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CN103522208A - Binding agent of resin dry grinding wheel, resin dry grinding wheel and method for manufacturing resin dry grinding wheel - Google Patents

Binding agent of resin dry grinding wheel, resin dry grinding wheel and method for manufacturing resin dry grinding wheel Download PDF

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Publication number
CN103522208A
CN103522208A CN201310454588.3A CN201310454588A CN103522208A CN 103522208 A CN103522208 A CN 103522208A CN 201310454588 A CN201310454588 A CN 201310454588A CN 103522208 A CN103522208 A CN 103522208A
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CN
China
Prior art keywords
dry grinding
resin
grinding wheel
resin dry
abrasive disk
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310454588.3A
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Chinese (zh)
Inventor
秦景厂
郭留希
李晓苹
袁德禄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henan Hua Mao New Material Science And Technology Development Co Ltd
Original Assignee
Henan Hua Mao New Material Science And Technology Development Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Henan Hua Mao New Material Science And Technology Development Co Ltd filed Critical Henan Hua Mao New Material Science And Technology Development Co Ltd
Priority to CN201310454588.3A priority Critical patent/CN103522208A/en
Publication of CN103522208A publication Critical patent/CN103522208A/en
Pending legal-status Critical Current

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Abstract

The invention relates to a resin grinding wheel and a method for manufacturing the resin grinding wheel, in particular to a binding agent of a resin dry grinding wheel, the resin dry grinding wheel and a method for manufacturing the resin dry grinding wheel. The method includes the following steps that firstly, the binding agent is evenly mixed according to a proportion, and then by volume, 25%-35% of diamond and 65%-75% of binding agent are taken and evenly mixed, wherein the binding agent comprises, by weight, 30%-35% of polyimide resin, 20%-25% of copper powder, 10%-15% of molybdenum disulfide, 8%-12% of silicon carbide, 10%-15% of chromic oxide and 6%-10% of zinc oxide; secondly, press molding is carried out; thirdly, firing is carried out; fourthly, processing is carried out till a dimensional requirement is met, and then the resin dry grinding wheel is obtained. The binding agent and the resin dry grinding wheel are good in thermal conductivity and can be applied to dry grinding operation, and the diamond can not fall off.

