CN102610941A - Testing connector - Google Patents
Testing connector Download PDFInfo
- Publication number
- CN102610941A CN102610941A CN2011100219405A CN201110021940A CN102610941A CN 102610941 A CN102610941 A CN 102610941A CN 2011100219405 A CN2011100219405 A CN 2011100219405A CN 201110021940 A CN201110021940 A CN 201110021940A CN 102610941 A CN102610941 A CN 102610941A
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- terminal
- wafer
- testing
- test connector
- conducting medium
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- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention provides a testing connector for testing a chip module. The testing connector comprises a wafer distributed with multiple circuits, wherein the testing connector further comprises a testing terminal mounted on the wafer, and a conducting medium arranged below the wafer. The testing terminal and the conducting medium are connected with the two ends of related circuits in the wafer, respectively. The testing terminal is a carbon nanotube terminal. The testing connector provided by the invention has high density in testing points, and can detect more grains once; moreover, the testing connector can reduce the testing time and meet the testing requirement of the high-density wafer.
Description
[technical field]
The present invention refers to a kind of high electrically test connector of the high-order wafer sort of demand that satisfies especially about a kind of test connector.
[background technology]
Industry adopts a kind of probe test connector to carry out wafer sort usually.Wafer sort is each crystal grain on the chip module to be carried out pin survey.Test connector generally comprises insulating body and some terminals that is located in insulating body.Insulating body is used for the carries chips module, and the contact on the crystal grain of terminal and chip module contacts to test its electrical characteristic.Underproof crystal grain can be put signs in the test, then when chip module be unit when cutting into independently crystal grain according to crystal grain, the defective crystal grain that indicates mark can be eliminated, and no longer carries out next processing procedure, in order to avoid increase manufacturing cost on foot.
United States Patent (USP) the 6th, 932 has disclosed a kind of test connector relevant with the present invention No. 619, is mainly used in to electrically connect chip module and printed circuit board (PCB), to realize the purpose of test.This test connector comprises insulating body and is placed in the plurality of terminals in the insulating body.The end that this terminal comprises the contact site that connects with the tin ball or the conducting strip of chip module, connect with printed circuit board (PCB) and be used to be connected the crooked elongate base portion that is provided with of being of contact site and end.The contact site of this terminal stretches out insulating body, and when chip module was pushed downwards, terminal can produce strain, makes terminal flexible up and down, to reach the purpose that connects or separate with the tin ball of chip module.
But; Along with the lifting of computer speed, require the speed of chip module increasingly high, the terminal of this test connector is arranged and correspondingly is tending towards densification day by day; And it is more and more littler between the terminals of adjacent apart from requiring; But the structure of these terminals is less, makes that assembling is loaded down with trivial details, has increased the production cost of test connector.
So, be necessary to design a kind of novel test connector, to overcome above-mentioned defective of the prior art.
[summary of the invention]
The technical problem that the present invention will solve provides a kind of test connector, can reduce the testing time, reduces testing cost, and can satisfy the testing requirement of high density wafer.
For solveing the technical problem; The present invention provides a kind of test connector, is used for the test chip module, and it comprises the wafer that is furnished with some circuits; Wherein, Said test connector also comprises the calibrating terminal of being located at wafer top and the conducting medium of being located at the wafer below, this calibrating terminal and conducting medium respectively with wafer in the two ends of respective lines link to each other, this calibrating terminal is the carbon nanotube terminal.
Said conducting medium is tin ball or tin cream.Said conducting medium also can be conducting resinl.Said carbon nanotube terminal is the vertical type cone-shaped structure.Also be provided with some insulating base frames on the said wafer, the corresponding terminal accommodation holes of accommodating the carbon nanotube terminal that is provided with on each insulating base frame.
Compared with prior art, the present invention has the following advantages: this test connector site density is high, once can detect more crystal grain, can reduce the testing time, and can satisfy the testing requirement of high density wafer.
[description of drawings]
Fig. 1 is the assembly drawing that test connector of the present invention connects chip module and printed circuit board (PCB).
Fig. 2 is the partial enlarged drawing shown in Fig. 1 circle.
Fig. 3 is a test connector of the present invention bottom surface stereogram up.
Fig. 4 is the cutaway view that test connector of the present invention connects chip module and printed circuit board (PCB).
Fig. 5 is the sketch map of the upright boundling forming method of carbon nanotube terminal of test connector of the present invention.
[embodiment]
See also Fig. 1 to shown in Figure 4, it has disclosed test connector 1 of the present invention, can connect relevant chip module 2 and printed circuit board (PCB) 3, can realize the purpose of test chip module 2.
Please consult Fig. 2 to shown in Figure 4 by emphasis, test connector 1 of the present invention comprises wafer 10, some insulating base frame 151 and some calibrating terminals 12 that is mounted in the insulating base frame 151 of being located at wafer 10 tops of the good some circuits 101 of cloth.The upper end of the respective lines 101 in this calibrating terminal 12 and the wafer 10 links to each other.This test connector 1 also comprises the conducting medium 13 of being located at wafer 10 belows, the lower ends of the respective lines 101 in this conducting medium 13 and the wafer 10.
Calibrating terminal 12 of the present invention is the carbon nanotube terminal, mainly is to utilize " vertical type dielectrophoresis " to reach the carbon nanotube terminal that integrated and boundling carbon nanotube dispersion liquid become vertical type.
