CN108565233B - Semiconductor device packaging device - Google Patents
Semiconductor device packaging device Download PDFInfo
- Publication number
- CN108565233B CN108565233B CN201810517190.2A CN201810517190A CN108565233B CN 108565233 B CN108565233 B CN 108565233B CN 201810517190 A CN201810517190 A CN 201810517190A CN 108565233 B CN108565233 B CN 108565233B
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- Prior art keywords
- fan
- marking
- disc
- shaped
- semiconductor device
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 77
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 8
- 238000001125 extrusion Methods 0.000 claims description 16
- 238000007599 discharging Methods 0.000 claims description 14
- 239000000463 material Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000010330 laser marking Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- -1 etc. Chemical compound 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67282—Marking devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Labeling Devices (AREA)
Abstract
The invention relates to a semiconductor device packaging device, which comprises a marking machine and a processing table, wherein a first bracket and a second bracket are rotationally connected to the processing table; the fan-shaped disc is rotationally connected to the second support, racks meshed with the gears are arranged on the fan-shaped disc, each rack comprises two connecting portions and two arc-shaped portions, the angle of each arc-shaped portion is equal to that of the fan-shaped disc, the length of each connecting portion is equal to the thickness of the fan-shaped disc, the arc-shaped portions are respectively located on two side faces of the fan-shaped disc, the connecting portions are connected between the end portions of the two arc-shaped portions, a plurality of clamps are arranged on the fan-shaped disc, and the clamps are evenly distributed by taking the circle centers of the fan-shaped disc as the centers. The scheme realizes automatic marking of the two sides of the semiconductor device.
Description
Technical Field
The invention relates to the field of semiconductor device processing, in particular to a semiconductor device packaging device.
Background
Semiconductors refer to materials that have electrical conductivity properties at normal temperatures that are intermediate between conductors and insulators. Semiconductors have a wide range of applications in radio, television and temperature measurement, such as diodes, which are devices fabricated using semiconductors. A semiconductor refers to a material whose conductivity can be controlled and which can range from an insulator to a conductor. The importance of semiconductors is enormous, both from a technological and an economic point of view. Most electronic products today, such as computers, mobile phones or digital recorders, have very close association with semiconductors. Common semiconductor materials are silicon, germanium, gallium arsenide, etc., and silicon is one of the most influential in commercial applications among various semiconductor materials.
The semiconductor device requires marking on both sides of the semiconductor device during the packaging process. Currently, the way in which semiconductor devices are marked is by laser marking. Because marks are required to be printed on two side surfaces of the semiconductor device, after the marking of one side surface of the semiconductor device is finished, the semiconductor device is required to be manually turned over, so that the other side surface of the semiconductor device is opposite to the marking head of the marking machine, the automatic turning over and the like of the semiconductor device cannot be realized at present, and the operation is troublesome.
Disclosure of Invention
The invention aims to provide a semiconductor device packaging device which is used for automatically marking two sides of a semiconductor device.
In order to achieve the above purpose, the technical scheme of the invention is as follows: the utility model provides a semiconductor device packaging hardware, including marking machine, processing platform, the processing bench rotates and is connected with first support and fixedly connected with second support, marking machine installs on first support, the last rotation of marking machine is connected with the pivot, the one end fixedly connected with gear of marking machine is kept away from to the pivot, be equipped with the fixed connection between gear and the marking machine and beat epaxial marking dish in the pivot, beat and be equipped with a plurality of marking heads on the marking dish, a plurality of marking heads take the circular of marking dish as the center evenly distributed, beat and all be equipped with the extrusion switch that intermittent type and semiconductor device offset on the marking head, be equipped with driving gear pivoted motor on the marking machine; the fan-shaped disc is rotationally connected to the second support, racks meshed with the gears are arranged on the fan-shaped disc, each rack comprises two connecting portions and two arc-shaped portions, the angle of each arc-shaped portion is equal to that of the fan-shaped disc, the length of each connecting portion is equal to the thickness of the fan-shaped disc, the arc-shaped portions are respectively located on two side faces of the fan-shaped disc, the connecting portions are connected between the end portions of the two arc-shaped portions, a plurality of clamps are arranged on the fan-shaped disc, and the clamps are evenly distributed by taking the circle centers of the fan-shaped disc as the centers.