Description

A kind of bonding agent of resin dry grinding abrasive disk, resin dry grinding abrasive disk and preparation method thereof
Technical field
The present invention relates to a kind of resin wheel and preparation method thereof, especially a kind of bonding agent of resin dry grinding abrasive disk, resin dry grinding abrasive disk and preparation method thereof.
Background technology
Resin flake abrasive cut-off wheel is one of modal kind in grinding tool product.It is to take resin as the agent of bull knot, and loose abrasive material is bondd, and being consolidated into thickness is l~5mm or thinner cutting discs.Resin abrasive cutting wheel is mainly used in the cutting processing of the metal materials such as the rod iron, steel pipe, band steel, angle bar, channel-section steel, rail, steel plate of metallurgical industry; Precision fluting or cut-out processing and building material industry, chemical industry, aerospace industry, mechanical industry, auto industry, the metal material of shipping industry and the cutting processing of nonmetallic materials of the metals such as the silicon of semicon industry, germanium, sapphire, cable body, graphite, pottery, quartz and nonmetallic materials.
Traditional resin wheel can not be for dry grinding, and during dry grinding, caloric value is large, and resin is burned very soon, and diamond does not play a role and comes off.The formula of ordinary resin grinding wheel bond: phenolic resins 33.6%, copper powder 14.4%, carborundum 7.5%, chromium oxide 14%, zinc oxide 12.1%, corundum 12.8%, magnesia 5.6%.
Summary of the invention
The invention provides bonding agent, resin dry grinding abrasive disk of a kind of resin dry grinding abrasive disk and preparation method thereof, having solved existing resin wheel can not be for the problem of dry grinding.
For solving the problems of the technologies described above, the technical solution used in the present invention is:
A bonding agent for resin dry grinding abrasive disk, according to weight percent meter, comprises polyimide resin 30-35%, copper powder 20-25%, molybdenum bisuphide 10-15%, carborundum 8-12%, chromium oxide 10-15%, zinc oxide 6-10%.
Further, a preferred embodiment of the present invention is: according to weight percent meter, comprise polyimide resin 33.4%, copper powder 22.4%, molybdenum bisuphide 12.1%, carborundum 10.6%, chromium oxide 13.1%, zinc oxide 8.4%.
A grinding abrasive disk, according to percent by volume meter, comprises abrasive material 25%-35%, the bonding agent 65%-75% described in claim 1 or 2.
Further, a preferred embodiment of the present invention is: described abrasive material is diamond.
A preparation method for resin dry grinding abrasive disk, comprises the following steps:
1) proportionally in connection with agent, mix, then according to percent by volume meter, get diamond 25%-35% and bonding agent 65%-75%, mix, wherein said bonding agent, according to weight percent meter, comprise polyimide resin 30-35%, copper powder 20-25%, molybdenum bisuphide 10-15%, carborundum 8-12%, chromium oxide 10-15%, zinc oxide 6-10%
It is 2) compressing,
3) fire,
4) be worked into dimensional requirement, obtain resin dry grinding abrasive disk.
Further, a preferred embodiment of the present invention is: described compressing pressure is 15-25Kg/cm 2.
Further, a preferred embodiment of the present invention is: the described temperature of firing is 200 ℃-300 ℃.
Beneficial effect of the present invention:
Bonding agent of the present invention and resin dry grinding abrasive disk, thermal conductivity is good, can be for dry ginding operation, diamond can not come off.
The specific embodiment
Below in conjunction with specific embodiments, technical scheme of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, rather than whole embodiment.Embodiment based in the present invention, those of ordinary skills, not making the every other embodiment obtaining under creative work prerequisite, belong to the scope of protection of the invention.
Embodiment 1
A preparation method for resin dry grinding abrasive disk, comprises the following steps:
1) proportionally in connection with agent, mix, then according to percent by volume meter, get diamond 25% and bonding agent 75%, mix, wherein said bonding agent, according to weight percent meter, comprise polyimide resin 30%, copper powder 25%, molybdenum bisuphide 12%, carborundum 12%, chromium oxide 15%, zinc oxide 6%
2) compressing, compressing pressure is 15Kg/cm 2,
3) fire, firing temperature is 200 ℃,
4) be worked into dimensional requirement, obtain resin dry grinding abrasive disk.
Embodiment 2
A preparation method for resin dry grinding abrasive disk, comprises the following steps:
1) proportionally in connection with agent, mix, then according to percent by volume meter, get diamond 25% and bonding agent 75%, mix,
2) compressing, compressing pressure is 15Kg/cm 2,
3) fire, firing temperature is 230 ℃,
4) be worked into dimensional requirement, obtain resin dry grinding abrasive disk; Wherein said bonding agent, according to weight percent meter, comprises polyimide resin 33.4%, copper powder 22.4%, molybdenum bisuphide 12.1%, carborundum 10.6%, chromium oxide 13.1%, zinc oxide 8.4%.
Embodiment 3
A preparation method for resin dry grinding abrasive disk, comprises the following steps:
1) proportionally in connection with agent, mix, then according to percent by volume meter, get diamond 25% and bonding agent 75%, mix, wherein said bonding agent, according to weight percent meter, comprise polyimide resin 35%, copper powder 20%, molybdenum bisuphide 15%, carborundum 8%, chromium oxide 12%, zinc oxide 10%.
2) compressing, compressing pressure is 200Kg/cm 2,
3) fire, firing temperature is 230 ℃,
4) be worked into dimensional requirement, obtain resin dry grinding abrasive disk.
Embodiment 4
A preparation method for resin dry grinding abrasive disk, comprises the following steps:
1) proportionally in connection with agent, mix, then according to percent by volume meter, get diamond 25% and bonding agent 75%, mix, wherein said bonding agent, according to weight percent meter, comprise polyimide resin 34%, copper powder 24%, molybdenum bisuphide 10%, carborundum 12%, chromium oxide 10%, zinc oxide 10%.
2) compressing, compressing pressure is 15Kg/cm 2,
3) fire, firing temperature is 300 ℃,
4) be worked into dimensional requirement, obtain resin dry grinding abrasive disk.
Comparative example
A preparation method for resin wheel, comprises the following steps:
1) proportionally in connection with agent, mix, then according to percent by volume meter, get diamond 25% and bonding agent 75%, mix, wherein said bonding agent, according to weight percent meter, comprise phenolic resins 33.6%, copper powder 14.4%, carborundum 7.5%, chromium oxide 14%, zinc oxide 12.1%, corundum 12.8%, magnesia 5.6%
2) compressing, compressing pressure is 15Kg/cm 2,
3) fire, firing temperature is 230 ℃,
4) be worked into dimensional requirement, obtain resin wheel.
Grinding-wheel grinder carbide bit by embodiment 1-4 and comparative example manufacturing, is not used cooling fluid, the experiment of dry grinding, the consistent size of the emery wheel of embodiment 1-4 and comparative example manufacturing, with rotating speed 2000 turn/per minute, dry grinding 1h, the results are shown in Table 1.
The emery wheel dry grinding experimental result of table 1 embodiment 1-4 and comparative example manufacturing
? Wheel face situation Diamond drop-off situation Workpiece temperature
Embodiment 1 Surface is complete, there is no significant change Diamond does not come off 58℃
Embodiment 2 Surface is complete, there is no significant change Diamond does not come off 50℃
Embodiment 3 Surface is complete, there is no significant change Diamond does not come off 55℃
Embodiment 4 Surface is complete, there is no significant change Diamond does not come off 60℃
Comparative example Surface blackening Diamond major part comes off 560℃
By table 1 can, the good heat conductivity of the resin dry grinding abrasive disk that the present invention is prepared, after dry grinding, workpiece temperature is 50-60 ℃, diamond does not come off, there is not the phenomenon of blackening in wheel face.
Abrasive material in the present invention is not limited to diamond, and other abrasive material is also applicable to resin dry grinding abrasive disk of the present invention.
The foregoing is only preferred embodiment of the present invention, in order to limit the present invention, within the spirit and principles in the present invention not all, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.

