CN103781341A - Element installation device and element installation method - Google Patents

Abstract

The present invention aims to provide an element installation device and an element installation method, which can perform element installation to substrates both of a small size and a large size, and thus can the production line of the substrates of both sizes to be uniform. Under the condition that a substrate receiving part (21) sets the gap between two substrate receiving stations (21s) to be a first gap so as to receive two substrates (2) of the small size, a left substrate transferring part (82a) transfers the two substrates (2) of the small size received by the substrate receiving part (21) simultaneously to an element installation part (22); and under the condition that the substrate receiving part (21) sets the gap between the two substrate receiving stations (21s) to be a second gas larger than the first gap so as to receive two substrates (2) of the large size, the left substrate transferring part (82a) transfers the two substrates (2) of the large size received by the substrate receiving part (21) one by one to the element installation part (22)

Description

Component mounting device and component mounting method

technical field

The present invention relates to a component mounting device and a component mounting method for manufacturing a liquid crystal panel substrate by pressure-bonding the component to the substrate after mounting the component on the substrate.

Background technique

Conventionally, there is known a component mounting apparatus for liquid crystal panel substrate manufacturing that mounts a component on a substrate to manufacture a liquid crystal panel substrate (for example, refer to Patent Document 1). Such a component mounting device for manufacturing liquid crystal panel substrates includes, in addition to a component mounting section for mounting components on the substrate, a substrate receiving section for receiving two substrates conveyed from the upstream process side by using two substrate receiving tables; and a substrate transfer section that transfers the substrates received by the substrate receiving section to the component mounting section. The substrate transfer section picks up two substrates at the same time and transfers them using two pick-up members arranged at intervals between the two substrate receiving tables provided in the substrate receiving section. to the component mounting section.

Among such component mounting devices, there are component mounting devices that mount components on boards of the first size (small size), and boards of the second size (large size) that are larger in size than the boards of the first size. A component mounting device that performs component mounting for objects. Here, when two large-sized substrates are placed on two substrate receiving tables by a component mounting device that performs component mounting on small-sized substrates, the two substrates interfere with each other, so the target is large-sized substrates. The component mounting device for component mounting needs to be different from the component mounting device for component mounting on small-sized substrates. The two types of component mounting devices corresponding to the substrate are respectively assembled in the substrate production line.

Patent Document 1: Japanese Patent Application Laid-Open No. 6-75199

However, if the two types of component mounting devices corresponding to the two types of large and small substrates are separately assembled on the substrate production line as described above, there will be a plurality of substrate production lines, which is disadvantageous in terms of cost.

Contents of the invention

Therefore, an object of the present invention is to provide a component mounting device and a component mounting method that can perform component mounting on both small-sized and large-sized substrates, and can unify production lines for both large and small-sized substrates.

The component mounting apparatus according to Claim 1 is a component mounting apparatus including a component mounting portion for mounting components on a substrate, wherein the component mounting apparatus includes: a substrate receiving portion that sets an interval between two substrate receiving stages to a first Receive two substrates of the first size transported from the upstream process side at intervals, or set the interval between the two substrate receiving stations to a second interval greater than the first interval and receive the substrates from the upstream process Two substrates of a second size larger than the substrate of the first size that are transported from the side; and a substrate transfer part that receives the substrate of the first size or the second size received by the substrate receiving part transfer to the substrate mounting section, and in the case where the substrate receiving section receives two substrates of the second size, the substrate transfer section takes one of the received two substrates of the second size Transfer to the component mounting part one by one.

In the component mounting device according to claim 2, in the component mounting device according to claim 1, when the board receiving part receives two boards of the first size, the board transfer part The received two substrates of the first size are simultaneously transferred to the component mounting section.

In the component mounting device according to claim 3, in the component mounting device according to claim 1 or 2, the component mounting part includes a board holding part for simultaneously transferring two sheets of the board from the board transferring part. The substrates of the first size or the substrates of the second size transferred one by one by the substrate transfer part are held; The component mounting operation part mounts the component on the substrate on which the adhesive member is pasted by the adhesive member pasting operation part; and the component crimping operation part crimps the component mounted by the component mounting operation part on the substrate A substrate on which components are mounted on the component mounting operation section, the substrate holding section can selectively mount a first substrate holding table that simultaneously holds two substrates of the first size or a single substrate of the second size. A second substrate holding table for the substrate.

In the component mounting device according to claim 4, in the component mounting device according to any one of claims 1 to 3, the substrate transfer section has two pick-up members configured to be able to Simultaneously pick up the interval between two substrates of the first size received by the substrate receiving section when the two substrate receiving stages are adjusted to the first interval, and place the substrates in the substrate receiving section When the two substrate receiving stations are adjusted to the first interval and receive two substrates of the first size, the substrate transfer part picks up two sheets of the second substrate at the same time by using the two pick-up members. One-size substrate and transfer to the substrate holder.

In the component mounting apparatus according to claim 5, in the component mounting apparatus according to claim 4, the board receiving unit receives the substrate while the two board receiving stages are adjusted to the second interval. In the case of two substrates of the second size, the substrate transfer unit uses one of the two pick-up members to pick up a substrate of the second size and transfer it to the substrate holding unit, and then After the substrate receiving part adjusts the two substrate receiving stages to the first interval, the substrate transfer part picks up the remaining one of the second pick-up members by the other pick-up member of the two pick-up members. sized substrates and transfer to the substrate holder.

The component mounting method according to claim 6 is a component mounting method realized by a component mounting device provided with a component mounting section for component mounting on a substrate, wherein the component mounting method includes a substrate receiving step of placing two substrate receiving stages The interval is set as the first interval to receive two substrates of the first size transported from the upstream process side, or the interval between the two substrate receiving stations is set to a second interval greater than the first interval to receiving two substrates of a second size larger than the substrate of the first size conveyed from the upstream process side; and a substrate transfer process of transferring the first size received in the substrate receiving process Or the substrate of the second size is transferred to the substrate mounting part, and when two substrates of the second size are received in the substrate receiving process, the received substrates are transferred in the substrate transfer process The two substrates of the second size are transferred to the component mounting part one by one.

In the component mounting method according to claim 7, in the component mounting method according to claim 6, when two substrates of the first size are received in the substrate receiving step, the substrate transfer In the process, the received two substrates of the first size are simultaneously transferred to the component mounting part.

In the present invention, the interval between the two substrate receiving stations is set as the first interval to receive two substrates of the first size (small size) conveyed from the upstream process side, or the interval between the two substrate receiving stations is set to Two substrates of a second size (large size) that are larger than the substrate of the first size and transported from the upstream process side are received at a second interval that is larger than the first interval. And, in the case of receiving two substrates of the second size, the received two substrates of the second size are transferred to the component mounting part one by one, so that the substrate of the first size and the substrate of the second Since component mounting is performed on any one of boards of different sizes, it is possible to unify production lines for boards of both sizes.

Description of drawings

FIG. 1 is a plan view of a component mounting device according to one embodiment of the present invention.

FIG. 2 is a diagram showing a procedure for performing a component mounting operation on a substrate in the component mounting apparatus according to one embodiment of the present invention.

FIG. 3 is a block diagram showing a control system of the component mounting apparatus according to one embodiment of the present invention.

4( a ) and ( b ) are diagrams illustrating a configuration of a board receiving unit included in a component mounting device according to an embodiment of the present invention.

5( a ) and ( b ) are perspective views of an ACF pasting unit and a left board transport unit included in the component mounting apparatus according to the embodiment of the present invention.

6( a ) and ( b ) are perspective views of an ACF pasting unit and a left board transport unit included in the component mounting apparatus according to the embodiment of the present invention.

7( a ), ( b ) and ( c ) are diagrams showing the execution procedure of the ACF tape pasting operation performed by the ACF pasting operation unit in one embodiment of the present invention.

8( a ) and ( b ) are perspective views of a component mounting operation unit and a central board transport unit (right board transport unit) included in the component mounting apparatus according to one embodiment of the present invention.

9( a ) and ( b ) are perspective views of a component mounting operation unit and a central board transport unit (right board transport unit) included in the component mounting apparatus according to one embodiment of the present invention.

FIG. 10 is a flowchart showing the execution procedure of a component mounting operation performed by a component mounting operation unit according to one embodiment of the present invention.

11( a ) ( b ) ( c ) are diagrams illustrating execution procedures of component mounting work performed by the component mounting work unit according to one embodiment of the present invention.

12( a ), (b) and (c) are diagrams showing the execution procedure of component mounting work performed by the component mounting work unit according to one embodiment of the present invention.

13( a ) and ( b ) show the first component crimping unit (second component crimping unit) and the left board transport unit (right board transport unit) included in the component mounting apparatus according to the embodiment of the present invention. stereogram.

14( a ) and ( b ) show the first component crimping unit (second component crimping unit) and the left board transport unit (right board transport unit) included in the component mounting apparatus according to the embodiment of the present invention. stereogram.

15( a ), ( b ) and ( c ) are diagrams showing the execution steps of the component crimping work of the first component crimping work unit (second component crimping work unit) according to the embodiment of the present invention.

FIG. 16 is a flowchart showing the steps of the component crimping operation performed by the component mounting apparatus according to the embodiment of the present invention.

17( a ) to ( f ) are diagrams showing the execution steps of component crimping work performed by the first component crimping work unit (second component crimping work unit) according to one embodiment of the present invention.

18( a ) and ( b ) are diagrams illustrating the configuration of a board delivery section included in a component mounting device according to an embodiment of the present invention.

Fig. 19 is a perspective view of a substrate transfer unit according to one embodiment of the present invention.

Fig. 20 is a partial plan view of a component mounting device according to one embodiment of the present invention.

21( a ) ( b ) ( c ) are diagrams showing the execution steps of component mounting work performed by the component mounting device according to one embodiment of the present invention.

22( a ), (b) and (c) are diagrams showing execution steps of component mounting work performed by the component mounting device according to one embodiment of the present invention.

23( a ), (b) and (c) are diagrams showing the execution steps of component mounting work performed by the component mounting device according to one embodiment of the present invention.

