JP5834212B2 - Component mounting apparatus and component mounting method - Google Patents

Description

  The present invention relates to a component mounting apparatus and a component mounting method for manufacturing a substrate such as a liquid crystal panel substrate by mounting the component on the substrate and then pressing the component onto the substrate.

  Conventionally, in a component mounting apparatus for manufacturing a liquid crystal panel substrate, an ACF adhering operation unit for adhering a tape-shaped ACF (Anisotropic Conductive Film) as an adhesive member to an end portion of the substrate, and an ACF tape for the substrate have been adhered A component mounting work section for mounting (temporary pressure bonding) a part having a film-like part such as a drive circuit on the part, and a component pressure bonding working part for pressure bonding (main pressure bonding) the part to the board on which the component is mounted in the component mounting work part. I have. Here, usually two component crimping work units are provided, and the ACF adhering work unit, the component mounting work unit, the first component crimping work unit, and the second component crimping work unit are arranged along the flow of the substrate. They are arranged in order (for example, refer to Patent Document 1). Then, the transfer of the substrate between the work steps is performed by a substrate transfer means such as an arm device having a substrate suction portion at the tip, and the processing can be advanced while the substrate is transferred between the work steps.

  The conventional component mounting apparatus includes a type in which components are attached only to one side of a substrate. In such a case, the first component crimping operation unit and the second component crimping operation unit perform the same operation. Therefore, the substrate on which the component is mounted is subjected to the component crimping operation for each side of the substrate in the first component crimping working unit or the second component crimping working unit.

JP 2005-129753 A

  By the way, as described above, in a component mounting apparatus that mounts a component having a film-like portion at the end of a substrate, when the substrate is transferred by the substrate transfer means in the process of shifting from the component mounting operation to the component crimping operation. There is a risk that the parts mounted on the substrate may be dropped due to impact.

  Therefore, an object of the present invention is to provide a component mounting apparatus and a component mounting method that can shift to a component crimping operation without dropping a component mounted on a substrate.

  The component mounting apparatus according to claim 1 is provided at a position where the component mounting operation unit that performs the component mounting operation on the board and the component mounting operation unit are sandwiched from both sides. A first component crimping operation unit and a second component crimping operation unit for crimping a component mounted in the component mounting operation unit on a substrate on which work has been performed, the component mounting operation unit, and the first component crimping operation The components are mounted so as to be movable in the horizontal direction, and the substrate is transferred to the component mounting operation unit in a state where the substrate is mounted on the substrate mounting stage, and the component mounting operation unit mounts the component on the substrate. Is moved to the side of the first component crimping operation part, and the substrate that is still placed on the substrate mounting stage is transferred to the first component crimping operation unit. A substrate transfer means, the component mounting working unit, and the 2 is provided so as to be movable in the horizontal direction between the component crimping operation parts, and the substrate is transferred to the component mounting work unit in a state where the substrate is placed on the substrate mounting stage, and the substrate by the component mounting work unit After the component mounting operation is performed on the substrate, the substrate that has been placed on the substrate mounting stage and moved to the second component crimping operation portion side is moved to the second component crimping operation portion. Second substrate transfer means for transferring.

  The component mounting apparatus according to claim 2 is the component mounting apparatus according to claim 1, wherein the board holding unit that holds a board carried in from the outside, and the component of the board held by the board holding unit. The first substrate transfer means includes an adhesive member attaching operation portion for attaching an adhesive member to a place where a component is mounted by the mounting operation portion, and a substrate on which the adhesive member is attached by the adhesive member attaching operation portion. And a substrate transfer means for distributing and placing on the substrate placement stage provided in the substrate placement stage and the second substrate transfer means.

  A component mounting apparatus according to a third aspect is the component mounting apparatus according to the first or second aspect, wherein the substrate transfer means includes a substrate on which a component is crimped by the first component crimping working unit. Received from the substrate placement stage included in the first substrate transfer means, or received from the substrate placement stage included in the second substrate transfer means, the substrate on which the component has been pressure-bonded by the second component pressure-bonding working unit. The substrate is transferred to the substrate carry-out section.

  A component mounting apparatus according to a fourth aspect of the present invention is the component mounting apparatus according to any one of the first to third aspects, wherein the component mounting working unit is a substrate transferred by the first substrate transfer means or the Prior to performing a component mounting operation on the substrate transferred by the second substrate transfer means, the position recognition of the substrate with respect to the substrate mounting stage provided in the first substrate transfer means or the second substrate transfer means is provided. Position recognition means for recognizing the position of the substrate relative to the substrate placement stage is provided.

  The component mounting apparatus according to claim 5 is the component mounting apparatus according to claim 1, wherein the component mounted on the substrate by the component mounting operation unit protrudes from the substrate in a state of being mounted on the substrate. The substrate placement stage provided in the first substrate transfer means and the substrate placement stage provided in the second substrate transfer means include the film-like portion in a state where components are mounted on the substrate. A film-like partial support portion that is supported from below is provided.

  According to a sixth aspect of the present invention, there is provided a component mounting method comprising: a component mounting operation unit that performs a component mounting operation on a board; and a position that sandwiches the component mounting operation unit from both sides. A first component crimping working unit and a second component crimping working unit for crimping a component mounted in the component mounting working unit on a substrate on which the mounting operation has been performed, the component mounting working unit, and the first component crimping A first substrate transfer means provided movably in the horizontal direction between the working parts, and a second board movably provided in the horizontal direction between the component mounting work part and the second component crimping work part. A component mounting method using a component mounting apparatus including a substrate transfer unit, wherein the substrate is transferred to the component mounting operation unit in a state where the substrate is mounted on a substrate mounting stage included in the first substrate transfer unit. And the component mounting working unit After the component mounting operation is performed, the first substrate transfer means is moved to the first component crimping operation portion side, and the substrate that has been mounted on the substrate mounting stage is moved to the first substrate mounting stage. In a state where the substrate is placed on the substrate placement stage included in the second substrate transfer means, and a step of crimping the component onto the substrate by the first component crimping operation portion. The board is transferred to the component mounting operation section, and after the component mounting operation section performs the component mounting operation on the board, the second substrate transfer means is moved to the second component crimping operation section side. And a step of transferring the substrate that has been placed on the substrate placement stage to the second component crimping operation unit, and crimping the component to the substrate by the second component crimping operation unit.

  In the present invention, the substrate is transferred to the component mounting operation section while being mounted on the substrate mounting stage provided in the first substrate transfer means or the second substrate transfer means, and the component mounting operation is performed. After the work, it is transferred to the first component crimping work section or the second component crimping work section while being placed on the substrate placing stage, and the parts are crimped there. In the process of shifting from the mounting operation to the component crimping operation, the substrate transfer means does not change the substrate, so that it is possible to shift to the component crimping operation without dropping the component mounted on the substrate.