The working principle of the scheme is as follows: the marking machine is used for emitting laser from the marking head and carrying out laser marking on the semiconductor device. The clip is used to hold the semiconductor device, thereby fixing the semiconductor device on the fanned disk. The clamps are uniformly distributed by taking the circle center of the fan-shaped disc as the center, so that the semiconductor devices on the clamps are also uniformly distributed by taking the circle center of the fan-shaped disc as the center, and the semiconductor devices are uniformly distributed along the edge of the fan-shaped disc. The extrusion switch is used for controlling whether the marking head emits laser or not. The motor is used for driving the gear and the marking disc to rotate through the rotating shaft. When the gear rotates, the gear can drive the sector plate to rotate due to the meshing of the gear and the rack. When the gear is meshed with the arc-shaped part on one side of the sector disc, the gear drives the sector disc to rotate, and the marking disc and the sector disc rotate, so that the same side face of the semiconductor device on the sector disc sequentially extrudes extrusion switches on different marking heads, and the marking heads sequentially mark the same side face of different semiconductor devices. When the connecting part of the gear and the rack rotates, the sector plate stops rotating, the gear rolls on the connecting part, and the first bracket is rotationally connected to the processing table, so that the first bracket swings along with the rolling of the gear, and the marking plate swings along with the first bracket to the other side of the sector plate. When the gear rolls to the other side of the sector plate, the gear is meshed with the arc-shaped part of the rack at the other side of the sector plate, and the sector plate reversely rotates, so that marking of the other side of the semiconductor device is facilitated. Thus, double-sided marking of the semiconductor device is completed in batches.
By adopting the technical scheme, when the gear is meshed with the arc-shaped part of the rack, the gear drives the fan-shaped disc to rotate in the rotating process, so that the semiconductor devices on the fan-shaped disc rotate together, and a plurality of semiconductor devices sequentially squeeze the squeeze switches on the marking heads on the gear, so that the marking heads mark different semiconductor devices, and the automatic replacement of the semiconductor devices is realized. When the gear is meshed with the connecting part of the rack, the gear rolls on the connecting part, and the first bracket swings along with the gear, so that the marking disc rolls from one side of the fan-shaped disc to the other side, and marking is carried out on the other side of the semiconductor device, and therefore marking is carried out on different sides of the semiconductor device. In conclusion, when the device can be used for marking a plurality of semiconductor devices, the device can be used for automatically marking different sides of the semiconductor devices, the marking speed is high, the efficiency is high, and the batch marking of the semiconductor devices is realized.
Further, be equipped with the last silo that is located fan-shaped dish below on the processing platform, the one end of going up the silo is equipped with the pressure spring, and the other end of going up the silo articulates there is the flitch, and the flitch is equipped with the torsional spring with the articulated department of going up the silo, and the top of flitch is equipped with two guide plates of slope, and the top of two guide plates offsets, and the bottom of two guide plates is kept away from each other. Thereby, a number of semiconductor devices are placed in the loading chute. When the fan-shaped disc rotates, the clips on the fan-shaped disc are inserted from the top end of the guide plate. Since the guide plates are inclined, the top ends of the guide plates are close to each other, and the bottom ends of the guide plates are distant from each other, when the clip is inserted from the top end of the guide plate, the guide plates are easily inserted into the clip, so that the clip is opened, and thus, the clip does not need to be manually opened. After the clip is separated from the guide plate, the clip automatically closes and clamps the semiconductor device under the action of self-elastic force, then the semiconductor device clamped on the clip is propped against the discharging plate along with the rotation of the sector plate, the discharging plate rotates around the hinged position, and the discharging plate opens the feeding groove, so that the semiconductor device clamped on the clip is separated from the feeding groove. Therefore, with the rotation of the fan-shaped disc, the semiconductor device is automatically clamped on the clamp without manually clamping the semiconductor device on the clamp, batch feeding of the fan-shaped disc is realized, feeding speed is improved, and operation is simple.