24( a ) ( b ) ( c ) are diagrams illustrating execution steps of component mounting work performed by the component mounting device according to one embodiment of the present invention.

25( a ) ( b ) ( c ) are diagrams illustrating execution steps of component mounting work performed by the component mounting device according to one embodiment of the present invention.

26( a ) and ( b ) are diagrams illustrating execution steps of component mounting work performed by the component mounting device according to one embodiment of the present invention.

27( a ) ( b ) ( c ) are diagrams illustrating execution steps of component mounting work performed by the component mounting device according to one embodiment of the present invention.

28( a ) ( b ) ( c ) are diagrams showing execution steps of component mounting work performed by the component mounting device according to one embodiment of the present invention.

29( a ) ( b ) ( c ) are diagrams illustrating execution steps of component mounting work performed by the component mounting device according to one embodiment of the present invention.

30 ( a ) ( b ) ( c ) are diagrams showing execution steps of component mounting work performed by the component mounting device according to one embodiment of the present invention.

31( a ) and ( b ) are diagrams showing execution steps of component mounting work performed by the component mounting device according to one embodiment of the present invention.

Label description

1: component mounting device;

2: Substrate;

3: ACF tape (adhesive parts);

4: component;

21: substrate receiving part;

21s: substrate receiving station;

22: component installation part;

22a: ACF paste operation department (adhesive parts paste operation department);

22b: component loading operation department;

22c: The first component crimping operation department (component crimping operation department);

22d: the second component crimping operation department (component crimping operation department);

33L: Left substrate conveying part (substrate holding part);

36: substrate holding table (first substrate holding table);

36T: substrate holding table (second substrate holding table);

82a: left substrate transfer part (substrate transfer part);

94: Arm (pick component).

Detailed ways

Hereinafter, embodiments of the present invention will be described with reference to the drawings. The component mounting apparatus 1 for manufacturing liquid crystal panel substrates shown in FIG. 1 executes component mounting operations in which ACF tape 3 as an adhesive member is attached to four sides of a rectangular panel-shaped substrate 2 shown in FIG. 2 . After the electrode portion 2a is provided at one end of the ACF tape 3, the element 4 is mounted (temporarily crimped) on the pasted ACF tape 3, and then the element 4 is mounted on the substrate 2 by crimping (full crimping). The element 4 employed here is, for example, a drive circuit element, which has a film-like portion 4a.

In FIG. 1 , the bases 11 of the component mounting apparatus 1 are arranged in order from the left in the left-right direction viewed from the operator OP (the left-right direction on the paper in FIG. 1 is referred to as the X-axis direction). The table 11a, the central base 11b, and the right base 11c include a board receiving section 21 on the left base 11a, a component mounting section 22 on the central base 11b, and a board transfer section 23 on the right base 11c. The operations of the above-mentioned board receiving unit 21 , component mounting unit 22 and board delivery unit 23 are controlled by a control device 24 ( FIG. 3 ) as a control member. The substrate 2 flows from left to right along the X-axis direction, that is, in the order of the substrate receiving part 21 , the component mounting part 22 , and the substrate delivery part 23 , and operations are performed sequentially.

In FIG. 1 , the substrate receiving unit 21 has two substrate receiving tables 21 s on the left side (upstream process side) and right side (downstream process side). The two substrate receiving tables 21 s are provided so as to be able to move up and down with respect to the left base 11 a, and two substrates 2 transported from the upstream process side of the component mounting apparatus 1 are placed on the two substrate receiving tables 21 s.

As shown in FIG. 4 , the substrate receiving table 21s on the right is fixed to the left base 11a, and the substrate receiving table 21s on the left is movable in the X-axis direction on the left base 11a. This component mounting apparatus 1 can perform component mounting operations on substrates 2 of different sizes. The interval between the receiving stations 21s is set so that two small-sized substrates 2 can be received without interfering with each other (referred to as the first interval) (Fig. In the case of component mounting work on a substrate 2 of the second size (hereinafter referred to as a large size), the interval between the two substrate receiving stations 21s is set to be larger than the first interval so that two large substrates can be received without interfering with each other. Dimensions of the substrate 2 spacing (referred to as the second spacing) (Figure 4(b)).

The component mounting unit 22 has an ACF sticking operation unit 22a (adhesive component sticking work unit) for sticking the ACF tape 3 as an adhesive member to the substrate 2, and a component mounting operation for performing the mounting operation of the component 4 on the substrate 2. part 22b, two component crimping operation parts (the first component crimping operation part 22c) that press-bond the component 4 mounted by the component mounting operation part 22b to the substrate 2 that has carried out the mounting operation of the component 4 in the component mounting operation part 22b. and the second element crimping operation part 22d).

The ACF bonding operation part 22a is provided in the left area of the center base 11b, and the component mounting operation part 22b is provided in the center area of the center base 11b. The first component crimping operation part 22c is provided in the area between the ACF bonding operation part 22a and the component mounting operation part 22b on the central base 11b, and the second component crimping operation part 22d is provided on the component mounting part on the central base 11b. The area on the right side of the working part 22b. That is, in the component mounting apparatus 1 of this embodiment, the first component crimping operation part 22c and the second component crimping operation part 22d are provided at positions sandwiching the component mounting operation part 22b from the left and right sides.

The first base part 31 is provided in the area in front of the ACF bonding operation part 22a on the central base 11b (the front and rear direction viewed from the operator OP is the Y-axis direction), and the component mounting operation on the central base 11b A second base portion 32 is provided extending in the X-axis direction in front regions of the portion 22b, the first component crimping operation portion 22c, and the second component crimping operation portion 22d.

In FIGS. 1 and 5( a ) and ( b ), the first base unit 31 is provided with a left substrate transport unit 33L. The left substrate transport unit 33L is extended in the Y-axis direction on the first base portion 31 , and has a Y-axis table 34 movably provided in the X-axis direction on the first base portion 31 . 34 , a movable table 35 provided movably in the Y-axis direction, and two substrate holding tables 36 arranged side by side in the X-axis direction on the upper surface of the movable table 35 . Two substrates 2 are transferred from the two substrate receiving stages 21 s of the substrate receiving section 21 and held on the two substrate holding stages 36 .

As shown in FIG. 6( a ), the two substrate holding tables 36 of the left substrate transport unit 33L can be exchanged for one substrate holding table 36T. One substrate receiving table 21s transfers and holds one substrate 2 on the substrate holding table 36T.

In addition, two substrate holding tables 36 are installed on the left substrate conveying part 33L in order to use the two substrate holding stages 36 to hold two small-sized substrates 2, and one substrate holding table 36 is installed on the left substrate conveying part 33L. The table 36T is for holding a single large-sized substrate 2 by the one substrate holding table 36T. That is, in the present embodiment, the left substrate transport unit 33L can selectively mount two substrate holding tables 36 (first substrate holding tables) that simultaneously hold two small-sized substrates 2 or hold one large-sized substrate 2 . One substrate holding table 36T (second substrate holding table).

The two substrate holding tables 36 (or one substrate holding table 36T) can move up and down freely relative to the movable table 35, and the control device 24 moves the movable table 35 in the Y-axis direction relative to the Y-axis table 34 to carry out the transportation of the substrate 2, so that The two substrate holding tables 36 or one substrate holding table 36T are raised and lowered, and the substrate 2 placed on the two substrate holding tables 36 or one substrate holding table 36T is moved up and down.

In Fig. 5 (a), (b) and Fig. 6 (a), (b), the ACF sticking operation part 22a has two sticking heads 41 arranged side by side along the X-axis direction above the central base 11b, and Two auxiliary tables 42 for ACF pasting work are provided extending below each pasting head 41 along the X-axis direction.

The two sticking heads 41 are respectively equipped with: a tape supply part 41a, which draws out and supplies the ACF tape 3, cuts the drawn out ACF tape 3 to a predetermined length and holds it at a predetermined position in a horizontal posture; and a sticking tool 41b, This presses the ACF tape 3 held in a horizontal posture by the tape supply unit 41 a from above to the side of the auxiliary table 42 for ACF pasting work.

The control device 24 sets the moving stage 35 of the left substrate conveying unit 33L at the "substrate transfer position" set in front of the Y-axis table 34 (Fig. Move between the "working positions" (Fig. 5(b) and Fig. 6(b)). The "substrate transfer position" is a position where the substrate 2 can be transferred to and from the two substrate holding tables 36 (or one substrate holding table 36T), and the "work position" is a position where two substrates placed on the two substrate holding tables 36 can be placed. The respective electrode portions 2a of the substrates 2 are located above the auxiliary table 42 for the two ACF bonding operations (or the electrode portions 2a of one substrate 2 placed on one substrate holding table 36T can be positioned above the two ACF bonding operations). The position above one of the auxiliary tables 42 of the auxiliary tables 42).

The sticking operation of sticking the ACF tape 3 to the substrate 2 by the sticking head 41 will be described with reference to FIG. 7 . First, as shown in FIG. 7( a ), the control device 24 operates the tape supply unit 41 a to position the ACF tape 3 cut to a predetermined length above the substrate 2 (electrode portion 2 a ). Next, as shown in FIG. 7( b ), the bonding tool 41 b is lowered, and the ACF tape 3 is pressed against the auxiliary table 42 for the ACF bonding operation for each substrate 2 . Finally, as shown in FIG. 7( c ), the sticking tool 41 b is raised with respect to the substrate 2 . As a result, the ACF tape 3 of a predetermined length is attached to the substrate 2 .