The top view of the component mounting apparatus in one embodiment of this invention The figure which shows the advancing procedure of the component mounting operation | work with respect to the board | substrate by the component mounting apparatus in one embodiment of this invention The block diagram which shows the control system of the component mounting apparatus in one embodiment of this invention (A) (b) The perspective view of the ACF sticking operation part with which the component mounting apparatus in one embodiment of this invention is equipped, and a left board | substrate transfer part (A) (b) (c) The figure which shows the execution procedure of the sticking operation | work of the ACF tape by the ACF sticking operation | work part in one embodiment of this invention. (A) (b) The perspective view of the component mounting operation part with which the component mounting apparatus in one embodiment of this invention is equipped, and a center board | substrate transfer part (right board | substrate transfer part) (A) (b) (c) The figure which shows the execution procedure of the component mounting operation | work by the component mounting operation part in one embodiment of this invention. (A) (b) (c) The figure which shows the execution procedure of the component mounting operation | work by the component mounting operation part in one embodiment of this invention. (A) (b) The perspective view of the 1st component crimping operation part (2nd component crimping operation part) and the left board | substrate transfer part (right board transfer part) with which the component mounting apparatus in one embodiment of this invention is equipped. Figure (A) (b) (c) The figure which shows the execution procedure of the component crimping operation | work by the 1st component crimping operation part (2nd component crimping operation part) working part in one embodiment of this invention. (A)-(f) The figure which shows the execution procedure of the component crimping operation | work by the 1st component crimping operation part (2nd component crimping operation part) in one embodiment of this invention. The perspective view of the board | substrate transfer part in one embodiment of this invention The fragmentary top view of the component mounting apparatus in one embodiment of this invention (A) (b) (c) The figure which shows the execution procedure of the component mounting operation | work by the component mounting apparatus in one embodiment of this invention. (A) (b) (c) The figure which shows the execution procedure of the component mounting operation | work by the component mounting apparatus in one embodiment of this invention. (A) (b) (c) The figure which shows the execution procedure of the component mounting operation | work by the component mounting apparatus in one embodiment of this invention. (A) (b) (c) The figure which shows the execution procedure of the component mounting operation | work by the component mounting apparatus in one embodiment of this invention. (A) (b) (c) The figure which shows the execution procedure of the component mounting operation | work by the component mounting apparatus in one embodiment of this invention. (A) (b) The figure which shows the execution procedure of the component mounting operation | work by the component mounting apparatus in one embodiment of this invention

  Embodiments of the present invention will be described below with reference to the drawings. A component mounting apparatus 1 for manufacturing a liquid crystal panel substrate shown in FIG. 1 has an ACF tape as an adhesive member on an electrode portion 2a provided at one end of four sides of a rectangular panel-like substrate 2 shown in FIG. After attaching 3, the component 4 is mounted on the attached ACF tape 3 (preliminary pressure bonding) and then pressure bonded (main pressure bonding), thereby performing the component mounting operation for mounting the component 4 on the substrate 2. The component 4 used here is, for example, a drive circuit component and has a film-like portion 4a.

  In FIG. 1, a base 11 of the component mounting apparatus 1 includes a left base 11 a and a center base from the left in the left-right direction as viewed from the operator OP (the left-right direction in FIG. 1 and the X-axis direction). 11b and the right base 11c are arranged in this order. The left base 11a has a carry-in board placement unit 21, the central base 11b has a component mounting execution part 22, and the right base 11c has a carry-out board placement. Placement portions 23 are provided. The operations of the carry-in substrate placement unit 21, the component mounting execution unit 22, and the carry-out substrate placement unit 23 are controlled by a control device 24 (FIG. 3) as control means. Substrate 2 flows in the X-axis direction from the left side to the right side, that is, the carry-in board placement unit 21, the component mounting execution unit 22, and the carry-out board placement unit 23 in this order, and the work is sequentially performed.

  In FIG. 1, the carry-in substrate placement unit 21 has two substrate placement stages 21s on the left side (upstream process side) and the right side (downstream process side). These two substrate mounting stages 21 s are provided so as to be movable up and down with respect to the left base 11 a, and the substrate 2 sent from the upstream process side of the component mounting apparatus 1 is placed on the two substrate mounting stages 21 s. Placed.

  The component mounting execution unit 22 performs an operation of attaching the ACF tape 3 that is an adhesive member to the substrate 2, an ACF attaching operation portion (adhesive member attaching operation portion) 22 a, and an operation of mounting the component 4 on the substrate 2. The component mounting operation unit 22b, the first component crimping operation unit 22c that crimps the component 4 mounted on the component mounting operation unit 22b on the substrate 2 on which the component 4 mounting operation has been performed, and the second component mounting operation unit 22b. It has a component crimping work part 22d.

  The ACF attaching work part 22a is provided in the left area of the central base 11b, and the component mounting work part 22b is provided in the central area of the central base 11b. The first component crimping work part 22c is provided in a region between the ACF adhering work part 22a and the component mounting work part 22b on the central base 11b, and the second component crimping work part 22d is the central base. It is provided in the area on the right side of the component mounting work part 22b on 11b. That is, in the component mounting apparatus 1 according to the present embodiment, the first component crimping work part 22c and the second component crimping work part 22d are provided at positions sandwiching the component mounting work part 22b from the left and right sides.

  A first base portion 31 is provided in the front area of the ACF attaching work portion 22a on the central base 11b (the front-rear direction viewed from the operator OP is the Y-axis direction). A second base portion 32 is provided extending in the X-axis direction in the front region of the component mounting operation portion 22b, the first component crimping operation portion 22c, and the second component crimping operation portion 22d.

  1 and FIGS. 4A and 4B, the first base portion 31 is provided with a left substrate transfer portion 33L. The left substrate transfer portion 33L is provided on the first base portion 31 so as to extend in the Y-axis direction, and is provided on the first base portion 31 so as to be movable in the X-axis direction. The moving stage 35 is provided so as to be movable in the Y-axis direction on the Y-axis table 34, and two substrate mounting stages 36 provided side by side in the X-axis direction on the upper surface of the moving stage 35. On the two substrate placement stages 36, the two substrates 2 are transferred and held from the two substrate placement stages 21s of the carry-in substrate placement portion 21.

  The two substrate mounting stages 36 are provided so as to be movable up and down with respect to the moving stage 35. The control device 24 moves the moving stage 35 in the Y-axis direction with respect to the Y-axis table 34 to transfer the substrate 2. Then, the two substrate placement stages 36 are moved up and down to raise and lower the two substrates 2 placed on the two substrate placement stages 36.

  4 (a) and 4 (b), the ACF adhering work part 22a includes two adhering heads 41 arranged in the X-axis direction above the central base 11b, and below the adhering heads 41. Two backup stages 42 for attaching ACF are provided extending in the X-axis direction.

