fixer is a lid, covers this radiating part, and this fan fixer has several ventilating openings, in order to but air communication mistake of cooling.
17. the radiator structure of electronic installation as claimed in claim 15, it is characterized in that this fan fixer forms a convection current chamber, make this radiator fan be arranged in this convection current chamber, and this fan fixer has several ventilating openings, in order to cooling but air-flow enter or leave this convection current chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006101231494A CN101174168A (en) | 2006-10-31 | 2006-10-31 | Cooling structure of electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006101231494A CN101174168A (en) | 2006-10-31 | 2006-10-31 | Cooling structure of electronic device |
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| Publication Number | Publication Date |
|---|---|
| CN101174168A true CN101174168A (en) | 2008-05-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006101231494A Pending CN101174168A (en) | 2006-10-31 | 2006-10-31 | Cooling structure of electronic device |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102088837B (en) * | 2009-12-08 | 2014-12-10 | 深圳富泰宏精密工业有限公司 | Heat sink and portable electronic device with same |
| CN104219927A (en) * | 2013-05-31 | 2014-12-17 | 昆山巨仲电子有限公司 | Portable electronic product with exposed heat dissipation mechanism |
| CN110880803A (en) * | 2019-12-17 | 2020-03-13 | 台达电子企业管理（上海）有限公司 | Wireless charging device |
| CN111083889A (en) * | 2019-11-27 | 2020-04-28 | 西安呱牛信息技术有限公司 | Coat device applied to portable data processing equipment |
| CN112188814A (en) * | 2020-10-26 | 2021-01-05 | 太仓欣华盈电子有限公司 | Electronic device |
| CN112286333A (en) * | 2020-10-16 | 2021-01-29 | 锐捷网络股份有限公司 | Power supply control method and device |
| WO2021139809A1 (en) * | 2020-01-09 | 2021-07-15 | 苏州宝时得电动工具有限公司 | Self-moving apparatus |
| CN114423217A (en) * | 2020-10-28 | 2022-04-29 | 清华大学 | Waterproof safety inspection instrument |
| CN114765935A (en) * | 2021-01-15 | 2022-07-19 | 华硕电脑股份有限公司 | Electronic system |
| WO2023087511A1 (en) * | 2021-11-22 | 2023-05-25 | 苏州科瓴精密机械科技有限公司 | Lawn mower |
| CN116528535A (en) * | 2023-07-03 | 2023-08-01 | 武汉嘉晨电子技术有限公司 | Electric connector assembly structure, distribution box and preparation method of distribution box |
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2006
- 2006-10-31 CN CNA2006101231494A patent/CN101174168A/en active Pending
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102088837B (en) * | 2009-12-08 | 2014-12-10 | 深圳富泰宏精密工业有限公司 | Heat sink and portable electronic device with same |
| CN104219927A (en) * | 2013-05-31 | 2014-12-17 | 昆山巨仲电子有限公司 | Portable electronic product with exposed heat dissipation mechanism |
| CN111083889A (en) * | 2019-11-27 | 2020-04-28 | 西安呱牛信息技术有限公司 | Coat device applied to portable data processing equipment |
| CN110880803A (en) * | 2019-12-17 | 2020-03-13 | 台达电子企业管理（上海）有限公司 | Wireless charging device |
| US11581750B2 (en) | 2019-12-17 | 2023-02-14 | Delta Electronics (Shanghai) Co., Ltd. | Wireless charging device with enhanced charging power and increased charging speed |
| CN110880803B (en) * | 2019-12-17 | 2022-02-15 | 台达电子企业管理（上海）有限公司 | Wireless charging device |
| WO2021139809A1 (en) * | 2020-01-09 | 2021-07-15 | 苏州宝时得电动工具有限公司 | Self-moving apparatus |
| CN112286333A (en) * | 2020-10-16 | 2021-01-29 | 锐捷网络股份有限公司 | Power supply control method and device |
| CN112188814A (en) * | 2020-10-26 | 2021-01-05 | 太仓欣华盈电子有限公司 | Electronic device |
| CN114423217A (en) * | 2020-10-28 | 2022-04-29 | 清华大学 | Waterproof safety inspection instrument |
| CN114423217B (en) * | 2020-10-28 | 2023-11-24 | 清华大学 | Waterproof safety inspection instrument |
| CN114765935A (en) * | 2021-01-15 | 2022-07-19 | 华硕电脑股份有限公司 | Electronic system |
| WO2023087511A1 (en) * | 2021-11-22 | 2023-05-25 | 苏州科瓴精密机械科技有限公司 | Lawn mower |
| CN116528535A (en) * | 2023-07-03 | 2023-08-01 | 武汉嘉晨电子技术有限公司 | Electric connector assembly structure, distribution box and preparation method of distribution box |
| CN116528535B (en) * | 2023-07-03 | 2023-10-03 | 武汉嘉晨电子技术有限公司 | Electric connector assembly structure, distribution box and preparation method of distribution box |
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