In FIG. 1 , a central substrate transport unit 33C and a right substrate transport unit 33R are provided on the second base unit 32 . The central substrate transport unit 33C is of the same type as the right substrate transport unit 33R, and the central substrate transport unit 33C is located to the left of the right substrate transport unit 33R. As shown in FIGS. 8( a ) and ( b ), the central substrate transport unit 33C (the same applies to the right substrate transport unit 33R) has a Y-axis table 51 provided on the second base unit 32 to be movable in the X-axis direction. , a moving table 52 provided movably in the Y-axis direction on the Y-axis table 51 , and two substrate holding tables 53 arranged side by side in the X-axis direction on the upper surface of the moving table 52 . The moving table 52 incorporates an elevating mechanism for elevating the two substrate holding tables 53 in the Z-axis direction, respectively. The two substrate holding tables 53 are freely movable in the horizontal direction by the movement of the Y-axis table 51 relative to the second base part 32 in the X-axis direction and the movement of the moving table 52 relative to the Y-axis table 51, and the substrate is transported from the left side. The two substrate holding tables 36 of the section 33L transfer and hold the two substrates 2 on the two substrate holding tables 53 .

The two substrate holding tables 53 of the central substrate transport unit 33C and the two substrate holding tables 53 of the right substrate transport unit 33R can be replaced with one substrate holding table 53T as shown in FIG. 9( a ). In this case, One substrate 2 is transferred from one substrate holding table 36T of the left substrate transport unit 33L and held on the substrate holding table 53T.

In addition, two substrate holding tables 53 are installed in the central substrate conveying part 33C and the right substrate conveying part 33R in order to use the two substrate holding tables 53 to hold two small-sized substrates 2, and the central substrate conveying part One substrate holding table 53T is attached to 33C and the right substrate conveyance part 33R in order to hold a single large-sized substrate 2 by the one substrate holding table 53T. That is, in the present embodiment, the central substrate transport unit 33C and the right substrate transport unit 33R can selectively mount two substrate holding tables 53 (first substrate holding tables) that simultaneously hold two small-sized substrates or hold one substrate holding table. One substrate holding table 53T (second substrate holding table) for the large-sized substrate 2 is expanded.

The two substrate holding tables 53 (or one substrate holding table 53T) are each moved horizontally by the movement of the Y-axis table 51 in the X-axis direction relative to the second base portion 32 and the movement of the moving table 52 relative to the Y-axis table 51 . The direction of movement is free, and it is provided so that it can be moved up and down freely by the driving of the above-mentioned lifting mechanism built in the moving table 52 . The control device 24 makes the two substrate holding tables 53 (or One substrate holding table 53T) is moved in the horizontal plane direction to carry out the transportation of the substrate 2, and the two substrate holding tables 53 (or one substrate holding table 53T) are lowered/raised, and the two substrates placed on the two substrate holding tables 53 One substrate 2 (or one substrate 2 placed on one substrate holding table 53T) lands on/off the upper surface of the auxiliary table 64 .

In Fig. 1, Fig. 8 (a), (b) and Fig. 9 (a), (b), the component mounting operation part 22b is equipped with: a component supply part 61 protruding rearward from the rear part of the central base 11b The supply of components 4 is provided and carried out; the mounting head 63 is movable in the horizontal plane by the mounting head moving mechanism 62 provided at the central rear portion of the center base 11b, and absorbs the components 4 supplied from the component supply part 61 from above; and The auxiliary table 64 for component mounting operation is extended in the Y-axis direction in the area behind the central portion of the second base portion 32 . The control device 24 controls the supply operation of the component 4 by the component supply unit 61 , the movement operation of the mounting head 63 in the horizontal plane by the operation of the head moving mechanism 62 , and the suction operation of the component 4 by the mounting head 63 . Thereby, a series of operations are performed from the suction (pick-up) of the component 4 by the mounting head 63 to the mounting of the component 4 on the substrate 2 .

In FIG. 8( a ) and FIG. 9( a ), two position recognition cameras 65 whose imaging field of view faces upward are arranged in parallel along the X-axis direction on the auxiliary table 64 for component mounting work. The two position recognition cameras 65 are controlled by the control device 24 to perform an imaging operation, passing through a transparent material part 64a such as quartz glass provided on the upper part of the auxiliary table 64 for component mounting (Fig. 8(a) and Fig. 9(a) ), an image is taken of the object located above the auxiliary table 64 for component mounting.

The component mounting operation control unit SR1 ( FIG. 3 ) of the control device 24 sets the moving stage 52 of the central substrate transport unit 33C at the “substrate transfer position” ( FIG. 8( a ) and FIG. 9(a)) and the "working position" (Fig. 8(b) and Fig. 9(b)) set at the rear. The “substrate delivery position” is a position where the substrate 2 can be delivered to and from the two substrate holding tables 53 (or one substrate holding table 53T). The "working position" is a position where the ACF tape 3 attached to the electrode portion 2a of the substrate 2 mounted on the two substrate holding tables 53 (or one substrate holding table 53T) can be positioned above the auxiliary table 64 for component mounting work (further That is, it is a position above an auxiliary table 72 for component crimping work described later).

When executing the component mounting operation of mounting the component 4 on the substrate 2, the control device 24 (component mounting operation control unit SR1) first moves the moving table 52 to the "working position" to position the electrode portion 2a of the substrate 2 It is at a position above the auxiliary table 64 (loading work position) (step ST1 shown in the flowchart of FIG. 10 ). Next, two position recognition cameras 65 are used to image and recognize two position recognition marks m ( FIG. 2 ) on the substrate 2 located above the auxiliary table 64 for component mounting ( FIG. 11( a )). Calculate (acquire) information related to the position of the substrate 2 (position information of the substrate 2 relative to the substrate holding table 53 or the substrate holding table 53T) from the position information of each position identification mark m, and store the result in the storage unit of the control device 24. 24a (Fig. 3) (step ST2).

Specifically, when two substrates 2 are placed on the two substrate holding tables 53, the substrate 2 held on the substrate holding table 53 on the left side of the central substrate conveying part 33C will be held relative to the substrate holding table 53. The data of the position correction amount is stored in the first correction data storage area KR1 of the storage unit 24a as information on the position of the substrate 2 . Similarly, the data of the position correction amount of the substrate 2 held on the substrate holding table 53 on the right side of the central substrate conveyance unit 33C is stored in the second correction data storage area KR2 . Furthermore, the data of the position correction amount of the substrate 2 held on the substrate holding table 53 on the left side of the right substrate conveyance part 33R with respect to the substrate holding table 53 is stored in the third correction data storage area KR3, and the data on the right side The position correction data of the substrate 2 held on the substrate holding table 53 is stored in the fourth correction data storage area KR4.

On the other hand, in the case of placing one substrate 2 on one substrate holding table 53T, the position correction amount of the substrate 2 held on the substrate holding table 53T of the central substrate transport unit 33C relative to the substrate holding table 53T The data of is stored in the first correction data storage region KR1 of the storage unit 24a as information related to the position of the substrate 2 . Similarly, the data of the position correction amount of the substrate 2 held on the substrate holding table 53T of the right substrate transport unit 33R with respect to the substrate holding table 53T is stored in the third correction data storage area KR3 .

After the above-mentioned step ST2 is completed, the control device 24 (component mounting operation control unit SR1) temporarily moves the moving table 52 forward to retract the electrode portion 2a of the substrate 2 from the position above the auxiliary table 64 (the mounting operation position) ( FIG. 11 ). (b). Step ST3 ), next, the mounting head 63 is lowered to move the component 4 toward the auxiliary table 64 (on the side of the position recognition camera 65 ) (the mounting operation position) (step ST4 ). Next, at this time, two position recognition cameras 65 image and recognize unillustrated position recognition marks of the component 4 ( FIG. 11( c )), and calculate (acquire) information related to the position of the component 4 (component 4 position information with respect to the mounting head 63 ), the position correction amount of the component 4 is obtained, and the result is stored in the storage unit 24 a (step ST5 ).

The control device 24 (the component mounting operation control unit SR1) stores the position information of the substrate 2 and the position information of the component 4 in the storage unit 24a as described above, then raises the mounting head 63 ( FIG. 12( a ), and then moves the The stage 52 is located at the "working position" again. Next, based on the information on the position of the substrate 2 (position correction amount of the substrate 2) and the information on the position of the component 4 (position correction amount of the component 4) stored in the storage unit 24a, ), so that the electrode portion (not shown) on the element 4 side and the electrode portion 2a on the substrate 2 side are vertically aligned to control the movement of the central substrate conveying portion 33C, and the substrate 2 is relative to the element mounting operation portion 22b (directly from Say, with respect to the positioning of element 4) (Fig. 12(b). Step ST6).

The control device 24 (component mounting operation control unit SR1 ), after positioning the substrate 2 relative to the component mounting operation unit 22b in this way, lowers the mounting head 63 and presses the component 4 sucked by the mounting head 63 against the ACF tape 3 on the substrate 2 And it is mounted on the board|substrate 2 (FIG.12(c). Step ST7). In addition, the pressing force of the mounting head 63 at this time is received by the auxiliary table 64 for component mounting. The control device 24 raises the mounting head 63 after mounting the component 4 on the substrate 2 (step ST8 ).

As shown in FIG. 8, FIG. 9, FIG. 11 and FIG. 12, the two substrate holding tables 53 (or one substrate holding table 53T) provided in the center substrate conveying part 33C (the same applies to the right substrate conveying part 33R) are respectively provided with The frame-shaped film-shaped partial support portion 54 has a horizontal portion 54 a extending in the X-axis direction behind the substrate holding table 53 (or the substrate holding table 53T). As shown in FIG. 2 and the like, the component 4 mounted on the substrate 2 by the component mounting operation part 22b protrudes from the substrate 2 with the thin film portion 4a in the state mounted on the substrate 2 . However, by providing the above-mentioned film-shaped portion supporting portion 54 on each substrate holding table 53 (or substrate holding table 53T), the element 4 is supported from below by the horizontal portion 54 a of the film-shaped portion supporting portion 54 in a state where the element 4 is mounted on the substrate 2 . Film-like portion 4a of element 4 protruding beyond substrate 2 . This prevents the thin film portion 4 a of the element 4 mounted on the substrate 2 from hanging down downward.

