CN114361089B - A get mark mechanism for chip heat dissipation subsides - Google Patents
A get mark mechanism for chip heat dissipation subsides Download PDFInfo
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- CN114361089B CN114361089B CN202111664473.8A CN202111664473A CN114361089B CN 114361089 B CN114361089 B CN 114361089B CN 202111664473 A CN202111664473 A CN 202111664473A CN 114361089 B CN114361089 B CN 114361089B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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- Microelectronics & Electronic Packaging (AREA)
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- Labeling Devices (AREA)
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Abstract
The invention discloses a label picking mechanism for chip heat dissipation labels, which comprises a bracket, a label head assembly, an adjusting assembly and a height adjusting piece, wherein the label head assembly is arranged on the bracket and comprises a middle label head and side label heads arranged on two opposite sides of the middle label head, the middle label head and the two side label heads are arranged in parallel in the transverse direction, and the adjusting assembly is matched with the side label heads to drive the side label heads to approach or be far away from the middle label heads in the transverse direction; the height adjusting piece drives the middle mark head to move along the vertical direction; the bottoms of the middle mark head and the side mark head are respectively provided with a concave space, and vacuum adsorption holes are arranged in the concave spaces. The embodiment of the invention can be suitable for heat dissipation pastes with various sizes, and the bottom of the label taking mechanism is provided with the concave which is matched with the size of the heat dissipation paste, so that the air bubbles can be conveniently discharged in the process of adhering the heat dissipation paste to the flexible substrate, and the generation of the air bubbles after adhering the heat dissipation paste is effectively solved.
Description
Technical Field
The invention relates to the technical field of labeling, in particular to a label taking mechanism for chip heat dissipation labeling.
Background
In the packaging process of the chip, a heat dissipation paste is required to be attached to the back surface of the chip so as to conveniently realize heat dissipation of the chip, and a heat dissipation paste machine is generally used for pasting the heat dissipation paste in the prior art. The handle for transferring the mark head as the heat dissipation paste has an important function in the process of pasting the heat dissipation paste. The bottom of the header is generally arranged to be of a planar structure in the prior art, a plurality of vacuum adsorption holes are formed in the bottom of the header, and the vacuum adsorption holes are used for adsorbing the heat dissipation paste. In the in-service use process, the heat dissipation subsides board can form the bubble easily between heat dissipation subsides and flexible substrate after pasting heat dissipation subsides, especially to the bubble in 2mm generally hardly eliminates, causes the bubble unusual easily, need handle unusual bubble and debug the board after the bubble is unusual, also cause the waste of manpower and materials when influencing the productivity.
The bottom of getting the mark head forms the recess in order to form the uplift to the recess direction in intermediate position after the heat dissipation pastes the absorption, and the heat dissipation pastes in one side after being adsorbed simultaneously and forms the opening, and the effect of pasting at the mark head is got in the heat dissipation is pasted down and is shifted to the attached position and is pasted the back and can form one side opening and three side in addition by the pocket form structure of adhesion like this, can be convenient when adopting the roller roll-in realization bubble discharge to reach the effect of eliminating the bubble.
However, in the prior art, the size of the header is fixed, and one header corresponds to one heat dissipation patch with one size, so that one device needs to be provided with the header with multiple sizes, and the header is poor in universality.
Disclosure of Invention
The invention aims to provide a label picking mechanism for a chip heat dissipation label, which is used for solving the defects in the prior art, can be suitable for heat dissipation labels with various sizes, and is provided with a dent at the bottom part, wherein the dent is matched with the size of the heat dissipation label, so that air bubbles can be conveniently discharged in the process of adhering the heat dissipation label to a flexible substrate, and the generation of the air bubbles after the heat dissipation label is effectively solved.
The invention provides a label picking mechanism for chip heat dissipation labels, which comprises a bracket, a label head assembly, an adjusting assembly and a height adjusting piece, wherein the label head assembly is arranged on the bracket, the label head assembly comprises a middle label head and side label heads arranged on two opposite sides of the middle label head, the middle label head and the two side label heads are arranged in parallel in the transverse direction, and the adjusting assembly is matched with the side label heads to drive the side label heads to approach or be far away from the middle label head along the transverse direction; the height adjusting piece drives the middle mark head to move along the vertical direction; the middle header and the bottom of side header all are provided with the indent space, be provided with the vacuum adsorption hole in the indent space.
Further, the height adjusting piece comprises an adjusting rod which is arranged in the vertical direction in an extending mode and rotatably installed on the support, and an adjusting thread section which is arranged on the adjusting rod, and the middle mark head is provided with a threaded hole which is arranged in the vertical direction in an opening mode and is matched with the adjusting thread section.
Further, be provided with on the support along the setting of vertical direction extension regulating part locating hole and setting vertical spacing portion on the support, adjust the pole with regulating part locating hole looks adaptation, the altitude mixture control spare still have with vertical spacing portion looks butt is in order to restrict the limit nut that the altitude mixture control spare moved down along vertical direction, limit nut with the regulation screw thread section is located vertical spacing portion's relative both sides.
Further, the height adjusting piece is further provided with a lower limiting part arranged between the adjusting thread section and the limiting nut, a limiting groove is formed between the limiting nut and the lower limiting part, the vertical limiting part is matched with the limiting groove and positioned in the limiting groove, and the limiting nut and the lower limiting part are respectively used for being propped against the top surface and the bottom surface of the vertical limiting part.