  Each of the two sticking heads 41 feeds and feeds the ACF tape 3, cuts the fed ACF tape 3 into a predetermined length, and holds it in a horizontal position at a predetermined position, and a tape supply A sticking tool 41b for pressing the ACF tape 3 held in a horizontal posture by the part 41a from above onto the backup stage 42 side for ACF sticking work is provided.

  The control device 24 moves the moving stage 35 of the left substrate transfer part 33L on the Y-axis table 34 to the “substrate delivery position” (FIG. 4A) set to the front and the “work position” set to the rear (see FIG. 4A). 4 (b)). The “substrate delivery position” is a position where the substrate 2 can be delivered to the two substrate placement stages 36, and the “working position” is the two sheets placed on the two substrate placement stages 36. This is a position where the electrode portions 2a of the respective substrates 2 can be positioned above the two backup stages 42 for attaching the ACF.

  An operation of attaching the ACF tape 3 to the substrate 2 by the attaching head 41 will be described with reference to FIG. First, as shown in FIG. 5A, the control device 24 operates the tape supply unit 41a to position the ACF tape 3 in a state cut to a predetermined length above the substrate 2 (electrode unit 2a). Next, as shown in FIG. 5B, the sticking tool 41b is lowered to press the ACF tape 3 together with the substrate 2 against the backup stage 42 for the ACF sticking work. Finally, as shown in FIG. 5C, the sticking tool 41 b is raised with respect to the substrate 2. As a result, the ACF tape 3 having a predetermined length is attached to the substrate 2.

  In FIG. 1, the second base portion 32 is provided with a central substrate transfer portion 33C and a right substrate transfer portion 33R. The central substrate transfer unit 33C and the right substrate transfer unit 33R are the same type, and the central substrate transfer unit 33C is located to the left of the right substrate transfer unit 33R. The central substrate transfer unit 33C (same as the right substrate transfer unit 33R) is provided to be movable in the X-axis direction along the second base portion 32, as shown in FIGS. 6 (a) and 6 (b). A Y-axis table 51, a moving stage 52 provided on the Y-axis table 51 so as to be movable in the Y-axis direction, and two substrate mounting stages 53 provided side by side in the X-axis direction on the upper surface of the moving stage 52 are provided. . The two substrate placement stages 53 can move in the horizontal direction by moving the Y-axis table 51 in the X-axis direction with respect to the second base portion 32 and moving the moving stage 52 with respect to the Y-axis table 51. On the substrate placement stage 53, the two substrates 2 are transferred from the left substrate transfer part 33L.

  The two substrate mounting stages 53 are provided so as to be movable up and down with respect to the moving stage 52. The control device 24 moves the Y-axis table 51 in the X-axis direction with respect to the second base portion 32 and moves the moving stage 52 in the Y-axis direction with respect to the Y-axis table 51 to place the two substrate placement stages 53 in a horizontal plane. The substrate 2 is transferred by moving inward, the two substrate placement stages 53 are moved up and down (FIG. 3), and the two substrates 2 placed on the two substrate placement stages 53 are moved up and down. .

  In FIG. 1 and FIGS. 6A and 6B, the component mounting work unit 22b is provided so as to project rearward from the rear portion of the central base 11b to supply the component 4, and the central base 11b. A mounting head 63 that is movable in a horizontal plane by a mounting head moving mechanism 62 provided at the center rear of the mounting head 63 and sucks the component 4 supplied by the component supply unit 61 from above, and a central rear region of the second base portion 32. Is provided with a backup stage 64 for component mounting provided extending in the Y-axis direction. The control device 24 controls the supply operation of the component 4 by the component supply unit 61, the movement operation of the mounting head 63 in the horizontal plane by the operation of the mounting head moving mechanism 62, and the suction operation of the component 4 by the mounting head 63. Thereby, a series of operations from adsorption (pickup) of the component 4 by the mounting head 63 to mounting of the component 4 on the substrate 2 is performed (FIG. 3).

  In FIG. 6A, in the backup stage 64 for component mounting work, two position recognition cameras 65 with the imaging field of view facing upward are provided side by side in the X-axis direction. These two position recognition cameras 65 are controlled by the control device 24 to perform an imaging operation, and the parts are passed through a transparent material part 64a (FIG. 6A) such as quartz glass provided on the upper part of the backup stage 64 for mounting parts. An object located above the mounting backup stage 64 is imaged.

  The control device 24 sets the moving stage 52 of the central substrate transfer unit 33C to the “substrate transfer position” (FIG. 6A) set in front of the Y-axis table 51 and the “work position” set in the rear (FIG. 6). 6 (b)). The “substrate delivery position” is a position where the substrate 2 can be delivered to the two substrate placement stages 53. The “working position” indicates that the ACF tape 3 attached to the electrode portion 2a of the substrate 2 placed on the two substrate placement stages 53 is positioned above the backup stage 64 for component placement work (further, component crimping described later). This is a position that can be positioned above the work backup stage 72.

  When the component 4 is mounted on the board 2, the control device 24 first has two position recognition cameras 65 and two position recognition marks m (see FIG. 2) of the board 2 positioned above the component mounting backup stage 64. ) (FIG. 7A), the position of the substrate 2 with respect to the substrate mounting stage 53 is calculated to recognize the position of the substrate 2, and the position information of the recognized substrate 2 is stored in the storage unit of the control device 24. 24b (FIG. 3). Once the moving stage 52 is moved forward and the substrate 2 is withdrawn from above the backup stage 64 (FIG. 7B), the mounting head 63 is lowered to move the component 4 to the backup stage 64 (position recognition). Approach the camera 65 side. Then, the position recognition marks (not shown) of the component 4 are picked up by the two position recognition cameras 65 (FIG. 7C), the position of the component 4 with respect to the mounting head 63 is calculated, and the position of the component 4 is calculated. Recognition is performed, and the position information of the recognized component 4 is stored in the storage unit 24b.

  After storing the position information of the substrate 2 and the position information of the component 4 in the storage unit 24b, the control device 24 raises the mounting head 63 (FIG. 8A), and then moves the moving stage 52 to the “working position” again. To be located. Then, based on the relative positional relationship between the position of the component 4 and the position of the substrate 2 stored in the storage unit 24b, two position recognition marks (not shown) on the component 4 side and two position recognition marks m on the substrate 2 side are moved up and down. The position of the substrate 2 is adjusted by controlling the operation of the central substrate transfer unit 33C so as to match the above (FIG. 8B).

  As described above, the position recognition camera 65 included in the component mounting operation unit 22b of the component mounting apparatus 1 according to the present embodiment is the substrate 2 transferred by the central substrate transfer unit 33C or the substrate transferred by the right substrate transfer unit 33R. 2, the position recognition of the substrate 2 with respect to the substrate placement stage 53 provided in the central substrate transfer unit 33 </ b> C or the position recognition of the substrate 2 with respect to the substrate placement stage 53 provided in the right substrate transfer unit 33 </ b> R is performed. It is a position recognition means for performing.