Claims (9)

1. a bonding agent for resin dry grinding abrasive disk, is characterized in that: according to weight percent meter, comprise polyimide resin 30-35%, copper powder 20-25%, molybdenum bisuphide 10-15%, carborundum 8-12%, chromium oxide 10-15%, zinc oxide 6-10%.
2. the bonding agent of a kind of resin dry grinding abrasive disk according to claim 1, it is characterized in that: according to weight percent meter, comprise polyimide resin 33.4%, copper powder 22.4%, molybdenum bisuphide 12.1%, carborundum 10.6%, chromium oxide 13.1%, zinc oxide 8.4%.
3. a resin dry grinding abrasive disk, is characterized in that: according to percent by volume meter, comprise abrasive material 25%-35%, the bonding agent 65%-75% described in claim 1 or 2.
4. a kind of resin dry grinding abrasive disk according to claim 3, is characterized in that: described abrasive material is diamond.
5. a preparation method for resin dry grinding abrasive disk, is characterized in that, comprises the following steps:
1) proportionally in connection with agent, mix, then according to percent by volume meter, get diamond 25%-35% and bonding agent 65%-75%, mix, wherein said bonding agent, according to weight percent meter, comprise polyimide resin 30-35%, copper powder 20-25%, molybdenum bisuphide 10-15%, carborundum 8-12%, chromium oxide 10-15%, zinc oxide 6-10%
It is 2) compressing,
3) fire,
4) be worked into dimensional requirement, obtain resin dry grinding abrasive disk.
6. the preparation method of a kind of resin dry grinding abrasive disk according to claim 5, is characterized in that: described compressing pressure is 15-25Kg/cm 2.
7. the preparation method of a kind of resin dry grinding abrasive disk according to claim 5, is characterized in that: the described temperature of firing is 200 ℃-300 ℃.
8. the preparation method of a kind of resin dry grinding abrasive disk according to claim 7, is characterized in that: the described temperature of firing is 230 ℃.
9. the preparation method of a kind of resin dry grinding abrasive disk according to claim 5, it is characterized in that: described bonding agent, according to weight percent meter, comprise polyimide resin 33.4%, copper powder 22.4%, molybdenum bisuphide 12.1%, carborundum 10.6%, chromium oxide 13.1%, zinc oxide 8.4%.
CN201310454588.3A 2013-09-29 2013-09-29 Binding agent of resin dry grinding wheel, resin dry grinding wheel and method for manufacturing resin dry grinding wheel Pending CN103522208A (en)

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Cited By (13)