Further, the support is located beside the adjusting piece locating hole and is further provided with an adjusting piece assembling hole communicated with the adjusting piece locating hole, the size of the adjusting piece assembling hole is larger than that of the adjusting piece locating hole, and the size of the adjusting piece assembling hole is not smaller than that of the section of the adjusting thread section.
Further, one end of the limit nut far away from the adjusting threaded section is exposed outwards and forms a height adjusting groove.
Further, the mark taking mechanism for chip heat dissipation pastes is further provided with a vertical locking piece, the support is provided with a vertical locking slide hole matched with the vertical locking piece, the vertical locking slide hole is a waist-shaped hole extending in the vertical direction, one end of the vertical locking piece is penetrated and arranged in the vertical locking slide hole in a threaded connection mode on the middle mark, and the other end of the vertical locking piece is provided with an abutting limiting part for abutting with the support.
Further, the depth of the concave space at the bottom of the side header is H, the width is L, the distance that the side header is far away from the middle header along the transverse direction is L, and the distance that the middle header is adjusted upwards along the vertical direction is H, wherein the maximum value of H is not more than (H/L) x L.
Further, the maximum value of h does not exceed 0.05.
Further, the adjusting component drives the two side headers to synchronously approach each other or synchronously depart from each other by taking the middle header as a center.
Further, the adjusting component comprises an adjusting screw rod which is arranged in a extending mode along the transverse direction and rotatably installed on the support, a first threaded section and a second threaded section which are opposite in threaded direction are arranged on the adjusting screw rod, and the first threaded section and the second threaded section are in threaded connection with the two side marks respectively.
Further, the adjusting screw extends to be arranged at one end outside the bracket to form an adjusting piece positioning part, and the adjusting piece positioning part is a groove arranged on the adjusting screw.
Further, the side mark head is arranged on the bracket in a sliding way along the transverse direction, the bracket comprises a bracket body and a pair of sliding rods arranged on the bracket body, the pair of sliding rods are arranged in parallel along the front-rear direction, and the side mark head is in sliding fit with the sliding rods; and the middle mark head is provided with an avoidance sliding hole which extends along the vertical direction and is matched with the sliding rod.
Furthermore, the label taking mechanism for the chip heat dissipation label is further provided with a side label head locking piece arranged on the frame body, and the side label head locking piece is in threaded connection with the side label head and locks and positions the side label head on the frame body.
Further, a locking sliding hole matched with the side mark head locking piece is formed in the frame body, and the locking sliding hole extends in the transverse direction.
Compared with the prior art, the invention has the advantages that the header component is arranged into the structure that the side header and the middle header are separated, and the positions of the side header and the middle header can be adjusted according to the size of the heat dissipation paste, so that the application to various heat dissipation pastes is realized, and the applicability of a label taking mechanism is improved. Meanwhile, the concave space is arranged at the bottom of the label taking mechanism, the size of the concave space can be controlled by controlling the upward movement of the middle label, the size of the concave space is matched with the heat dissipation paste of the corresponding size, the heat dissipation paste opposite to the concave space after being pasted by the label taking mechanism forms an arch after being pasted, a pocket-shaped exhaust channel is formed through one end opening, the air bubble can be conveniently discharged, and the generation of the air bubble after the heat dissipation paste is pasted can be effectively solved.
Drawings
Fig. 1 is a schematic diagram of a first structure of a label picking mechanism for chip heat dissipation paste according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a second structure of a label picking mechanism for chip heat dissipation paste according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a first structure of an intermediate header in a label picking mechanism for chip heat dissipation labels according to an embodiment of the present invention;
fig. 4 is a second schematic structural diagram of an intermediate header in a label picking mechanism for chip heat dissipation labels according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a side header in a label picking mechanism for chip heat dissipation paste according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a rectangular frame in a label picking mechanism for chip heat dissipation paste according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of a cover plate in a label picking mechanism for chip heat dissipation paste according to an embodiment of the present invention;
fig. 8 is a top view of a cover plate in the label picking mechanism for chip heat dissipation paste according to the embodiment of the invention;
fig. 9 is a schematic structural diagram of an adjusting component in a label picking mechanism for chip heat dissipation labels according to an embodiment of the present invention;
fig. 10 is a schematic structural diagram of a height adjusting member in a label picking mechanism for chip heat dissipation labels according to an embodiment of the present invention;
fig. 11 is a schematic structural diagram of a side header locking member in a header removing mechanism for a chip heat dissipating label according to an embodiment of the present invention;
fig. 12 is a schematic structural diagram of a label picking mechanism for chip heat dissipation labels according to an embodiment of the present invention after a side label moves to two sides of a middle label;
fig. 13 is a schematic diagram of an internal structure of a label picking mechanism for chip heat dissipation labels according to an embodiment of the present invention after a side label moves to two sides of a middle label;
fig. 14 is a schematic diagram of an internal structure of a label picking mechanism for chip heat dissipation labels according to an embodiment of the present invention after side labels are drawn toward middle labels;
fig. 15 is a schematic diagram of an installation structure of a slide bar on a frame body in a label picking mechanism for chip heat dissipation labels according to an embodiment of the present invention;
fig. 16 is a schematic diagram of an installation structure of a label component in a label picking mechanism for chip heat dissipation labels according to an embodiment of the present invention;
reference numerals illustrate: 1-a bracket, 11-a positioning hole of an adjusting piece, 12-a vertical limiting part, 13-a bracket body, 130-an installation space, 131-a rectangular frame and 132-a cover plate,
14-sliding rod, 15-side mark head positioning hole and 16-vertical locking sliding hole
2-header assembly, 20-indent space,
21-middle header, 210-threaded hole, 211-avoiding slide hole, 212-avoiding groove, 213-middle compression joint part,
22-side header, 220-slide hole, 221-side crimp, 222-side bottom crimp,
23-vacuum adsorption holes, 24-heat dissipation adhesive crimping parts,
3-adjusting component, 30-adjusting screw, 31-first thread section, 32-second thread section, 33-adjusting piece positioning part, 34-screw mounting column,
4-height adjusting parts, 40-positioning grooves, 41-adjusting rods, 42-adjusting thread sections, 43-limit nuts, 44-lower limit parts and 45-height adjusting grooves;
5-a vertical locking piece, wherein the vertical locking piece is provided with a plurality of locking grooves,
6-side header lock, 61-side lock nut.