As shown in Fig. 13(a), (b) and Fig. 14(a), (b), the first component crimping operation part 22c (the same is true for the second component crimping operation part 22b) has There are two crimping heads 71 and two auxiliary tables 72 for component crimping work extending in the Y-axis direction below each crimping head 71 . The component crimping operation control unit SR2 ( FIG. 3 ) of the control device 24 controls the respective lifting operations of the crimping head 71 provided in the first component crimping operation part 22 c and the crimping head 71 provided in the second component crimping operation part 22 d ( FIG. 3 ). ).

Regarding the two substrates 2 placed on the two substrate holding tables 53 (or one substrate 2 placed on one substrate holding table 53T) included in the central substrate conveying unit 33C, the control device 24 (the component pressing operation control unit SR2 ) After the mounting operation of the component 4 by the mounting head 63 is completed, keep the Y-axis table 51 to the left along the second base part 32 (that is, to the side of the first component crimping operation part 22c in the horizontal direction ) moves so that the parts to which the ACF tapes 3 of the two substrates 2 placed on the two substrate holding tables 53 (or one substrate 2 placed on one substrate holding table 53T) are pasted are positioned between the two component crimping operations. The top of the auxiliary table 72 used (below the two crimping heads 71). At this time, the substrate holding table 53 (or the substrate holding table 53T) is moved based on the information on the position of the substrate 2 stored in the storage unit 24a, and the substrate 2 is positioned with respect to the first component crimping operation part 22c ( FIG. 13( ). a) or Figure 14(a)).

Specifically, when two substrates 2 are placed on the two substrate holding tables 53, the position read from the first correction data storage area KR1 is used for the substrate 2 held on the left substrate holding table 53. The data of the correction amount is used for positioning, and the substrate 2 held on the right substrate holding table 53 is positioned using the data of the position correction amount read from the second correction data storage area KR2 . Then, the two crimping heads 71 included in the first component crimping operation part 22c are lowered sequentially, and the components 4 mounted by the component mounting operation part 22b are crimped on the two substrates 2 (FIG. 15(a)→FIG. 15( b) → Fig. 15(c)). On the other hand, when one substrate 2 is placed on one substrate holding table 53T, the substrate 2 held by the substrate holding table 53T is positioned using the data of the position correction amount read from the first correction data storage area KR1. Then, the two crimping heads 71 included in the first component crimping operation part 22c are lowered sequentially, and the components 4 mounted by the component mounting operation part 22b are crimped on the two substrates 2 (FIG. 15(a)→FIG. 15( b) → Fig. 15(c)).

Similarly, with respect to two substrates 2 placed on the two substrate holding tables 53 (or one substrate 2 placed on one substrate holding table 53T) included in the right substrate conveying unit 33R, the control device 24 (component pressure bonding) The operation control part SR2) after the mounting operation of the component 4 by the mounting head 63 is completed, the Y-axis table 51 is kept unchanged and moves to the right along the second base part 32 (that is, to one side of the second component crimping operation part 22d). side) so that the parts on which the components 4 are mounted on the two substrates 2 placed on the two substrate holding tables 53 (or one substrate 2 placed on one substrate holding table 53T) are respectively positioned at the parts for the component crimping operation. Above the auxiliary table 72 (below the crimping head 71). Next, based on the information on the position of the substrate 2 acquired in step ST2, the substrate holding table 53 is moved to position the substrate 2 relative to the second component crimping operation part 22d ( FIG. 13( a ) or FIG. 14( a ). )).

Specifically, when two substrates 2 are placed on the two substrate holding tables 53, the position read from the third correction data storage area KR3 is used for the substrate 2 held on the left substrate holding table 53. The data of the correction amount is used for positioning, and the substrate 2 held on the substrate holding table 53 on the right is positioned using the data of the position correction amount read from the fourth correction data storage area KR4 . Then, the two crimping heads 71 included in the second component crimping operation part 22d are lowered sequentially, and the components 4 mounted by the component mounting operation part 22b are crimped on the two substrates 2 ( FIG. 15( a ) → FIG. 15 ( b) → Fig. 15(c)). On the other hand, when one substrate 2 is placed on one substrate holding table 53T, the substrate 2 held by the substrate holding table 53T is positioned using the data of the position correction amount read from the third correction data storage area KR3. Then, the two crimping heads 71 included in the second component crimping operation part 22d are lowered sequentially, and the components 4 mounted by the component mounting operation part 22b are crimped on the two substrates 2 ( FIG. 15( a ) → FIG. 15 ( b) → Fig. 15(c)).

In the crimping operation of the components 4 by the two crimping heads 71 respectively provided in the first component crimping operation part 22c and the second component crimping operation part 22d, two substrate holding tables 53 are installed and two substrates are simultaneously processed. 2, since the two substrate holding tables 53 are mounted on one moving table 52, the positioning of each substrate 2 with respect to the corresponding crimping head 71 and subsequent component crimping operations are sequentially performed with timing shifted. This operation will be described in detail with reference to FIGS. 16 and 17 .

The control device 24 (component crimping operation control unit SR2 ) first positions the parts of the two substrates 2 placed on the two substrate holding tables 53 on which the components 4 are mounted to the upper position of the auxiliary table 72 (the crimping operation position). (Step ST11 shown in the flowchart of FIG. 16 ). At this time, based on the information related to the position of the substrate 2 acquired in the above-mentioned component mounting operation and stored in the first correction data storage region KR1 (or the third correction data storage region KR3 ) of the storage unit 24a (on the left side The position correction amount data of the substrate 2 held on the substrate holding table 53 of the substrate) moves the moving table 52 . As a result, the substrate 2 on the left side is positioned with respect to the corresponding crimp head 71 ( FIG. 17( a ). Step ST12 .

After the control device 24 has positioned the substrate 2 on the left side, the crimping head 71 on the left side is then lowered, the substrate 2 is clamped between the auxiliary table 72 and the crimping head 71, and the component 4 is positioned relative to the substrate 2 on the left side. Crimping (Fig. 17(b). Step ST13). Next, while maintaining the clamped state, the substrate holding table 53 on the left is slightly lowered to release the holding of the substrate 2 by the substrate holding table 53 ( FIG. 17( c ). Step ST14 .

Thus, the mobile table 52 can be moved independently of the left substrate 2, and then based on the second correction data storage area KR2 (or the fourth correction data storage area KR2) (or the fourth correction data storage area KR2) which is also obtained in the above-mentioned component mounting operation and stored in the storage unit 24a, it can be moved independently of the left substrate 2. The information related to the position of the substrate 2 in the area KR4) (the data of the position correction amount of the substrate 2 held on the substrate holding table 53 on the right side) moves the moving stage 52 to move the substrate 2 on the right side relative to the corresponding The crimping head 71 is positioned (step ST15).

After the control device 24 has positioned the substrate 2 on the right, it then lowers the crimping head 71 on the right, clamps the substrate 2 between the auxiliary table 72 and the crimping head 71, and places the component 4 relative to the substrate 2 on the right. Crimp (Fig. 17(d). Step ST16). After the manufacturing device 24 (component pressure bonding operation control unit SR2 ) press-bonds the component 4 to the right board 2 , it raises the left board holding table 53 to hold the board 2 , and then raises the left pressure head 71 ( FIG. 17( e ). Step ST17 ), and then raise the crimping head 71 on the right side ( FIG. 17( f ). Step ST18 . Thus, the crimping operation of the component 4 relative to the two substrates 2 is completed.

The control device 24 (component crimping operation control unit SR2 ) moves the moving table 52 forward along the Y-axis table 51 after performing the crimping operation of the component 4 relative to the two substrates 2 through the above-mentioned steps. The table 52 returns to the "substrate delivery position".

In addition, the positioning of the crimping head 71 with respect to the substrates 2 placed on the two substrate holding tables 53 and the crimping of the components 4 by the crimping head 71 may not be performed separately with respect to the left and right substrates 2 as described above, but simultaneously. . In this case, the positional displacement of the left substrate 2 with respect to the left substrate holding table 53 and the positional displacement of the right substrate 2 with respect to the right substrate holding table 53 acquired during the component mounting operation are calculated. The average value of , the left and right substrate holding stages 53 are simultaneously positioned relative to the respective crimping heads 71 . Then, the element 4 is simultaneously crimped to the substrate 2 by the crimp head 71 . In this case, the positioning accuracy is slightly lower than in the case of separate positioning, but the tact time can be shortened.

In FIG. 1 , the substrate delivery unit 23 has two substrate delivery stages 23 s on the left side (upstream process side) and right side (downstream process side). The two left and right substrate transfer stations 23s are provided so as to be able to move up and down with respect to the right base 11c, and the first component crimping operation part 22c or the second component crimping operation part 22d is placed on the two substrate transfer tables 23s. The two substrates 2 with the components 4 crimped. The two substrates 2 placed on the two substrate delivery tables 23 s are conveyed to another device installed on the downstream side of the component mounting device 1 by a substrate carrying-out means (not shown).

As shown in FIG. 18 , the substrate delivery table 23s on the left is fixed to the right base 11c, and the substrate delivery table 23s on the right is movable in the X-axis direction on the right base 11c. In the case of performing component mounting operations on small-sized substrates 2, the interval between the two substrate transfer stations 23s is set to the first interval capable of receiving two small-sized substrates 2 without interfering with each other (Fig. 18(a)), or the second interval set to be able to receive two large-sized substrates 2 without interfering with each other ( FIG. 18( b )).

In FIG. 11 , a movable base 81 extending in the X-axis direction is provided in the area in front of the base 11 in the range of the left base 11a, the center base 11b, and the right base 11c. On this moving base 81, a left board transfer unit 82a, a central board transfer unit 82b, and a right board transfer unit 82c are provided in this order from the left.

As shown in FIG. 19, the left substrate transfer part 82a, the central substrate transfer part 82b, and the right substrate transfer part 82c respectively have a base part 91 provided to move freely in the X-axis direction relative to the movable base 81 and a base part 91 provided on the substrate 91. Two arm units 92. Each arm unit 92 includes an arm base 93 fixed to the base 91 and two arms 94 extending horizontally rearward from the arm base 93 . Each arm 94 is provided with a plurality of suction pads 95 whose suction surfaces face downward. Each arm unit 92 is capable of vacuum-adsorbing one substrate 2 by a total of four suction pads 95 provided on two arms 94 .