  When the two position recognition marks on the component 4 side (not shown) and the two position recognition marks m on the substrate 2 are aligned vertically as described above, the control device 24 lowers the mounting head 63 and moves the mounting head 63 to the mounting head 63. The sucked component 4 is pressed against the ACF tape 3 on the substrate 2 and mounted on the substrate 2 (FIG. 8C). The pressing force of the mounting head 63 at this time is supported by the backup stage 64 for mounting components.

  As shown in FIGS. 6 to 8, each of the two substrate placement stages 53 provided in the central substrate transfer portion 33 </ b> C (the same applies to the right substrate transfer portion 33 </ b> R) is arranged so that the rear of the substrate placement stage 53 is placed on the X axis. A frame-like film-like partial support portion 54 having a horizontal portion 54a extending in the direction is provided. As shown in FIG. 2 and the like, the component 4 mounted on the substrate 2 by the component mounting operation unit 22 b protrudes from the substrate 2 in the state where the component 4 is mounted on the substrate 2. However, since the film-like portion support portion 54 is provided on each substrate mounting stage 53, the film-like portion 4 a of the component 4 protruding from the substrate 2 in a state where the component 4 is mounted on the substrate 2. Is supported from below by the horizontal part 54a of the film-like part support part 54. Thereby, it is prevented that the film-like part 4a of the component 4 in the state mounted on the board | substrate 2 will be in the state hung down below.

  As shown in FIGS. 9A and 9B, the first component crimping work portion 22c (same as the second component crimping work portion 22d) has two crimping heads arranged side by side in the X-axis direction. 71 and two backup stages 72 for crimping the two components provided in the Y-axis direction below the respective crimping heads 71. The control device 24 controls the ascending and descending operations of the crimping head 71 provided in the first component crimping operation unit 22c and the crimping head 71 provided in the second component crimping operation unit 22d (FIG. 3).

  When the mounting operation of the component 4 by the mounting head 63 is completed on the two substrates 2 placed on the two substrate placement stages 53 provided in the central substrate transfer unit 33C, the control device 24 uses the Y-axis table 51 as it is. The two substrates 2 placed on the two substrate placement stages 53 are moved to the left along the second base portion 32 (that is, horizontally toward the first component crimping work portion 22c). The portion to which each ACF tape 3 is attached is positioned above the backup stage 72 for two component crimping operations (below the two crimping heads 71) (FIG. 9A). Then, the two crimping heads 71 provided in the first component crimping work unit 22c are sequentially lowered, and the component 4 mounted by the component mounting work unit 22b is crimped to the two substrates 2 (FIG. 10A → FIG. 10). 10 (b) → FIG. 10 (c)).

  Similarly, when the mounting operation of the component 4 by the mounting head 63 is completed on the two substrates 2 placed on the two substrate placement stages 53 provided in the right substrate transfer unit 33R, the control device 24 returns to Y The axis table 51 is moved rightward along the second base portion 32 (that is, on the second component crimping work portion 22d side), and the two substrates 2 placed on the two substrate placement stages 53 are moved. The part on which the component 4 is mounted is positioned above the backup stage 72 for two component crimping operations (below the two crimping heads 71) (FIG. 9A). Then, the two crimping heads 71 provided in the second component crimping operation unit 22d are sequentially lowered, and the component 4 mounted in the component mounting operation unit 22b is crimped to the two substrates 2 (FIG. 10A → FIG. 10). 10 (b) → FIG. 10 (c)).

  In the crimping operation of the component 4 by the two crimping heads 71, the two substrate placement stages 53 on which the two substrates 2 are placed are attached to the single moving stage 52. Positioning with respect to the pressure-bonding head 71 (and subsequent component pressure-bonding work) is sequentially performed at different timings. This operation will be described in detail with reference to FIG.

  The control device 24 positions the part on which the components 4 of the two substrates 2 mounted on the two substrate mounting stages 53 are mounted above the backup stage 72, and acquires (stores) in the aforementioned component mounting operation. The moving stage 52 is moved based on the position information of the left substrate 2 relative to the left substrate mounting stage 53 stored in the unit 24b. Thereby, one (here, the left side) board | substrate 2 is positioned with respect to the corresponding crimping | compression-bonding head 71 (FIG. 11 (a)). In this state, the left pressure-bonding head 71 is lowered to clamp the substrate 2 between the backup stage 72 and the pressure-bonding head 71, and the component 4 is pressure-bonded to the left-side substrate 2 (FIG. 11B). . Then, while the clamped state is maintained, the left substrate placement stage 53 is slightly lowered to release the support state of the substrate 2 by the substrate placement stage 53 (FIG. 11C).

  As a result, when the moving stage 52 can be moved independently of the left substrate 2, the right side with respect to the right substrate mounting stage 53 obtained (stored in the storage unit 24 b) in the same component mounting operation as described above. The moving stage 52 is moved based on the position information of the substrate 2 and the other (right side here) substrate 2 is positioned with respect to the corresponding pressure bonding head 71. In this state, the right pressure bonding head 71 is lowered to clamp the substrate 2 between the backup stage 72 and the pressure bonding head 71, and the component 4 is pressure bonded to the right substrate 2 (FIG. 11 (d)). . When the component 4 is crimped to the right substrate 2, the control device 24 raises the left substrate mounting stage 53 to support the substrate 2, and then raises the left crimping head 71 (FIG. 11 ( e)), and then the right crimping head 71 is raised (FIG. 11 (f)). Thereby, the crimping operation of the component 4 to the two substrates 2 is completed.

  When the component 24 is crimped to the two substrates 2 by the above procedure, the control device 24 moves the moving stage 52 forward along the Y-axis table 51 and returns the moving stage 52 to the “substrate delivery position”. Let

  The positioning of the crimping head 71 with respect to the substrates 2 placed on the two substrate placement stages 53 and the crimping of the component 4 by the crimping head 71 are not performed individually on the left and right substrates 2 as described above, but at the same time. You may go. In that case, the average value of the positional deviation of the left substrate 2 relative to the left substrate placement stage 53 and the positional deviation of the right substrate 2 relative to the right substrate placement stage 53 obtained in the component mounting operation is calculated, The right substrate mounting stage 53 is simultaneously positioned with respect to the corresponding pressure bonding head 71. Thereafter, the component 4 is simultaneously crimped to the substrate 2 by the crimping head 71. In this case, the tact time can be shortened although the positioning accuracy is slightly lowered as compared with the individual positioning.