Detailed Description
The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.
Embodiments of the invention: as shown in fig. 1 to 16, a label picking mechanism for a heat dissipating label of a chip is disclosed, which can adsorb the heat dissipating label and transfer the heat dissipating label to a position of a flexible substrate under the action of a vacuum adsorption hole and then attach the heat dissipating label to the flexible substrate.
In a specific embodiment, the label picking mechanism for the chip heat dissipation label generally comprises a bracket 1, a label assembly 2, an adjusting assembly 3 and a height adjusting piece 4, wherein the label assembly 2 is arranged on the bracket 1, the label assembly 2 comprises a middle label 21 and a side label 22 arranged beside the middle label 21, the middle label 21 and the side label 22 are arranged in parallel in the transverse direction, and the adjusting assembly 3 is matched with the side label 22 to drive the side label 22 to be close to or far away from the middle label 21 in the transverse direction; the bottoms of the middle header 21 and the side header 22 are provided with vacuum adsorption holes 23.
The negative pressure formed by the vacuum adsorption holes 23 is used for adsorbing the heat dissipation paste, the adsorbed heat dissipation paste is transferred along with the header assembly 2, in the prior art, a label taking mechanism can only correspondingly use the heat dissipation paste with one size, the applicability of the label taking mechanism is poor, a plurality of label taking mechanisms are generally required to be arranged on one machine for being applicable to more products, and therefore, the waste of the manufacture of the label taking mechanism is necessarily caused, and meanwhile, the assembly inconvenience is also easily caused in the installation and use processes.
In this embodiment, the label taking mechanism is split and comprises two parts including a middle label 21 and a side label 22, and the distance between the middle label 21 and the side label 22 can be adjusted, so that the label taking mechanism can be better applied to heat dissipation labels of different sizes, the universality of the heat dissipation labels is improved, and the use of the label taking mechanism is realized conveniently.
As shown in fig. 15-16, the side header 22 is slidably disposed on the support 1 along a transverse direction, the support 1 includes a frame body 13 and a slide bar 14 disposed on the frame body 13, the side header 22 is slidably matched with the slide bar 14, a slide hole 220 adapted to the slide bar 14 is disposed on the side header 22, and movement of the side header 22 can be more stably achieved through matching of the slide bar 14 and the slide hole 220.
In this embodiment, at least two slide bars 14 are provided, and the slide bars 14 are juxtaposed in the front-rear direction perpendicular to the lateral direction. The two slide bars 14 are oppositely arranged on two sides of the side mark head 22, the two slide bars 14 are arranged to enable the whole side mark head 22 to move in parallel along the horizontal direction, movement adjustment of the side mark head 22 is better achieved, and most importantly, the two slide bars 14 are arranged to enable the side mark head 22 to move along the horizontal direction when moving, so that the bottom of the side mark head 22 is still in a horizontal state after moving, and the influence on adsorption of heat dissipation pastes caused by uneven bottom of the side mark head 22 is avoided.
As shown in fig. 6, in this embodiment, the frame 13 includes a rectangular frame 131, an installation space 130 formed in the rectangular frame 131, and a cover plate 132 disposed on the rectangular frame 131, where the slide bar 14 extends in a transverse direction and is fixedly connected with the rectangular frame 131, the cover plate 132 is fixed on the top of the rectangular frame 131 and is located on the upper side of the installation space 130, and the cover plate 132 covers the installation space 130, and a mounting column is further disposed on the cover plate 132 and is fixedly connected with a corresponding control device through the mounting column, so as to implement the installation and fixation of the label picking mechanism.
In this embodiment, the sliding rod 14 is located in the installation space 130, and the sliding rod 14 is disposed in the installation space 130, so that the space in the installation space 130 can be better utilized, the design of the whole label picking mechanism is more reasonable, and the whole label picking mechanism occupies a smaller volume.