When the substrate 2 placed on the substrate receiving table 21s of the substrate receiving unit 21 is picked up by the left substrate transfer unit 82a, the suction pad 95 of the arm 94 on the right side of the left substrate transfer unit 82a of the control device 24 is located on both sides. Among the substrate receiving stages 21s, the substrate receiving stage 21s is raised and lowered while being fixed above the substrate receiving stage 21s on the right side of the left base 11a. Here, the interval in the X-axis direction of the two arms 94 provided in each of the left substrate transfer unit 82a, the central substrate transfer unit 82b, and the right substrate transfer unit 82c is set to the first interval. When the substrate receiving table 21s is set at the first interval, the substrate receiving table 21s on the right is located under the suction pad 95 of the right arm 94, and the substrate receiving table 21s on the right is located on the suction pad 95 of the left arm 94. Below the pad 95, when two substrates 2 are placed on the two substrate receiving stages 21s, the two arms 94 can pick up two substrates 2 at the same time.

The arm 94 picks up the substrate 2 placed on the substrate holding table 36 (or the substrate holding table 36T) of the left substrate transport part 33L, or places the substrate 2 picked up by the arm 94 on the substrate holding table 36 (or the substrate holding table 36T). 36T), the control device 24 positions the suction pads 95 of the two arms 94 above the two substrate holding tables 36 included in the left substrate transport unit 33L (or makes one of the two arms 94 The suction pad 95 of the arm 94 moves up and down the two substrate holding tables 36 (or one substrate holding table 36T) while the adsorption pad 95 of the arm 94 is located above one of the substrate holding tables 36T.

Then, the arm 94 picks up the substrate 2 held on the substrate holding table 53 (or the substrate holding table 53T) of the central substrate conveyance part 33C or the right substrate conveyance part 33R, or places the substrate 2 picked up by the arm 94 on the substrate. In the case of the holding table 53 (or the substrate holding table 53T), the control device 24 positions the suction pads 95 of the two arms 94 between the two substrate holding tables 53 included in the central substrate conveyance part 33C or the right substrate conveyance part 33R. In the upper state or in the state where the suction pad 95 of one arm 94 of the two arms 94 is positioned above one substrate holding table 53T (or the suction pad 95 of one arm 94 of the two arms 94 is positioned on a substrate holding table 53T above the table 53T), the two substrate holding tables 53 (or one substrate holding table 53T) are raised and lowered.

The control device 24 controls the movement of the left substrate transfer part 82a, the central substrate transfer part 82b, and the right substrate transfer part 82c along the moving base 81 to the X-axis direction, and the suction operation of each arm unit 92 to the substrate 2 via the suction pad 95. (image 3). Specifically, the control device 24 operates the left substrate transfer unit 82a to transfer the substrate 2 from the substrate receiving unit 21 to the left substrate transfer unit 33L, and operates the central substrate transfer unit 82b to transfer the substrate 2 from the left substrate transfer unit 33L. 33L is transported to the center substrate transport unit 33C or the right substrate transport unit 33R. That is, the substrate 2 to which the ACF tape 3 is pasted by the ACF pasting operation part 22a is separately placed on the two substrate holding tables 53 (or one substrate holding table 53T) provided in the central substrate conveying part 33C and the right substrate conveying part 33R. Two substrate holding tables 53 (or one substrate holding table 53T) are provided. Then, the control device 24 operates the right substrate transfer unit 82 c to transfer the substrate 2 from the central substrate transfer unit 33C or the right substrate transfer unit 33R to the substrate transfer unit 23 .

Next, the operation of each part when the component mounting apparatus 1 performs component mounting work on the substrate 2 will be described. As shown in FIG. 20 , the control device 24 sets the respective possible positions of the left substrate transfer part 82a, the central substrate transfer part 82b and the right substrate transfer part 82c as: the front position of the substrate receiving part 21 (the first position P1) , the front position of the ACF bonding operation part 22a (second position P2), the front position of the first component crimping operation part 22c (third position P3), the front position of the component mounting operation part 22b (fourth position P4), the The front position (fifth position P5 ) of the two-component crimping operation part 22 d and the front position (sixth position P6 ) of the board transfer part 23 .

In this component mounting device 1, as described above, the component mounting operation can be performed on the substrate 2 of two sizes, and in the following description, for convenience, the operation mode of performing component mounting on the small-sized substrate 2 is referred to as the first mode. In the first mode, the work mode in which components are mounted on a large-sized substrate 2 is called a second mode. The selection of whether to perform component mounting work in the first mode or in the second mode in the component mounting apparatus 1 is performed by the operator OP operating a mode selection switch 90 ( FIG. 3 ) connected to the control device 24 .

When the first mode is set, the substrate receiving section 21 simultaneously receives two small-sized substrates 2 conveyed from the upstream process side with the two substrate receiving stages 21s set at a first interval. On the other hand, when the second mode is set, the substrate receiving section 21 simultaneously receives two large-sized substrates conveyed from the upstream process side in a state where the two substrate receiving stages 21s are set at the second interval. 2.

Similarly, when the first mode is set, the substrate transfer unit 23 simultaneously receives substrates from the central substrate transfer unit 33C or the right substrate transfer unit 33R with the two substrate transfer stations 23s set at a first interval. Two substrates 2 are delivered to the downstream process side. When the second mode is set, the substrate delivery unit 23 transfers from the central substrate transfer unit 33C or The right substrate conveying unit 33R receives one substrate and delivers it to the downstream process side.

When the operator OP selects the first mode, first, the two substrate holding stages 36 are mounted on the moving stage 35 of the left substrate conveying part 33L, and the two substrate holding stages 53 are mounted on the central substrate conveying part 33C. and the right substrate transport unit 33R on the respective moving stages 52 . Next, the mode selection switch 90 is operated to select the first mode.

After the first mode is selected by the mode selection switch 90, the control device 24 makes the left substrate transfer part 82a at the first position P1, the central substrate transfer part 82b at the second position P2, and the right substrate transfer part 82c at the fourth position. In position P4, the central substrate conveyance part 33C is positioned in front of the component mounting operation part 22b, and the right substrate conveyance part 33R is positioned in front of the second component crimping operation part 22d. Next, the interval between the two substrate receiving stations 21s of the substrate receiving section 21 and the interval between the two substrate transferring stations 23s of the substrate transferring section 23 are both set to the first interval (not changed hereafter). After the two substrate receiving stations 21s receive the two small-sized substrates 2 transported from the device on the upstream process side (substrate receiving process), the two received two substrates are picked up by the two arms 94 of the left substrate transfer part 82a 2 (Fig. 21(a)).

After the control device 24 picks up two substrates 2 from the two substrate receiving tables 21s of the substrate receiving section 21 by the two arms 94 of the left substrate transferring section 82a, the left substrate transferring section 82a is positioned at the second position P2, The central substrate transfer unit 82b is located at the fourth position P4, and the right substrate transfer unit 82c is located at the sixth position P6, so that the two substrates 2 picked up by the left substrate transfer unit 82a are placed and held on the left side substrate transfer unit 33L. Two substrate holding stages 36 ( FIG. 21( b ). Substrate transfer process). Next, the moving table 35 of the left substrate conveyance unit 33L is moved to the “working position”, and the ACF bonding operation of the two substrates 2 by the ACF bonding operation unit 22 a is performed ( FIG. 21( c )). In addition, during this period, two new substrates 2 are placed on the two substrate receiving tables 21 s of the substrate receiving unit 21 .

After the control device 24 has executed the ACF pasting operation of the two substrates 2 by the ACF pasting operation part 22a, the moving table 35 of the ACF left substrate transport part 33L is moved to the "substrate transfer position", and then the left substrate transfer part 82a At the first position P1, the central substrate transfer part 82b is located at the second position P2, and the right substrate transfer part 82c is located at the fourth position P4. Next, use the two arms 94 of the left substrate transfer part 82a to pick up the two substrates 2 on the two substrate receiving tables 21s of the substrate receiving part 21, and use the two arms 94 of the central substrate transfer part 82b to pick up the left substrate transport part. Two substrates 2 on 33L (Fig. 22(a)).

The control device 24 uses the two arms 94 of the left substrate transfer part 82a to pick up two substrates 2 from the two substrate receiving tables 21s of the substrate receiving part 21, and uses the two arms 94 of the central substrate transfer part 82b to pick up the left substrate transport part. Two substrates 2 on the two substrate holding tables 36 of 33L, then make the left substrate transfer part 82a be located at the second position P2, make the central substrate transfer part 82b be located at the fourth position P4, make the right substrate transfer part 82c be located at the second position Six positions P6, whereby the two substrates 2 picked up by the two arms 94 of the left substrate transfer part 82a are placed and held on the two substrate holding tables 36 of the left substrate transfer part 33L, and the two substrates 2 picked up by the central substrate transfer part The two substrates 2 picked up by the two arms 94 of 82b are placed and held on the two substrate holding tables 53 of the central substrate conveying unit 33C ( FIG. 22( b )).

Next, the control device 24 positions the moving table 35 of the left substrate conveying unit 33L at the “working position” and executes the ACF bonding operation of the two substrates 2 by the ACF bonding unit 22a, and on the other hand, moves the central substrate conveying unit 33C The table 52 is moved to the "working position", so that the left substrate 2 among the two substrates 2 on the two substrate holding tables 53 is located above the auxiliary table 64 for component mounting operations, so that the component mounting operation part 22b is aligned to the left. Component mounting operation on a square substrate 2 ( FIG. 22( c ). Component mounting process).

The control device 24 moves the central substrate conveyance part 33C to the left after performing the component mounting operation of the above-mentioned component mounting operation part 22b on the left substrate 2, and places the substrate on the two substrate holding tables 53 of the central substrate conveyance part 33C. The right substrate 2 among the two substrates 2 is located above the auxiliary table 64 for component mounting operations, so that the component mounting operation part 22b performs component mounting operations on the right substrate 2 (Figure 23 (a). Component mounting process). In addition, during this period, two new substrates 2 are placed on the two substrate receiving tables 21 s of the substrate receiving unit 21 .