  In FIG. 1, the carry-out substrate placement unit 23 has two substrate placement stages 23s on the left side (upstream process side) and the right side (downstream process side). These two left and right substrate mounting stages 23s are provided so as to be movable up and down with respect to the right base 11c, and the first component pressing operation portion 22c or the second component pressing operation is provided on the two substrate mounting stages 23s. Two substrates 2 on which the crimping operation of the component 4 has been completed in the part 22d are placed. The two substrates 2 placed on the two substrate placement stages 23 s are sent to another device provided on the lower side of the component mounting apparatus 1 by a substrate unloading means (not shown).

  In FIG. 1, a moving base 81 extending in the X-axis direction is provided in the front region of the base 11 over the left base 11a, the center base 11b, and the right base 11c. On the moving base 81, there are provided three substrate transfer portions 82, a left substrate transfer portion 82a, a central substrate transfer portion 82b, and a right substrate transfer portion 82c in order from the left.

  As shown in FIG. 12, each substrate transfer unit 82 includes a base 91 provided so as to be movable in the X-axis direction with respect to the moving base 81 and two arm units 92 provided on the base 91. Each arm unit 92 includes an arm base 93 fixed to the base portion 91 and two arms 94 provided to extend horizontally rearward from the arm base 93. Each arm 94 is provided with a plurality of suction pads 95 with suction surfaces facing downward. Each arm unit 92 can vacuum-suck a single substrate 2 through a total of four suction pads 95 provided on the two arms 94.

  When the arm unit 92 receives the substrate 2 on the substrate placement stage 21 s of the carry-in substrate placement unit 21, the control device 24 keeps the suction pads 95 of the two arms 94 positioned above the substrate 2. The mounting stage 21s is moved up and down. When the substrate 2 on the substrate placement stage 36 of the left substrate transfer unit 33L is received by the arm unit 92 or the substrate 2 adsorbed by the arm unit 92 is placed on the substrate placement stage 36, the control device 24 lifts and lowers the substrate mounting stage 36 with the suction pads 95 of the two arms 94 positioned above the substrate 2. Further, the arm unit 92 receives the substrate 2 on the substrate placement stage 53 of the central substrate transfer unit 33C or the right substrate transfer unit 33R, or the substrate 2 adsorbed by the arm unit 92 is placed on the substrate placement stage 53. When placing, the control device 24 raises and lowers the substrate placement stage 53 with the suction pads 95 of the two arms 94 positioned above the substrate 2.

  The controller 24 moves the left substrate transfer unit 82a, the central substrate transfer unit 82b, and the right substrate transfer unit 82c in the X-axis direction along the movement base 81, and suction pads in each arm unit 92. The adsorption | suction operation | movement of the board | substrate 2 through 95 is controlled (FIG. 3). Specifically, the control device 24 operates the left substrate transfer unit 82a to transfer the substrate 2 from the carry-in substrate mounting unit 21 to the left substrate transfer unit 33L, and operates the central substrate transfer unit 82b. Then, the substrate 2 is transferred from the left substrate transfer unit 33L to the central substrate transfer unit 33C or the right substrate transfer unit 33R. That is, the two substrate placement stages 53 provided in the central substrate transfer portion 33C and the two substrate placement stages 53 provided in the right substrate transfer portion 33R include the substrate 2 on which the ACF tape 3 is attached by the ACF attachment operation portion 22a. Sort and place. In addition, the control device 24 operates the right substrate transfer unit 82c to transfer the substrate 2 from the central substrate transfer unit 33C or the right substrate transfer unit 33R to the carry-out substrate mounting unit 23.

  Next, the operation of each part when the component mounting apparatus 1 performs the mounting operation of the component 4 on the board 2 will be described. As shown in FIG. 13, the control device 24 is configured so that the three substrate transfer units 82 can take the front position (first position P <b> 1) of the carry-in substrate mounting unit 21 and the front position of the ACF attaching work unit 22 a. (Second position P2), the front position of the first component crimping work section 22c (third position P3), the front position of the component mounting work section 22b (fourth position P4), the front of the second component crimping work section 22d. The position (fifth position P5) and the front position (sixth position P6) of the carry-out substrate placement part 23 are determined.

  When performing the mounting operation of the component 4 on the board 2, the control device 24 first sets the left board transfer part 82a to the first position P1, the center board transfer part 82b to the second position P2, and the right side. The substrate transfer unit 82c is positioned at the fourth position P4, the central substrate transfer unit 33C is positioned in front of the component mounting operation unit 22b, and the right substrate transfer unit 33R is positioned in front of the second component crimping operation unit 22d. In the state of being positioned, the two substrates 2 carried in from the upstream process side apparatus and placed on the carry-in substrate placing portion 21 are received by the left substrate transfer portion 82a (FIG. 14A).

  When receiving the two substrates 2 from the carry-in substrate platform 21 by the left substrate transfer unit 82a, the control device 24 sets the left substrate transfer unit 82a to the second position P2 and the central substrate transfer unit 82b. By positioning the right substrate transfer unit 82c at the fourth position P4 at the sixth position P6, the two substrates 2 received by the left substrate transfer unit 82a are transferred to the two substrates of the left substrate transfer unit 33L. It is transferred to the mounting stage 36 (FIG. 14B)). Then, the moving stage 35 of the left substrate transfer part 33L is moved to the “working position”, and the ACF attaching work to the two substrates 2 by the ACF attaching work part 22a is executed (FIG. 14C). During this time, two new substrates 2 are placed (loaded in) on the carry-in substrate placement unit 21.

  When the control device 24 performs the ACF attaching operation to the two substrates 2 by the ACF attaching operation portion 22a, the control device 24 moves the moving stage 35 of the ACF left substrate transfer portion 33L to the “substrate delivery position”, and then to the left The substrate transfer unit 82a is positioned at the first position P1, the central substrate transfer unit 82b is positioned at the second position P2, and the right substrate transfer unit 82c is positioned at the fourth position P4. Then, the two substrates 2 on the carry-in substrate placement unit 21 are received by the left substrate transfer unit 82a, and the two substrates 2 on the left substrate transfer unit 33L are received by the central substrate transfer unit 82b ( FIG. 15 (a)).

  The control device 24 receives the two substrates 2 from the carry-in substrate placement unit 21 by the left substrate transfer unit 82a, and receives the two substrates 2 on the left substrate transfer unit 33L by the central substrate transfer unit 82b. Then, the left substrate transfer section 82a is positioned at the second position P2, the central substrate transfer section 82b is positioned at the fourth position P4, and the right substrate transfer section 82c is positioned at the sixth position P6. The two substrates 2 received by the transfer unit 82a are placed on the two substrate placement stages 36 of the left substrate transfer unit 33L, and the two substrates 2 received by the central substrate transfer unit 82b are transferred to the central substrate. It is made to mount on the two board | substrate mounting stages 53 of the part 33C (FIG.15 (b)).