As shown in fig. 9, the adjusting assembly 3 includes an adjusting screw 30 rotatably mounted on the frame 13, and a threaded section screwed with the side header 22 is provided on the adjusting screw 30. Since the adjusting screw 30 is rotatably mounted on the frame 13, the rotational force of the adjusting screw 30 is transferred to the side header 22 through the cooperation of the threaded section and the side header 22 during the rotation, thereby realizing the movement of the position of the side header 22.
In a specific embodiment, the adjusting screw 30 is provided with a screw mounting post 34 that is in a rotating fit with the bracket 1, and an end of the screw mounting post 34 facing away from the threaded section is exposed outwards and is formed with an adjusting member positioning portion 33.
In this embodiment, the adjusting member positioning portion 33 is a groove disposed on the screw mounting post 34, where the adjusting member positioning portion 33 is used to position an adjusting member, and the adjusting member can enable a wrench, a screwdriver or other thin sheets to be more conveniently controlled by the adjusting member, and the adjusting member is positioned in the adjusting member positioning portion 33 and drives the adjusting screw 30 to rotate in the rotating process, and the adjusting screw 30 drives the side header 22 to move in the rotating process.
In another embodiment, the adjusting assembly 3 can also be rotatably mounted on the side header 22, and the threaded section of the adjusting assembly 3 is in threaded connection with the frame 13. However, by adopting the scheme, the adjusting component 3 can outwards extend from the frame 13 in the rotating process, and the interference to the subsequent process is easy to influence.
In order to better control the movement of the side header 22, the side headers 22 are disposed on opposite sides of the middle header 21, and the adjusting assembly 3 drives the two side headers 22 to synchronously approach each other or synchronously separate from each other along the transverse direction.
In order to achieve the above effect, in the embodiment, two thread segments, namely, a first thread segment 31 and a second thread segment 32, are disposed on the adjusting screw 30, the first thread segment 31 and the second thread segment 32 are respectively in threaded connection with the two side headers 22, and the thread directions of the first thread segment 31 and the second thread segment 32 are opposite.
Since the thread directions of the first thread segments 31 and the second thread segments 32 are opposite, the two side heads 22 can be controlled to move away from each other in opposite directions or to move toward each other in a center direction when the adjusting screw 30 is rotated.
When the two side headers 22 are away from each other in opposite directions, the size of the header assembly 2 in the width direction increases, so that a larger-sized heat dissipating patch can be applied; when the two side headers 22 move towards the middle header 21, the size of the header assembly 2 in the width direction is reduced, so that the heat dissipation paste with smaller size can be applied, the grabbing of the heat dissipation paste with various sizes by the label grabbing mechanism is realized through the arrangement of the structure, and the applicability of the grabbing mechanism is improved.
As shown in fig. 1 and 11, the label picking mechanism for the chip heat dissipation label further comprises a side label locking member 6 matched with the bracket 1, wherein the side label locking member 6 is in threaded connection with the side label 22 and locks and positions the side label on the bracket 1.
The side mark head locking piece 6 is in threaded connection at the top of the side mark head 22, and be provided with on the support 1 with the side mark head locating hole 15 of side mark head locking piece 6 looks adaptation, specifically, side mark head locating hole 15 sets up on the apron 132, side mark head locating hole 15 is waist type hole and extends along the lateral direction and set up, set up side mark head locating hole 15 as the waist type hole that extends along the lateral direction and set up can make side mark head locking piece 6 move when moving along with side mark head 22, moves side mark head locking piece 6 after side mark head 22 moves into place and locks side mark head 22 location on apron 132.
The end of the side header locking member 6 remote from the side header 22 is formed with a side locking nut 61 for abutting against the bracket 1. The side lock nut 61 abuts against the upper surface of the cover plate 132, the other end of the side lock nut 61 is in threaded connection with the side header 22, and finally the side header 22 is locked and positioned on the cover plate 132 under the action of the side lock nut 61.
As shown in fig. 3-5, in order to avoid generating air bubbles after heat dissipation and attachment, the bottoms of the middle header 21 and the side header 22 are respectively provided with a concave space 20, and meanwhile, the edge positions of the middle header 21 and the side header 22, which are positioned in the concave space 20, form compression joint parts oppositely, the concave spaces 20 on the middle header 21 and the concave spaces 20 on the side header 22 are communicated with each other, and a complete groove is formed after the middle header 21 and the side header 22 are spliced.
The setting of recess makes the heat dissipation paste form the perk to recess direction arch with the relative department of recess position on being got the mark mechanism and snatchs the back heat dissipation paste, when the heat dissipation paste is got the mark mechanism and is moved to the upper surface of flexible substrate after getting the mark, the arch of heat dissipation paste intermediate position can not adhere on flexible substrate, just the place that several edge positions and crimping portion position of heat dissipation paste are relative can be stuck on the base plate, simultaneously, after the heat dissipation paste is adsorbed one side of heat dissipation paste need not be relative with crimping portion position, the heat dissipation paste is just three edge and crimping portion position relative, namely the heat dissipation paste is just three first attached on flexible substrate in four edges when attaching, and the arch that the intermediate position of heat dissipation paste forms and one edge that is not relative with crimping portion can not paste on flexible substrate, the heat dissipation paste forms the pocket form one end open-ended after getting the mark pasting like this, the benefit of design like this is that the bubble in the heat dissipation paste can be discharged from the pocket form the mouth of pocket form when being rolled to the heat dissipation paste, thereby the problem of unable formation after attaching to the heat dissipation paste has been avoided.
