CN104759994A - Gemstone polishing disk and manufacturing material thereof - Google Patents
Gemstone polishing disk and manufacturing material thereof Download PDFInfo
- Publication number
- CN104759994A CN104759994A CN201510169603.9A CN201510169603A CN104759994A CN 104759994 A CN104759994 A CN 104759994A CN 201510169603 A CN201510169603 A CN 201510169603A CN 104759994 A CN104759994 A CN 104759994A
- Authority
- CN
- China
- Prior art keywords
- polishing disk
- powder
- oxide powder
- polyimide resin
- orders
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The invention discloses a material for manufacturing a gemstone polishing disk. The material includes the following ingredients by the weight percent: 25%-40% of polyimide resin powder, 3%-9% of iron trioxide powder, 25%-45% of copper powder, and 25%-40% of zinc oxide powder. In the polishing disk manufactured by the material for manufacturing the gemstone polishing disk, the material is high in surface quality and has no pores and impurities; the polishing disk is formed by pressing at low temperature, the gemstone and high-hardness fragile work pieces cannot be damaged in processing, and the processing quality is relatively high.
Description
Technical field
The present invention relates to polishing disk technical field, particularly relate to a kind of polishing disk for processing gem and make material.
Background technology
Jewel is being commonly called as of alumina single crystal, main component is aluminium oxide (Al2O3), there is the series of characteristics such as intensity is high, hardness is high (hardness is 9, is only second to masonry), high temperature resistant, rub resistance, resistance to corrosion strong, translucidus energy, electrical insulation capability are excellent.Surfacing is mainly removed with chemistry and mechanism by polishing, with obtain bright and clean, without the surface of lattice defect.Jewel due to the high and fragility of its hardness large, machining difficulty, slight crack and to collapse limit phenomenon ratio higher.In process, often because resin disk blemish as: the undesirable appearance such as pore, impurity situation makes workpiece occur cut, or even collapses limit phenomenon.Secondly, the material removing rate of polishing process is little, and current international level is, removes speed lower than 1um/h; Surface roughness reaches about 0.4nm; Flatness is less than 5um.
Summary of the invention
The object of the present invention is to provide a kind of polishing disk and the making material thereof that are exclusively used in processing gem, which solve current gem processing, the technical problem of the crudy difference caused because of polishing disk blemish.
For achieving the above object, technical scheme proposed by the invention is:
The making material of a kind of jewel polishing disk of the present invention, its compositions in weight percentage making material is: polyimide resin powder end: 25% ~ 40%; Ferric oxide powder: 3% ~ 9%; Copper powder: 25% ~ 45%; Zinc oxide powder: 25% ~ 40%.
Wherein, the powder particle granularity in described component is respectively: polyimide resin powder end: 2000 orders; Di-iron trioxide: 450 orders; Copper powder: 200 orders; Zinc oxide powder: 2000 orders.
A kind of jewel polishing disk, it comprises following component: polyimide resin powder end, ferric oxide powder, copper powder, Zinc oxide powder, and described compositions in weight percentage is: polyimide resin powder end: 25% ~ 40%; Ferric oxide powder: 3% ~ 9%; Copper powder: 25% ~ 45%; Zinc oxide powder: 25% ~ 40%.
Wherein, card diameter is 190mm ~ 230mm, and thickness is 30mm ~ 50mm.
Wherein, described jewel polishing disk is sapphire polishing disk.
The making material of a kind of jewel polishing disk of the present invention and polishing disk thereof, the surface quality of material own is high, pore-free, free from admixture, and adopt low temperature compacting to form, to the processing not damaged of the contour hard easy crisp workpiece of jewel, processing quality is higher.
Accompanying drawing explanation
Fig. 1 is that the present invention is a kind of for jewel polishing disk structural representation.
Detailed description of the invention
Below with reference to accompanying drawing, elaboration is further given to the present invention.
Refer to accompanying drawing 1, it is of the present invention for jewel polishing disk structural representation, and it comprises an emery wheel body 1, and described emery wheel body 1 is rounded, is provided with a through hole 11 in the middle part of it, and this through hole 11 is for being installed on rotating mechanism by the emery wheel body 1 of this polishing disk.
Wherein, described emery wheel body 1 or the diameter being referred to as card are 190mm ~ 230mm, and thickness is 30mm ~ 50mm.
A making material for jewel polishing disk, its compositions in weight percentage is: polyimide resin powder end: 25% ~ 40%; Ferric oxide powder: 3% ~ 9%; Copper powder: 25% ~ 45%; Zinc oxide powder: 25% ~ 40%.
Further, the powder particle granularity in described component is respectively: polyimide resin powder end: 2000 orders; Di-iron trioxide: 450 orders; Copper powder: 200 orders; Zinc oxide powder: 2000 orders.
Preferably, this jewel polishing disk is for processing sapphire.