  Next, the control device 24 positions the moving stage 35 of the left substrate transfer unit 33L at the “working position” and executes the ACF adhering operation to the two substrates 2 by the ACF adhering operation unit 22a, while the central substrate The moving stage 52 of the transfer unit 33C is moved to the “working position” and the left substrate 2 of the two substrates 2 is positioned above the backup stage 64 for component mounting work (first transfer step). ), A component mounting operation is performed on the left board 2 by the component mounting operation unit 22b (FIG. 15C, first component mounting operation step).

  When the component mounting operation is performed on the left substrate 2 by the component mounting operation unit 22b, the control device 24 moves the central substrate transfer unit 33C to the left (second transfer step), and the two of the central substrate transfer unit 33C. The right substrate 2 of the two substrates 2 placed on the substrate placement stage 53 is positioned above the backup stage 64 for component mounting work, and the right substrate 2 by the component mounting work unit 22b. The component mounting operation is executed (FIG. 16A, second component mounting operation step). During this time, two new substrates 2 are placed (loaded in) on the carry-in substrate placement unit 21.

  After executing the component mounting operation by the component mounting operation unit 22b, the control device 24 moves the central substrate transfer unit 33C to the left (the first component crimping operation unit 22c side) as it is and moves it to the substrate mounting stage 53. The substrate 2 that has been placed is transferred to the first component crimping work unit 22c (the moving process to the first component crimping work unit 22c), and 2 placed on the two substrate placing stages 53. The two substrates 2 are positioned above the two component crimping work backup stages 72, and the component crimping operation is performed on the two substrates 2 by the first component crimping operation unit 22c (first component crimping operation). Component crimping operation process by the portion 22c (FIG. 16B). At the same time, the left substrate transfer portion 82a is positioned at the first position P1, and the two substrates 2 placed on the carry-in substrate placement portion 21 are moved by the left substrate transfer portion 82a. On the other hand, the central substrate transfer unit 82b is positioned at the second position P2 in accordance with the movement stage 35 of the left substrate transfer unit 33L being positioned at the “substrate transfer position”. The two substrates 2 on the substrate transfer unit 33L are received. Further, the right substrate transfer part 33R is positioned at the front position of the component mounting work unit 22b, and the right substrate transfer part 82c is positioned at the fourth position P4 (FIG. 16B).

  When the above operation is completed, the control device 24 positions the right substrate transfer portion 82c at the sixth position P6, and then positions the central substrate transfer portion 82b at the fourth position P4, thereby moving the left substrate transfer portion. The two substrates 2 received from 33L are transferred to the two substrate mounting stages 53 of the right substrate transfer unit 33R, and the left substrate transfer unit 82a is positioned at the second position P2, thereby loading the loaded substrate. The two substrates 2 received from the unit 21 are transferred to the two substrate placement stages 36 of the left substrate transfer unit 33L (FIG. 16C).

  When the control device 24 delivers the substrate 2 to the right-side substrate transfer unit 33R and the left-side substrate transfer unit 33L, the moving stage 35 of the left-side substrate transfer unit 33L is positioned at the “working position” and the ACF adhering work unit 22a. While the ACF attaching operation to the two substrates 2 is performed, the moving stage 52 of the right substrate transfer unit 33R is moved to the “operation position”, and the right substrate 2 of the two substrates 2 is mounted. By positioning it above the work backup stage 64 (third transfer step), a component mounting operation is performed on the right substrate 2 by the component mounting operation unit 22b (FIG. 17A). Mounting work process).

  After executing the ACF adhering operation by the ACF adhering operation unit 22a and the component mounting operation by the component mounting operation unit 22b, the control device 24 moves the right substrate transfer unit 33R to the right (fourth transfer step), Component mounting is performed by positioning the left substrate 2 of the two substrates 2 placed on the two substrate mounting stages 53 of the right substrate transfer unit 33R above the backup stage 64 for mounting components. A component mounting operation is performed on the left substrate 2 by the working unit 22b (FIG. 17B, a fourth component mounting operation step). During this time, two new substrates 2 are placed (loaded in) on the carry-in substrate placement unit 21.

  After executing the component mounting operation by the component mounting operation unit 22b, the control device 24 moves the right substrate transfer unit 33R to the right (the second component crimping operation unit 22d side) as it is, and the substrate placement stage 53. The substrate 2 that has been placed on the substrate 2 is transferred to the second component crimping working unit 22d (moving step to the second component crimping working unit 22d) and placed on the two substrate placing stages 53. The two substrates 2 are positioned above the two component crimping work backup stages 72, and the component crimping operation is performed on the two substrates 2 by the second component crimping operation unit 22d (second component crimping operation). Component crimping operation process by the working unit 22d (FIG. 17C). At the same time, the left substrate transfer unit 82a receives the two substrates 2 placed on the carry-in substrate mounting unit 21 with the left substrate transfer unit 82a positioned at the first position P1. On the other hand, the central substrate transfer portion 82b is positioned at the second position P2 in accordance with the movement stage 35 of the left substrate transfer portion 33L being positioned at the “substrate transfer position”, and the left substrate is moved by the central substrate transfer portion 82b. The two substrates 2 on the transfer unit 33L are received. Further, while moving the moving stage 52 of the central substrate transfer unit 33C to the “substrate delivery position”, the central substrate transfer unit 33C is positioned in front of the component mounting operation unit 22b and is positioned in front of the component mounting operation unit 22b. The two substrates 2 on the central substrate transfer unit 33C are received by the right substrate transfer unit 82c (FIG. 17C).

  When the above operation is completed, the control device 24 positions the right substrate transfer portion 82c at the sixth position P6 to place the two substrates 2 on the carry-out substrate placement portion 23, while the central substrate transfer portion 82b. Is transferred to the fourth position P4, the two substrates 2 received from the left substrate transfer unit 33L are transferred to the two substrate placement stages 53 of the central substrate transfer unit 33C, and the left substrate transfer unit 82a. Is placed at the second position P2, and the two substrates 2 received from the carry-in substrate platform 21 are transferred to the two substrate platforms 36 of the left substrate transfer unit 33L (FIG. 18A). .

  When the control device 24 delivers the substrate 2 to the central substrate transfer unit 33C and the left substrate transfer unit 33L, the moving stage 35 of the left substrate transfer unit 33L is positioned at the “working position” and the ACF adhering operation unit 22a performs the operation. While performing the ACF attaching operation to the two substrates 2, the moving stage 52 of the central substrate transfer unit 33C is positioned at the “operation position”, and the left substrate 2 of the two substrates 2 is mounted on the component. Is placed above the backup stage 64 (first transfer step), the component mounting operation on the left substrate 2 by the component mounting operation unit 22b is executed (FIG. 18B). Working process).

  When the controller 24 executes the ACF adhering operation by the ACF adhering operation unit 22a and the component mounting operation by the component mounting operation unit 22b, the control device 24 moves the central substrate transfer unit 33C to the left (second transfer process), Of the two substrates 2 placed on the two substrate placement stages 53 of the substrate transfer unit 33C, the right substrate 2 is positioned above the backup stage 64 for component placement work, and the component placement work unit A component mounting operation is performed on the right board 2 by 22b (FIG. 18C, second component mounting operation step). During this time, two new substrates 2 are placed (loaded in) on the carry-in substrate placement unit 21.