In the prior art, the bottom surfaces of the label picking mechanism are generally planar, that is, the bottom surfaces of the middle label 21 and the side labels 22 are planar, so that the whole surface is simultaneously attached to the flexible substrate when the heat dissipation is attached to the flexible substrate after being adsorbed, and the problem is that once the air bubbles are generated, the air bubbles cannot effectively form a discharge channel, and the elimination of the air bubbles cannot be realized when the heat dissipation is attached by rolling.
In this embodiment, since the concave space 20 is formed at the bottom of the label picking mechanism, the concave spaces 20 on the middle label 21 and the side labels 22 are concave after being spliced, the concave position corresponding to the concave area can not be adhered when the label picking mechanism attaches the heat dissipation to the flexible substrate, but only the edge position of the heat dissipation label is adhered, in this process, if the edge of one of the heat dissipation labels is not adhered, the part of the heat dissipation label, which is located in the concave area after the primary adhesion, arches to form an exhaust channel similar to a pocket together with the non-adhered edge, and air bubbles are conveniently discharged along the exhaust channel in the pocket shape when the roll shaft is adopted for rolling the heat dissipation label, thereby effectively avoiding the air bubbles generated after the heat dissipation label is adhered.
It should be noted that, for the knowledge in the prior art, setting up the recess on getting the mark mechanism can increase the content of bubble after pasting. But this application research discovers and can not exert an influence to the bubble under the less circumstances of the degree of depth of recess, and this just also requires the degree of depth h of recess not too big, if too big can make the heat dissipation subsides after getting mark mechanism and compressing tightly form the fold to the quantity of bubble in the heat dissipation subsides can be more increased. The depth of the groove in this embodiment is set in relation to the width of the heat-dissipating patch to be adhered, and the depth of the concave space 20 is set to not more than 0.1mm in this state since it represents the depth of the groove after the middle header 21 and the side header 22 are pasted.
As shown in fig. 4, in the present embodiment, an intermediate crimping portion 213 is formed on the intermediate header 21 at a position opposite to the edge of the concave space 20.
As shown in fig. 5, a side crimp portion 221 and a pair of side crimp portions 222 are formed on the side header 22 at edge positions of the concave space 20, respectively, and the pair of side crimp portions 222 are located on opposite sides of the side crimp portion 221; the side bottom crimping portions 222 and the intermediate crimping portions 213 on the intermediate header 21 are both provided extending in the lateral direction and are opposite in position in the lateral direction;
after the middle header 21 and the side header 22 are spliced together, the concave space 20 of the middle header 21 and the concave space 20 of the side header 22 are spliced to form a complete recess. After the heat dissipation paste is adsorbed by the header assembly 2, two edges in the width direction of the heat dissipation paste are respectively opposite to the positions of the side crimping parts 221 on the two side headers 22, one edge in the length direction of the heat dissipation paste is opposite to the positions of the middle crimping part 213 and the side bottom crimping part 222, and the other edge in the length direction of the heat dissipation paste is opposite to the concave position, so that a pocket-shaped exhaust channel is conveniently formed after the heat dissipation paste is attached.
When the middle header 21 and the side header 22 are spliced together, the width of the header assembly 2 is the smallest at this time, that is, the header assembly is used for the smallest-sized heat dissipating label, and since the depth of the concave space 20 is the same, that is, not higher than 0.1mm as mentioned above, the depth of the required groove also needs to be increased as the distance between the middle header 21 and the side header 22 increases, and in order to enable the increase of the groove depth to use the large-sized heat dissipating label, the label picking mechanism for chip heat dissipating label of the present embodiment further has the height adjusting member 4.
The height adjusting piece 4 drives the middle header 21 to move along the vertical direction; the height adjusting piece 4 can enable the middle header 21 to move upwards, the middle header 21 can be better suitable for the scheme that two side headers 22 are far away from the middle header 21 after moving upwards, a certain height difference exists between the plane where the bottom of the middle header 21 is located and the plane where the bottom of the side header 22 is located after the adjustment, so that the depth of the groove of the adjusted header assembly 2 can be increased, and if the depth of the groove is unchanged when the heat dissipation paste with larger absorption is carried out, the arched collapse is easy to be caused due to the fact that the height of the arched formed in the middle position is insufficient, and therefore the pocket-shaped exhaust channel is closed.
As shown in fig. 10, the height adjusting member 4 in this embodiment includes an adjusting lever 41 extending in the vertical direction and rotatably mounted on the bracket 1, and an adjusting screw section 42 provided on the adjusting lever 41, specifically, the adjusting lever 41 is rotatably mounted on a cover plate 132 of the bracket 1, and the adjusting screw section 42 extends downward and is screw-coupled with the intermediate header 21.
The middle header 21 is provided with a threaded hole 210 which is opened in the vertical direction and is matched with the adjusting threaded section 42. The adjusting rod 41 drives the adjusting screw section 42 to rotate in the rotating process, and the adjusting screw section 42 generates a matching relationship with the threaded hole 210 when rotating, so as to drive the middle header 21 to move up and down.