Please emphasis consult shown in Figure 5, according to " vertical type dielectrophoresis " method, when needs obtain carbon nanotube terminal 12, at first need be at wafer 10 upper surfaces plating one deck gold or other suitable material as first electrode 14.Above first electrode 14, one deck insulated substrate 15 is set then.Some terminal accommodation holes 150 that are used to accommodate corresponding carbon nanotube terminal 12 are set on this insulated substrate 15.This terminal accommodation holes 150 can be arranged in matrix according to actual needs or any other meets the aspect of actual user demand.One second electrode 16 is set above insulated substrate 15 then again, and makes first electrode 14 and second electrode 16 corresponding with respective terminal accepting hole 150.
According to preferred embodiment of the present invention; This second electrode 16 is the conductor of a column or needle-like; Can certainly be other any shape; Can cooperate first electrode 14 to form electric field (or power line), and its diameter is little than this terminal accommodation holes 150 preferably, to be used to control and dominate the diameter of the carbon nanotube terminal 12 that is formed.Though it may be noted that second electrode 16 that embodiment discloses an electrode is only arranged, in the utilization of reality, this second electrode 16 can also cooperate the shape or the array of the arrangement of respective terminal accepting hole 150 to come deploying.For example, when respective terminal accepting hole 150 is arranged in the matrix of standard, then should can also be arranged in corresponding matrix by electricity two electrodes 16, in each corresponding terminal accommodation holes 150, to form carbon nanotube terminal 12 simultaneously.
Next, then in this terminal accommodation holes 150, drip and establish carbon nanotube dispersion liquid 17.Between first electrode 14 and second electrode 16, apply a suitable alternating voltage then to pass this carbon nanotube dispersion liquid 17, in this terminal accommodation holes 150, to form the coniform carbon nanotube terminal 12 of the vertical type that accumulates pencil.After, through the back segment operation gold-plated i.e. first electrode 14 on the wafer 10 is removed, simultaneously second electrode 16 is removed in the lump, again insulated substrate 15 is divided into some insulating base frames 151, each insulating base frame 151 is used to be installed with corresponding carbon nanotube terminal 12.
At last, the lower surface at wafer 10 is provided with some conducting mediums 13.This conducting medium 13 can be tin ball, tin cream or conducting resinl.In preferred embodiment of the present invention, this conducting medium 13 is some tin balls that under high temperature fused state, are mounted on wafer 10 lower surfaces through back welding process.This conducting medium 13 and corresponding circuit 101 lower ends are to remove to electrically connect the conductive junction point 31 on the printed circuit board (PCB) 3.
During test; Earlier test connector 1 is mounted on the printed circuit board (PCB) 3; Chip module 2 is mounted on the top of test connector 1, the crystal grain 21 of calibrating terminal of this test connector 1 12 and chip module 2 connects again, and this conducting medium 13 contacts with conductive junction point 31 on the printed circuit board (PCB) 3; Reach thus and electrically conduct the purpose of realization test chip module 2.
The above is merely one embodiment of the present invention; It or not whole or unique execution mode; The variation of any equivalence that those of ordinary skills take technical scheme of the present invention through reading specification of the present invention is claim of the present invention and contains.
Claims (6)
1. test connector; Be used for the test chip module; It comprises the wafer that is furnished with some circuits, it is characterized in that, said test connector also comprises the calibrating terminal of being located at the wafer top and the conducting medium of being located at the wafer below; This calibrating terminal and conducting medium respectively with wafer in the two ends of respective lines link to each other, this calibrating terminal is the carbon nanotube terminal.
2. test connector as claimed in claim 1 is characterized in that: said conducting medium is the tin ball.
3. test connector as claimed in claim 1 is characterized in that: said conducting medium is a tin cream.
4. test connector as claimed in claim 1 is characterized in that: said conducting medium is a conducting resinl.
5. test connector as claimed in claim 1 is characterized in that: said carbon nanotube terminal is the vertical type cone-shaped structure.
6. test connector as claimed in claim 1 is characterized in that: also be provided with some insulating base frames on the said wafer, the corresponding terminal accommodation holes of accommodating the carbon nanotube terminal that is provided with on each insulating base frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100219405A CN102610941A (en) | 2011-01-19 | 2011-01-19 | Testing connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100219405A CN102610941A (en) | 2011-01-19 | 2011-01-19 | Testing connector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102610941A true CN102610941A (en) | 2012-07-25 |
Family
ID=46528175
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100219405A Pending CN102610941A (en) | 2011-01-19 | 2011-01-19 | Testing connector |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102610941A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2574215Y (en) * | 2002-10-08 | 2003-09-17 | 许明慧 | Nanotube probe structure for testing IC |
| CN1916647A (en) * | 2005-08-19 | 2007-02-21 | 旭达电脑（昆山）有限公司 | Testing fixture connected to socket, and testing method |
| CN1930482A (en) * | 2004-03-05 | 2007-03-14 | 奥克泰克有限公司 | Probe and probe manufacturing method |
| TWM309779U (en) * | 2006-08-15 | 2007-04-11 | Hon Hai Prec Ind Co Ltd | Electrical connector |
-
2011
- 2011-01-19 CN CN2011100219405A patent/CN102610941A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2574215Y (en) * | 2002-10-08 | 2003-09-17 | 许明慧 | Nanotube probe structure for testing IC |
| CN1930482A (en) * | 2004-03-05 | 2007-03-14 | 奥克泰克有限公司 | Probe and probe manufacturing method |
| CN1916647A (en) * | 2005-08-19 | 2007-02-21 | 旭达电脑（昆山）有限公司 | Testing fixture connected to socket, and testing method |
| TWM309779U (en) * | 2006-08-15 | 2007-04-11 | Hon Hai Prec Ind Co Ltd | Electrical connector |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120725 |