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Publication number Priority date Publication date Assignee Title
CN104759994A (en) * 2015-04-10 2015-07-08 深圳市常兴技术股份有限公司 Gemstone polishing disk and manufacturing material thereof
CN105252427A (en) * 2015-09-18 2016-01-20 苏州国量量具科技有限公司 Hard grinding wheel and preparation method thereof
CN105269471A (en) * 2015-10-22 2016-01-27 蓝思科技(长沙)有限公司 Resin grinding tool for processing glass or ceramic
CN107127688A (en) * 2017-06-08 2017-09-05 泉州众志新材料科技有限公司 One kind cast dry grinding sheet material
CN107297688A (en) * 2017-07-28 2017-10-27 义乌市台荣超硬制品有限公司 A kind of resin bonding agent diamond or CBN tool tyre case powder
CN107662165A (en) * 2017-10-25 2018-02-06 台山市兰宝磨具有限公司 A kind of emery wheel manufacturing process
CN109227419A (en) * 2018-09-20 2019-01-18 贵州荣清工具有限公司 The major diameter manufacturing method that integrally ultra-thin resin-diamond is sliced
CN109434700A (en) * 2018-10-29 2019-03-08 株洲市超宇实业有限责任公司 A kind of hard alloy plates special grinding wheel and its manufacturing method
CN109894991A (en) * 2019-03-28 2019-06-18 上海橄榄精密工具有限公司 Composition and its grinding wheel obtained
CN110774170A (en) * 2017-12-30 2020-02-11 苏州赛尔科技有限公司 Grinding wheel tooth for thinning sapphire substrate
CN111633574A (en) * 2020-05-19 2020-09-08 郑州磨料磨具磨削研究所有限公司 Composite binder grinding wheel for steel rail grinding and preparation method thereof
CN111823150A (en) * 2019-04-23 2020-10-27 广东新劲刚金刚石工具有限公司 Resin binder diamond grinding tool and preparation method thereof
CN115366013A (en) * 2022-04-02 2022-11-22 珠海市世创金刚石工具制造有限公司 Bismaleimide resin grinding wheel for dry grinding

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Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104759994A (en) * 2015-04-10 2015-07-08 深圳市常兴技术股份有限公司 Gemstone polishing disk and manufacturing material thereof
CN105252427A (en) * 2015-09-18 2016-01-20 苏州国量量具科技有限公司 Hard grinding wheel and preparation method thereof
CN105252427B (en) * 2015-09-18 2017-12-22 苏州国量量具科技有限公司 A kind of hard grinding wheel with and preparation method thereof
CN105269471A (en) * 2015-10-22 2016-01-27 蓝思科技(长沙)有限公司 Resin grinding tool for processing glass or ceramic
CN105269471B (en) * 2015-10-22 2017-10-17 蓝思科技(长沙)有限公司 A kind of resin abrasive tools for being used to be processed glass or ceramics
CN107127688B (en) * 2017-06-08 2019-06-28 泉州众志新材料科技有限公司 A kind of casting dry grinding sheet material
CN107127688A (en) * 2017-06-08 2017-09-05 泉州众志新材料科技有限公司 One kind cast dry grinding sheet material
CN107297688A (en) * 2017-07-28 2017-10-27 义乌市台荣超硬制品有限公司 A kind of resin bonding agent diamond or CBN tool tyre case powder
CN107662165A (en) * 2017-10-25 2018-02-06 台山市兰宝磨具有限公司 A kind of emery wheel manufacturing process
CN110774170A (en) * 2017-12-30 2020-02-11 苏州赛尔科技有限公司 Grinding wheel tooth for thinning sapphire substrate
CN109227419A (en) * 2018-09-20 2019-01-18 贵州荣清工具有限公司 The major diameter manufacturing method that integrally ultra-thin resin-diamond is sliced
CN109434700A (en) * 2018-10-29 2019-03-08 株洲市超宇实业有限责任公司 A kind of hard alloy plates special grinding wheel and its manufacturing method
CN109894991A (en) * 2019-03-28 2019-06-18 上海橄榄精密工具有限公司 Composition and its grinding wheel obtained
CN111823150A (en) * 2019-04-23 2020-10-27 广东新劲刚金刚石工具有限公司 Resin binder diamond grinding tool and preparation method thereof
CN111633574A (en) * 2020-05-19 2020-09-08 郑州磨料磨具磨削研究所有限公司 Composite binder grinding wheel for steel rail grinding and preparation method thereof
CN115366013A (en) * 2022-04-02 2022-11-22 珠海市世创金刚石工具制造有限公司 Bismaleimide resin grinding wheel for dry grinding
CN115366013B (en) * 2022-04-02 2023-12-08 珠海市世创金刚石工具制造有限公司 Double-horse polyimide resin grinding wheel for dry grinding

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