Specifically, as shown in fig. 7-8, the cover 132 of the bracket 1 is provided with an adjusting member positioning hole 11 extending in the vertical direction and a vertical limiting portion 12 disposed on the cover 132 of the bracket 1, the adjusting rod 41 is adapted to the adjusting member positioning hole 11, the height adjusting member 4 is further provided with a limiting nut 43 abutting against the vertical limiting portion 12 to limit the height adjusting member 4 to move downwards in the vertical direction, and the limiting nut 43 and the adjusting threaded section 42 are located on opposite sides of the vertical limiting portion 12.
The height adjusting piece 4 is further provided with a lower limit part 44 arranged between the adjusting thread section 42 and the limit nut 43, the size of the cross section of the adjusting rod 41 is smaller than that of the cross section of the lower limit part 44, a positioning groove 40 is formed among the limit nut 43, the lower limit part 44 and the adjusting rod 41, the vertical limit part 12 is matched with the positioning groove 40 and positioned in the positioning groove 40, and the limit nut 43 and the lower limit part 44 are respectively used for being propped against the top surface and the bottom surface of the vertical limit part 12.
The positioning of the height adjusting piece 4 in the vertical direction is realized through the cooperation of the limit nut 43 and the lower limit part 44, and the rotation of the height adjusting piece 4 is realized through the clearance fit of the adjusting rod 41 and the adjusting piece positioning hole 11.
The above structure can conveniently adjust the height of the middle header 21, but it is inconvenient to install and fix the height adjusting member 4, further for conveniently installing and fixing the height adjusting member 4 on the cover plate 132, the bracket 1 is located at the side of the adjusting member positioning hole 11 and further has an adjusting member assembling hole 17 communicated with the adjusting member positioning hole 11, the size of the adjusting member assembling hole 17 is larger than the size of the adjusting member positioning hole 11, and the size of the adjusting member assembling hole 17 is not smaller than the cross-sectional size of the adjusting screw section 42, and the size of the adjusting member assembling hole 17 is not smaller than the cross-sectional size of the lower limiting portion 44.
When the height adjusting piece 4 is assembled to the cover plate 132, the adjusting threaded section 42 is penetrated through the adjusting piece assembling hole 17, so that the positioning groove 40 on the height adjusting piece 4 is opposite to the vertical limiting part 12, and then the height adjusting piece 4 is pushed to move towards the direction of the adjusting piece positioning hole 11, and the installation and fixation of the height adjusting piece 4 are realized.
Further, for conveniently realizing the operation and rotation of the height adjusting member 4, the end of the limit nut 43 away from the adjusting thread section 42 is exposed outwards and forms a height adjusting groove 45. The height adjustment slot 45 is used to cooperate with a tool such as an adjustment wrench or screwdriver to drive rotation of the height adjustment member 4.
The mark taking mechanism for the chip heat dissipation paste is characterized by further comprising a vertical locking piece 5, wherein a vertical locking slide hole 16 matched with the vertical locking piece 5 is formed in the support 1, the vertical locking slide hole 16 is a waist-shaped hole extending in the vertical direction, one end of the vertical locking piece 5 penetrates through the vertical locking slide hole 16 and is in threaded connection with the middle mark head 21, the other end of the vertical locking piece 5 is provided with a butt limiting part for being abutted to the support 1, and the middle mark head 21 is locked and fixed on the support 1 through the vertical locking piece 5.
As shown in fig. 13 and 14, in the present embodiment, the depth of the concave space 20 at the bottom of the side header 22 is H, the width is L, the distance of the side header 22 away from the middle header 21 in the lateral direction is L, and the distance of the middle header 21 adjusted upward in the vertical direction is H, where the maximum value of H is not greater than (H/L) ×l.
If the maximum value of H is greater than (H/L) ×l, when the label picking mechanism adsorbs and sticks to the heat dissipation paste, the adsorbed heat dissipation paste will be jacked up at the edge position of the side label 22 close to the middle label 21, when the heat dissipation paste is attached to the corresponding flexible substrate, the edge position of the side label 22 and the side crimping part 221 on the side label 22 may be stuck to the flexible substrate, so that after the heat dissipation paste is preliminarily stuck and adsorbed, the pocket-shaped exhaust channel formed on the flexible substrate is narrowed, and because two sticking points exist, wrinkles are easily generated during subsequent rolling, thereby causing unevenness after the heat dissipation paste is stuck.
More specifically, the maximum value of H in this embodiment is not more than 0.05mm, since the depth H of the side header 22 is not more than 0.1mm. Therefore, setting the maximum value of h to not more than 0.05mm ensures that the maximum depth of the recess formed between the middle header 21 and the two side headers 22 after the middle header 21 is adjusted to the maximum position is not more than 0.15mm, and the arrangement of this structure makes the arch height formed by the adsorbed heat-dissipating paste just appropriate, and if the depth exceeds 0.15mm, the collapse of the arch is easily caused, and at the same time, the wrinkling condition after the heat-dissipating paste is stuck is also easily caused.