In order to further illustrate, adopt the raising of the processing quality of polishing disk processing gem of the present invention, referring to following, the polishing experiments tables of data under same operating: table 1 is the list of different component proportioning.Table 2 be in table 1 different ratio make polishing disk polishing after surface roughness list;
Table 1
| Contrast case | Surface roughness (nm) |
| Case study on implementation 1 | 70-90 |
| Case study on implementation 2 | 60-80 |
| Case study on implementation 3 | 30-50 |
| Case study on implementation 4 | 35-70 |
Table 2
Foregoing; be only preferred embodiment of the present invention; not for limiting embodiment of the present invention; those of ordinary skill in the art are according to central scope of the present invention and spirit; can carry out corresponding flexible or amendment very easily, therefore protection scope of the present invention should be as the criterion with the protection domain required by claims.
Claims (5)
1. a making material for jewel polishing disk, is characterized in that, the compositions in weight percentage making material is: polyimide resin powder end: 25% ~ 40%; Ferric oxide powder: 3% ~ 9%; Copper powder: 25% ~ 45%; Zinc oxide powder: 25% ~ 40%.
2. the making material of jewel polishing disk as claimed in claim 1, it is characterized in that, the powder particle granularity in described component is respectively: polyimide resin powder end: 2000 orders; Di-iron trioxide: 450 orders; Copper powder: 200 orders; Zinc oxide powder: 2000 orders.
3. a jewel polishing disk, is characterized in that, comprises following component: polyimide resin powder end, ferric oxide powder, copper powder, Zinc oxide powder, and described compositions in weight percentage is: polyimide resin powder end: 25% ~ 40%; Ferric oxide powder: 3% ~ 9%; Copper powder: 25% ~ 45%; Zinc oxide powder: 25% ~ 40%.
4. jewel polishing disk as claimed in claim 3, it is characterized in that, card diameter is 190mm ~ 230mm, and thickness is 30mm ~ 50mm.
5. jewel polishing disk as claimed in claim 3, it is characterized in that, described jewel polishing disk is sapphire polishing disk.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510169603.9A CN104759994A (en) | 2015-04-10 | 2015-04-10 | Gemstone polishing disk and manufacturing material thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510169603.9A CN104759994A (en) | 2015-04-10 | 2015-04-10 | Gemstone polishing disk and manufacturing material thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104759994A true CN104759994A (en) | 2015-07-08 |
Family
ID=53642259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510169603.9A Pending CN104759994A (en) | 2015-04-10 | 2015-04-10 | Gemstone polishing disk and manufacturing material thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104759994A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105014516A (en) * | 2015-07-29 | 2015-11-04 | 柳州市旭平首饰有限公司 | Gem bead polishing machine |
| CN110774170A (en) * | 2017-12-30 | 2020-02-11 | 苏州赛尔科技有限公司 | Grinding wheel tooth for thinning sapphire substrate |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0379273A (en) * | 1989-08-22 | 1991-04-04 | Mitsubishi Heavy Ind Ltd | Resin bonded super abrasive grain grindstone |
| JPH11188633A (en) * | 1997-12-26 | 1999-07-13 | Mitsubishi Materials Corp | Resin bond grinding wheel |
| CN1421478A (en) * | 2001-11-22 | 2003-06-04 | 四川大学 | Strongly heat-dissipated resin-diamond grinding apparatus |
| CN103522208A (en) * | 2013-09-29 | 2014-01-22 | 河南华茂新材料科技开发有限公司 | Binding agent of resin dry grinding wheel, resin dry grinding wheel and method for manufacturing resin dry grinding wheel |
| CN103923607A (en) * | 2014-04-16 | 2014-07-16 | 泉州金山石材工具科技有限公司 | Diamond resin grinding tool and preparation method thereof |
-
2015
- 2015-04-10 CN CN201510169603.9A patent/CN104759994A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0379273A (en) * | 1989-08-22 | 1991-04-04 | Mitsubishi Heavy Ind Ltd | Resin bonded super abrasive grain grindstone |
| JPH11188633A (en) * | 1997-12-26 | 1999-07-13 | Mitsubishi Materials Corp | Resin bond grinding wheel |
| CN1421478A (en) * | 2001-11-22 | 2003-06-04 | 四川大学 | Strongly heat-dissipated resin-diamond grinding apparatus |
| CN103522208A (en) * | 2013-09-29 | 2014-01-22 | 河南华茂新材料科技开发有限公司 | Binding agent of resin dry grinding wheel, resin dry grinding wheel and method for manufacturing resin dry grinding wheel |
| CN103923607A (en) * | 2014-04-16 | 2014-07-16 | 泉州金山石材工具科技有限公司 | Diamond resin grinding tool and preparation method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105014516A (en) * | 2015-07-29 | 2015-11-04 | 柳州市旭平首饰有限公司 | Gem bead polishing machine |
| CN110774170A (en) * | 2017-12-30 | 2020-02-11 | 苏州赛尔科技有限公司 | Grinding wheel tooth for thinning sapphire substrate |
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Legal Events
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| C06 | Publication | ||
| PB01 | Publication | ||
| EXSB | Decision made by sipo to initiate substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150708 |
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| RJ01 | Rejection of invention patent application after publication |