  After executing the component mounting operation by the component mounting operation unit 22b, the control device 24 moves the central substrate transfer unit 33C to the left (the first component crimping operation unit 22c side) as it is and moves it to the substrate mounting stage 53. The substrate 2 that has been placed is transferred to the first component crimping work unit 22c (the moving process to the first component crimping work unit 22c), and 2 placed on the two substrate placing stages 53. The two substrates 2 are positioned above the two component crimping work backup stages 72, and the component crimping operation is performed on the two substrates 2 by the first component crimping operation unit 22c (first component crimping operation). Component crimping operation process by the portion 22c (FIG. 19A). At the same time, the left substrate transfer unit 82a receives the two substrates 2 placed on the carry-in substrate mounting unit 21 with the left substrate transfer unit 82a positioned at the first position P1. On the other hand, the central substrate transfer portion 82b is positioned at the second position P2 in accordance with the movement stage 35 of the left substrate transfer portion 33L being positioned at the “substrate transfer position”, and the left substrate is moved by the central substrate transfer portion 82b. The two substrates 2 on the transfer unit 33L are received. Further, while moving the moving stage 52 of the right board transfer section 33R to the “board delivery position”, the right board transfer section 33R is positioned in front of the component mounting work section 22b, and is already positioned in front of the component mounting work section 22b. The two substrates 2 on the right substrate transfer unit 33R are received by the right substrate transfer unit 82c that has been moved (FIG. 19A).

  When the above operation is completed, the control device 24 positions the right substrate transfer portion 82c at the sixth position P6 to place the two substrates 2 on the carry-out substrate placement portion 23 and the central substrate transfer portion. 82b is positioned at the fourth position P4, the two substrates 2 received from the left substrate transfer unit 33L are transferred to the two substrate placement stages 53 of the right substrate transfer unit 33R, and the left substrate transfer unit 82a is transferred. By positioning at the second position P2, the two substrates 2 received from the carry-in substrate platform 21 are transferred to the two substrate platforms 36 of the left substrate transport unit 33L (FIG. 19B).

  Since the state of FIG. 19B is exactly the same as the state of FIG. 16C, thereafter, the steps of FIGS. 16C to 19A are repeated to return to the carry-in substrate placement unit 21. Continuous substrate production can be performed by repeatedly executing a series of operations from loading of the substrate 2 to mounting of the component 4 on the substrate 2 to unloading to the unloading substrate mounting portion 23.

  As described above, the component mounting apparatus 1 according to the present embodiment is provided at a position where the component mounting operation unit 22b for mounting the component 4 on the board 2 and the component mounting operation unit 22b are sandwiched from both sides. A first component crimping work unit 22c and a second component crimping work unit 22d for crimping the component 4 mounted by the component mounting work unit 22b on the board 2 on which the component 4 mounting work has been performed in the mounting work unit 22b. Between the mounting work part 22b and the first component crimping work part 22c, it is provided so as to be movable in the horizontal direction, and the substrate 2 is mounted on the component mounting work part 22b in a state where the substrate 2 is mounted on the substrate mounting stage 53. After the parts are mounted and the component 4 is mounted on the substrate 2 by the component mounting unit 22b, the component 4 is moved to the first component crimping unit 22c and remains mounted on the substrate mounting stage 53. Board 2 A central substrate transfer portion 33C (first substrate transfer means) for transferring to one component crimping operation portion 22c and a component mounting operation portion 22b and a second component crimping operation portion 22d are provided so as to be movable in the horizontal direction; After the substrate 2 is placed on the substrate placement stage 53, the substrate 2 is transferred to the component mounting operation unit 22b, and after the component 4 is mounted on the substrate 2 by the component mounting operation unit 22b, the second operation is performed. The right side substrate transfer unit 33R (the second substrate transfer unit 33R) transfers the substrate 2 that has been moved to the component crimping operation unit 22d side and is still placed on the substrate mounting stage 53 to the second component crimping operation unit 22d. Substrate transfer means).

  The left substrate transfer unit 33L is a substrate holding unit that holds the substrate 2 carried in from the outside, and the ACF adhering work unit 22a is a component mounting operation of the substrate 2 held by the left substrate transfer unit 33L. This is an adhesive member adhering operation unit for adhering the ACF tape 3 as an adhesive member to a place where the component 4 is mounted by the portion 22b.

  In addition, the central substrate transfer unit 82b, which is the substrate transfer unit 82, includes a substrate mounting stage 53 provided in the central substrate transfer unit 33C and the right side of the substrate 2 on which the ACF tape 3 is attached by the ACF attaching operation unit 22a. This is a substrate transfer means for distributing and mounting on the substrate mounting stage 53 provided in the substrate transfer unit 33R.

  Further, the right substrate transfer unit 82c, which is the substrate transfer unit 82, receives the substrate 2 on which the component 4 is bonded by the first component crimping operation unit 22c from the substrate mounting stage 53 provided in the central substrate transfer unit 33C. Alternatively, the substrate 2 on which the component 4 is crimped by the second component crimping operation unit 22d is received from the substrate platform stage 53 provided in the right substrate transport unit 33R, and the substrate 2 is an unloading substrate platform that is a substrate unloading unit. Pass to 23.

  Further, the component mounting method by the component mounting apparatus 1 in the present embodiment is that the substrate 2 is placed in a state where the substrate 2 is placed on the substrate placement stage 53 provided in the central substrate transfer unit 33C (first substrate transfer means). Is transferred to the component mounting operation unit 22b (the first transfer step and the second transfer step described above), and the component 4 is mounted on the substrate 2 by the component mounting operation unit 22b (the first component described above). Mounting work process and second component mounting work process), the substrate 2 as it is placed on the substrate placing stage 53 by moving the central substrate transfer part 33C to the first component crimping work part 22c side. Step of transferring to the first component crimping work part 22c (moving process to the first component crimping work part 22c described above), and crimping of the component 4 to the substrate 2 by the first component crimping work part 22c (described above) 1 by the component crimping work part 22c Component pressing operation step), and the substrate 2 is transferred to the component mounting operation unit 22b in a state where the substrate 2 is mounted on the substrate mounting stage 53 provided in the right substrate transfer unit 33R (second substrate transfer means). After the mounting operation of the component 4 on the substrate 2 is performed by the component mounting operation unit 22b (the above-described third transfer step and fourth transfer step) (the above-described third component mounting operation step and fourth component mounting). Working process), the right substrate transfer part 33R is moved to the second component crimping work unit 22d side, and the substrate 2 that is still placed on the substrate placement stage 53 is moved to the second component crimping work unit 22d. (Moving step to the above-described second component crimping operation portion 22d), and a step of crimping the component 4 to the substrate 2 by the second component crimping operation portion 22d (by the above-described second component crimping operation portion 22d). Parts crimping process) That.

