CN103779125A - Method for attaching protective film to wire outlet end of thin-film switch - Google Patents
Method for attaching protective film to wire outlet end of thin-film switch Download PDFInfo
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- CN103779125A CN103779125A CN201410036658.8A CN201410036658A CN103779125A CN 103779125 A CN103779125 A CN 103779125A CN 201410036658 A CN201410036658 A CN 201410036658A CN 103779125 A CN103779125 A CN 103779125A
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- outlet end
- film switch
- wire outlet
- thin
- out terminal
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Abstract
The invention relates to a method for attaching a protective film to the wire outlet end of a thin-film switch. The method for attaching the protective film to the wire outlet end of the thin-film switch comprises the steps that (a) the wire outlet end of the thin-film switch is coated with hot melt adhesive, and then the wire outlet end coated with the hot melt adhesive is dried at the temperature of 30 DEGC-80 DEGC to enable a solidified adhesive layer to be formed; (b) the protective film is placed on the solidified adhesive layer, and hot rolling is conducted at the temperature of 100 DEGC-200 DEGC to enable the protective film to be attached to the wire outlet end in an integrated mode. By the adoption of the technical scheme, the method for attaching the protective film to the wire outlet end of the thin-film switch has the advantages that on one hand, due to the fact that the wire outlet end of the thin-film switch is coated with the hot melt adhesive and the solidified adhesive layer is formed after the hot melt adhesive is dried, the detects of bubbles, wrinkles, impurities and the like which can be caused when a non-setting adhesive protective film is attached manually according to the prior art can be overcome; on the other hand, due to the fact that hot rolling type attaching is conducted at the temperature of 100 DEGC-200 DEG, the automation degree and the production efficiency can be improved, manpower resource input is reduced, and cost is reduced.
Description
Technical field
The present invention relates to electronic switch field, be specifically related to a kind of method of thin film switch leading-out terminal laminating diaphragm.
Background technology
Along with scientific and technical development, various electronic equipments emerge in multitude.Keyboard is the common devices of a lot of electronic equipments, for inputting word information etc., common are computor-keyboard, communication apparatus keyboard, family's key shelf etc.Thin film switch is the components and parts of above-mentioned keyboard, now be tending towards thin design, the flexible and low future development of cost, and have that volume is little, lightweight, simple operation and other advantages, be widely used in the various products such as intelligent electronic instrument, Medical Instruments, Digit Control Machine Tool, communication apparatus, office appliances, household electrical appliances, computor-keyboard.
Thin film switch structure is mainly made up of three-decker: upper strata circuit, middle bed course and lower circuit; these three layers is all individual part; in conjunction with forming thin film switch, it should have leading-out terminal on circuit or lower circuit at the middle and upper levels, is covered with diaphragm on leading-out terminal.The method that existing leading-out terminal pastes diaphragm adopts manual assembly adhesive sticker diaphragm production efficiency low, and it is bad that laminating easily produces bubble, wrinkle, impurity etc., also may be subject to extraneous mechanical scratch.
Summary of the invention
The present invention seeks to provide in order to overcome the deficiencies in the prior art that a kind of automaticity is high, thickness is controlled and the method for the thin film switch leading-out terminal of difficult formation defect laminating diaphragm
For achieving the above object, the technical solution adopted in the present invention is: a kind of method of thin film switch leading-out terminal laminating diaphragm, comprises the following steps:
(a) coated heat melten gel on thin film switch leading-out terminal, is placed on the dry solidified glue layer that forms at 30 ~ 80 ℃ subsequently;
(b) diaphragm is placed on solidified glue layer, at 100 ~ 200 ℃, carries out hot roll extrusion and diaphragm and leading-out terminal are pasted be integrated.
Optimally, in described step (b), hot rolling speed is 1 μ m/s ~ 1cm/s.
Optimally, in described step (b), hot rolling pressure is 0.5MPa ~ 5MPa.
Optimally, before described step (b) is carried out, the repeatedly operation of step (a).Further, the thickness of described glue layer is 20 ~ 200 microns.
Because technique scheme is used, the present invention compared with prior art has following advantages: the method for thin film switch leading-out terminal laminating diaphragm of the present invention, on thin film switch leading-out terminal, after coated heat melten gel, be dried and form solidified glue layer on the one hand, can overcome bubble, wrinkle that traditional-handwork laminating adhesive sticker diaphragm may cause, the defects such as impurity; On the other hand, at 100 ~ 200 ℃, carry out hot roll extrusion and paste, can improve automaticity and production efficiency, reduce the use of human resources, reduce costs.
Accompanying drawing explanation
Accompanying drawing 1 is the schematic diagram of disassembling of film for thin film switch of the present invention;
Wherein: 1, main film body; 11, conductiving point; 12, conducting wire; 13, leading-out terminal; 2, diaphragm.
Embodiment
Below in conjunction with accompanying drawing, the preferred embodiment of the invention is elaborated.
Thin film switch film as shown in Figure 1, the leading-out terminal 13 that mainly comprises main film body 1, connects as one with main film body 1, is covered on the diaphragm 2 on leading-out terminal 13.Wherein main film body 1 is provided with multiple conductiving points 11 and connects the conducting wire 12 of conductiving point 11, and conducting wire 12 extends on leading-out terminal 13, and diaphragm 2, for the protection of the conducting wire 12 on leading-out terminal 13, prevents extraneous mechanical scratch.