The invention also discloses a device for sticking the heat dissipation paste, which comprises a frame body, a label taking mechanism and a rolling mechanism, wherein the label taking mechanism is arranged on the frame body, and the label taking mechanism is used for sticking the heat dissipation paste of the chip. The label taking mechanism is used for grabbing the heat dissipation paste and moving the heat dissipation paste to a corresponding pasting area, the label taking mechanism pre-presses the heat dissipation paste on the flexible substrate, the three edges of the heat dissipation paste are pressed and pasted on the flexible substrate through the pressing connection part on the label taking mechanism in the process, the middle position of the heat dissipation paste forms an arch, one side edge of the heat dissipation paste also forms an opening shape, and thus the arch formed in the middle of the heat dissipation paste and the opening of one side edge of the heat dissipation paste form an exhaust channel.
The air bubble in the heat dissipation paste can be timely discharged through the exhaust channel in the process of completely attaching the heat dissipation paste to the flexible substrate by adopting the rolling mechanism, the rolling mechanism rolls from the edge of one side opposite to the opening on the heat dissipation paste to the opening direction in the process of attaching the heat dissipation paste to the chip, so that the air bubble can be conveniently discharged in the process of attaching the heat dissipation paste to the chip, the generation of the air bubble after the heat dissipation paste is effectively solved, and the heat dissipation paste after the heat dissipation paste is more smooth.
While the foregoing is directed to embodiments of the present invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.
Claims (15)
1. A get mark mechanism for chip heat dissipation subsides, its characterized in that: the device comprises a bracket, a header assembly, an adjusting assembly and a height adjusting piece, wherein the header assembly is arranged on the bracket and comprises a middle header and side headers arranged on two opposite sides of the middle header, the middle header and the two side headers are arranged in parallel in the transverse direction, and the adjusting assembly is matched with the side headers to drive the side headers to be close to or far away from the middle header in the transverse direction; the height adjusting piece drives the middle mark head to move along the vertical direction; the bottoms of the middle header and the side header are respectively provided with a concave space, and vacuum adsorption holes are formed in the concave spaces;
the concave space on the middle header and the concave space on the side header are communicated with each other and form a complete groove after the middle header and the side header are spliced;
as the middle header and side header distance increases, the height adjuster can move the middle header upward to increase the depth of the groove of the adjusted header assembly.
2. The label picking mechanism for chip heat dissipation paste according to claim 1, wherein: the height adjusting piece comprises an adjusting rod and an adjusting thread section, the adjusting rod is arranged on the support in an extending mode along the vertical direction, the adjusting thread section is arranged on the adjusting rod in a rotating mode, and the middle mark head is provided with a threaded hole which is arranged along the vertical direction and matched with the adjusting thread section.
3. The label picking mechanism for the chip heat dissipation paste according to claim 2, wherein: the adjusting piece positioning hole is formed in the support, the adjusting piece positioning hole extends in the vertical direction, the adjusting piece positioning hole is formed in the support, the adjusting rod is matched with the adjusting piece positioning hole, the height adjusting piece is further provided with a limiting nut which is in butt joint with the vertical limiting portion to limit the height adjusting piece to move downwards in the vertical direction, and the limiting nut and the adjusting thread section are located on two opposite sides of the vertical limiting portion.
4. The label picking mechanism for chip heat dissipation paste according to claim 3, wherein: the height adjusting piece is further provided with a lower limiting part arranged between the adjusting thread section and the limiting nut, a limiting groove is formed between the limiting nut and the lower limiting part, the vertical limiting part is matched with the limiting groove and positioned in the limiting groove, and the limiting nut and the lower limiting part are respectively used for being propped against the top surface and the bottom surface of the vertical limiting part.
5. The label picking mechanism for the chip heat dissipation paste as defined in claim 4, wherein: the support is located at the side of the adjusting piece locating hole and is further provided with an adjusting piece assembling hole communicated with the adjusting piece locating hole, the size of the adjusting piece assembling hole is larger than that of the adjusting piece locating hole, and the size of the adjusting piece assembling hole is not smaller than that of the section of the adjusting thread section.
6. The label picking mechanism for chip heat dissipation paste according to claim 3, wherein: one end of the limit nut, which is far away from the adjusting threaded section, is outwards exposed and forms a height adjusting groove.
7. The label picking mechanism for chip heat dissipation paste according to claim 1, wherein: the mark taking mechanism for the chip heat dissipation paste is characterized by further comprising a vertical locking piece, wherein a vertical locking slide hole matched with the vertical locking piece is formed in the support, the vertical locking slide hole is a waist-shaped hole extending in the vertical direction, one end of the vertical locking piece is penetrated through the vertical locking slide hole and is in threaded connection with the middle mark, and the other end of the vertical locking piece is provided with a butt limiting part for being abutted to the support.
8. The label picking mechanism for chip heat dissipation paste according to claim 1, wherein: the depth of the indent space of side mark head bottom is H, and the width is L, the side mark head is kept away from along the lateral direction the distance of middle mark head is L, the distance of middle mark head along the upward adjustment of vertical direction is H, and wherein, the maximum value of H is not more than (H/L) x L.
9. The label picking mechanism for the chip heat dissipation paste according to claim 8, wherein: the maximum value of h does not exceed 0.05.
10. The label picking mechanism for chip heat dissipation paste according to claim 1, wherein: the adjusting component drives the two side headers to synchronously approach each other or synchronously depart from each other by taking the middle header as a center.