Further, the clip includes clamping part and pressing part, is connected with the extrusion dish on the fan-shaped dish detachably. After the semiconductor devices on the fan-shaped disc are all marked, the pressing part of the clamp is pressed simultaneously through the pressing disc, so that the clamp is opened, the clamping part of the clamp can be opened simultaneously, the semiconductor devices on the clamp drop from the clamp, the clamp is not required to be opened one by one, and the blanking speed is improved.
Further, a guide rod is fixedly connected to the circle center of the fan-shaped disc, and the extrusion disc is connected to the guide rod in a sliding manner. Thus, the pressing plate slides on the guide rod, so that the pressing plate is far from and near to the pressing portion of the clip. The guide rod plays a guiding role, so that the extrusion of the extrusion disc is more accurate.
Further, be equipped with control module on the processing platform, be connected with the control button that is located first support both sides on the control module, be equipped with two briquetting that are used for with control button counterbalance on the first support, the briquetting is located the both sides of first support. The control button is used for controlling the marking machine to emit different lasers through the control module so as to print different marks. Therefore, when the first support is positioned on two sides of the fan-shaped disc, the pressing blocks on the first support can press different control buttons, so that the marking heads emit different lasers through the control modules, and different marks can be marked on two sides of the semiconductor device.
Further, the arc portion and the connecting portion of the rack are integrally formed. Thus, the gear and the rack are meshed more smoothly.
Drawings
FIG. 1 is a schematic diagram of an embodiment of the present invention;
FIG. 2 is a top view of the marking machine of FIG. 1;
FIG. 3 is a top view of the second processing station of FIG. 1;
FIG. 4 is a right side view of the guide plate of FIG. 1.
Detailed Description
The following is a further detailed description of the embodiments:
reference numerals in the drawings of the specification include: the device comprises a second processing table 1, a second bracket 2, a fan-shaped disc 3, a clamp 4, a pressing part 5, a rack 6, a notch surface 7, a guide rod 8, a discharging plate 9, a guide plate 10, a gear 11, a marking disc 12, a marking head 13, a rotating shaft 14, a marking machine 15, a control button 16, a first bracket 17, a connecting rod 18, a first processing table 19, a pressing block 20, a pressure spring 21 and a notch 22.
An example is substantially as shown in figures 1 to 4 of the accompanying drawings: a semiconductor device packaging apparatus includes a first processing stage 19 and a second processing stage 1 located on the left side of the first processing stage 19. The first processing bench 19 is rotationally connected with a first support 17 through a pin shaft, the first support 17 is provided with a marking machine 15 through a screw, the left end of the marking machine 15 is rotationally connected with a rotating shaft 14, the left end of the rotating shaft 14 is rotationally connected with a gear 11, a marking disc 12 welded on the rotating shaft 14 is arranged between the gear 11 and the marking machine 15, a plurality of marking heads 13 are arranged on the marking disc 12, the marking heads 13 are uniformly distributed by taking the circle center of the marking disc 12 as the center, and the marking heads 13 are all provided with extrusion switches which intermittently abut against a semiconductor device and are commonly used switches on the current marking machine for controlling whether the marking heads 13 emit laser or not. The marking machine 15 is provided with a motor (not shown in the figure) for driving the rotating shaft 14 to rotate, and as shown in fig. 2, two transverse connecting rods 18 are welded on the first bracket 17, and two pressing blocks 20 are welded at the left ends of the connecting rods 18. The first processing table 19 is provided with a control module (not shown in the figure), the control module is connected with two control buttons 16, the two control buttons 16 are used for controlling the marking machine 15 to send out different types of laser from the marking head 13 through the control module, the two control buttons 16 can respectively offset with the pressing block 20, the control module in this embodiment is a common module for controlling the marking machine AT present, and the comparison is existing, such as an AT89C51 series singlechip, which is not described herein again.