After the control device 24 executes the component mounting operation by the above-mentioned component mounting operation part 22b, the central substrate conveyance part 33C is moved to the left (the side of the first component crimping operation part 22c) without changing, and the The substrate 2 placed on each substrate holding table 53 is transported to the first component crimping operation section 22c, so that the two substrates 2 placed on the two substrate holding tables 53 are located above the two auxiliary tables 72 for component crimping operation. , thereby performing the component crimping operation of the first component crimping operation part 22 c on the two substrates 2 ( FIG. 23( b ). Component crimping process). And at the same time, the left substrate transfer part 82a is positioned at the first position P1, and the two substrates placed on the two substrate receiving tables 21s of the substrate receiving part 21 are picked up by the two arms 94 of the left substrate transfer part 82a. 2. On the other hand, make the moving table 35 of the left substrate conveying part 33L located at the "substrate handover position" and in conjunction with this, position the central substrate transfer part 82b at the second position P2, using the two arms of the central substrate transfer part 82b 94 picks up the two substrates 2 on the two substrate holding tables 36 of the left substrate transport unit 33L. Furthermore, the right board conveyance part 33R is located in the front position of the component mounting operation part 22b, and the right board transfer part 82c is located in the 4th position P4.

After the above operations are completed, the control device 24 sets the right substrate transfer unit 82c at the sixth position P6, then positions the central substrate transfer unit 82b at the fourth position P4, and transfers the two substrate holding platforms 36 from the left substrate transfer unit 33L to the sixth position P6. The two substrates 2 picked up from the top are placed and held on the two substrate holding tables 53 of the right substrate conveying part 33R, and by placing the left substrate transfer part 82a at the second position P2, the two substrates from the substrate receiving part 21 are placed and held. The two substrates 2 picked up by the substrate receiving table 21 s are placed and held on the two substrate holding tables 36 of the left substrate transport unit 33L ( FIG. 23( c )).

After the control device 24 places the substrate 2 on the two substrate holding tables 36 of the right substrate transporting part 33R and the two substrate holding tables 53 of the left substrate transporting part 33L, the moving stage 35 of the left substrate transporting part 33L Located in the "working position" and performing the ACF pasting operation of the ACF pasting operation part 22a on the two substrates 2, on the other hand, the moving table 52 of the right substrate conveying part 33R is moved to the "working position" to hold the two substrates Among the two substrates 2 placed on the table 53, the right substrate 2 is located above the auxiliary table 64 for component mounting operation, so that the component mounting operation of the right substrate 2 by the component mounting operation part 22b is performed (FIG. 24(a). ). Component mounting process).

After the control device 24 has executed the ACF pasting operation by the above-mentioned ACF pasting operation part 22a and the component mounting operation by the component mounting operation part 22a, the right board conveying part 33R is moved to the right, and the right board conveying part 33R is moved to the right. Among the two substrates 2 placed on the two substrate holding tables 53, the left substrate 2 is located above the auxiliary table 64 for component mounting operation, so that the component mounting operation of the component mounting operation part 22b on the left substrate 2 is performed. (Fig. 24(b). Component mounting process). In addition, during this period, two new substrates 2 are placed (carried in) on the two substrate receiving stages 21 s of the substrate receiving unit 21 .

After executing the component mounting operation by the component mounting operation part 22b, the control device 24 moves the right substrate conveyance part 33R to the right (side of the second component crimping operation part 22d) without changing, and will The two substrates 2 placed on the two substrate holding tables 53 are transported to the second component crimping work section 22d, and the two substrates 2 placed on the two substrate holding tables 53 are positioned on the auxiliary table for the two component crimping operations. 72, thereby performing the component crimping operation of the second component crimping operation part 22d on the two substrates 2 (FIG. 24(c). Component crimping process). And at the same time, the left substrate transfer part 82a is positioned at the first position P1, and the two substrates placed on the two substrate receiving tables 21s of the substrate receiving part 21 are picked up by the two arms 94 of the left substrate transfer part 82a. 2. On the other hand, make the moving table 35 of the left substrate conveying part 33L located at the "substrate handover position" and in conjunction with this, position the central substrate transfer part 82b at the second position P2, using the two arms of the central substrate transfer part 82b 94 picks up the two substrates 2 on the two substrate holding tables 36 of the left substrate transport unit 33L. Then, move the moving table 52 of the central substrate conveyance part 33C to the "substrate delivery position" and position the central substrate conveyance part 33C at the front position of the component mounting operation part 22b, and transfer the substrate by the right side located in front of the component mounting operation part 22b. The two arms 94 of the section 82 c pick up the two substrates 2 on the two substrate holding tables 36 of the central substrate transport section 33C ( FIG. 24( c )).

After the above operations are completed, the control device 24 positions the right substrate transfer unit 82c at the sixth position P6 and places the two substrates 2 on the two substrate transfer stations 23s of the substrate transfer unit 23, and transfers the central substrate The part 82b is located at the fourth position P4, and the two substrates 2 picked up from the two substrate holding tables 36 of the left substrate transporting part 33L are placed and held on the two substrate holding tables 53 of the central substrate transporting part 33C, and passed With the left substrate transfer unit 82a positioned at the second position P2, the two substrates 2 picked up from the two substrate receiving tables 21s of the substrate receiving unit 21 are placed and held on the two substrate holding tables 36 of the left substrate transport unit 33L. (Fig. 25(a)).

After the control device 24 places and holds the substrate 2 on the two substrate holding tables 36 of the central substrate transporting part 33C and the two substrate holding tables 36 of the left substrate transporting part 33L, the moving stage of the left substrate transporting part 33L 35 is located in the "working position" and executes the ACF pasting operation of the two substrates 2 by the ACF pasting operation part 22a. The left substrate 2 is located above the auxiliary table 64 for component mounting operation, and the component mounting operation part 22b performs component mounting operation on the left substrate 2 ( FIG. 25( b ). Component mounting process).

After the control device 24 executes the ACF pasting operation by the above-mentioned ACF pasting operation part 22a and the component mounting operation by the component mounting operation part 22a, it moves the central board conveying part 33C to the left, so that both sides of the central board conveying part 33C Among the two substrates 2 placed on each substrate holding table 53, the right substrate 2 is located above the auxiliary table 64 for component mounting operation, so that the component mounting operation of the component mounting operation part 22b on the right substrate 2 is performed (Fig. 25(c). Component mounting process). In addition, during this period, two new substrates 2 are placed on the two substrate receiving tables 21 s of the substrate receiving unit 21 .

After the control device 24 executes the component mounting operation by the above-mentioned component mounting operation part 22b, the central substrate conveyance part 33C is moved to the left (the side of the first component crimping operation part 22c) without changing, and the The two substrates 2 placed on the two substrate holding tables 53 are transported to the first component crimping operation part 22c, and the two substrates 2 placed on the two substrate holding tables 53 are positioned on the auxiliary table 72 for the two component crimping operations. , so as to perform the component crimping operation of the first component crimping operation part 22c on the two substrates 2 ( FIG. 26( a ). Component crimping process). And at the same time, the left substrate transfer part 82a is positioned at the first position P1, and the two substrates placed on the two substrate receiving tables 21s of the substrate receiving part 21 are picked up by the two arms 94 of the left substrate transfer part 82a. 2. On the other hand, make the moving table 35 of the left substrate conveying part 33L located at the "substrate handover position" and in conjunction with this, position the central substrate transfer part 82b at the second position P2, using the two arms of the central substrate transfer part 82b 94 picks up the two substrates 2 on the two substrate holding tables 36 of the left substrate transport unit 33L. And move the moving table 52 of the right board conveying part 33R to the "substrate delivery position" and make the right board conveying part 33R located in front of the component mounting operation part 22b, and utilize the right hand side already located in front of the component mounting operation part 22b. The two arms 94 of the substrate transfer unit 82 c pick up the two substrates 2 on the right substrate transport unit 33R ( FIG. 26( a )).

After the above operations are completed, the control device 24 positions the right substrate transfer unit 82c at the sixth position P6 and places two substrates 2 on the two substrate transfer stations 23s of the substrate transfer unit 23, and makes the central substrate transfer unit 82b Located at the fourth position P4, the two substrates 2 picked up from the substrate holding table 36 of the left substrate conveying part 33L are placed and held on the two substrate holding tables 53 of the right substrate conveying part 33R, so that the left substrate transfer part 82a is located at the second position P2, so that the two substrates 2 picked up from the two substrate receiving tables 21s of the substrate receiving part 21 are loaded and held on the two substrate holding tables 36 of the left substrate conveying part 33L (Fig. 26(b) )).

The state of this FIG. 26(b) is exactly the same as the state of FIG. 23(c). Therefore, by repeating the steps of FIG. 23(c) to FIG. The substrate 2 undergoes a series of operations from mounting the components 4 on the substrate 2 until the substrate transfer unit 23 transfers the substrate 2 to the outside, thereby performing continuous substrate production.

On the other hand, when the operator OP selects the second mode, first, one substrate holding table 36T is attached to the moving table 35 of the left substrate conveyance part 33L, and one substrate holding table 53T is also attached to the center substrate. The transport unit 33C and the right substrate transport unit 33R are placed on the respective moving stages 52 . Next, the mode selection switch 90 is operated to select the second mode.

After the second mode is selected by the mode selection switch 90, the control device 24 makes the left substrate transfer part 82a at the first position P1, the central substrate transfer part 82b at the second position P2, and the right substrate transfer part 82c at the fourth position. The position P4 is such that the central substrate conveying unit 33C is positioned in front of the component mounting operation portion 22b, and the right substrate conveying portion 33R is positioned in front of the second component crimping operation portion 22d. Next, the interval between the two substrate receiving tables 21s of the substrate receiving section 21 is set to the second interval, and the two substrate receiving tables 21s of the substrate receiving section 21 receive two large-sized paper sheets transported from the device on the upstream process side. After the substrate 2 (substrate receiving process), the right substrate 2 among the received two substrates 2 is picked up by the right arm 94 of the left substrate transfer part 82 a ( FIG. 27( a )).