11. The label picking mechanism for chip heat dissipation paste as defined in claim 10, wherein: the adjusting assembly comprises an adjusting screw rod which is arranged in a extending mode along the transverse direction and rotatably installed on the support, a first threaded section and a second threaded section which are opposite in threaded direction are arranged on the adjusting screw rod, and the first threaded section and the second threaded section are in threaded connection with the two side marks respectively.
12. The label picking mechanism for chip heat dissipation paste as defined in claim 11, wherein: the adjusting screw extends to be arranged at one end outside the bracket to form an adjusting piece positioning part, and the adjusting piece positioning part is a groove arranged on the adjusting screw.
13. The label picking mechanism for chip heat dissipation paste as defined in claim 12, wherein: the side mark head is arranged on the bracket in a sliding way along the transverse direction, the bracket comprises a bracket body and a pair of sliding rods arranged on the bracket body, the pair of sliding rods are arranged in parallel along the front-rear direction, and the side mark head is in sliding fit with the sliding rods; and the middle mark head is provided with an avoidance sliding hole which extends along the vertical direction and is matched with the sliding rod.
14. The label picking mechanism for chip heat dissipation paste as defined in claim 13, wherein: the label taking mechanism for the chip heat dissipation label is further provided with a side label head locking piece arranged on the frame body, and the side label head locking piece is in threaded connection with the side label head and locks and positions the side label head on the frame body.
15. The label picking mechanism for chip heat dissipation paste as defined in claim 14, wherein: the frame body is provided with a locking slide hole matched with the side mark head locking piece, and the locking slide hole extends along the transverse direction.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111664473.8A CN114361089B (en) | 2021-12-31 | 2021-12-31 | A get mark mechanism for chip heat dissipation subsides |
| PCT/CN2022/124667 WO2023124375A1 (en) | 2021-12-31 | 2022-10-11 | Attachment acquisition mechanism for chip heat dissipation attachment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202111664473.8A CN114361089B (en) | 2021-12-31 | 2021-12-31 | A get mark mechanism for chip heat dissipation subsides |
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| CN114361089A CN114361089A (en) | 2022-04-15 |
| CN114361089B true CN114361089B (en) | 2023-06-06 |
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| CN202111664473.8A Active CN114361089B (en) | 2021-12-31 | 2021-12-31 | A get mark mechanism for chip heat dissipation subsides |
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| WO (1) | WO2023124375A1 (en) |
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| CN114361089B (en) * | 2021-12-31 | 2023-06-06 | 颀中科技（苏州）有限公司 | A get mark mechanism for chip heat dissipation subsides |
| CN115241094B (en) * | 2022-07-28 | 2025-02-11 | 颀中科技（苏州）有限公司 | Heat sink installation jig and production equipment for flip chip packaging |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113471131A (en) * | 2021-07-13 | 2021-10-01 | 深圳市燕麦科技股份有限公司 | Chip positioning suction head |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0637124A (en) * | 1992-07-15 | 1994-02-10 | Fujitsu Miyagi Electron:Kk | Method for aligning chip |
| JPH08130395A (en) * | 1994-10-31 | 1996-05-21 | Nec Eng Ltd | Suction pad for carrying parts |
| JP2001034187A (en) * | 1999-07-22 | 2001-02-09 | Nec Corp | Thermocompression bonding device and thermo- compression bonding method |
| JP4701037B2 (en) * | 2005-08-10 | 2011-06-15 | Ｊｕｋｉ株式会社 | Image acquisition method and apparatus for electronic components |
| US8181949B2 (en) * | 2009-05-25 | 2012-05-22 | Yi-Po Hung | Micro-adjustable parallel bench vise |
| JP5695466B2 (en) * | 2011-03-29 | 2015-04-08 | リンテック株式会社 | Sheet sticking device and sticking method |
| US9196521B2 (en) * | 2012-11-05 | 2015-11-24 | Infineon Technologies Ag | Adjustable pick-up head and method for manufacturing a device |
| CN204322093U (en) * | 2014-12-23 | 2015-05-13 | 贵州正方实业有限公司 | A kind of fixture for double glazing processing |
| CN205738453U (en) * | 2016-05-13 | 2016-11-30 | 广州达意隆包装机械股份有限公司 | Labeling wheel apparatus |
| CN108565233B (en) * | 2018-05-25 | 2023-12-08 | 重庆市嘉凌新科技有限公司 | Semiconductor device packaging device |
| JP6768755B2 (en) * | 2018-09-21 | 2020-10-14 | 株式会社Ｓｃｒｅｅｎホールディングス | Slit nozzle and substrate processing equipment |
| CN113488421B (en) * | 2021-06-30 | 2024-05-03 | 颀中科技（苏州）有限公司 | Label taking head for chip heat dissipation paste, heat dissipation paste device and paste method |
| CN114361089B (en) * | 2021-12-31 | 2023-06-06 | 颀中科技（苏州）有限公司 | A get mark mechanism for chip heat dissipation subsides |
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2021
- 2021-12-31 CN CN202111664473.8A patent/CN114361089B/en active Active
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|---|---|---|---|---|
| CN113471131A (en) * | 2021-07-13 | 2021-10-01 | 深圳市燕麦科技股份有限公司 | Chip positioning suction head |
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| WO2023124375A1 (en) | 2023-07-06 |
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