The top of second support 2 is connected with fan-shaped dish 3 through the round pin axle rotation, be equipped with breach 22 on the fan-shaped dish 3, be equipped with on the fan-shaped dish 3 with gear 11 engaged rack 6, rack 6 includes two connecting portions and two arc portions, the angle of arc portion equals the angle of fan-shaped dish 3, the length of connecting portion equals the thickness of fan-shaped dish 3, arc portion is located respectively on two sides of fan-shaped dish 3, connecting portion is located on breach face 7 of breach 22 of fan-shaped dish 3, connecting portion connects between the tip of two arc portions, connecting portion and arc portion integrated into one piece. The fan-shaped disc 3 is provided with a plurality of clamps 4 through screws, and the clamps 4 are uniformly distributed by taking the center of the fan-shaped disc 3 as the center. The clip 4 includes a holding portion that holds the semiconductor device and a pressing portion 5 that opens the holding portion. The center of the fan-shaped disc 3 is welded with a guide rod 8, and an extrusion disc (not shown in the figure) is slidably connected to the guide rod 8. The second processing bench 1 is provided with a feeding groove positioned below the fan-shaped disc 3, and the left end of the feeding groove is welded with a pressure spring 21 as shown in combination with fig. 3, the right end of the feeding groove is hinged with a discharging plate 9 through a hinge, and the hinge position of the discharging plate 9 and the feeding groove is provided with a torsion spring, so that the discharging plate 9 is in an upward inclined state in a natural state, and a semiconductor device is prevented from automatically sliding out of the feeding groove. Two inclined guide plates 10 are arranged above the discharging plate 9, and the top ends of the two guide plates 10 are propped against each other, and the bottom ends of the two guide plates 10 are far away from each other, so that the two guide plates 10 form a shape with open lower ends.
When the device is used, a plurality of semiconductor devices are placed in the feeding groove. The motor is started, the motor drives the gear 11 to rotate through the rotating shaft 14, the gear 11 drives the sector plate 3 to rotate anticlockwise through the engagement of the gear 11 and the arc-shaped part of the rack 6, and the clips 4 on the sector plate 3 rotate anticlockwise around the center of the sector plate 3 along with the sector plate 3. In the rotation of the clip 4 following the fan-shaped disc 3, when the clip 4 moves to the top ends of the guide plates 10, the top ends of the two guide plates 10 are relatively sharp, so that the top ends of the guide plates 10 are inserted into the clamping parts of the clip 4, the clamping parts of the clip 4 are spread by the two guide plates 10, so that the clip 4 is automatically spread, and as the clip 4 moves downwards along the guide plates 10, the opening of the clamping parts of the clip 4 is larger and larger due to the fact that the bottom end openings of the two guide plates 10 are larger and larger. Since the semiconductor device is arranged below the guide plate 10, the clamp 4 is separated from the guide plate 10 along with the rotation of the sector plate 3, and then the clamp 4 is automatically closed and clamped under the action of self-elastic force, so that the semiconductor device in the right end of the feeding groove is clamped. The clamped semiconductor part extrudes the discharging plate 9 along with the rotation of the clamp 4, so that the discharging plate 9 is inclined downwards, the right end of the feeding groove is communicated with the outside, and the clamped semiconductor part is discharged from the feeding groove. Therefore, along with the rotation of the fan-shaped disc 3, a plurality of semiconductor devices can be sequentially clamped on the clamp 4, and automatic batch feeding is realized.