For diaphragm 2 is covered on leading-out terminal 13, the present embodiment provides a kind of method of thin film switch leading-out terminal laminating diaphragm, comprise the following steps: (a) coated heat melten gel on thin film switch leading-out terminal, is placed on the dry solidified glue layer that forms at 30 ~ 80 ℃ subsequently; (b) diaphragm is placed on solidified glue layer, at 100 ~ 200 ℃, carries out hot roll extrusion and diaphragm and leading-out terminal are pasted be integrated.Adopt the technique of coating can overcome bubble, the wrinkle that traditional-handwork laminating adhesive sticker diaphragm may cause, the defects such as impurity; And follow-uply at 100 ~ 200 ℃, carry out hot roll extrusion and paste, can improve automaticity and production efficiency, reduce the use of human resources, reduce costs.
In the present embodiment, in step (b), hot rolling speed is preferably 1 μ m/s ~ 1cm/s; hot rolling pressure is preferably 0.5MPa ~ 5MPa; make diaphragm 2 and leading-out terminal 13 fit closelyr, thereby conductive silver paste on protection conducting wire 12 prevent that it is subject to wet oxidation.And the thickness of glue layer can control in to a certain degree, be preferably 20 ~ 200 microns, only need to be before step (b) carry out, the repeatedly operation of step (a).
Above-described embodiment is only explanation technical conceive of the present invention and feature, and its object is to allow person skilled in the art can understand content of the present invention and implement according to this, can not limit the scope of the invention with this.All equivalences that Spirit Essence is done according to the present invention change or modify, within all should being encompassed in protection scope of the present invention.
Claims (5)
1. a method for thin film switch leading-out terminal laminating diaphragm, is characterized in that: comprise the following steps:
(a) coated heat melten gel on thin film switch leading-out terminal, is placed on the dry solidified glue layer that forms at 30 ~ 80 ℃ subsequently;
(b) diaphragm is placed on solidified glue layer, at 100 ~ 200 ℃, carries out hot roll extrusion and diaphragm and leading-out terminal are pasted be integrated.
2. the method for thin film switch leading-out terminal laminating diaphragm according to claim 1, is characterized in that: in described step (b), hot rolling speed is 1 μ m/s ~ 1cm/s.
3. the method for thin film switch leading-out terminal laminating diaphragm according to claim 1, is characterized in that: in described step (b), hot rolling pressure is 0.5MPa ~ 5MPa.
4. the method for thin film switch leading-out terminal laminating diaphragm according to claim 1, is characterized in that: before described step (b) is carried out, and the repeatedly operation of step (a).
5. the method for thin film switch leading-out terminal laminating diaphragm according to claim 4, is characterized in that: the thickness of described glue layer is 20 ~ 200 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410036658.8A CN103779125A (en) | 2014-01-26 | 2014-01-26 | Method for attaching protective film to wire outlet end of thin-film switch |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410036658.8A CN103779125A (en) | 2014-01-26 | 2014-01-26 | Method for attaching protective film to wire outlet end of thin-film switch |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103779125A true CN103779125A (en) | 2014-05-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410036658.8A Pending CN103779125A (en) | 2014-01-26 | 2014-01-26 | Method for attaching protective film to wire outlet end of thin-film switch |
Country Status (1)
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| CN (1) | CN103779125A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101363570A (en) * | 2008-09-27 | 2009-02-11 | 张庆党 | Copper-aluminum composite section bar and processing technology thereof |
| CN101409169A (en) * | 2008-09-05 | 2009-04-15 | 深圳市飞荣达科技有限公司 | Novel processing technique for film switch circuit layer |
| FR2959690A1 (en) * | 2010-05-05 | 2011-11-11 | Inovame | Method for manufacturing e.g. blade, from wood particle or fiberboards, involves hot-pressing panel to perform fixation heat treatment by polymerization on two faces simultaneously with thermocompression treatment |
| CN202160336U (en) * | 2011-08-06 | 2012-03-07 | 何忠亮 | Circuit board bonding structure |
| CN103165329A (en) * | 2013-03-05 | 2013-06-19 | 上海意力寰宇电路世界有限公司 | Method for manufacturing thin-film switch window |
| CN203217885U (en) * | 2013-01-30 | 2013-09-25 | 索威斯胶带(上海)有限公司 | Display device and film assembly used for same |
-
2014
- 2014-01-26 CN CN201410036658.8A patent/CN103779125A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101409169A (en) * | 2008-09-05 | 2009-04-15 | 深圳市飞荣达科技有限公司 | Novel processing technique for film switch circuit layer |
| CN101363570A (en) * | 2008-09-27 | 2009-02-11 | 张庆党 | Copper-aluminum composite section bar and processing technology thereof |
| FR2959690A1 (en) * | 2010-05-05 | 2011-11-11 | Inovame | Method for manufacturing e.g. blade, from wood particle or fiberboards, involves hot-pressing panel to perform fixation heat treatment by polymerization on two faces simultaneously with thermocompression treatment |
| CN202160336U (en) * | 2011-08-06 | 2012-03-07 | 何忠亮 | Circuit board bonding structure |
| CN203217885U (en) * | 2013-01-30 | 2013-09-25 | 索威斯胶带(上海)有限公司 | Display device and film assembly used for same |
| CN103165329A (en) * | 2013-03-05 | 2013-06-19 | 上海意力寰宇电路世界有限公司 | Method for manufacturing thin-film switch window |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140507 |
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| RJ01 | Rejection of invention patent application after publication |