After the control device 24 picks up the substrate 2 from the substrate receiving table 21s on the right side of the substrate receiving unit 21 by the arm 94 on the right side of the left substrate transferring unit 82a, the left substrate transferring unit 82a is positioned at the second position P2, and the center The substrate transfer unit 82b is located at the fourth position P4, and the right substrate transfer unit 82c is located at the sixth position P6, so that the substrate 2 picked up by the left substrate transfer unit 82a is placed and held on the substrate holding table of the left substrate transfer unit 33L 36T (Fig. 27(b). Substrate transfer process). During this period, the substrate receiving stage 21s on the left side of the substrate receiving section 21 in the state where the substrate 2 is placed is moved to the right, and the interval between the two substrate receiving stages 21s is set to the first interval ( FIG. 27( b ). )). Next, the moving table 35 of the left substrate conveying unit 33L is moved to the “working position”, and the ACF bonding operation of the ACF bonding operation unit 22 a to the substrate 2 is performed ( FIG. 27( c )).

After the control device 24 executes the ACF pasting operation of the substrate 2 by the ACF pasting operation part 22a, the moving table 35 of the ACF left substrate transport part 33L moves to the "substrate transfer position", and then the left substrate transfer part 82a is positioned at the first position. In the first position P1, the central substrate transfer part 82b is located in the second position P2, and the right substrate transfer part 82c is located in the fourth position P4. Next, use the left arm 94 of the left substrate transfer part 82a to pick up the substrate 2 on the substrate receiving table 21s on the left side of the substrate receiving part 21, and use the right arm 94 of the central substrate transfer part 82b to pick up the left substrate and transport it. The substrate 2 on the portion 33L ( FIG. 28( a )).

The control device 24 picks up the substrate 2 on the substrate receiving table 21 s on the left side of the substrate receiving section 21 by using the left substrate transfer part 82 a, and picks up the substrate on the substrate holding table 36T of the left substrate transport part 33L by using the central substrate transfer part 82 b. After 2, make the left side substrate transfer part 82a be positioned at the second position P2, make the center substrate transfer part 82b be positioned at the fourth position P4, make the right side substrate transfer part 82c be positioned at the sixth position P6, thereby, will be positioned at the sixth position P6 by the left side substrate transfer part. The substrate 2 picked up by 82a is placed and held on the substrate holding table 36T of the left substrate transfer unit 33L, and the substrate 2 picked up by the central substrate transfer unit 82b is placed and held on the substrate holding table 53T of the central substrate transfer unit 33C ( FIG. 28 (b)). And, during this period, the substrate receiving table 21s on the left side of the substrate receiving unit 21 is moved to the left, and the interval between the two substrate receiving tables 21s is set as the second interval.

Next, the control device 24 positions the moving stage 35 of the left substrate conveying part 33L at the "working position" to execute the ACF pasting operation of the substrate 2 by the ACF pasting operation part 22a. On the other hand, the moving stage 52 of the central substrate conveying part 33C Move to the "working position" to position the substrate 2 above the auxiliary table 64 for component mounting operation, and perform the component mounting operation on the substrate 2 by the component mounting operation part 22b ( FIG. 28( c ). Component mounting process). In addition, during this period, two new large-sized substrates 2 are placed on the substrate receiver 21 .

After executing the component mounting operation on the substrate 2 by the component mounting operation part 22b, the control device 24 moves the central substrate conveyance part 33C to the left (to the side of the first component pressure bonding operation part 22c) without changing, and moves the The substrate 2 held on the substrate holding table 53T is transported to the first component pressure-bonding operation part 22c, and the substrate 2 held on the substrate holding table 53T is positioned on one side of the two auxiliary tables 72 (herein, left) above the auxiliary table 72, thereby performing the component crimping work of the first component crimping operation part 22c on the substrate 2 ( FIG. 29( a ). Component crimping process). And at the same time, the left substrate transfer part 82a is positioned at the first position P1, and the substrate placed on the substrate receiving table 21s on the right side of the substrate receiving part 21 is picked up by the arm 94 on the right side of the left substrate transfer part 82a. 2. On the other hand, make the moving table 35 of the left substrate conveying part 33L located at the "substrate transfer position" and coordinate with this to locate the central substrate transfer part 82b at the second position P2, and use the left side of the central substrate transfer part 82b The arm 94 picks up the substrate 2 on the left substrate transport unit 33L. Furthermore, the right board transfer part 82c is positioned at the fourth position P4 ( FIG. 29( a )).

After the above operations are completed, the control device 24 positions the right board transfer unit 82c at the sixth position P6, and positions the right board transfer unit 33R at the front position of the component mounting operation unit 22b, and then positions the central board transfer unit 82b at the fourth position. position P4, thereby placing and holding the substrate 2 picked up from the left substrate conveying part 33L on the substrate holding table 53T of the right substrate conveying part 33R, and making the left substrate transfer part 82a located at the second position P2, so that the substrate 2 picked up from the left substrate conveying part 33L The substrate 2 picked up by the substrate receiving unit 21 is placed and held on the substrate holding table 36T of the left substrate transport unit 33L ( FIG. 29( b )).

After the control device 24 holds the substrate 2 on the substrate holding table 53T of the right substrate conveying unit 33R and the substrate holding table 36T of the left substrate conveying unit 33L, respectively, the moving table 35 of the left substrate conveying unit 33L is positioned at the “working position”. ” and execute the ACF pasting operation of the substrate 2 by the ACF pasting operation unit 22a, and on the other hand, move the moving table 52 of the right substrate transport unit 33R to the “working position” so that the substrate 2 placed on the substrate holding table 53T is positioned The component mounting operation part 22b executes the component mounting operation on the substrate 2 above the auxiliary table 64 for the component mounting operation ( FIG. 29( c ). Component mounting process).

After the control device 24 executes the ACF pasting operation by the above-mentioned ACF pasting operation part 22a and the component mounting operation by the component mounting operation part 22a, it keeps the right board conveying part 33R to the right (the second component press-bonding operation). One side of the operation part 22d) moves, and the substrate 2 held on the substrate holding table 53T is transported to the second component crimping operation part 22d, so that the substrate 2 placed on the substrate holding table 53T is located on one side (here, the left side). ) above the auxiliary table 72 for the component crimping operation, thereby performing the component crimping operation of the second component crimping operation part 22d on the substrate 2 ( FIG. 30( a ). Component crimping process). And at the same time, the left substrate transfer part 82a is positioned at the first position P1, and the substrate placed on the substrate receiving table 21s on the left side of the substrate receiving part 21 is picked up by the arm 94 on the left side of the left substrate transfer part 82a. 2. On the other hand, make the moving table 35 of the left substrate transfer part 33L located at the "substrate transfer position" and coordinate with this to locate the central substrate transfer part 82b at the second position P2, and use the right side of the central substrate transfer part 82b. The arm 94 picks up the substrate 2 on the substrate holding table 36T of the left substrate transport unit 33L. Then, move the moving table 52 of the central substrate conveyance part 33C to the "substrate delivery position" and position the central substrate conveyance part 33C at the front position of the component mounting operation part 22b, and transfer the substrate by the right side located in front of the component mounting operation part 22b. The arm 94 on the right side of the section 82 c picks up the substrate 2 on the substrate holding table 53T of the central substrate transport section 33C ( FIG. 30( a )).

After the above work is completed, the control device 24 positions the right substrate transfer unit 82c at the sixth position P6 and places the substrate 2 picked up by the right arm 94 on the right side of the substrate transfer unit 23 set at the second interval. The substrate transfer table 23s, on the other hand, places the central substrate transfer part 82b at the fourth position P4, and places and holds the substrate 2 picked up from the substrate holding table 36T of the left substrate transfer part 33L on the center substrate transfer part 33C. The substrate holding table 53T, and the left substrate transfer part 82a is located at the second position P2, so that the substrate 2 picked up from the substrate receiving table 21s on the left side of the substrate receiving part 21 is placed and held on the left side of the substrate conveying part 33L. The substrate holding table 36T ( FIG. 30( b )).

After the control device 24 places the substrate 2 on the substrate holding table 53T of the central substrate conveying part 33C and the substrate holding table 36T of the left substrate conveying part 33L, respectively, the moving stage 35 of the left substrate conveying part 33L is positioned at the "working position". ” and execute the ACF pasting operation of the substrate 2 by the ACF pasting operation part 22a, and on the other hand, move the moving table 52 of the central substrate conveying part 33C to the “working position” so that the substrate 2 on the substrate holding table 53T is located in the component mounting operation The component mounting operation of the component mounting operation part 22b on the substrate 2 is performed above the auxiliary table 64 used ( FIG. 30( c ). Component mounting process). And, during this period, the substrate transfer stage 23s on the right side of the substrate transfer section 23 is moved to the right, and the interval between the two substrate transfer stages 23s is set to the second interval ( FIG. 30( c )).

After the control device 24 executes the ACF pasting operation by the above-mentioned ACF pasting operation part 22a and the component mounting operation by the component mounting operation part 22b, the central substrate conveying part 33C is turned to the left without changing (the first component pressure-bonding operation). part 22c) to move the substrate 2 held on the substrate holding table 53T to the first component crimping operation part 22c so that the substrate 2 placed on the substrate holding table 53T is located on one side (here, the right side) Above the auxiliary table 72 for the component crimping operation, the component crimping operation of the first component crimping operation part 22c on the substrate 2 is performed ( FIG. 31( a ). Component crimping process). And at the same time, the left substrate transfer part 82a is positioned at the first position P1, and the substrate placed on the substrate receiving table 21s on the right side of the substrate receiving part 21 is picked up by the arm 94 on the right side of the left substrate transfer part 82a. 2. On the other hand, make the moving table 35 of the left substrate conveying part 33L located at the "substrate transfer position" and coordinate with this to locate the central substrate transfer part 82b at the second position P2, and use the left side of the central substrate transfer part 82b The arm 94 picks up the substrate 2 on the substrate holding table 36T of the left substrate transport unit 33L ( FIG. 31( a )).