After the loading is finished, the marking machine 15 is started, so that the marking machine 15 works. In the rotation process of the fan-shaped disc 3, the semiconductor devices on the clips 4 are respectively propped against the marking heads 13 on the marking disc 12 in sequence, the semiconductor devices squeeze the corresponding squeezing switches on the marking heads 13, and the squeezing switches enable the marking heads 13 to emit laser so as to mark the side surfaces of the semiconductor devices in batches. When the connecting part of the rack 6 on the fan-shaped disc 3 is meshed with the gear 11, in order to stop the fan-shaped disc 3 from rotating, the fan-shaped disc 3 is provided with a stop pin which is propped against the second bracket 2, at the moment, the stop pin is propped against the second bracket 2, the fan-shaped disc 3 stops rotating, then the gear 11 rolls on the connecting part, the first bracket 17 swings, the gear 11 rolls from one side of the fan-shaped disc 3 to the other side, the marking disc 12 also swings from one side of the fan-shaped disc 3 to the other side, then the gear 11 is meshed with the arc-shaped part of the rack 6 on the other side of the fan-shaped disc 3, so that the fan-shaped disc 3 is reversely rotated, and the marking head 13 is used for marking the other side of the semiconductor device in batches.
When the gear 11 is positioned on two sides of the fan-shaped disc 3, the pressing blocks 20 on the connecting rod 18 can press different control buttons 16, and the control buttons 16 enable the marking machine 15 to emit laser of different types through the control module, so that different marks can be marked on two sides of the semiconductor device.
After marking is finished on two sides of the semiconductor device, the extrusion plate is slid on the guide rod 8, so that the extrusion plate moves towards the direction close to the sector plate 3, the edge of the extrusion plate extrudes the pressing part 5 of the clamp 4, the clamps 4 are pressed by the extrusion plate and simultaneously opened, and the semiconductor devices on the clamps 4 are all dropped from the clamps 4, so that batch discharging of the semiconductor devices on the clamps 4 is realized.
While only the preferred embodiments of the present invention have been described above, it should be noted that it will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit of the invention, and these should also be considered as the scope of the invention, which does not affect the effect of the practice of the invention and the utility of the patent. The technology, shape, and construction parts omitted herein are all known in the art.
Claims (4)
1. The utility model provides a semiconductor device packaging hardware, includes marking machine, its characterized in that: the device comprises a semiconductor device, and is characterized by further comprising a processing table, wherein a first support and a second support are rotationally connected to the processing table, a rotating shaft is rotationally connected to the marking machine, one end of the rotating shaft, far away from the marking machine, is fixedly connected with a gear, a marking disc fixedly connected to the rotating shaft is arranged between the gear and the marking machine, a plurality of marking heads are arranged on the marking disc, the marking heads are uniformly distributed by taking the circle of the marking disc as the center, the marking heads are all provided with extrusion switches for intermittently propping against the semiconductor device, and the marking machine is provided with a motor for driving the gear to rotate; the second bracket is rotationally connected with a fan-shaped disc, the fan-shaped disc is provided with a rack meshed with a gear, the rack comprises two connecting parts and two arc-shaped parts, the angle of each arc-shaped part is equal to that of the fan-shaped disc, the length of each connecting part is equal to the thickness of the fan-shaped disc, the arc-shaped parts are respectively positioned on two side surfaces of the fan-shaped disc, the connecting parts are connected between the end parts of the two arc-shaped parts, the fan-shaped disc is provided with a plurality of clamps, and the clamps are uniformly distributed by taking the center of the circle of the fan-shaped disc as the center; the processing table is provided with a feeding groove positioned below the fan-shaped disc, one end of the feeding groove is provided with a pressure spring, the other end of the feeding groove is hinged with a discharging plate, a torsional spring is arranged at the hinge position of the discharging plate and the feeding groove, two inclined guide plates are arranged above the discharging plate, the top ends of the two guide plates are propped against each other, and the bottom ends of the two guide plates are far away from each other; the processing table is provided with a control module, the control module is connected with control buttons positioned on two sides of a first bracket, the first bracket is provided with two pressing blocks which are used for propping against the control buttons, the pressing blocks are positioned on two sides of the first bracket, and the two control buttons are used for controlling a marking machine to emit different types of laser from a marking head; the clip includes a clamping portion into which the tip of the guide plate is inserted when the clip moves to the tip of the guide plate while the clip follows the rotation of the sector plate, and the two guide plates spread the clamping portion of the clip apart.