  In the component mounting apparatus 1 and the component mounting method according to the present embodiment, the substrate 2 is provided in the central substrate transfer unit 33C (first substrate transfer unit) or the right substrate transfer unit 33R (second substrate transfer unit). The component 4 is transferred to the component mounting operation unit 22b in a state of being mounted on the mounting stage 53, and the component 4 is mounted. After the component 4 is mounted, the component 4 is mounted on the substrate mounting stage 53. The process is transferred to the first component crimping work section 22c or the second component crimping work section 22d, where the crimping operation of the component 4 is performed, and the process of shifting from the mounting operation of the component 4 to the crimping operation of the component 4 is performed. In FIG. 5, since the substrate 2 is not transferred by the substrate transfer unit 82 (substrate transfer means), the component 4 mounted on the substrate 2 can be shifted to the pressure bonding operation without dropping.

  The transfer of the substrate 2 to the central substrate transfer unit 33C or the right substrate transfer unit 33R by the substrate transfer unit 82 (central substrate transfer unit 82b) is not limited to the order shown in the embodiment. After transferring to the right substrate transfer part 33R, it may be transferred to the central substrate transfer part 33C.

  The component mounting operation and the component crimping operation in the component mounting operation unit 22b, the first component crimping operation unit 22c, and the second component crimping operation unit 22d are respectively performed by the corresponding substrate transfer units (left substrate transfer unit 33L, center). You may carry out from the left-right board | substrate mounting stages 36 and 53 with which the board | substrate transfer part 33C or the right side board | substrate transfer part 33R) is equipped.

  Further, the left base 11a, the center base 11b, and the right base 11c may be formed as an integral base or may be formed as separate bases.

  Provided are a component mounting apparatus and a component mounting method which can shift to a component crimping operation without dropping a component mounted on a substrate.

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 2 Board | substrate 3 ACF tape (adhesive member)
4 Parts 4a Film-like part 22a ACF sticking work part (adhesive member sticking work part)
22b Component mounting operation unit 22c First component crimping operation unit 22d Second component crimping operation unit 23 Unloading substrate mounting unit (substrate unloading unit)
33L Left substrate transfer unit (substrate holding unit)
33C Central substrate transfer unit (first substrate transfer means)
33R Right substrate transfer unit (second substrate transfer means)
53 Substrate Placement Stage 54 Film-like Partial Supporting Unit 65 Position Recognition Camera (Position Recognition Means)
82 Substrate transfer section (substrate transfer means)

Claims (6)

A component mounting work unit for mounting components on the board;
A first component crimping operation that is provided at a position sandwiching the component mounting operation unit from both sides and that crimps the component mounted in the component mounting operation unit on a substrate on which the component mounting operation has been performed in the component mounting operation unit. Part and second component crimping working part;
Between the component mounting operation unit and the first component crimping operation unit, a horizontal movement is provided, and the substrate is transferred to the component mounting operation unit while the substrate is placed on the substrate mounting stage. After the component mounting operation is performed on the substrate by the component mounting operation unit, the substrate that has been moved to the first component crimping operation unit side and mounted on the substrate mounting stage is A first substrate transfer means for transferring to the first component crimping working unit;
Between the component mounting operation unit and the second component crimping operation unit, a horizontal movement is provided, and the substrate is transferred to the component mounting operation unit while the substrate is placed on the substrate mounting stage. After the component mounting operation is performed on the substrate by the component mounting operation unit, the substrate that has been moved to the second component crimping operation unit side and mounted on the substrate mounting stage is A component mounting apparatus comprising: a second substrate transfer means for transferring to a second component crimping operation unit.   A substrate holding unit for holding a substrate carried in from the outside, and an adhesive member adhering work unit for adhering an adhesive member to a place where a component is mounted by the component mounting operation unit of the substrate held by the substrate holding unit; The substrate on which the adhesive member is attached by the adhesive member attaching operation unit is distributed and placed on the substrate placement stage provided in the first substrate transfer means and the substrate placement stage provided in the second substrate transfer means. The component mounting apparatus according to claim 1, further comprising a board transfer means for placing the board.   The substrate transfer means receives a substrate on which a component has been crimped by the first component crimping working unit from the substrate mounting stage provided in the first substrate transporting unit or by the second component crimping working unit. 3. The component mounting apparatus according to claim 1, wherein a substrate to which a component is pressure-bonded is received from the substrate mounting stage provided in the second substrate transfer unit, and the substrate is transferred to a substrate carry-out unit.   The component mounting operation unit is configured so that the first substrate transfer unit performs the component mounting operation on the substrate transferred by the first substrate transfer unit or the substrate transferred by the second substrate transfer unit. 4. The apparatus according to claim 1, further comprising position recognition means for recognizing the position of the substrate with respect to the substrate placement stage, or for recognizing the position of the substrate with respect to the substrate placement stage provided in the second substrate transfer means. The component mounting apparatus according to any one of the above.   The component mounted on the substrate by the component mounting operation unit has a film-like portion protruding from the substrate in a state of being mounted on the substrate, and the substrate mounting stage provided in the first substrate transfer means and the second 2. The component according to claim 1, wherein the substrate mounting stage included in the substrate transfer unit includes a film-shaped portion supporting portion that supports the film-shaped portion from below in a state where the component is mounted on the substrate. Mounting device. A component mounting work unit in which a component mounting operation is performed on a board, and the component mounting work unit are provided at positions sandwiching the component mounting work unit from both sides. A first component crimping working unit and a second component crimping working unit for crimping a component mounted in the working unit, and a horizontal movement between the component mounting working unit and the first component crimping working unit. According to the component mounting apparatus including the first board transfer means provided and the second board transfer means provided so as to be movable in the horizontal direction between the component mounting work section and the second component crimping work section. A component mounting method,
After the substrate is transferred to the component mounting operation unit in a state where the substrate is mounted on the substrate mounting stage provided in the first substrate transfer means, and the component mounting operation unit performs the component mounting operation on the substrate. Then, the first substrate transfer means is moved to the first component crimping operation part side to transfer the substrate that has been placed on the substrate mounting stage to the first component crimping operation unit. , The step of crimping the component to the substrate by the first component crimping working unit;
After the substrate is transferred to the component mounting operation unit in a state where the substrate is placed on the substrate mounting stage provided in the second substrate transfer means, and the component mounting operation unit performs the component mounting operation on the substrate. Then, the second substrate transfer means is moved to the second component crimping operation part side to transfer the substrate that has been placed on the substrate mounting stage to the second component crimping operation unit. And a step of crimping the component to the substrate by the second component crimping operation section.

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