After the above operation is completed, the control device 24 positions the right substrate transfer unit 82c at the sixth position P6 and places the substrate 2 picked up by the left arm 94 on the left substrate delivery table 23s of the substrate delivery unit 23, and, With the central substrate transfer unit 82b at the fourth position P4, the substrate 2 picked up from the substrate holding table 36T of the left substrate transfer unit 33L is placed on the substrate holding table 53T of the right substrate transfer unit 33R, and the left substrate transfer unit 82 a is located at the second position P2 , and the substrate 2 picked up from the substrate receiving table 21 s on the right side of the substrate receiving unit 21 is placed on the substrate holding table 36T of the left substrate transport unit 33L ( FIG. 31( b )).

The state in FIG. 31( b ) is exactly the same as the state in FIG. 29( b ). Therefore, by repeating the steps in FIG. 29( b ) to FIG. Continuous substrate production is performed through a series of operations from mounting the components 4 on the substrate 2 to carrying out to the substrate transfer unit 23 .

As described above, the component mounting apparatus 1 of the present embodiment includes, in addition to the component mounting portion 22 for mounting components on the substrate 2, the substrate receiving portion 21 that sets the interval between two substrate receiving stages 21s to Receive two small-sized substrates 2 transported from the upstream process side at the first interval, or set the interval between the two substrate receiving stations 21s to a second interval greater than the first interval to receive the substrates 2 transported from the upstream process side. Two large-sized substrates 2 whose size is larger than the small-sized substrate 2; and the left substrate transfer part 82a, which transfers the small-sized or large-sized substrate 2 received by the substrate receiving part 21 to the component mounting part 22, the left The square substrate transfer section 82a transfers the two small-sized substrates 2 received by the substrate receiving section 21 to the component mounting section 22 at the same time when the substrate receiving section 21 receives two small-sized substrates 2, and places the two small-sized substrates 2 on the substrate receiving section 21. When receiving two large-sized substrates 2 , the receiving unit 21 transfers the two large-sized substrates 2 received by the substrate receiving unit 21 to the component mounting unit 22 one by one.

In addition, the component mounting unit 22 is provided with a left board conveying unit 33L as a board holding unit, which holds two small-sized boards 2 simultaneously transferred by the left board transfer unit 82 a or one board transferred by the left board transfer unit 82 a. Large-sized substrates 2 transferred one by one; ACF pasting unit 22a (adhesive member pasting unit) that sticks ACF tape 3 as an adhesive member to the substrate held on the left board transport unit 33L 2; the component mounting operation part 22b, which mounts the component 4 to the substrate 2 on which the ACF tape 3 has been pasted by the ACF pasting operation part 22a; and the component crimping operation part (the first component crimping operation part 22c and the second component crimping operation part 22d), which crimps the component 4 mounted by the component mounting operation part 22b to the substrate 2 on which the component 4 is mounted on the component mounting operation part 22b, and the left substrate conveyance part 33L can selectively mount while holding two small The first substrate holding table (two substrate holding tables 36 ) for a substrate 2 of small size or the second substrate holding table (one substrate holding table 36T) for holding one large-sized substrate 2 .

Furthermore, the left substrate transfer section 82a has two arms 94 (picking members) configured to be able to simultaneously pick up the two substrate receiving tables 21s adjusted to the first interval in the substrate receiving section 21 . The interval between two small-sized substrates 2 received in the state, when the substrate receiving part 21 adjusts the two substrate receiving stations 21s to the first interval to receive two small-sized substrates 2, the left substrate The transfer unit 82a uses two arms 94 to pick up two small-sized substrates 2 at the same time and transfer them to the left substrate transport unit 33L. On the other hand, the substrate receiving unit 21 adjusts the two substrate receiving tables 21s to the state of the second interval. In the case of receiving two large-sized substrates 2, the left substrate transfer unit 82a picks up a large-sized substrate 2 with one of the two arms 94 and transfers it to the left substrate transport unit 33L, and then transfers it to the left substrate transfer unit 33L, and then transfers it to the left substrate transfer unit 33L, and then transfers it to the substrate receiving unit 33L. After adjusting the two substrate receiving stages 21s to the first interval, the part 21 uses the other arm 94 of the two arms 94 to pick up the remaining large-sized substrate 2 and transfer it to the left substrate conveying part 33L.

Moreover, the component mounting method of this embodiment includes: a substrate receiving step, setting the interval between two substrate receiving stations 21s as the first interval to receive two small-sized substrates 2 conveyed from the upstream process side, or to place the two substrates 2 The interval of each substrate receiving station 21s is set to a second interval larger than the first interval to receive two large-size substrates 2 that are transported from the upstream process side and are larger than the small-size substrate; The small-size or large-size substrate 2 received in the substrate receiving process is transferred to the component mounting part 22. The substrate transfer process is to receive two small-sized substrates 2 in the substrate receiving process. The two small-sized substrates 2 received in the process are transferred to the component mounting part 22 at the same time. In the case of receiving two large-sized substrates 2 in the substrate receiving process, the two large-sized substrates received in the substrate receiving process 2Transfer to the component mounting part one by one.

In the component mounting apparatus 1 and the component mounting method of the present embodiment, the interval between two substrate receiving stations 21s is set as the first interval to receive two small-sized substrates 2 conveyed from the upstream process side, or to place the two substrates 2 The interval between the two substrate receiving stations 21s is set to a second interval greater than the first interval, and two large-size substrates 2 having a size larger than the small-size substrate 2 transported from the upstream process side are received. And, in the case of receiving two large-sized substrates 2, the received two large-sized substrates 2 are transferred to the component mounting part 22 one by one, so that the small-sized substrate 2 and the large-sized substrate 2 can be compared. Since components are mounted on any one of the substrates 2, the production lines for substrates 2 of two sizes can be unified.

Industrial availability

Provided are a component mounting device and a component mounting method that can perform component mounting on both a small-sized substrate and a large-sized substrate, and can unify production lines for both large and small-sized substrates.

Claims (7)

1. an element fixing apparatus, for possessing the element fixing apparatus that substrate is carried out to the element installation portion of element installation, is characterized in that,

Described element fixing apparatus possesses:

Substrate acceptance division, the interval of two substrate receiving platforms be set as to the first interval and receive the substrate of two first sizes that transport from upstream process side, or the interval of described two substrate receiving platforms be set as to second interval larger than described the first interval and receive the substrate of the second size that two sizes transporting from described upstream process side are larger than the substrate of described first size; And

Substrate transfer portion, the described first size that described substrate acceptance division is received or the substrate of described the second size are transferred to described substrate installation portion,

Receive the substrate of two described the second sizes at described substrate acceptance division, element installation portion transferred to respectively one by one by the substrate of these two described the second sizes that receive by described substrate transfer portion.

2. element fixing apparatus according to claim 1, is characterized in that,

Receive the substrate of two described first sizes at described substrate acceptance division, described element installation portion transferred to by the substrate of these two described first sizes that receive by described substrate transfer portion simultaneously.

3. element fixing apparatus according to claim 1 and 2, is characterized in that,

Described element installation portion possesses:

Substrate maintaining part, to shifted the substrate of two described first sizes of coming or kept by the substrate of described substrate transfer portion described the second size that transfer is come respectively one by one simultaneously by described substrate transfer portion;

Adhering part sticking operation portion, pastes adhering part the substrate being kept by substrate maintaining part;

Element mounting homework department, by element mounting to the substrate of having been pasted adhering part by described adhering part sticking operation portion; And

Element crimping operation portion, is crimped on the element that utilizes described element mounting homework department to carry the substrate that has carried element in described element mounting homework department,

The first substrate that described substrate maintaining part can optionally be installed the substrate that simultaneously keeps two described first sizes keeps platform or keeps the second substrate of the substrate of described second size to keep platform.

4. according to the element fixing apparatus described in any one of claims 1 to 3, it is characterized in that,

Described substrate transfer portion has two pick-up member, described two pick-up member are configured to pick up described substrate acceptance division at the interval that described two substrate receiving platforms is adjusted into the substrate of two described first sizes that receive under the state at described the first interval simultaneously, receive the substrate of two described first sizes under the state that described two substrate receiving platforms is adjusted into described the first interval at described substrate acceptance division, described substrate transfer portion utilizes described two pick-up member to pick up the substrate of two described first sizes simultaneously and transfer to described substrate maintaining part.

5. element fixing apparatus according to claim 4, is characterized in that,

Receive the substrate of two described the second sizes under the state that described two substrate receiving platforms is adjusted into described the second interval at described substrate acceptance division, described substrate transfer portion utilizes a pick-up member in described two pick-up member to pick up the substrate of described second size and transfer to described substrate maintaining part, then at described substrate acceptance division, described two substrate receiving platforms are adjusted into behind described the first interval, described substrate transfer portion utilizes another pick-up member in described two pick-up member pick up the substrate of remaining described second size and transfer to described substrate maintaining part.

6. a component mounting method, for by possessing the component mounting method that substrate is carried out to the element fixing apparatus realization of the element installation portion of element installation, is characterized in that,

Described component mounting method comprises:

Substrate receives operation, the interval of two substrate receiving platforms be set as to the first interval and receive the substrate of two first sizes that transport from upstream process side, or the interval of described two substrate receiving platforms be set as to second interval larger than described the first interval and receive the substrate of the second size that two sizes transporting from described upstream process side are larger than the substrate of described first size; And

Substrate transfering process, transfers to described substrate installation portion by the described first size receiving in described substrate reception operation or the substrate of described the second size,

Receive in operation and receive the substrate of two described the second sizes at described substrate, the substrate of two described the second sizes that in described substrate transfering process, this received is transferred to respectively element installation portion one by one.

7. component mounting method according to claim 6, is characterized in that,

Receive in operation and receive the substrate of two described first sizes at described substrate, the substrate of two described first sizes that in described substrate transfering process, this received is transferred to described element installation portion simultaneously.

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