2. The semiconductor device package apparatus according to claim 1, wherein: the clip further comprises a pressing part, and the fan-shaped disc is detachably connected with an extrusion disc.
3. A semiconductor device package apparatus according to claim 2, wherein: the circle center of the fan-shaped disc is fixedly connected with a guide rod, and the extrusion disc is connected to the guide rod in a sliding manner.
4. A semiconductor device package apparatus according to claim 3, wherein: the arc part and the connecting part of the rack are integrally formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810517190.2A CN108565233B (en) | 2018-05-25 | 2018-05-25 | Semiconductor device packaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810517190.2A CN108565233B (en) | 2018-05-25 | 2018-05-25 | Semiconductor device packaging device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108565233A CN108565233A (en) | 2018-09-21 |
| CN108565233B true CN108565233B (en) | 2023-12-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810517190.2A Active CN108565233B (en) | 2018-05-25 | 2018-05-25 | Semiconductor device packaging device |
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| CN (1) | CN108565233B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109300812B (en) * | 2018-10-08 | 2021-10-29 | 创域智能(常熟)网联科技有限公司 | Fixed rotating robot for laser printing of integrated circuit chip |
| CN112864041B (en) * | 2019-11-27 | 2024-03-22 | 西安航思半导体有限公司 | Semiconductor device packaging device |
| CN113601041B (en) * | 2021-08-17 | 2023-08-18 | 河北申科电子股份有限公司 | Self-adjusting clamping alignment marking machine |
| CN114361089B (en) * | 2021-12-31 | 2023-06-06 | 颀中科技（苏州）有限公司 | A get mark mechanism for chip heat dissipation subsides |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100720372B1 (en) * | 2006-09-06 | 2007-05-21 | 주식회사 고려반도체시스템 | Laser marking device for semiconductor device marking with up / down function of laser assembly |
| CN203752696U (en) * | 2014-03-31 | 2014-08-06 | 宁波科强标识科技有限公司 | Laser marking machine |
| CN203805506U (en) * | 2014-03-31 | 2014-09-03 | 宁波科强标识科技有限公司 | Laser marking machine |
| CN203901977U (en) * | 2014-03-31 | 2014-10-29 | 宁波科强标识科技有限公司 | Rotation marking device |
| CN207155019U (en) * | 2017-08-26 | 2018-03-30 | 温州市大鹏激光科技有限公司 | A kind of double-sided laser marking machine |
-
2018
- 2018-05-25 CN CN201810517190.2A patent/CN108565233B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100720372B1 (en) * | 2006-09-06 | 2007-05-21 | 주식회사 고려반도체시스템 | Laser marking device for semiconductor device marking with up / down function of laser assembly |
| CN203752696U (en) * | 2014-03-31 | 2014-08-06 | 宁波科强标识科技有限公司 | Laser marking machine |
| CN203805506U (en) * | 2014-03-31 | 2014-09-03 | 宁波科强标识科技有限公司 | Laser marking machine |
| CN203901977U (en) * | 2014-03-31 | 2014-10-29 | 宁波科强标识科技有限公司 | Rotation marking device |
| CN207155019U (en) * | 2017-08-26 | 2018-03-30 | 温州市大鹏激光科技有限公司 | A kind of double-sided laser marking machine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108565233A (en) | 2018-09-21 |
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